CN104801887A - Paste flux for low-temperature solder paste and preparation method thereof - Google Patents
Paste flux for low-temperature solder paste and preparation method thereof Download PDFInfo
- Publication number
- CN104801887A CN104801887A CN201510258233.6A CN201510258233A CN104801887A CN 104801887 A CN104801887 A CN 104801887A CN 201510258233 A CN201510258233 A CN 201510258233A CN 104801887 A CN104801887 A CN 104801887A
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- CN
- China
- Prior art keywords
- low temperature
- cream
- temperature tin
- parts
- weld
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a paste flux for low-temperature solder paste and a preparation method thereof. The paste flux comprises 35 to 50 parts of a solvent, 3 to 6 parts of malonic acid, 0.3 to 0.6 part of cholamine, 0.5 to 2 parts of dibromoethyl, and 40 to 50 parts of rosin. The preparation method comprises the following steps: weighing 35 to 50 parts of a solvent, 3 to 6 parts of malonic acid, 0.3 to 0.6 part of cholamine, 0.5 to 2 parts of dibromoethyl, and 40 to 50 parts of rosin in parts by weight, uniformly mixing, and then obtaining the paste flux.
Description
[technical field]
The invention belongs to welding technology field, relate to a kind of low temperature tin cream weld-aiding cream and preparation method thereof.
[background technology]
China will become the main drive amount of global LED market development, and government will extensively adopt the ecological project of LED illumination in civilian and commercial kitchen area, this will make LED industry obtain recovery.And LED industry can not bear element and the pcb board of high temperature reflux welding with some, the welding material of main application is low temperature tin cream.So present market gets more and more to the demand of low temperature tin cream.
Current low temperature tin cream has that low, the excellent printing of fusing point, wetability are good, reflow time without the advantage such as generation of tin sweat(ing) and Xi Qiao; But the existing maximum shortcoming of low temperature tin cream is easy blackout, reason is that metal Bi is more oxidizable than other metal, and oxide layer is also thicker, and the slaine that weld-aiding cream is formed after removing oxide is also many, and these salt postweldings will form a kind of atrament.Therefore, the On Blackening how improving low temperature tin cream becomes the key of prior art.
[summary of the invention]
the technical problem solved:the object of this invention is to provide a kind of low temperature tin cream weld-aiding cream and preparation method thereof, be intended to solve the problem that current low temperature tin cream easily turns black.
technical scheme:the present invention is achieved through the following technical solutions above-mentioned purpose:
A kind of low temperature tin cream weld-aiding cream, described low temperature tin cream weld-aiding cream comprises the composition of following weight portion:
Solvent 35-50 part,
Malonic acid 3-6 part,
Monoethanolamine 0.3-0.6 part,
Dibromo ethyl benzene 0.5-2 part,
Rosin 40-50 part.
Described a kind of low temperature tin cream weld-aiding cream, described solvent is ethylene glycol or 2 methyl-2,4 pentanediols.
Preferably, described described a kind of low temperature tin cream weld-aiding cream, described malonic acid is 4 parts.
Preferably, described described a kind of low temperature tin cream weld-aiding cream, described monoethanolamine is 0.45 part.
Preferably, described described a kind of low temperature tin cream weld-aiding cream, described dibromo ethyl benzene is 1.5 parts.
Preferably, described described a kind of low temperature tin cream weld-aiding cream, described rosin is 45 parts.
The preparation method of described described a kind of low temperature tin cream weld-aiding cream, step is: get that solvent is 35-50 part, malonic acid is 3-6 part, monoethanolamine is 0.3-0.6 part, dibromo ethyl benzene is 0.5-2 part by weight respectively,
Rosin is 40-50 part, obtains product after mixing.
beneficial effect:low temperature tin cream weld-aiding cream of the present invention solves the problem that current low temperature tin cream easily turns black, and can be used in tin cream, has good application space.
Accompanying drawing explanation
Fig. 1 is the pattern of embodiment.
Fig. 2 is the pattern of comparative example.
Detailed description of the invention
Embodiment 1
Get that ethylene glycol is 50 parts, malonic acid is 6 parts, monoethanolamine is 0.3 part, dibromo ethyl benzene is 0.5 part, rosin is 50 parts by weight respectively, after mixing, obtain product.
Embodiment 2
Get that ethylene glycol is 35 parts, malonic acid is 3 parts, monoethanolamine is 0.6 part, dibromo ethyl benzene is 2 parts, rosin is 40 parts by weight respectively, after mixing, obtain product.
Embodiment 3
Get that 2 methyl-2,4 pentanediols are 45 parts, malonic acid is 4 parts, monoethanolamine is 0.45 part, dibromo ethyl benzene is 1.5 parts, rosin is 45 parts by weight respectively, after mixing, obtain product.
Comparative example
Get that ethylene glycol is 50 parts, malonic acid is 6 parts, rosin is 50 parts by weight respectively, after mixing, obtain product.
By corresponding experimental comparison, activating agent of the present invention contrasts with conventional activating agent, and low temperature tin cream of the present invention can not turn black.
Claims (7)
1. a low temperature tin cream weld-aiding cream, is characterized in that, described low temperature tin cream weld-aiding cream comprises the composition of following weight portion:
Solvent 35-50 part,
Malonic acid 3-6 part,
Monoethanolamine 0.3-0.6 part,
Dibromo ethyl benzene 0.5-2 part,
Rosin 40-50 part.
2. a kind of low temperature tin cream weld-aiding cream according to claim 1, is characterized in that, described solvent is ethylene glycol or 2 methyl-2,4 pentanediols.
3. a kind of low temperature tin cream weld-aiding cream according to claim 1, is characterized in that, described described a kind of low temperature tin cream weld-aiding cream, described malonic acid is 4 parts.
4. a kind of low temperature tin cream weld-aiding cream according to claim 1, is characterized in that, described described a kind of low temperature tin cream weld-aiding cream, described monoethanolamine is 0.45 part.
5. a kind of low temperature tin cream weld-aiding cream according to claim 1, is characterized in that, described described a kind of low temperature tin cream weld-aiding cream, described dibromo ethyl benzene is 1.5 parts.
6. a kind of low temperature tin cream weld-aiding cream according to claim 1, is characterized in that, described described a kind of low temperature tin cream weld-aiding cream, described rosin is 45 parts.
7. the preparation method of a kind of low temperature tin cream weld-aiding cream according to claim 1, it is characterized in that step is: get that solvent is 35-50 part, malonic acid is 3-6 part, monoethanolamine is 0.3-0.6 part, dibromo ethyl benzene is 0.5-2 part, rosin is 40-50 part by weight respectively, after mixing, obtain product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510258233.6A CN104801887A (en) | 2015-05-20 | 2015-05-20 | Paste flux for low-temperature solder paste and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510258233.6A CN104801887A (en) | 2015-05-20 | 2015-05-20 | Paste flux for low-temperature solder paste and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104801887A true CN104801887A (en) | 2015-07-29 |
Family
ID=53687301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510258233.6A Pending CN104801887A (en) | 2015-05-20 | 2015-05-20 | Paste flux for low-temperature solder paste and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104801887A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106493483A (en) * | 2016-11-30 | 2017-03-15 | 安徽华众焊业有限公司 | Low-temperature lead-free tin cream |
| CN106624430A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin soldering paste |
| CN106736017A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Low-silver copper-base middle temperature solder paste |
| CN107442969A (en) * | 2017-09-08 | 2017-12-08 | 苏州汉尔信电子科技有限公司 | A kind of nanometer weld-aiding cream and low-temperature environment-friendly type nanometer solder(ing) paste and preparation method thereof |
| CN111590235A (en) * | 2020-06-11 | 2020-08-28 | 中山翰华锡业有限公司 | Low-dielectric-loss high-reliability soldering paste and preparation method thereof |
| CN112059467A (en) * | 2020-09-22 | 2020-12-11 | 深圳市鑫富锦新材料有限公司 | Lead-free solder alloy soldering paste |
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| CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN101879671A (en) * | 2010-06-13 | 2010-11-10 | 汕头市骏码凯撒有限公司 | Halogen-free flux and method for preparing same |
| CN102489897A (en) * | 2011-11-16 | 2012-06-13 | 苏州之侨新材料科技有限公司 | Low-temperature lead-free soldering flux for tin-bismuth series |
| CN102513734A (en) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | Method for preparing paste soldering flux |
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN103212923A (en) * | 2013-05-07 | 2013-07-24 | 浙江省冶金研究院有限公司 | High temperature resistant rosinyl scaling powder |
| JP2014087814A (en) * | 2012-10-29 | 2014-05-15 | Tamura Seisakusho Co Ltd | Flux composition, solder composition, and electronic substrate |
-
2015
- 2015-05-20 CN CN201510258233.6A patent/CN104801887A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN101879671A (en) * | 2010-06-13 | 2010-11-10 | 汕头市骏码凯撒有限公司 | Halogen-free flux and method for preparing same |
| CN102489897A (en) * | 2011-11-16 | 2012-06-13 | 苏州之侨新材料科技有限公司 | Low-temperature lead-free soldering flux for tin-bismuth series |
| CN102513734A (en) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | Method for preparing paste soldering flux |
| JP2014087814A (en) * | 2012-10-29 | 2014-05-15 | Tamura Seisakusho Co Ltd | Flux composition, solder composition, and electronic substrate |
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN103212923A (en) * | 2013-05-07 | 2013-07-24 | 浙江省冶金研究院有限公司 | High temperature resistant rosinyl scaling powder |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106493483A (en) * | 2016-11-30 | 2017-03-15 | 安徽华众焊业有限公司 | Low-temperature lead-free tin cream |
| CN106624430A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin soldering paste |
| CN106736017A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Low-silver copper-base middle temperature solder paste |
| CN107442969A (en) * | 2017-09-08 | 2017-12-08 | 苏州汉尔信电子科技有限公司 | A kind of nanometer weld-aiding cream and low-temperature environment-friendly type nanometer solder(ing) paste and preparation method thereof |
| CN107442969B (en) * | 2017-09-08 | 2019-06-21 | 苏州汉尔信电子科技有限公司 | A kind of nanometer of weld-aiding cream and low-temperature environment-friendly type nanometer solder(ing) paste and preparation method thereof |
| CN111590235A (en) * | 2020-06-11 | 2020-08-28 | 中山翰华锡业有限公司 | Low-dielectric-loss high-reliability soldering paste and preparation method thereof |
| CN112059467A (en) * | 2020-09-22 | 2020-12-11 | 深圳市鑫富锦新材料有限公司 | Lead-free solder alloy soldering paste |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150729 |
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| RJ01 | Rejection of invention patent application after publication |