CN104794801A - Bijection type ultrasonic module for bank note thickness detection - Google Patents
Bijection type ultrasonic module for bank note thickness detection Download PDFInfo
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- CN104794801A CN104794801A CN201510242116.0A CN201510242116A CN104794801A CN 104794801 A CN104794801 A CN 104794801A CN 201510242116 A CN201510242116 A CN 201510242116A CN 104794801 A CN104794801 A CN 104794801A
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- 238000001514 detection method Methods 0.000 title abstract description 9
- 238000002604 ultrasonography Methods 0.000 claims description 14
- 230000003321 amplification Effects 0.000 claims description 13
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
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- 238000004891 communication Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
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- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
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Abstract
The invention discloses a bijection type ultrasonic thickness detection module for bank note thickness detection. The bijection type ultrasonic thickness detection module comprises ultrasonic transmitters and ultrasonic receivers, which are arranged at intervals in pairs, and a controller, an ultrasonic transmission driving circuit, a signal amplifying and maintaining circuit, a signal collecting circuit and a signal discharging circuit. The bijection type ultrasonic thickness detection module disclosed by the invention detects the bank note thickness through ultrasonic, thereby simplifying the installation manner, improving the adaptability of the installation position and getting rid of the constraint of a following roller on the installation position, meanwhile, the signal amplifying and maintaining circuit is used for improving the signal processing effect, and meanwhile shortening the actual working times of the ultrasonic transmitters and the ultrasonic receivers, effectively prolonging the service lives of the ultrasonic transmitters and the ultrasonic receivers and stably collecting signals at multiple points to guarantee the processing accuracy. Signals detected by each path of independent thickness sensors are spliced to the thickness feature of an entire bank note to effectively improve the accuracy of judging whether the bank note is an overlapped bank note.
Description
Technical field
The present invention relates to financial automation services field of terminal technology, particularly relate to a kind of correlation type ultrasonic module detected for stiff thickness.
Background technology
In order to ensure accurate to the banknote counting of process in cash handling device (paper money counter, circulator, cleaning-sorting machine etc.), all possesses a thickness detection apparatus, the effect of thickness detection apparatus in cash handling device is the thickness detecting flaky medium, the i.e. thickness of bank note, obtain the feature that the thickness of bank note not only can be used for judging whether to meet true bank note, but also can ensure that bank note carries out the accuracy counted when being separated and transmitting, judge whether to re-open, provided safeguard for cash process arranges quantitatively and the qualitatively bank note provided.
Current cash handling device, generally adopt the sophisticated sensors such as eddy current type, Hall-type, photo-electric to detect, and the general sensing range of sophisticated sensor is little, very high to the accuracy requirement of thickness detection mechanism in the application.
Summary of the invention
The object of the invention is the technological deficiency for existing in prior art, and a kind of correlation type ultrasonic module detected for stiff thickness is provided.
The technical scheme adopted for realizing object of the present invention is:
The correlation type ultrasonic detected for stiff thickness examines a thick module, comprises paired and spaced apart ultrasonic transmitter and ultrasonic receiver, and,
Controller, sets up communication for generation of control signal by interface and external devices;
Ultrasound wave launches driving circuit, is supplied to ultrasonic transmitter and launches predetermined power signal to make it after control signal being amplified;
Signal amplifies holding circuit, and itself and ultrasonic receiver one_to_one corresponding arrange and to amplify with the ultrasonic signal received and to keep being stabilized in predetermined voltage range;
Signal acquisition circuit, gathers and amplifies the ultrasonic signal of holding circuit process through signal and be converted into digital signal and feed back to controller;
Signal discharge circuit, receives discharge signal that controller produces afterwards in the collection of Acquisition Circuit settling signal and signal is amplified the signal losses kept in holding circuit.
Comprise multipair ultrasonic transmitter and ultrasonic receiver, it is launched driving circuit with described ultrasound wave respectively and is connected, and described signal acquisition circuit is at least two and interleaved ground amplifies holding circuit with signal and is connected.
Interval is furnished with 10 pairs of ultrasonic transmitters and ultrasonic receiver, and described signal acquisition circuit is two and signal corresponding with the ultrasonic receiver of odd bits and even bit respectively amplifies holding circuit connects.
Described signal amplifies holding circuit and comprises signal amplification circuit and signal holding circuit, and described signal amplification circuit is three-stage amplifier, the output resistance of the operational amplifier of amplifying circuit is parallel with gain capacitances to realize open-loop gain.
Described signal holding circuit comprises the semibridge system rectification circuit that two diodes are formed, and is arranged in parallel and exports the first resistance between signal ground and the second resistance and filter capacitor at signal amplification circuit.
Described signal discharge circuit comprises a triode, and described transistor base is communicated with controller through base resistance, and collector amplifies the output of holding circuit through collector resistance access signal, and emitter connects signal ground.
Compared with prior art, the invention has the beneficial effects as follows:
Ultrasound wave correlation of the present invention examines thick module, utilize ultrasound wave thick to its inspection, simplify mounting means, improve the adaptability of installation site, break away from the installation site constraint of loose roll, meanwhile, signal is utilized to amplify holding circuit, while improving signal transacting effect, shorten the running time of ultrasonic transmitter and ultrasonic receiver, effective prolongation its serviceable life, achieve multiple spot simultaneously and stablize collection signal, ensure the accuracy of process.By every road independently signal of detecting of thickness transducer, be spliced into the thickness characteristics of whole banknote, effectively improve the judging nicety rate to the whether folded paper money of banknote.
Accompanying drawing explanation
Figure 1 shows that the structural representation of the correlation type ultrasonic module for stiff thickness detection of the present invention;
Figure 2 shows that ultrasound wave launches the circuit diagram of driving circuit;
Figure 3 shows that signal amplification circuit structural representation;
Figure 4 shows that signal holding circuit and signal discharge circuit schematic diagram.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 1, the present invention examines thick module for the correlation type ultrasonic that stiff thickness detects and comprises multipair, as 10 between the upper and lower every layout with the ultrasonic transmitter and the ultrasonic receiver that form banknote passageway, and controller, as programmable logic controller (PLC) part FPGA, set up communication for generation of control signal by interface and external devices; Wherein interface can adopt SPI communication mode, can reach the transmission speed of 10Mb/s, facilitates master control system real-time update data.
Ultrasound wave launches driving circuit, and the control signal produced by controller is supplied to ultrasonic transmitter after amplifying and launches predetermined power signal to make it; Ultrasound wave launches driving circuit can adopt general amplification oscillating circuit, as adopted circuit shown in Fig. 2.Control signal by the generation of controller interruption is amplified and is the energy supply of ultrasonic transmitter pulsed, enables ultrasonic transmitter launch high-power signal, and pulsed interval function, reduces running time, extends the serviceable life of each device.
Signal amplifies holding circuit, and itself and ultrasonic receiver one_to_one corresponding amplify with the ultrasonic signal received and keep being stabilized in predetermined voltage range; Introduce signal and amplify holding circuit, the feeble signal that ultrasonic receiver receives can be amplified and keep being stabilized in certain voltage range, so that signal acquisition circuit can accurate acquisition.As the oscillator signal of, ultrasound wave Received signal strength to be amplitude after 80dB amplifies be 9V, then make signal maintain about 4V through signal holding circuit, extend waveform life period simultaneously, facilitate the multi-site data collection of signal acquisition circuit.Adopt to extend signal after signal holding circuit can acquisition time, the batch (-type) modulation that can realize ultrasonic transmitter like this drives, and shortens its running time, extends serviceable life.Wherein, described signal amplifies holding circuit and comprises signal amplification circuit and signal holding circuit, described signal amplification circuit is three-stage amplifier, as adopted three high speed operation amplifiers, on the output resistance of high speed operation amplifier, be parallel with gain capacitances to realize open-loop gain simultaneously, this similarly to the prior art, as adopted shown in Fig. 3.No longer launch to describe at this.As shown in Figure 4, described signal holding circuit comprises the semibridge system rectification circuit that two diode D1 and D2 are formed, and the first resistance R45 be arranged in parallel between signal amplification circuit output with signal ground and the second resistance R46 and steady ripple electric capacity C42.The access point of the first described resistance R45 is positioned at the output terminal of signal amplification circuit, and the second described resistance R46 and steady ripple electric capacity C42 is positioned at two diode rear portions, is positioned at signal acquisition circuit access point anterior.
Signal acquisition circuit, gathers and amplifies the ultrasonic signal of holding circuit process through signal and be converted into digital signal and feed back to controller; It is for being converted into digital signal by simulating signal and transferring to controller, and it can adopt A/D chip, as ADS series.
Signal discharge circuit, receives discharge signal that controller produces afterwards in the collection of Acquisition Circuit settling signal and signal is amplified the signal losses kept in holding circuit, namely controlled signal is amplified holding circuit output and signal ground connect.Because electric charge can be accumulated on the steady ripple electric capacity of holding circuit, in order to increase sensor response speed, need before ultrasound wave sends pulse, the charge consumption on steady ripple electric capacity to be fallen, adopt signal amplification circuit to be fallen by the signal electric quantity consumption of maintenance to upgrade ultrasound wave Received signal strength, ensure accuracy and the processing speed of signal.As shown in Figure 4, described signal discharge circuit comprises a triode Q3, and described transistor base is communicated with controller through base resistance R49, and collector accesses through collector resistance R44 the output that signal amplifies holding circuit, and emitter meets signal ground SGND.
Ultrasound wave correlation of the present invention examines thick module, utilize ultrasound wave thick to its inspection, simplify mounting means, improve the adaptability of installation site, break away from the installation site constraint of servo-actuated rod, meanwhile, signal is utilized to amplify holding circuit, while improving signal transacting effect, shorten the running time of ultrasonic transmitter and ultrasonic receiver, effective prolongation its serviceable life, achieve multiple spot simultaneously and stablize collection signal, ensure the accuracy of process.By every road independently signal of detecting of thickness transducer, be spliced into the thickness characteristics of whole banknote, effectively improve the judging nicety rate to the whether folded paper money of banknote.
Specifically, described signal acquisition circuit is two and signal corresponding with the ultrasonic receiver of odd bits and even bit respectively amplifies holding circuit connects.By odd bits passage and even-numbered channels ultrasonic sensor independence, access unlike signal Acquisition Circuit respectively, prevent adjacent sensors from disturbing, and add system stability.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. the correlation type ultrasonic detected for stiff thickness examines a thick module, it is characterized in that, comprises paired and spaced apart ultrasonic transmitter and ultrasonic receiver, and,
Controller, sets up communication for generation of control signal by interface and external devices;
Ultrasound wave launches driving circuit, is supplied to ultrasonic transmitter and launches predetermined power signal to make it after control signal being amplified;
Signal amplifies holding circuit, and itself and ultrasonic receiver one_to_one corresponding arrange and to amplify with the ultrasonic signal received and to keep being stabilized in predetermined voltage range;
Signal acquisition circuit, gathers and amplifies the ultrasonic signal of holding circuit process through signal and be converted into digital signal and feed back to controller;
Signal discharge circuit, receives discharge signal that controller produces afterwards in the collection of Acquisition Circuit settling signal and signal is amplified the signal losses kept in holding circuit.
2. correlation type ultrasonic as claimed in claim 1 examines thick module, it is characterized in that, comprise multipair ultrasonic transmitter and ultrasonic receiver, it is launched driving circuit with described ultrasound wave respectively and is connected, and described signal acquisition circuit is at least two and interleaved ground amplifies holding circuit with signal and is connected.
3. correlation type ultrasonic as claimed in claim 2 examines thick module, it is characterized in that, interval is furnished with 10 pairs of ultrasonic transmitters and ultrasonic receiver, and described signal acquisition circuit is two and signal corresponding with the ultrasonic receiver of odd bits and even bit respectively amplifies holding circuit connects.
4. correlation type ultrasonic as claimed in claim 1 examines thick module, it is characterized in that, described signal amplifies holding circuit and comprises signal amplification circuit and signal holding circuit, described signal amplification circuit is three-stage amplifier, the output resistance of the operational amplifier of amplifying circuit is parallel with gain capacitances to realize open-loop gain.
5. correlation type ultrasonic as claimed in claim 4 examines thick module, it is characterized in that, described signal holding circuit comprises the semibridge system rectification circuit that two diodes are formed, and is arranged in parallel and exports the first resistance between signal ground and the second resistance and filter capacitor at signal amplification circuit.
6. correlation type ultrasonic as claimed in claim 1 examines thick module, it is characterized in that, described signal discharge circuit comprises a triode, described transistor base is communicated with controller through base resistance, collector amplifies the output of holding circuit through collector resistance access signal, and emitter connects signal ground.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105046805A (en) * | 2015-08-07 | 2015-11-11 | 新达通科技股份有限公司 | Banknote thickness detection device and calibration method |
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- 2015-05-13 CN CN201510242116.0A patent/CN104794801A/en active Pending
Patent Citations (10)
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CN2344752Y (en) * | 1998-11-10 | 1999-10-20 | 华中理工大学 | Ultrasonic multidimensional detecting and locating device |
CN1722871A (en) * | 2004-07-13 | 2006-01-18 | 中兴通讯股份有限公司 | Method of optimal system reconfiguration after intelligent antenna array element failure |
JP2008205877A (en) * | 2007-02-21 | 2008-09-04 | Sharp Corp | Pipeline ad conversion circuit and analog front end for image sensor using the circuit |
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Application publication date: 20150722 |