CN104793098B - A kind of substrate through-hole on off test device - Google Patents
A kind of substrate through-hole on off test device Download PDFInfo
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- CN104793098B CN104793098B CN201510208131.3A CN201510208131A CN104793098B CN 104793098 B CN104793098 B CN 104793098B CN 201510208131 A CN201510208131 A CN 201510208131A CN 104793098 B CN104793098 B CN 104793098B
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- probe card
- substrate
- hole
- probe
- conductive plate
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Abstract
The present invention discloses a kind of substrate through-hole on off test device, the probe card mounting bracket being hinged including conductive seat and with conductive seat, conductive seat top surface is provided with the lagging and longitudinal baffle for being additionally provided with compliant conductive plate, compliant conductive plate and spacing fixation being played to substrate to be detected;The top surface of conductive seat is additionally provided with conductive pole;Probe card mounting bracket is provided with probe card, the bottom surface of probe card is provided with one group of probe with the plated-through hole formation corresponding matching of substrate to be detected, the top surface of probe card is provided with binding post, and the every probe is connected by wire with binding post respectively, is also in series with indicator lamp in each wire respectively;It is engaged using compliant conductive plate with the bottom surface of substrate to be detected, plated-through hole is rapidly integrally in close contact with compliant conductive plate, compliant conductive plate is with low cost relative to traditional probe card, and simplify whole detection means, improves detection efficiency.
Description
Technical field
The present invention relates to microelectronic testing field, specifically a kind of substrate through-hole on off test device.
Background technology
Known, plated-through hole interconnection technique refers to realize that insulated substrate just carries on the back electricity interlinkage by plated-through hole
One conducting technology, support is provided to improve microelectronic product packing density.In hydrid integrated circuit, ceramic substrate is used
Plated-through hole interconnection technique is relatively conventional, is usually that the mode that conductor paste is filled in substrate through-hole is realized, however, right
In the case that appearance filling is insufficient in through hole filling process, or when there is shrinking fracture in conductor paste sintering process,
All easily there is the situation that plated-through hole is not turned on, cause the quality of connection problem of substrate.Therefore completed in plated-through hole
Post-order process in, it is necessary to plated-through hole carry out 100% conduction detection, underproof product is rejected in time.
At present, the common methods of substrate through-hole on off test have manual test, special flying probe tester, Simple testing table to survey
Examination;During manual conduction detection, the positive back of the body in same plated-through hole is pricked respectively by two electrode tips of the hand-held universal meter of operator
Face is tested, and sees whether universal meter can detect current signal, and the detection method speed is slow, efficiency is low, is suitable only for small lot
The detection operation of product.
, it is necessary to which by special flying probe instrument, flying probe tester is typically compiled by computer during substrate through-hole flying probe
Journey detects that detection speed is fast, alignment precision is high, detection efficiency is high, but required special flying probe tester is expensive, typically about needs
RMB up to a million, are unfavorable for popularizing.
Simple testing table clamps substrate generally by setting fixture, and passes through the probe and plated-through hole on fixture
It is connected, replaces looking for a connecting test manually with this,《Thick film hybrid integrated circuit module plated through-hole continuity test fixture》(It is public
Cloth CN203535078U)Patent document disclose a kind of device for clamping through holes by two pieces of needle plates up and down and turned on
Detection,《A kind of on off test machine that function is detected with small opening》(Publication No. CN203117344U)Patent document also disclose that
A kind of device for carrying out continuity test to through hole by upper and lower two pieces of probe cards, although these detection means are to a certain extent
Detection efficiency is improved, but on the one hand the structure of two pieces of probe cards adds the complexity of device, is unfavorable for operating personnel
Fast operating, on the other hand also increase the manufacturing cost of detection means.
The content of the invention
It is an object of the invention to provide a kind of substrate through-hole on off test device, the apparatus structure is simple, easy to use,
The break-make detection efficiency of substrate through-hole can be improved, manufacturing cost is reduced, and can also be to there is the progress of the substrate of crooked radian
Detection.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of substrate through-hole on off test device, including conductive seat and the probe card that is hinged with conductive seat are installed
Frame, the conductive seat top surface is provided with compliant conductive plate, and compliant conductive plate is used to place on substrate to be detected, compliant conductive plate also
Provided with the lagging and longitudinal baffle that spacing fixation is played to substrate to be detected;The top surface of the conductive seat is additionally provided with conduction
Post;The probe card mounting bracket is provided with probe card, and the bottom surface of probe card is formed provided with the plated-through hole with substrate to be detected
One group of probe of corresponding matching, the top surface of probe card is provided with binding post, and the every probe passes through wire and binding post phase respectively
Even, indicator lamp is also in series with respectively in each wire.
Further, the probe card mounting bracket is U-shaped, and the inner side of probe card mounting bracket is provided with to be coordinated with probe card formation
Slot.
Further, the conductive seat top surface is provided with plays the spacing of restriction effect to the turned position of probe card mounting bracket
Bar, the gag lever post, which is located at, is hinged side, and top and the formation of probe card mounting bracket of gag lever post coordinate.
The beneficial effects of the invention are as follows be engaged with the bottom surface of substrate to be detected using compliant conductive plate, on the one hand can
The plated-through hole of substrate to be detected is set rapidly integrally to be in close contact with compliant conductive plate, on the other hand, compliant conductive plate phase
It is with low cost for traditional probe card, and whole detection means is simplified, the difficulty of operation is reduced, detection efficiency is improved;
Due to the deformability characteristics of compliant conductive plate, the substrate for having crooked radian can also be completely attached to compliant conductive plate, so that real
Now to there is the detection of the substrate of crooked radian.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples:
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the assembling enlarged diagram of lagging, longitudinal baffle and compliant conductive plate in Fig. 1;
Fig. 3 is Fig. 1 middle probe card mounting brackets and the exploded perspective view of probe card;
Fig. 4 is the closure state schematic diagram of middle probe card mounting bracket of the present invention;
Fig. 5 is the enlarged diagram of binding post and indicator lamp in Fig. 4.
Embodiment
As shown in figure 1, the present invention provides a kind of substrate through-hole on off test device, including conductive seat 1 and with conduction
The probe card mounting bracket 8 that base 1 is hinged, the top surface of conductive seat 1 is provided with compliant conductive plate 2, can be in the top surface of conductive seat 1
Mounting groove is set, compliant conductive plate 2 is arranged in mounting groove, the top surface of compliant conductive plate 2 is existed with the top surface of conductive seat 1
In same level;Compliant conductive plate 2 is used to place substrate 3 to be detected;With reference to shown in Fig. 2, it is additionally provided with compliant conductive plate 2 pair
The lagging 5 of 3 spacing fixations of substrate to be detected and longitudinal baffle 6;Lagging 5 is provided with horizontal groove 5a, longitudinal baffle 6
Provided with longitudinal groove 6a, lagging 5 is connected by the first screw 16 with compliant conductive plate 2, the first screw 16 and horizontal groove 5a
Formed and coordinated, longitudinal baffle 6 is connected by the second screw 17 with compliant conductive plate 2, the second screw 17 is matched somebody with somebody with longitudinal groove 6a formation
Close;The top surface of the conductive seat 1 is additionally provided with conductive pole 7;With reference to shown in Fig. 3, the probe card mounting bracket 8 is U-shaped, probe card
The inner side of mounting bracket 8 is provided with slot 11, and probe card 9 is fixed by slot 11 with the grafting of probe card mounting bracket 8, the bottom of probe card 9
Face is provided with one group of probe 10 with the formation corresponding matching of plated-through hole 4 of substrate to be detected, and probe 10 is preferably telescopic
Spring probe;With reference to shown in Fig. 4 and Fig. 5, the top surface of probe card 9 is provided with binding post 13, and every probe 10 passes through wire 15 respectively
It is connected with binding post 13, is also in series with indicator lamp 14 in each wire 15 respectively.It can set logical with metallization in probe card 9
The one-to-one mounting hole in hole 4, the top of probe is connected by mounting hole with probe card, and one end of wire passes through mounting hole with visiting
The top of pin is connected, and the other end is connected with binding post 13.The top surface of conductive seat 1 is additionally provided with the rotation to probe card mounting bracket 8
The gag lever post 12 of restriction effect is played in position, and the gag lever post 12, which is located at, is hinged side, and top and the probe card of gag lever post 12 install 8 framves
Formed and coordinated.
In use, first digging probe card mounting bracket 8, substrate 3 to be detected is placed on compliant conductive plate 2, passes through lagging 5
Substrate 3 to be detected can be limited with longitudinal baffle 6, fix its position, can with longitudinal groove 6a by horizontal groove 5a
To adjust the position of lagging 5 and longitudinal baffle 6 respectively, for adapting to various sizes of substrate;The bottom surface of substrate 3 to be detected with it is soft
Property the overall contact of conductive plate 2, the bottom of plated-through hole 4 is fully contacted with compliant conductive plate 2;Then probe card installation is closed
Frame 8, makes the probe 10 in probe card 9 be corresponded with the plated-through hole 4 of substrate 3 to be detected and is in contact;Direct current is taken afterwards
Source, the positive pole of dc source is connected with binding post 13, and the negative pole of dc source is connected with conductive pole 7, viewing lamp 14, such as
Really all plated-through holes 4 are conducting, then the electric loop where each indicator lamp is path, all indicator lamps
All light;If some indicator lamp does not work, the electric loop where that shows the indicator lamp is breaking, corresponding to the indicator lamp
Plated-through hole be to be not turned on, so as to find substandard product.Simple in construction, easy to use, compliant conductive plate of the invention
It is with low cost relative to traditional probe card, the difficulty of operation is reduced, detection efficiency is improved, additionally, due to compliant conductive plate
Deformability characteristics, the substrate for having crooked radian can also be completely attached to compliant conductive plate, so as to realize to there is crooked radian
Substrate detection.
The above described is only a preferred embodiment of the present invention, not making any formal limitation to the present invention;Appoint
What those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the side of the disclosure above
Method and technology contents make many possible variations and modification to technical solution of the present invention, or are revised as the equivalent reality of equivalent variations
Apply example.Therefore, every content without departing from technical solution of the present invention, the technical spirit according to the present invention is done to above example
Any simple modification, equivalent substitution, equivalence changes and modification, still fall within technical solution of the present invention protection in the range of.
Claims (1)
1. a kind of substrate through-hole on off test device, it is characterised in that described device include conductive seat (1) and with conductive bottom
The probe card mounting bracket (8) that seat (1) is hinged, conductive seat (1) top surface is provided with compliant conductive plate (2), compliant conductive plate
(2) it is used to place to be additionally provided with substrate to be detected (3), compliant conductive plate (2) to play spacing fixation to substrate to be detected (3)
Lagging (5) and longitudinal baffle (6);The top surface of the conductive seat (1) is additionally provided with conductive pole (7);The probe card mounting bracket (8)
Probe card (9) is provided with, the bottom surface of probe card (9) is provided with plated-through hole (4) the formation corresponding matching with substrate to be detected (3)
One group of probe (10), the top surface of probe card (9) is provided with binding post (13), and every probe passes through wire and binding post (13) respectively
It is connected, is also in series with indicator lamp (14) in each wire respectively;The probe card mounting bracket (8) is U-shaped, probe card mounting bracket
(8) inner side is provided with the slot (11) coordinated with probe card (9) formation;Conductive seat (1) top surface is provided with pacifies to probe card
The gag lever post (12) of restriction effect is played in the turned position for shelving (8), and the gag lever post (12), which is located at, is hinged side, gag lever post (12)
Top coordinates with probe card mounting bracket (8) formation.
Priority Applications (1)
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CN201510208131.3A CN104793098B (en) | 2015-04-28 | 2015-04-28 | A kind of substrate through-hole on off test device |
Applications Claiming Priority (1)
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CN201510208131.3A CN104793098B (en) | 2015-04-28 | 2015-04-28 | A kind of substrate through-hole on off test device |
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CN104793098A CN104793098A (en) | 2015-07-22 |
CN104793098B true CN104793098B (en) | 2017-11-03 |
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CN201510208131.3A Active CN104793098B (en) | 2015-04-28 | 2015-04-28 | A kind of substrate through-hole on off test device |
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CN107132432B (en) * | 2016-02-29 | 2021-02-12 | 富泰华工业(深圳)有限公司 | Testing device |
CN105954671A (en) * | 2016-06-07 | 2016-09-21 | 珠海格力电器股份有限公司 | Wireless module calibration comprehensive testing tool |
JP7124834B2 (en) | 2017-12-26 | 2022-08-24 | 日本電産リード株式会社 | PCB inspection equipment |
CN114167259A (en) * | 2021-12-07 | 2022-03-11 | 华东光电集成器件研究所 | Method for programming and testing on-off of through holes of multi-piece substrate |
CN117075022A (en) * | 2023-10-16 | 2023-11-17 | 深圳市道格特科技有限公司 | Multi-performance test universal equipment for probe card |
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US5311120A (en) * | 1993-01-06 | 1994-05-10 | Bartholomew Mark R | Test fixture with test function feature |
US6084422A (en) * | 1997-11-10 | 2000-07-04 | Bartholomew; Mark | Printed circuit board testing device |
CN1168129C (en) * | 2000-11-23 | 2004-09-22 | 崇越科技股份有限公司 | Carrier for testing chip |
CN1553205A (en) * | 2003-06-03 | 2004-12-08 | 欣强科技股份有限公司 | Electrical property testing method of printing circuit board |
CN203012089U (en) * | 2012-11-13 | 2013-06-19 | 深圳市骏达光电有限公司 | FPC test fixture and FPC test system |
CN203535078U (en) * | 2013-11-20 | 2014-04-09 | 威科电子模块(深圳)有限公司 | Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module |
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