CN104791858A - Microwave oven - Google Patents
Microwave oven Download PDFInfo
- Publication number
- CN104791858A CN104791858A CN201510129113.6A CN201510129113A CN104791858A CN 104791858 A CN104791858 A CN 104791858A CN 201510129113 A CN201510129113 A CN 201510129113A CN 104791858 A CN104791858 A CN 104791858A
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- China
- Prior art keywords
- waveguide
- micro
- wave oven
- probe
- cavity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/707—Feed lines using waveguides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/66—Circuits
- H05B6/68—Circuits for monitoring or control
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Constitution Of High-Frequency Heating (AREA)
Abstract
The invention provides a microwave oven which comprises a cavity, a waveguide, a power feeding device and a semiconductor microwave source, wherein the waveguide is positioned on the outer side of the cavity; the breakover end of the waveguide is communicated with the cavity; the power feeding device is fixed on the inner end surface at the sealed end of the waveguide and is isolated from a short circuit surface of the waveguide; the semiconductor microwave source is positioned on the outer side of the waveguide; the connecting end of the semiconductor microwave source is connected with the power feeding device. Due to the adoption of the power feeding device, the problem of coaxially outputting microwaves emitted from microstrip lines of the semiconductor microwave source can be effectively solved, microwaves emitted from the semiconductor microwave source can be fed into the cavity of the microwave oven, the purpose that the semiconductor microwave source is applied to the microwave oven is achieved, and the microwave oven is relatively remarkable in practicability; meanwhile the design idea of company product optimization is also embodied, and the application of users can be relatively well met.
Description
Technical field
The present invention relates to field of household appliances, more specifically, relate to a kind of micro-wave oven.
Background technology
Semiconductor microwave oven uses semiconductor microactuator wave source to be fed in the cavity of micro-wave oven and sends microwave, heat food.The mode of heating of semiconductor microwave is different from magnetron, core devices (LDMOS pipe) volume of semiconductor microactuator wave technology is little, and pass through DC-voltage supply, the detection of heating using microwave standing wave, power stepless adjustment, microwave frequency adjustment, microwave output phase adjusted etc. can be realized, thus realize the intelligent and high-efficiency heating of semiconductor microwave oven.Along with semiconductor technology fast development, the application of semiconductor microactuator wave technology on micro-wave oven is inexorable trend.
Different from microwave magnetron stove (as shown in Figure 1), it is that 50 Europe microstrip lines turn coaxial output that semiconductor microactuator wave source sends microwave, export completely different from existing magnetron 4 ', how to realize the connection of semiconductor microactuator wave source and microwave oven cavity, become the technical problem that those skilled in the art need solution badly.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.
For this reason, the invention provides a kind of micro-wave oven, the microwave that semiconductor microactuator wave source can be made to launch is fed in the cavity of micro-wave oven, the microstrip line that effective solution semiconductor microwave source sends microwave simultaneously turns coaxial output problem, to be satisfied with the object that semiconductor microactuator wave source is applied to micro-wave oven, its practicality is more remarkable.
For achieving the above object, the invention provides a kind of micro-wave oven, comprising: cavity; Waveguide, is positioned at the outside of described cavity and its conduction terminal is connected with described cavity; RF power fed-in device, on the inner face being fixed on the blind end of described waveguide and with the short circuit face of described waveguide separately; With semiconductor microactuator wave source, be positioned at the outside of described waveguide and its link is connected with described RF power fed-in device.
Micro-wave oven provided by the invention, by the setting of RF power fed-in device, the microstrip line that effective solution semiconductor microwave source sends microwave turns coaxial output problem, the microwave that semiconductor microactuator wave source is launched is fed in the cavity of micro-wave oven, meet the object that semiconductor microactuator wave source is applied to micro-wave oven, its practicality is more remarkable; Also embody the design concept that enterprise product is optimized simultaneously, and meet user's use better.
In addition, the micro-wave oven that the above embodiment of the present invention provides also has following additional technical characteristic:
According to one embodiment of present invention, described RF power fed-in device is probe, and described semiconductor microactuator wave source is semiconductor circuit board.
Solve the microstrip line that semiconductor microactuator wave source sends microwave turn coaxial output problem by arranging probe, make it be fed in the cavity of micro-wave oven by waveguide, be applied to micro-wave oven to realize semiconductor microactuator wave source.
According to one embodiment of present invention, described micro-wave oven also comprises: cable, its one end is connected with the link of described semiconductor microactuator wave source, the other end is connected with described RF power fed-in device, that is: described RF power fed-in device is connected with described semiconductor microactuator wave source by described cable, so then can be convenient to the connection of RF power fed-in device and semiconductor microactuator wave source better, be convenient to be optimized setting to the structure of microwave oven internal.
According to one embodiment of present invention, described RF power fed-in device comprises: probe, is fixed on the inner face of the blind end of described waveguide; And joint, be positioned at the outside of described waveguide, and the outer face being fixed on the blind end of described waveguide connects described cable and described probe.
That is: probe is fixed on the blind end of waveguide by joint, and probe is connected with cable by joint, and cable also connects semiconductor microactuator wave source simultaneously.
According to one embodiment of present invention, described probe has on jack, described joint and have tongue, described tongue is plugged in described jack; And be connected by N connector structure between described joint with described cable and/or between described cable with described semiconductor microactuator wave source, and be welded and fixed by tin.
This kind of connected mode not only simple, convenient working, be also convenient to detachable maintaining simultaneously, and can promote the efficiency of assembling of micro-wave oven, its practicality is better.
According to one embodiment of present invention, described probe comprises: cylindrical section; And conical section, between described cylindrical section and described joint, and its tip has described jack, the other end is connected with described cylindrical section.
Wherein, the material of probe is copper, can be gold-plated or silver-colored etc. high-conductivity metal carry out improving performance, probe is adding man-hour, and its surface requirements is bright and clean.
According to one embodiment of present invention, the height of described cylindrical section and described conical section is equal.
According to one embodiment of present invention, the distance between the axis of described probe and the short circuit face of described waveguide is 29 ~ 32mm.
According to one embodiment of present invention, the described probe degree of depth inserted in described waveguide is not less than 1/2 of described duct thickness.
In sum, micro-wave oven provided by the invention, by the setting of RF power fed-in device, the microstrip line that effective solution semiconductor microwave source sends microwave turns coaxial output problem, the microwave that semiconductor microactuator wave source is launched is fed in the cavity of micro-wave oven, meet the object that semiconductor microactuator wave source is applied to micro-wave oven, its practicality is more remarkable; Also embody the design concept that enterprise product is optimized simultaneously, and meet user's use better.
Additional aspect of the present invention and advantage become obvious by description part below, or are recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the structural representation of the micro-wave oven described in correlation technique embodiment;
Fig. 2 is the structural representation of the micro-wave oven described in one embodiment of the invention;
Fig. 3 is the structural representation of the micro-wave oven described in another embodiment of the present invention;
Fig. 4 is the sectional structure schematic diagram of the probe in Fig. 3;
Fig. 5 is the broken section structural representation of the joint in Fig. 3;
Fig. 6 is the structural representation of the cable in Fig. 3;
Fig. 7 is the structural representation of the semiconductor microactuator wave source in Fig. 3.
Wherein, the corresponding relation in Fig. 1 between Reference numeral and component names is:
1 ' cavity, 2 ' waveguide, 4 ' magnetron.
Corresponding relation in Fig. 2 to Fig. 7 between Reference numeral and component names is:
1 cavity, 2 waveguides, 21 short circuit faces, 31 probes, 32 joints, 4 semiconductor microactuator wave sources, 5 cables, 61 tongues, 62 jacks.
Detailed description of the invention
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from mode described here to implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
Below in conjunction with accompanying drawing, the micro-wave oven described in some embodiments of the invention is described.
Micro-wave oven provided by the invention, as shown in Figures 2 and 3, comprising: cavity 1; Waveguide 2, is positioned at the outside of described cavity 1 and its conduction terminal is connected with described cavity 1; RF power fed-in device, on the inner face being fixed on the blind end of described waveguide 2 and with the short circuit face 21 of described waveguide 2 separately; With semiconductor microactuator wave source 4 (as shown in Figure 7), be positioned at the outside of described waveguide 2 and its link is connected with described RF power fed-in device.
Micro-wave oven provided by the invention, by the setting of RF power fed-in device, the microstrip line that effective solution semiconductor microwave source 4 sends microwave turns coaxial output problem, the microwave that semiconductor microactuator wave source 4 is launched is fed in the cavity 1 of micro-wave oven, meet the object that semiconductor microactuator wave source 4 is applied to micro-wave oven, its practicality is more remarkable; Also embody the design concept that enterprise product is optimized simultaneously, and meet user's use better.
In addition, the micro-wave oven that the above embodiment of the present invention provides also has following additional technical characteristic:
In one embodiment of the present of invention, described RF power fed-in device is probe 31, and described semiconductor microactuator wave source 4 is semiconductor circuit board (this scheme is not shown).
Solve the microstrip line that semiconductor microactuator wave source 4 sends microwave turn coaxial output problem by arranging probe 31, make it be fed in the cavity 1 of micro-wave oven by waveguide 2, be applied to micro-wave oven to realize semiconductor microactuator wave source 4.
In one embodiment of the present of invention, as shown in Figure 3 and Figure 6, described micro-wave oven also comprises: cable 5, its one end is connected with the link of described semiconductor microactuator wave source 4, the other end is connected with described RF power fed-in device, that is: described RF power fed-in device is connected with described semiconductor microactuator wave source 4 by described cable 5, so then can be convenient to the connection of RF power fed-in device and semiconductor microactuator wave source 4 better, be convenient to be optimized setting to the structure of microwave oven internal.
Wherein, as shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, described RF power fed-in device comprises: probe 31, is fixed on the inner face of the blind end of described waveguide 2; With joint 32, be positioned at the outside of described waveguide 2, and the outer face being fixed on the blind end of described waveguide 2 connects described cable 5 and described probe 31.
That is: probe 31 is fixed on the blind end of waveguide 2 by joint 32, and probe 31 is connected with cable 5 by joint 32, and cable 5 also connects semiconductor microactuator wave source 4 simultaneously.
Particularly, as shown in Figure 4 and Figure 5, described probe 31 has on jack 62, described joint 32 and have tongue 61, described tongue 61 is plugged in described jack 62; And be connected by N connector 32 structure between described joint 32 with described cable 5 and/or between described cable 5 with described semiconductor microactuator wave source 4, and be welded and fixed by tin.
This kind of connected mode not only simple, convenient working, be also convenient to detachable maintaining simultaneously, and can promote the efficiency of assembling of micro-wave oven, its practicality is better.
Certainly, other modes also can be adopted to fix, as fixing, gluing the fixing that be spirally connected, all can realize the object of the application, its aim does not depart from design philosophy of the present invention, does not repeat them here, but should belong in the protection domain of the application.
In one embodiment of the present of invention, as shown in Figures 2 to 4, described probe 31 comprises: cylindrical section; And conical section, between described cylindrical section and described joint 32, and its tip has described jack 62, the other end is connected with described cylindrical section.
Wherein, the material of probe 31 is copper, can be gold-plated or silver-colored etc. high-conductivity metal carry out improving performance, probe 31 is adding man-hour, and its surface requirements is bright and clean.
And described cylindrical section and described conical section are integral type structure.
In one embodiment of the present of invention, designed by simulation optimization, preferably, the height of described cylindrical section and described conical section is equal, distance between the axis of described probe 31 and the short circuit face 21 of described waveguide 2 is 29 ~ 32mm (being about 1/4 of wavelength), and described probe 31 degree of depth inserted in described waveguide 2 is not less than 1/2 of described waveguide 2 thickness.
Especially, the height of described cylindrical section and described conical section is 7mm, the diameter of described cylindrical section is 14mm, distance between the axis of described probe 31 and the short circuit face 21 of described waveguide 2 is 30mm, the thickness of described waveguide 2 is 26mm, and described probe 31 degree of depth inserted in described waveguide 2 is 15.9mm.
Adopt the micro-wave oven of above-mentioned data supporting, the speed of its heating using microwave food is faster, efficiency utilization rate is also relatively high, fully presents the design concept that enterprise product is optimized, and meets user better and purchase demand for micro-wave oven.
Wherein, preferably, described waveguide 2 is waveguide.
In sum, micro-wave oven provided by the invention, by the setting of RF power fed-in device, the microstrip line that effective solution semiconductor microwave source sends microwave turns coaxial output problem, the microwave that semiconductor microactuator wave source is launched is fed in the cavity of micro-wave oven, meet the object that semiconductor microactuator wave source is applied to micro-wave oven, its practicality is more remarkable; Also embody the design concept that enterprise product is optimized simultaneously, and meet user's use better.
In describing the invention, term " installation ", " being connected ", " connection ", " fixing " etc. all should be interpreted broadly, and such as, " connection " can be fixedly connected with, and also can be removably connect, or connects integratedly; Can be directly be connected, also indirectly can be connected by intermediary.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this description, specific features, structure, material or feature that the description of term " embodiment ", " some embodiments ", " specific embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a micro-wave oven, is characterized in that, comprising:
Cavity;
Waveguide, is positioned at the outside of described cavity and its conduction terminal is connected with described cavity;
RF power fed-in device, on the inner face being fixed on the blind end of described waveguide and with the short circuit face of described waveguide separately; With
Semiconductor microactuator wave source, is positioned at the outside of described waveguide and its link is connected with described RF power fed-in device.
2. micro-wave oven according to claim 1, is characterized in that,
Described RF power fed-in device is probe, and described semiconductor microactuator wave source is semiconductor circuit board.
3. micro-wave oven according to claim 1, is characterized in that, also comprises:
Cable, its one end is connected with the link of described semiconductor microactuator wave source, the other end is connected with described RF power fed-in device, that is: described RF power fed-in device is connected with described semiconductor microactuator wave source by described cable.
4. micro-wave oven according to claim 3, is characterized in that, described RF power fed-in device comprises:
Probe, is fixed on the inner face of the blind end of described waveguide; With
Joint, is positioned at the outside of described waveguide, and the outer face being fixed on the blind end of described waveguide connects described cable and described probe.
5. micro-wave oven according to claim 4, is characterized in that,
Described probe has on jack, described joint and have tongue, described tongue is plugged in described jack;
Be connected by N connector structure between described joint with described cable and/or between described cable with described semiconductor microactuator wave source.
6. micro-wave oven according to claim 5, is characterized in that, described probe comprises:
Cylindrical section; With
Conical section, between described cylindrical section and described joint, and its tip has described jack, the other end is connected with described cylindrical section.
7. micro-wave oven according to claim 6, is characterized in that,
The height of described cylindrical section and described conical section is equal.
8. micro-wave oven according to claim 6, is characterized in that,
Distance between the axis of described probe and the short circuit face of described waveguide is 29 ~ 32mm.
9. micro-wave oven according to claim 6, is characterized in that,
The described probe degree of depth inserted in described waveguide is not less than 1/2 of described duct thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510129113.6A CN104791858A (en) | 2015-03-23 | 2015-03-23 | Microwave oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510129113.6A CN104791858A (en) | 2015-03-23 | 2015-03-23 | Microwave oven |
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| Publication Number | Publication Date |
|---|---|
| CN104791858A true CN104791858A (en) | 2015-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510129113.6A Pending CN104791858A (en) | 2015-03-23 | 2015-03-23 | Microwave oven |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0482601A1 (en) * | 1990-10-26 | 1992-04-29 | Bosch-Siemens HausgerÀ¤te GmbH | Microwaves supply in microwave baking ovens |
| CN101979923A (en) * | 2010-11-17 | 2011-02-23 | 美的集团有限公司 | Microwave oven with a heat exchanger |
| CN102374557A (en) * | 2011-10-31 | 2012-03-14 | 广东美的微波电器制造有限公司 | Microwave feeding structure of semiconductor microwave oven |
| CN204157091U (en) * | 2014-10-27 | 2015-02-11 | 广东美的厨房电器制造有限公司 | Microwave source and there is the microwave oven of this microwave source |
| CN204534708U (en) * | 2015-03-23 | 2015-08-05 | 广东美的厨房电器制造有限公司 | Micro-wave oven |
-
2015
- 2015-03-23 CN CN201510129113.6A patent/CN104791858A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0482601A1 (en) * | 1990-10-26 | 1992-04-29 | Bosch-Siemens HausgerÀ¤te GmbH | Microwaves supply in microwave baking ovens |
| CN101979923A (en) * | 2010-11-17 | 2011-02-23 | 美的集团有限公司 | Microwave oven with a heat exchanger |
| CN102374557A (en) * | 2011-10-31 | 2012-03-14 | 广东美的微波电器制造有限公司 | Microwave feeding structure of semiconductor microwave oven |
| CN204157091U (en) * | 2014-10-27 | 2015-02-11 | 广东美的厨房电器制造有限公司 | Microwave source and there is the microwave oven of this microwave source |
| CN204534708U (en) * | 2015-03-23 | 2015-08-05 | 广东美的厨房电器制造有限公司 | Micro-wave oven |
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Application publication date: 20150722 |
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