CN104787496A - Packaging method for fragile wafers - Google Patents
Packaging method for fragile wafers Download PDFInfo
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- CN104787496A CN104787496A CN201510015619.4A CN201510015619A CN104787496A CN 104787496 A CN104787496 A CN 104787496A CN 201510015619 A CN201510015619 A CN 201510015619A CN 104787496 A CN104787496 A CN 104787496A
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- packaging bag
- packing
- packing box
- completing steps
- box
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
- 235000012431 wafers Nutrition 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000012856 packing Methods 0.000 claims description 54
- 238000004049 embossing Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000003860 storage Methods 0.000 abstract description 5
- 238000001125 extrusion Methods 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000012795 verification Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a packaging method for fragile wafers. The method includes the steps of fixing of a flower-shaped pressing piece, packaging box containing, packaging box vacuumizing, packaging bag wrapping, packaging bag vacuumizing, packaging bag air charging, repeated packaging bag vacuumizing and packaging bag air charging and packaging bag sealing. The method solves the problems that an existing packaging mode is simplex, the protection effect is poor and the wafers are prone to oxidization in storage and prone to damage in transportation. Through multiple packaging layers and various protection measures, the damage rate of the wafers in transportation is decreased, and it is ensured that the wafers are complete and safe in transportation. The method is reasonable and effective, product uniformity is high in the industrialization process, the product package is high in shock resistance and extrusion resistance, the damage rate of the wafers in transportation is greatly decreased, and the industrialization cost is lowered.
Description
Technical field
The present invention relates to a kind of packing method, particularly relate to a kind of packing method of brittle wafers.
Background technology
In the production link of monocrystal chip, the storage of crystal and transport be one usually by process procedure that people ignore.We it has been generally acknowledged that the growth of crystal, processing is important, and to the storage of crystal with transport few people and pay close attention to and research.This appearing to is that inessential details but brings huge trouble to our product design just, and the enterprise of let us pays painful cost.
It is unitary package box, packaging bags that existing market wafer great majority adopt, and corresponding technology of the package industrialization homogeneity of product is poor, low to the protection of product, and in wafer storage, easily oxidation, transportation are easily damaged.But; state of the art mainly around packing box, packaging bag research; the concrete technology of the package of semicon industry there is no related application; document or patent is not had to set forth the technology of the package in wafer handling way yet; therefore; for the technical task that the research of more effective, the safe technology of the package of protection wafer has become this field great, need a large amount of to put into practice, verification experimental verification.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of packing method of brittle wafers is provided.
A kind of packing method of brittle wafers comprises the following steps:
1) embossing is fixed: side embossing being placed on wafer, fixed wafer;
2) packing box holds: by completing steps 1) wafer place in packing box;
3) packing box is found time: by completing steps 2) packing box in air find time completely;
4) packaging bag parcel: by completing steps 3) packing box place in packaging bag;
5) packaging bag is found time: by completing steps 4) packaging bag air find time completely, packing box surface is close in packaging bag;
6) packaging bag inflation: by completing steps 5) packaging bag be filled with unreactable gas, until packing box just external packaging bag, packing box cannot be movable in packaging bag;
7) packaging bag repeats to find time, inflate: by completing steps 6) packaging bag repeat step 5), step 6), multiplicity once more than;
8) packaging bag sealing: by completing steps 7) packing bag mouth sealing, place cartons dividing plate in.
Described side embossing being placed on wafer is the crystal back side, fixed crystal.
Described embossing is flexible material, and profile is dome-shaped.
Described packing box is round box shape shape, and circle box comprises box body and lid, and after covering lid, embossing arch position is just tight against lid.
Described packaging bag is elasticity material.
Described unreactable gas be in purity higher than 99.999% nitrogen.
Problems such as using the present invention, solve existing manner of packing single, protection is low, be easily oxidized in wafer storage, transportation is easily damaged.The present invention, by multi-layer packaging and multiple protection, reduces damage rate in wafer handling way, ensures that wafer is intact, transports safely.This rational technology is effective, and in industrialization process, homogeneity of product is strong, and packing of product antidetonation, anti-extrusion ability are high, greatly reduce wafer damage rate in transit, have saved industrialization cost.
Accompanying drawing explanation
Fig. 1 is a kind of packing method diagram of circuit of brittle wafers;
Fig. 2 is explosion-proof another structural representation of stove dust collector of a kind of novel synthesis;
Fig. 3 is a kind of novel synthesis explosion-proof stove dust collector synthetic furnace one stationary arrangement schematic diagram;
Fig. 4 is another stationary arrangement schematic diagram of a kind of novel synthesis explosion-proof stove dust collector synthetic furnace;
Fig. 5 is schematic diagram after a kind of packing method packaging bag inflation of brittle wafers;
In figure, wafer 1, embossing 2, packing box 3, packaging bag 4, packing bag mouth 5.
Detailed description of the invention
As shown in Figure 1, a kind of packing method of brittle wafers comprises the following steps:
1) embossing 2 is fixed: side embossing 2 being placed on wafer 1, fixed wafer 1, as shown in Figure 2;
2) packing box 3 holds: by completing steps 1) wafer 1 place in packing box 3, as shown in Figure 3;
3) packing box 3 is found time: by completing steps 2) packing box 3 in air find time completely;
4) packaging bag 4 is wrapped up: by completing steps 3) packing box 3 place in packaging bag 4, as shown in Figure 4;
5) packaging bag 4 is found time: by completing steps 4) packaging bag 4 air find time completely, packaging bag 4 be close to packing box 3 surface;
6) packaging bag 4 is inflated: by completing steps 5) packaging bag 4 be filled with unreactable gas, until packing box 3 just external packaging bag 4, packing box 3 cannot be movable in packaging bag 4, as shown in Figure 5;
7) packaging bag 4 repeats to find time, inflate: by completing steps 6) packaging bag 4 repeat step 5), step 6), multiplicity once more than.
8) packaging bag 4 seals: by completing steps 7) packing bag mouth 5 seal, place cartons dividing plate in.
Side embossing 2 being placed on wafer in the packing method of brittle wafers is a crystal back side, fixed crystal.
Embossing in the packing method of brittle wafers is a flexible material, and profile is dome-shaped.
As shown in Figure 3, the packing box in a kind of packing method of brittle wafers is round box shape shape, and circle box comprises box body and lid, and after covering lid, embossing arch position is just tight against lid.
Packaging bag in a kind of packing method of brittle wafers is elasticity material.
Unreactable gas in a kind of packing method of brittle wafers be in purity higher than 99.999% nitrogen.
Claims (6)
1. a packing method for brittle wafers, is characterized in that comprising the following steps:
1) embossing is fixed: side embossing being placed on wafer, fixed wafer;
2) packing box holds: by completing steps 1) wafer place in packing box;
3) packing box is found time: by completing steps 2) packing box in air find time completely;
4) packaging bag parcel: by completing steps 3) packing box place in packaging bag;
5) packaging bag is found time: by completing steps 4) packaging bag air find time completely, packing box surface is close in packaging bag;
6) packaging bag inflation: by completing steps 5) packaging bag be filled with unreactable gas, until packing box just external packaging bag, packing box cannot be movable in packaging bag;
7) packaging bag repeats to find time, inflate: by completing steps 6) packaging bag repeat step 5), step 6), multiplicity once more than;
8) packaging bag sealing: by completing steps 7) packing bag mouth sealing, place cartons dividing plate in.
2. the packing method of a kind of brittle wafers according to claim 1, is characterized in that described side embossing being placed on wafer is the crystal back side, fixed crystal.
3. the packing method of a kind of brittle wafers according to claim 1 and 2, it is characterized in that described embossing is flexible material, profile is dome-shaped.
4. the packing method of a kind of brittle wafers according to claim 1, is characterized in that described packing box is round box shape shape, and circle box comprises box body and lid, and after covering lid, embossing arch position is just tight against lid.
5. the packing method of a kind of brittle wafers according to claim 1, is characterized in that described packaging bag is elasticity material.
6. the packing method of a kind of brittle wafers according to claim 1, it is characterized in that described unreactable gas be in purity higher than 99.999% nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510015619.4A CN104787496A (en) | 2014-12-09 | 2015-01-13 | Packaging method for fragile wafers |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410744366X | 2014-12-09 | ||
| CN201410744366 | 2014-12-09 | ||
| CN201510015619.4A CN104787496A (en) | 2014-12-09 | 2015-01-13 | Packaging method for fragile wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104787496A true CN104787496A (en) | 2015-07-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510015619.4A Pending CN104787496A (en) | 2014-12-09 | 2015-01-13 | Packaging method for fragile wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104787496A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113173285A (en) * | 2021-05-24 | 2021-07-27 | 上海超硅半导体有限公司 | Packaging method of silicon wafer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07330039A (en) * | 1994-06-09 | 1995-12-19 | Dainippon Printing Co Ltd | Sealing bag |
| CN1579892A (en) * | 2003-07-31 | 2005-02-16 | 蒂利亚国际公司 | Fragile-product cage for vacuum packaging appliances |
| CN101047138A (en) * | 2006-03-29 | 2007-10-03 | 联华电子股份有限公司 | Chip transport box and operation method of chip transport box |
| CN102001485A (en) * | 2009-08-31 | 2011-04-06 | 中芯国际集成电路制造(上海)有限公司 | Wafer packing string and wafer vacuum packing method |
| CN103231825A (en) * | 2013-05-15 | 2013-08-07 | 中锗科技有限公司 | Nitrogen-filled packaging method of germanium substrate piece of solar battery |
-
2015
- 2015-01-13 CN CN201510015619.4A patent/CN104787496A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07330039A (en) * | 1994-06-09 | 1995-12-19 | Dainippon Printing Co Ltd | Sealing bag |
| CN1579892A (en) * | 2003-07-31 | 2005-02-16 | 蒂利亚国际公司 | Fragile-product cage for vacuum packaging appliances |
| CN101047138A (en) * | 2006-03-29 | 2007-10-03 | 联华电子股份有限公司 | Chip transport box and operation method of chip transport box |
| CN102001485A (en) * | 2009-08-31 | 2011-04-06 | 中芯国际集成电路制造(上海)有限公司 | Wafer packing string and wafer vacuum packing method |
| CN103231825A (en) * | 2013-05-15 | 2013-08-07 | 中锗科技有限公司 | Nitrogen-filled packaging method of germanium substrate piece of solar battery |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113173285A (en) * | 2021-05-24 | 2021-07-27 | 上海超硅半导体有限公司 | Packaging method of silicon wafer |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151123 Address after: 344000 Jiangxi city of Fuzhou province high tech Zone gold Ni Road No. 198 incubator Park A7 building 3 floor Applicant after: JIANGXI DEYI SEMICONDUCTOR TECHNOLOGY CO., LTD. Address before: 344000 Jiangxi city of Fuzhou province high tech Zone gold Ni Road No. 198 incubator Park building A7 Applicant before: Yi Defu |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |
|
| RJ01 | Rejection of invention patent application after publication |