CN104766831B - 一种集成传感器的封装结构 - Google Patents
一种集成传感器的封装结构 Download PDFInfo
- Publication number
- CN104766831B CN104766831B CN201510181957.5A CN201510181957A CN104766831B CN 104766831 B CN104766831 B CN 104766831B CN 201510181957 A CN201510181957 A CN 201510181957A CN 104766831 B CN104766831 B CN 104766831B
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- sensor
- substrate
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- encapsulation
- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000005538 encapsulation Methods 0.000 claims abstract description 40
- 238000009413 insulation Methods 0.000 abstract description 6
- 230000002452 interceptive effect Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 3
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- ROXBGBWUWZTYLZ-UHFFFAOYSA-N [6-[[10-formyl-5,14-dihydroxy-13-methyl-17-(5-oxo-2h-furan-3-yl)-2,3,4,6,7,8,9,11,12,15,16,17-dodecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4-methoxy-2-methyloxan-3-yl] 4-[2-(4-azido-3-iodophenyl)ethylamino]-4-oxobutanoate Chemical compound O1C(C)C(OC(=O)CCC(=O)NCCC=2C=C(I)C(N=[N+]=[N-])=CC=2)C(OC)CC1OC(CC1(O)CCC2C3(O)CC4)CCC1(C=O)C2CCC3(C)C4C1=CC(=O)OC1 ROXBGBWUWZTYLZ-UHFFFAOYSA-N 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (6)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510181957.5A CN104766831B (zh) | 2015-04-16 | 2015-04-16 | 一种集成传感器的封装结构 |
PCT/CN2015/096910 WO2016165360A1 (zh) | 2015-04-16 | 2015-12-10 | 一种集成传感器的封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510181957.5A CN104766831B (zh) | 2015-04-16 | 2015-04-16 | 一种集成传感器的封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104766831A CN104766831A (zh) | 2015-07-08 |
CN104766831B true CN104766831B (zh) | 2018-03-23 |
Family
ID=53648582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510181957.5A Active CN104766831B (zh) | 2015-04-16 | 2015-04-16 | 一种集成传感器的封装结构 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104766831B (zh) |
WO (1) | WO2016165360A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104766831B (zh) * | 2015-04-16 | 2018-03-23 | 歌尔股份有限公司 | 一种集成传感器的封装结构 |
CN105676621A (zh) * | 2016-03-26 | 2016-06-15 | 林捷达 | 一种带照度检测的智能手表 |
CN105629713A (zh) * | 2016-03-26 | 2016-06-01 | 林捷达 | 一种带湿度检测的智能手表 |
CN105652654A (zh) * | 2016-03-26 | 2016-06-08 | 林捷达 | 一种带磁场强度检测的智能手表 |
US10149031B2 (en) * | 2016-05-26 | 2018-12-04 | Knowles Electronics, Llc | Microphone device with integrated pressure sensor |
CN108726469A (zh) * | 2018-08-17 | 2018-11-02 | 宁波琻捷电子科技有限公司 | 传感器封装结构及方法 |
CN112701211B (zh) * | 2020-12-29 | 2023-04-28 | 上海烨映微电子科技股份有限公司 | 红外热电堆封装结构及方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201403194Y (zh) * | 2009-03-27 | 2010-02-10 | 瑞声声学科技(常州)有限公司 | Mems麦克风 |
CN102131139A (zh) * | 2010-01-19 | 2011-07-20 | 美商富迪科技股份有限公司 | 微机电***麦克风封装体及其制造方法 |
CN102833659A (zh) * | 2012-08-25 | 2012-12-19 | 歌尔声学股份有限公司 | Mems麦克风及其制造方法 |
CN102859688A (zh) * | 2010-02-26 | 2013-01-02 | 优博创新科技产权有限公司 | 用于微机电***器件的半导体封装体及其制造方法 |
CN202799143U (zh) * | 2012-08-25 | 2013-03-13 | 歌尔声学股份有限公司 | Mems麦克风 |
CN103843134A (zh) * | 2011-10-03 | 2014-06-04 | 国际商业机器公司 | 用于esd、emi以及emc的***物 |
CN203820443U (zh) * | 2013-07-18 | 2014-09-10 | 瑞声声学科技(深圳)有限公司 | Mems封装 |
CN204464258U (zh) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | 一种集成传感器的封装结构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6927482B1 (en) * | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
US20070075417A1 (en) * | 2005-10-05 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | MEMS module package using sealing cap having heat releasing capability and manufacturing method thereof |
JP5174673B2 (ja) * | 2005-10-14 | 2013-04-03 | エスティーマイクロエレクトロニクス エス.アール.エル. | 基板レベル・アセンブリを具えた電子装置及びその製造処理方法 |
JP2010040656A (ja) * | 2008-08-01 | 2010-02-18 | Yamaha Corp | 半導体パッケージ、半導体装置及びその製造方法、並びにマイクロフォンパッケージ |
US20130320465A1 (en) * | 2012-05-30 | 2013-12-05 | Merry Electronics Co., Ltd. | Thin mems microphone module |
CN104766831B (zh) * | 2015-04-16 | 2018-03-23 | 歌尔股份有限公司 | 一种集成传感器的封装结构 |
-
2015
- 2015-04-16 CN CN201510181957.5A patent/CN104766831B/zh active Active
- 2015-12-10 WO PCT/CN2015/096910 patent/WO2016165360A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201403194Y (zh) * | 2009-03-27 | 2010-02-10 | 瑞声声学科技(常州)有限公司 | Mems麦克风 |
CN102131139A (zh) * | 2010-01-19 | 2011-07-20 | 美商富迪科技股份有限公司 | 微机电***麦克风封装体及其制造方法 |
CN102859688A (zh) * | 2010-02-26 | 2013-01-02 | 优博创新科技产权有限公司 | 用于微机电***器件的半导体封装体及其制造方法 |
CN103843134A (zh) * | 2011-10-03 | 2014-06-04 | 国际商业机器公司 | 用于esd、emi以及emc的***物 |
CN102833659A (zh) * | 2012-08-25 | 2012-12-19 | 歌尔声学股份有限公司 | Mems麦克风及其制造方法 |
CN202799143U (zh) * | 2012-08-25 | 2013-03-13 | 歌尔声学股份有限公司 | Mems麦克风 |
CN203820443U (zh) * | 2013-07-18 | 2014-09-10 | 瑞声声学科技(深圳)有限公司 | Mems封装 |
CN204464258U (zh) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | 一种集成传感器的封装结构 |
Also Published As
Publication number | Publication date |
---|---|
WO2016165360A1 (zh) | 2016-10-20 |
CN104766831A (zh) | 2015-07-08 |
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PB01 | Publication | ||
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Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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Effective date of registration: 20200609 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |