CN104756403B - LC filter cells body and LC wave filters - Google Patents

LC filter cells body and LC wave filters Download PDF

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Publication number
CN104756403B
CN104756403B CN201480002753.4A CN201480002753A CN104756403B CN 104756403 B CN104756403 B CN 104756403B CN 201480002753 A CN201480002753 A CN 201480002753A CN 104756403 B CN104756403 B CN 104756403B
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circuit
capacitance
ceramic layer
inductance
lead
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CN104756403A (en
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增田博志
松井则文
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Abstract

The present invention is that the design cost for making to be carried out the LC wave filters needed for various change using the characteristic for jumping over the decay pole that coupling is formed is reduced.LC filter cells body (100) includes：The ceramic layer stack (10) that multiple ceramic layers (11~61) are laminated, in the LC filter circuits that ceramic layer stack (10) is internally formed, in input terminal, lead-out terminal and the ground terminal that ceramic layer stack (10) surface is formed.As the circuit element that coupling is jumped over by being connected and formation decay pole, composition with LC filter circuits, formed on the surface of ceramic layer stack (10) for installing at least one installation in the inductance, capacitance and SAW resonator of peripheral hardware with electrode (64a, 64b).

Description

LC filter cells body and LC wave filters
Technical field
The present invention relates to be connected to form jump over coupling circuit element and use LC filter cells body and LC filter Ripple device.
Background technology
In the past, in the electronic equipment of mobile communication equipment etc., LC wave filters are widely used as the signal for making allocated frequency band The electronic component passed through.
Such as in patent document 1 (Japanese Patent Laid-Open 2012-23752 publications), disclose in ceramic layer stack Inside, forms the LC wave filters of circuit pattern using internal electrode.The circuit pattern connects with forming the circuit element for jumping over and coupling Connect, there is decay pole on defined frequency location, play a role as LC filter circuits.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 2012-23752 publications
The content of the invention
The technical problems to be solved by the invention
LC wave filters are according to purposes, it is desirable to possess and various pass through characteristic.Also, make having by characteristic for LC wave filters more A kind of method of sample is to make to jump over coupling (" jumping over coupling " by connecting and composing in the required location of LC filter circuits Refer to separate one section or the circuit structure of multistage and be electrically coupled) circuit element so that the decay pole formed is declined Subtract the method that characteristic changes.
However, in the conventional LC wave filters, in order to jump over the circuit element of coupling by connecting and composing to make The attenuation characteristic of the decay pole of formation changes, it is necessary in each LC wave filters, changes the inside electricity inside multilayered ceramic body The problem of pattern form of pole crosses position of pore electrod etc., and the design cost of generation LC wave filters becomes higher.
Technical scheme applied to solve the technical problem
Present invention aims to the LC filtering of various change occurs using the characteristic for jumping over the decay pole that coupling is formed The design cost of device reduces.
The present invention is used for LC filter cell bodies, and the LC wave filters using the LC filter cell bodies.
The LC filter cell bodies of the present invention, it is characterised in that including：The multilayered ceramic that multiple ceramic layers are laminated Body；In the LC filter circuits being internally formed of the ceramic layer stack；And formed on the surface of the ceramic layer stack Input terminal, lead-out terminal, ground terminal, decay pole, composition jump are formed as by being connected with the LC filter circuits The circuit element more coupled, forms the inductance, capacitance and SAW resonance for being used for installing peripheral hardware on the surface of the ceramic layer stack Device (SAW：Surface Acoustic Wave) at least one installation electrode.
The LC wave filters of the present invention, it is characterised in that on the installation electrode of the LC filter cells body, peace Fill at least one in the inductance, capacitance and SAW resonator of the peripheral hardware.
Invention effect
According to the present invention, by only installing in order to make the LC filter cells body have predetermined characteristic and it is preparing, even The LC filter cells body is connect so as to play the peripheral hardware inductance and/or capacitance of appropriate species that is jumping over coupling, can be obtained The LC wave filters of various characteristics, therefore the design cost of LC wave filters can be reduced.
Brief description of the drawings
Fig. 1 is the decomposition diagram of the LC filter cells body 100 of the first embodiment of the present invention.
Fig. 2 is the cross-sectional view of the LC filter cells body 100 of the first embodiment of the present invention.
Fig. 3 is the LC filter cells body 100 and LC wave filters of the first embodiment for illustrating the present invention The figure of 1100 equivalent circuit.
Fig. 4 is the cross-sectional view of the LC wave filters 1100 of the first embodiment of the present invention.
Fig. 5 is the figure by characteristic for representing the LC wave filters 1100 of the first embodiment of the present invention.
Fig. 6 is the LC wave filters 1100 of the first embodiment SAW resonator, of the invention for being mounted with peripheral hardware Cross-sectional view.
Fig. 7 is to represent to be mounted with the LC wave filters of the first embodiment SAW resonator, of the invention of peripheral hardware 1100 figure by characteristic.
Fig. 8 is the decomposition diagram of the LC filter cells body 200 of the second embodiment of the present invention.
Fig. 9 is the cross-sectional view of the LC filter cells body 200 of the second embodiment of the present invention.
Figure 10 is the LC filter cells body 200 and LC wave filters of the second embodiment for illustrating the present invention The figure of 1200 equivalent circuit.
Figure 11 is the cross-sectional view of the LC wave filters 1200 of the second embodiment of the present invention.
Figure 12 is the figure by characteristic for representing the LC wave filters 1200 of the second embodiment of the present invention.
Figure 13 is the decomposition diagram of the LC filter cells body 300 of the third embodiment of the present invention.
Figure 14 is the cross-sectional view of the LC filter cells body 300 of the third embodiment of the present invention.
Figure 15 is the LC filter cells body 300 and LC wave filters of the third embodiment for illustrating the present invention The figure of 1300 equivalent circuit.
Figure 16 is the cross-sectional view of the LC wave filters 1300 of the third embodiment of the present invention.
Figure 17 is the figure by characteristic for representing the LC wave filters 1300 of the third embodiment of the present invention.
Figure 18 is the LC wave filters 1300 of the third embodiment SAW resonator, of the invention for being mounted with peripheral hardware Cross-sectional view.
Figure 19 is to represent to be mounted with the LC wave filters of the third embodiment SAW resonator, of the invention of peripheral hardware 1300 figure by characteristic.
Figure 20 is the figure of the equivalent circuit for the LC wave filters 1400 being related to for illustrating other embodiments of the present invention.
Figure 21 is the figure by characteristic for representing the LC wave filters 1400 that other embodiments of the present invention are related to.
Figure 22 is the figure of the equivalent circuit for the LC wave filters 1500 being related to for illustrating other embodiments of the present invention.
Figure 23 is the figure by characteristic for representing the LC wave filters 1500 that other embodiments of the present invention are related to.
Figure 24 is the figure of the equivalent circuit for the LC wave filters 1600 being related to for illustrating other embodiments of the present invention.
Figure 25 is the figure by characteristic for representing the LC wave filters 1600 that other embodiments of the present invention are related to.
Figure 26 is the figure of the equivalent circuit for the LC wave filters 1700 being related to for illustrating other embodiments of the present invention.
Figure 27 is the figure by characteristic for representing the LC wave filters 1700 that other embodiments of the present invention are related to.
Embodiment
(the 1st embodiment)
In the following, the 1st embodiment of the present invention is illustrated based on attached drawing.
Fig. 1 is the decomposition diagram for representing the LC filter cells body 100 of the first embodiment of the present invention.Fig. 2 is Represent the cross-sectional view of LC filter cells body 100.Fig. 3 is to represent LC filter cells body 100 and the of the invention the 1st in fact The equivalent circuit for the LC wave filters 1100 that the mode of applying is related to.Fig. 4 is the cross-sectional view for representing LC wave filters 1100.In addition, LC Wave filter 1100 is used as bandpass filter.
As shown in Figure 1, LC wave filters 100 possess the ceramic layer stack 10 being made of multiple ceramic layers.Ceramic layer stack 10 Material and be not specially limited, such as barium titanate can be used.
Ceramic layer stack 10 is made of the structure that six ceramic layers 11,21,31,41,51,61 are laminated from lower to upper.
In the surface of ceramic layer 11 internal electrode 12a, 12b, 12c formed with three rectangles.Two internal electrode 12a, 12c leads to the side of layered product 10 from two opposite short sides of ceramic layer 11 respectively.
Internal electrode 22a, 22b of two rectangles are formed on the surface of ceramic layer 21.In addition, forming two crosses pore electrod 23a, 23b penetrate through ceramic layer 21.Pore electrod 23a is crossed to turn on internal electrode 12a and internal electrode 22a.Cross pore electrod 23b with Internal electrode 12c and internal electrode 22b conductings.
A grounding electrode 35a is formed on the surface of ceramic layer 31.Grounding electrode 35a is from ceramic layer 31 with respect to two long Side leads to the side of layered product 10 respectively.In addition, forming two crosses pore electrod 33a, 33b perforation ceramic layer 31.Cross pore electrod 33a is turned on crossing pore electrod 23a.Cross pore electrod 33b and turned on crossing pore electrod 23b.
A rectangular internal electrode 42a is formed on the surface of ceramic layer 41.In addition, the pore electrod 43a excessively of formation five, 43b, 43c, 43d, 43e penetrate through ceramic layer 41.Pore electrod 43a is crossed to turn on grounding electrode 35a.Cross pore electrod 43b and ground connection electricity Pole 35a is turned on.Cross pore electrod 43c and turned on crossing pore electrod 33b.Pore electrod 43d is crossed to turn on grounding electrode 35a.Cross pore electrod 43e is turned on crossing pore electrod 33a.
Three rectangular internal electrode 52a, 52b, 52c are formed on the surface of ceramic layer 51.In addition, form six vias Electrode 53a, 53b, 53c, 53d, 53e, 53f penetrate through ceramic layer 51.Pore electrod 53a is crossed with crossing pore electrod 43a and internal electrode One end conducting of 52a.One end of pore electrod 53b and internal electrode 42a and one end of internal electrode 52b is crossed to turn on.Via electricity Pole 53c is turned on crossing one end of pore electrod 43b and internal electrode 52c.Pore electrod 53d is crossed with crossing pore electrod 43c and inside The other end conducting of electrode 52c.Cross pore electrod 53e and turned on crossing the other end of pore electrod 43d and internal electrode 52b.Via Electrode 53f is turned on crossing the other end of pore electrod 43e and internal electrode 52a.
Two rectangular installations electrode 64a, 64b are formed on the surface of ceramic layer 61.In addition, form two via electricity Pole 63a, 63b perforation ceramic layer 61.Pore electrod 63a is crossed to be turned on installation with electrode 64a and pore electrod 53f excessively.Cross pore electrod 63b is turned on installation with electrode 64b and pore electrod 53d excessively.
As shown in Fig. 2, the opposite side of the short brink in ceramic layer stack 10, forms input terminal IN and output terminal Sub- OUT.But input terminal IN is blocked and not shown by ceramic layer stack 10.Input terminal IN connection internal electrodes 12a.It is defeated Go out terminal OUT connection internal electrodes 12c.
In the opposite side of the long side of ceramic layer stack 10, a pair of of ground terminal GND is formed.But a pair of of ground connection One of terminal GND is blocked not shown by ceramic layer stack 10.A pair of of ground terminal GND, GND connect with grounding electrode 35a respectively Connect.
Internal electrode 12a~12c, 22a, 22b, 42a, 52a~52c, grounding electrode 35a, excessively pore electrod 23a, 23b, Electrode 64a, 64b are used in 33a, 33b, 43a~43c, 53a~53f, 63a, 63b, installation, and input terminal IN, lead-out terminal OUT, connects The material of ground terminal GND, GND are not particularly limited, such as can use conductor thickener containing Cu (copper) etc..
The LC filter cells body 100 being made of said structure is in the equivalent circuit shown in Fig. 3, portion enclosed by the dotted line Divide and form.
In LC filter cells body 100, connect input terminal IN and lead-out terminal OUT path and ground terminal GND it Between, parallel connection insertion inductance L1 and capacitance C1, forms LC resonance circuit Q1.Inductance L1 is mainly by internal electrode 12a, excessively pore electrod 23a, cross pore electrod 33a, cross pore electrod 43e, cross pore electrod 53f, internal electrode 52a, cross pore electrod 53a, cross pore electrod 43a, And the cyclic structure that grounding electrode 35a is formed.Capacitance C1 is mainly by the internal electrode 22a and grounding electrode of double team ceramic layer 31 The capacitance formed between 35a is formed.
Between the path and the ground terminal GND that connect input terminal IN and lead-out terminal OUT, after LC resonance circuit Q1 Section, parallel connection insertion inductance L2 and capacitance C2, forms LC resonance circuit Q2.Inductance L2 is mainly by grounding electrode 35a, excessively pore electrod 43d, cross pore electrod 53e, internal electrode 52b, cross the cyclic structure that pore electrod 53b, internal electrode 42a are formed.Capacitance C2 is main It is made of the capacitance formed between the internal electrode 42a and grounding electrode 35a of double team ceramic layer 41.
Between the path and the ground terminal GND that connect input terminal IN and lead-out terminal OUT, after LC resonance circuit Q2 Section, parallel connection insertion inductance L3 and capacitance C3, forms LC resonance circuit Q3.Inductance L3 is mainly by internal electrode 12c, excessively pore electrod 23b, cross pore electrod 33b, cross pore electrod 43d, cross pore electrod 53d, internal electrode 52c, cross pore electrod 53c, cross pore electrod 43b, And the cyclic structure that grounding electrode 35a is formed.Capacitance C3 is mainly by the grounding electrode 35a and internal electrode of double team ceramic layer 31 The capacitance formed between 22a is formed.
By forming mutual inductance M1 between inductance L1 and inductance L2, make LC resonance circuit Q1 and LC resonance circuit Q2 electromagnetism couplings Close.By forming mutual inductance M2 between inductance L2 and inductance L3, make LC resonance circuit Q2 and LC resonance circuit Q3 electromagnetic coupleds.By This, on the path of connection input terminal IN and lead-out terminal OUT, sets multiple LC resonance circuit Q1, Q2, Q3 electromagnetism coupling successively Close.
Connection input terminal IN and lead-out terminal OUT path on, insertion composition jump over coupling C13a (present invention in, " jumping over coupling " refers to be electrically coupled across one or more snippets circuit structure) circuit element.It is main to jump over coupling C13a Will be by the capacitance that is formed between the internal electrode 22a and internal electrode 12b of double team ceramic layer 21, and sandwich the interior of ceramic layer 21 The combined capacity being connected in series to form of the capacitance formed between portion electrode 12b and internal electrode 22b and form.
In the LC filter cells body 100 that above structure is formed, between input terminal IN and lead-out terminal OUT, utilize Installation is provided with two open ends with electrode 64a, 64b.Between two open ends, it is connected to and redirects coupling C13b performances The capacitance (being recorded in figure 3 with dotted line) of effect, so as to be used as LC wave filters 1100.
Specifically, as coupling C13b is jumped over, as shown in figure 4, by the way that the capacitance 80 of peripheral hardware is installed on installation electricity consumption Pole 64a, 64b, complete LC wave filters 1100.The capacitance 80 of peripheral hardware is to form the patch capacitor of terminal electrode 80a, 80b at both ends Device, terminal electrode 80a, the 80b at both ends are respectively welded on installation electrode 64a, 64b.But in Fig. 4, omit the figure of wlding Show.
Above-mentioned installation results, are in LC filter circuits, jump are formed with jumping over coupling C13a and jumping over coupling C13b C13 is more coupled, decay pole can be formed in desired frequency domain.
According to the present invention, due to only by installing the peripheral hardware capacitance 80 of appropriate species, being filtered with regard to the LC that can obtain various characteristics Ripple device 1100, therefore the design cost of LC wave filters can be reduced, the peripheral hardware capacitance 80 of above-mentioned appropriate species is to filter LC Device cell cube 100 have defined characteristic and prepare, by connect the LC filter cells body 100 be used as jump over couple C13b Play a role.
, can by jumping over a part of C13a of coupling in being internally formed for ceramic layer stack 10 in addition, according to the present invention Spy to the decay pole realized in the case where being mounted with as the defined peripheral hardware capacitances 80 that play a role of coupling C13b are jumped over Property scope etc. is controlled.
In addition, in the present invention, installation crossing in pore electrod 63a, with internal electrode 52a in circuit with electrode 64a will be connected It is upper close to the part of input terminal IN, i.e., internal electrode 52a is connected with the part that pore electrod 53f is connected excessively.Similarly, will Cross in pore electrod 63b and internal electrode 52c on circuit close to the part of lead-out terminal OUT, i.e., internal electrode 52c and via The part of electrode 53d connections is connected.This be in order to make to jump over couple C13b both ends link position close proximity to Fig. 3 etc. Imitate the position of circuit.
Then, an example of the manufacture method of the LC filter cells body 100 of the first embodiment of the present invention is carried out Explanation.
First, prepare to be used for the ceramic green sheet for forming ceramic layer 11,21,31,41,51,61.Ceramic green sheet can utilize conventional Multilayered ceramic electronic component manufacturing process in be widely used known method manufacture.
Then, on ceramic green sheet, formed be used for formed pore electrod 23a, 23b, 33a, 33b, 43a~43e, 53a~ The hole of 53f, 63a, 63b.Hole can utilize punching or laser irradiation etc. to be formed.
Then, on the surface of ceramic green sheet internal electrode is formed respectively with desired shape applying conductive thickener Electrode 64a, 64b are used in 12a~12c, 22a, 22b, 42a, 52a~52c, grounding electrode 35a and installation.At this moment, while also exist Conductive paste is filled in hole for forming pore electrod, formed pore electrod 23a, 23b, 33a, 33b, 43a~43e, 53a ~53f, 63a, 63b.
Then, ceramic green sheet is laminated with order from the bottom up, is crimped, make unfired ceramic layers stack 10.
Then, on the surface of unfired ceramic layers stack 10, with defined shape applying conductive thickener, input is formed Terminal IN, lead-out terminal OUT and a pair of of ground terminal GND, GND.
Finally, with defined section bar firing ceramics layered product 10 while, by input terminal IN, lead-out terminal OUT, a pair Ground terminal GND, GND are calcined in ceramic layer stack 10, complete the LC filter cells of the first embodiment of the present invention Body 100.
(the 1st experimental example of the 1st embodiment)
In order to confirm effectiveness of the invention, ensuing simulated experiment is carried out.
First, it is assumed that the LC wave filters 1100 of the first embodiment of the invention, utilize circuit simulator (ADS：Advanced Design System (Agilent Technology Inc.)) to being simulated by characteristic, as Experimental example 1.Then, it is assumed that only make the capacitance of the capacitance 80 (chip capacitor) of the peripheral hardware of LC wave filters 1100 in experimental example 1 Value changes, to being simulated by characteristic, as experimental example 2.In addition, it is assumed that the peripheral hardware capacitance 80 installed in experimental example 1 Capacitance is more than experimental example 2.
Fig. 5 represents to pass through characteristic using the LC wave filters 1100 simulated and obtained.Solid line passes through spy for experimental example 1 Property, dotted line passes through characteristic for experimental example 2.
As shown in Figure 5, experimental example 1 and experimental example 2 are all with passband filtering of the about 2.3~2.6GHz with passband The function of device.In addition, the high frequency side in passband produces a decay pole, two decay poles are produced in the lower frequency side of passband. Experimental example 1 and experimental example 2 are compared and understood, the peripheral hardware capacitance 80 big by installing capacitance, can make by connecting and composing The attenuation characteristic (frequency location, attenuation) for the three decay poles jumped over the circuit element of coupling and formed changes.Specifically For, it can make in the decay pole of the high frequency side formation of passband, and decay pole (the about 2GHz of the lower frequency side formation in passband Near) frequency location to high frequency side move.In addition, it can make in the decay pole of the lower frequency side formation of passband (about near 1GHz) Frequency location to lower frequency side move.
In experimental example, two kinds of LC wave filters are made, the capacitance of the peripheral hardware capacitance by changing installation, can obtain more The LC wave filters of species, reduce the burden of design cost.
In 1st embodiment, the element beyond capacitance, such as SAW resonance can also be installed on the surface of ceramic layer stack 10 Device.SAW resonator is to utilize elastic surface wave (SAW：Surface Acoustic Wave) resonator.
That is, coupling C13b is jumped over as shown in Fig. 3, as shown in fig. 6, by the way that the SAW resonator 83 of peripheral hardware is installed on Installation completes LC wave filters 1100 with electrode 64a, 64b.SAW resonator 83 is to form terminal electrode 83a, 83b at both ends Resonant element, terminal electrode 83a, the 83b at both ends are respectively welded on installation electrode 64a, 64b.But weldering is omitted in Fig. 6 The diagram of material.
(the 2nd experimental example of the 1st embodiment)
Fig. 7 is the figure for illustrating an example by characteristic for the LC wave filters 1100 for being mounted with peripheral hardware SAW resonator.Figure In 7, the analog result by characteristic of experimental example 1A is represented with solid line respectively, dotted line represents the mould by characteristic of experimental example 2A Intend result.The experimental example 1A of Fig. 7 is denoted as jumping over coupling C13b shown in Fig. 3, is mounted with the same manner as the experimental example 1 of Fig. 3 Pass through characteristic in the case of the capacitance 80 (Fig. 4) of peripheral hardware.In experimental example 1 (Fig. 3) and experimental example 1A (Fig. 7), LC wave filters The constant value of 1100 each element (L1, C1 of Fig. 3 etc.) and the capacitance of capacitance 80 also can be different.The experimental example of Fig. 7 2A, is denoted as jumping over coupling C13b shown in Fig. 3, is mounted with that the situation of the SAW resonator 83 (Fig. 6) of peripheral hardware passes through spy Property.
Experimental example 1A and experimental example 2A, which is compared, to be understood, by installing peripheral hardware SAW resonator 83, forms decay pole.Tool For body, decay pole is formed in the high frequency side by characteristic.Thus, in the high frequency side by characteristic, it can realize and make use of SAW humorous Shake the attenuation characteristic drastically of device 83.Using the characteristic of SAW resonator 83, decay pole can be formed in the lower frequency side by characteristic. In this case, in the lower frequency side by characteristic, attenuation characteristic drastically can be realized using SAW resonator 83.
(the 2nd embodiment)
In the following, the 2nd embodiment of the present invention is illustrated based on attached drawing.
Fig. 8 shows the decomposition diagram of the LC filter cells body 200 of the second embodiment of the present invention.Fig. 9 is represented The cross-sectional view of LC filter cells body 200.Figure 10 represents the 2nd embodiment party of LC filter cells body 200 and the present invention The equivalent circuit for the LC wave filters 1200 that formula is related to.Figure 11 represents the cross-sectional view of LC wave filters 1200.In addition, though LC is filtered Ripple device 1100 is used as bandpass filter, but LC wave filters 1200 can also be used as low-pass filter.
As shown in figure 8, LC filter cells body 200 possesses the ceramic layer stack 10 that multiple ceramic layers are formed.Multilayered ceramic Body 10 is that 12 ceramic layers 11,21,31,41,51,61,71,81,91,101,111,121 are laminated composition from lower to upper.
Input terminal IN, the lead-out terminal OUT of two rectangles, the short side with ceramic layer 11 are formed at the back side of ceramic layer 11 The opposite both sides contact of side.In addition, forming a pair of of ground terminal GND, the opposite both sides with the long side of ceramic layer 11 contact.
On the surface of ceramic layer 21, grounding electrode 25a is formed.Opposite two of grounding electrode 25a from ceramic layer 21 are long While lead to the side of ceramic layer stack 10.
On the surface of ceramic layer 41, internal electrode 42a, 42b of two rectangles of formation.Two 42a, 42b points of internal electrodes The side of ceramic layer stack 10 is not led to from two opposite short sides.
On the surface of ceramic layer 51, the internal electrode 52a of one rectangle of formation.
On the surface of ceramic layer 61, internal electrode 62a, 62b of two rectangles of formation.Two 62a, 62b points of internal electrodes The side of ceramic layer stack 10 is not led to from opposite both sides.
On the surface of ceramic layer 81, a spiral helicine internal electrode 82a is formed.One end of internal electrode 82a is from ceramics One side of short brink leads to the side of ceramic layer stack 10 in layer 81.
On the surface of ceramic layer 91, the internal electrode 92a of one U-shaped of formation.In addition, forming one crosses pore electrod 93a Penetrate through ceramic layer 91.Cross one end of pore electrod 93a and internal electrode 92a and the other end of internal electrode 82a turns on.
On the surface of ceramic layer 101, a spiral helicine internal electrode 102a is formed.The other end of internal electrode 102a from One side of short brink leads to the side of ceramic layer stack 10 in ceramic layer 101.In addition, forming one crosses pore electrod 103a perforations Ceramic layer 101.Cross one end of pore electrod 103a and internal electrode 102a and the other end of internal electrode 92a turns on.
On the surface of ceramic layer 121, form two rectangular installations and use electrode 121a, 121b.Two installation electrodes 121a, 121b extend respectively to the opposite side of ceramic layer stack 10 and are formed.In addition, a pair of of ground terminal GND of formation, Both sides opposite with the long side of ceramic layer 121 GND contact.
As shown in figure 9, in the opposite side of the short brink of ceramic layer stack 10, input terminal IN and lead-out terminal are formed OUT.It is not shown but input terminal IN is blocked by ceramic layer stack 10.Input terminal IN and internal electrode 42a, internal electrode 62a, internal electrode 102a and installation are connected with electrode 121a.Lead-out terminal OUT and internal electrode 42b, internal electrode 62b, internal electrode 82a and installation are connected with electrode 121b.
In the opposite side of the long side of ceramic layer stack 10, a pair of of ground terminal GND is formed.But a pair of of ground terminal One of them of sub- GND is blocked by ceramic layer stack 10, not shown.One of them and the grounding electrode of a pair of of ground terminal GND 25a connections.The other in which of a pair of of ground terminal GND is connected with grounding electrode 25a.
The LC filter cells body 200 being made of said structure is enclosed by the dotted line in the equivalent circuit shown in Figure 10 Part is formed.
In LC filter cells body 200, on the path of connection input terminal IN and lead-out terminal OUT, an electricity is inserted into Feel L1.Inductance L1 is mainly by internal electrode 102a, excessively pore electrod 103a, excessively internal electrode 92a, pore electrod 93a, internal electrode The ring-type that 82a is formed is formed.
On the path of connection input terminal IN and lead-out terminal OUT, insertion forms the circuit element for jumping over coupling C12a, It is in parallel with inductance L1.Jump over coupling C12a be mainly by double team ceramic layer 51 internal electrode 42a, 42b and internal electrode 52a it Between the capacitance that is formed, and sandwich the conjunction of the capacitance formed between internal electrode 62a, 62b and internal electrode 52b of ceramic layer 61 Formed into capacitance.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C1 is inserted into.Capacitance One end of one end connection input terminal IN and inductance L1 of C1, other end connection ground terminal GND.Capacitance C1 is mainly by sandwiching The capacitance formed between the internal electrode 42a and grounding electrode 25a of ceramic layer 31,41 is formed.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C2 is inserted into.Capacitance The other end of one end connection lead-out terminal OUT and inductance L2 of C2, other end connection ground terminal GND.Capacitance C2 mainly by The capacitance formed between the internal electrode 42b and grounding electrode 25a of ceramic layer 31,41 is sandwiched to form.
As indicated above, in LC filter cells body 200, possesses one section of lc circuit, which contains：Even Meet the inductance L1 being inserted on the path of input terminal IN and lead-out terminal OUT, and interleaving in the path and ground terminal GND Inductance C1, the C2 entered.
In the LC filter cells body 200 that above structure is formed, on the road of connection input terminal IN and lead-out terminal OUT On footpath, two open ends are provided with electrode 121a, 121b using installation.In two open ends, it is connected to and jumps over coupling The capacitance (being recorded in Fig. 10 with dotted line) that C12b plays a role, coupling is jumped over so as to be connected in a manner of across one section of lc circuit C12b is closed, is used as LC wave filters 1200.
Specifically, as the circuit element that jumps over coupling C12b is formed, as shown in figure 11, by by the capacitance of peripheral hardware 130 are installed on installation electrode 121a, 121b, so as to complete LC wave filters 1200.
Above-mentioned installation results, are in LC filter circuits, jump are formed to jump over coupling C12a and jump over coupling C12b C12 is more coupled, decay pole can be formed in desired frequency domain.
According to the 2nd embodiment, in a same manner as in the first embodiment, due to the peripheral hardware capacitance only by installing appropriate species 130, the LC wave filters 1200 of various characteristics just can be obtained, therefore the design cost of LC wave filters can be reduced, above-mentioned appropriate species Peripheral hardware capacitance 130 in order to make LC filter cells body 200 reach as defined in characteristic and prepare, by connect the LC filtering Device cell cube 200 plays a role as coupling C12b is jumped over.
(experimental example of the 2nd embodiment)
In order to confirm effectiveness of the invention, to the LC wave filters 1200 of the 2nd embodiment, in a same manner as in the first embodiment Ground, carries out the simulated experiment by characteristic.
First, it is assumed that the LC wave filters 1200 of the second embodiment of the invention, to carrying out mould by characteristic Intend, as experimental example 3.Then, it is assumed that only make the 130 (patch capacitor of capacitance of the peripheral hardware of LC wave filters 1200 in experimental example 3 Device) capacitance change, to being simulated by characteristic, as experimental example 4.In addition, it is assumed that is installed in experimental example 3 is outer If the capacitance of capacitance 130 is more than experimental example 4.
Figure 12 represents to pass through characteristic using the LC wave filters 1200 simulated and obtained.Solid line passes through for experimental example 3 Characteristic, dotted line pass through characteristic for experimental example 4.
As can be seen from Figure 12, experimental example 3 and experimental example 4 all with the lower frequency side below about 1GHz with the low of passband The function of bandpass filter.In the high frequency side higher than passband about near 2GHz, occur jumping over coupling by connection to be formed One decay pole.Understood in addition, being compared to experimental example 3 and experimental example 4, the peripheral hardware capacitance big by installing capacitance, The frequency location that the decay pole that coupling is formed is jumped in connection can be made to be moved to lower frequency side, and the attenuation of decay pole can be made, with And the bandwidth of passband changes.
In addition, in the 2nd embodiment, also in a same manner as in the first embodiment, electricity is installed in the surface energy of ceramic layer stack 10 Element beyond appearance, such as SAW resonator.
(the 3rd embodiment)
In the following, the 3rd embodiment of the present invention is illustrated based on attached drawing.
Figure 13 represents the decomposition diagram of the LC filter cells body 300 of the third embodiment of the present invention.Figure 14 tables Show the cross-sectional view of LC filter cells body 300.Figure 15 represents that the 3rd of LC filter cells body 300 and the present invention implements The equivalent circuit for the LC wave filters 1300 that mode is related to.Figure 16 represents the cross-sectional view of LC wave filters 1300.In addition, LC is filtered Device cell cube 300 and LC wave filters 1300, in the same manner as LC wave filters 1200, as low-pass filter.
As shown in figure 13, LC filter cells body 300 possesses the ceramic layer stack 10 that multiple ceramic layers are formed.Multilayered ceramic Body 10 be 7 ceramic layers 11,21,31,41,51,61,71, from lower to upper stacking form.
Formed at the back side of ceramic layer 11 rectangle input terminal IN, lead-out terminal OUT and a pair of of ground terminal GND, GND。
On the surface of ceramic layer 21, grounding electrode 25a is formed.Opposite two of grounding electrode 25a from ceramic layer 21 are long While lead to the side of ceramic layer stack 10.
On the surface of ceramic layer 31, internal electrode 32a, 32b, 32c, 32d of four rectangles of formation.Two internal electrodes 32a, 32b lead to the side of ceramic layer stack 10 from opposite two short side of ceramic layer 31 respectively.
On the surface of ceramic layer 41, internal electrode 42a, 42b of two wire of formation.In addition, forming two crosses pore electrod 43a, 43b penetrate through ceramic layer 41.Cross one end of pore electrod 43a and internal electrode 32b and the pars intermedia of internal electrode 42a is led It is logical.One end of pore electrod 43b and internal electrode 32c and one end of internal electrode 42b is crossed to turn on.
On the surface of ceramic layer 51, internal electrode 52a, 52b, 52c of three wire of formation.In addition, form four vias Electrode 53a, 53b, 53c, 53d penetrate through ceramic layer 51.Cross one end and the internal electrode 52a of pore electrod 53a and internal electrode 42a One end conducting.One end of the other end and internal electrode 52b of crossing pore electrod 53b and internal electrode 42a turns on.Cross pore electrod 53c is turned on crossing one end of pore electrod 43b and internal electrode 42b.Cross the other end of pore electrod 53d and internal electrode 42b with And one end conducting of internal electrode 52c.
On the surface of ceramic layer 61, internal electrode 62a, 62b, 62c of three wire of formation.In addition, form four vias Electrode 63a, 63b, 63c, 63d penetrate through ceramic layer 61.Cross the other end and internal electrode of pore electrod 63a and internal electrode 52a One end conducting of 62a.One end of the other end and internal electrode 62b of crossing pore electrod 63b and internal electrode 52b turns on.Via Electrode 63c is turned on crossing the other end of pore electrod 53c and internal electrode 62b.Cross the another of pore electrod 63d and internal electrode 52c One end and the conducting of one end of internal electrode 62c.The short brink of the other end of internal electrode 62a from ceramic layer 61 leads to stacking The side of body 10.The short side of the other end of internal electrode 62c from the short side opposite side with drawing internal electrode 62a leads to stacking The side of body 10.
On the surface of ceramic layer 71, form two installations and use electrode 74a, 74b.Two installations are distinguished with electrode 74a, 74b Extend to the opposite side of short brink of ceramic layer stack 10 and formed.As shown in figure 14, in the short brink of ceramic layer stack 10 Opposite side, forms input terminal IN and lead-out terminal OUT.But input terminal IN is blocked by ceramic layer stack 10, not Diagram.Input terminal IN is connected with internal electrode 32a, 62a and installation with electrode 74a.Lead-out terminal OUT and internal electrode 32d, 62c and installation are connected with electrode 74b.
In another opposite side of ceramic layer stack 10, a pair of of ground terminal GND, GND are formed.But a pair of of ground connection One of them of terminal GND, GND are blocked by ceramic layer stack 10, not shown.A pair of of ground terminal GND, GND respectively with ground connection Electrode 25a connections.
The LC filter cells body 300 being made of said structure is enclosed by the dotted line in the equivalent circuit shown in Figure 15 Part is formed.
In LC filter cells body 300, on the path of connection input terminal IN and lead-out terminal OUT, series connection insertion three A inductance L1, L2, L3.Inductance L1 mainly by internal electrode 62a, cross pore electrod 63a, internal electrode 52a, cross pore electrod 53a, interior The ring-type that portion electrode 42a is formed is formed.Inductance L2 is mainly by internal electrode 42a, excessively pore electrod 53b, internal electrode 52b, via Electrode 63b, internal electrode 62b, cross pore electrod 63c, cross the ring-type composition that pore electrod 53c, internal electrode 42b are formed.Inductance L3 Mainly by internal electrode 42b, excessively pore electrod 53d, internal electrode 52c, the ring-type structure that pore electrod 63d, internal electrode 62c are formed excessively Into.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C1 is inserted into.Capacitance One end of one end connection input terminal IN and inductance L1 of C1, other end connection ground terminal GND.Capacitance C1 is mainly by sandwiching The capacitance formed between the internal electrode 32a and grounding electrode 25a of ceramic layer 31 is formed.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C2 is inserted into.Capacitance One end of one end connection inductance L1 and inductance L2 of C2, other end connection ground terminal GND.Capacitance C2 is mainly by sandwiching ceramics The capacitance formed between the internal electrode 32b and grounding electrode 25a of layer 31 is formed.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C3 is inserted into.Capacitance One end of one end connection inductance L2 and inductance L3 of C3, other end connection ground terminal GND.Capacitance C3 is mainly by sandwiching ceramics The capacitance formed between the internal electrode 32c and grounding electrode 25a of layer 31 is formed.
Between the path of connection input terminal IN and lead-out terminal OUT and ground terminal GND, capacitance C4 is inserted into.Capacitance One end of one end connection inductance L3 and lead-out terminal OUT of C4, other end connection ground terminal GND.Capacitance C4 is mainly by wrapping The capacitance formed between the internal electrode 32d and grounding electrode 25a of ceramic layer 31 is pressed from both sides to form.
As indicated above, in LC filter cells body 300, three sections of lc circuit cascade Connections are made, three sections of lc circuit bags Contain：The first lc circuit being made of inductance L1 and capacitance C1, C2, inductance L1 insertions connection input terminal IN and lead-out terminal Capacitance C1, C2 are inserted between path and ground terminal GND on the path of OUT；The 2nd LC being made of inductance L2 and capacitance C2, C3 Circuit, inductance L2 insertions path, between capacitance C2, C3 insertion path and ground terminal GND；By inductance L3 and capacitance C3, C4 The 3rd lc circuit formed, inductance L3 insertions path, between capacitance C3, C4 insertion path and ground terminal GND.
In the LC filter cells body 300 that above structure is formed, on the road of connection input terminal IN and lead-out terminal OUT On footpath, two open ends are provided with electrode 74a, 74b using installation.Between two open ends, it is connected to and jumps over coupling The capacitance (being recorded in fig.15 with dotted line) that C14 plays a role is closed, coupling is jumped over so as to be connected in a manner of across three sections of lc circuits C14 is closed, can be used as LC wave filters 1300.
Specifically, as the circuit element that jumps over coupling C14 is formed, as shown in figure 16, by by the capacitance 80 of peripheral hardware Installed in installation electrode 74a, 74b, decay pole can be formed in desired frequency domain, complete LC wave filters 1300.
According to the present invention, since only by installing the peripheral hardware capacitance 80 of appropriate species, the LC filtering of various characteristics can be obtained Device 1300, therefore the design cost of LC wave filters can be reduced, the peripheral hardware capacitance 80 of the appropriate species is to make LC wave filter lists First body 300 reach as defined in characteristic and prepare, by connect the LC filter cells body 300 be used as jump over coupling C14 performance Effect.
In addition, in LC filter cells body 100,200 involved in the 1st, the 2nd embodiment, a part for coupling is jumped over Be made of peripheral hardware capacitance, but also can such as LC filter cells body 300 of the third embodiment in this way, jump over coupling all by Peripheral hardware capacitance is formed.That is, in multilayered ceramic body, can not also be formed as jumping over the circuit pattern that plays a role of coupling, and The surface of ceramic layer stack forms the installation electrode for being used for making peripheral hardware capacitance connection circuit pattern.
In addition, in LC wave filters 1200 of the second embodiment, connection input terminal IN's and lead-out terminal OUT An inductance is inserted into path, but in LC wave filters 1300 of the third embodiment, series connection three inductance of insertion.As above Described, in the present invention, the inductance number be inserted on the path of connection input terminal and lead-out terminal can be as expected special Property make a change.
(the 1st experimental example of the 3rd embodiment)
In order to confirm effectiveness of the invention, to the LC wave filters 1300 of the 3rd embodiment, with the 1st, the 2nd embodiment Similarly, the simulated experiment by characteristic is carried out.
First, it is assumed that the LC wave filters 1300 of the third embodiment of the invention, to carrying out mould by characteristic Intend, as experimental example 5.Then, it is assumed that only make the capacitance 80 (chip capacitor) of the peripheral hardware of LC wave filters 1200 in experimental example 5 Capacitance change, to being simulated by characteristic, as experimental example 6.In addition, it is assumed that the peripheral hardware installed in experimental example 5 The capacitance of capacitance 80 is more than experimental example 6.
Figure 17 represents to pass through characteristic using the LC wave filters 1300 simulated and obtained.Solid line passes through for experimental example 5 Characteristic, dotted line pass through characteristic for experimental example 6.
As shown in Figure 17, experimental example 5 and experimental example 6 all with the lower frequency side below about 1.1GHz with passband The function of low-pass filter.In the high frequency side higher than passband about near 1.5~1.7GHz, occur jumping over coupling by connection The decay pole formed.Understood in addition, being compared to experimental example 5 and experimental example 6, the peripheral hardware electricity big by installing capacitance Hold, the frequency location that the decay pole that coupling is formed is jumped in connection can be made to be moved to lower frequency side, and attenuation can be made to change.
In addition, in the 3rd embodiment, also in a same manner as in the first embodiment, capacitance can also be installed on the surface of layered product 10 Element in addition, such as SAW resonator.
That is, coupling C14 is jumped over as shown in Figure 15, as shown in figure 18, by the way that the SAW resonator 84 of peripheral hardware is installed on Installation completes LC wave filters 1300 with electrode 74a, 74b.SAW resonator 84 is that terminal electrode 84a, 84b are formd at both ends Resonator, terminal electrode 84a, the 84b at both ends are respectively welded on installation electrode 74a, 74b.But weldering is omitted in Figure 18 The diagram of material.
(the 2nd experimental example of the 3rd embodiment)
Figure 19 is the figure for illustrating an example by characteristic for the LC wave filters 1300 for being mounted with peripheral hardware SAW resonator. In Figure 19, the analog result by characteristic of experimental example 5A is represented with solid line respectively, dotted line represents that experimental example 6A's passes through characteristic Analog result.The experimental example 5A of Figure 19 is denoted as jumping over coupling C14 shown in Figure 15 in the same manner as the experimental example 5 of Figure 17, It is mounted with to pass through characteristic in the case of the capacitance 80 (Figure 16) of peripheral hardware.In experimental example 5 (Figure 17) and experimental example 5A (Figure 19), The constant value of the circuit element (L1, C1 of Figure 15 etc.) of LC wave filters 1300 and the capacitance of capacitance 80 also can be different. The experimental example 6A of Figure 19, is denoted as jumping over coupling C14 shown in Figure 15, is mounted with the SAW resonator 84 (Figure 18) of peripheral hardware In the case of pass through characteristic.
As can be seen from Figure 19, experimental example 5A and experimental example 6A all with the lower frequency side below about 2.0GHz with passband Low-pass filter function.In the high frequency side higher than passband about near 2.7GHz and near 3.0GHz, occur two Decay pole.Understood in addition, experimental example 5A and experimental example 6A are compared, by installing peripheral hardware SAW resonator 84, in about 2.4GHz Nearby also form decay pole.Thus, in the high frequency side by characteristic, precipitous decay can be realized using 84 characteristic of SAW resonator Characteristic.
(other embodiment)
More than, to the present invention the 1st, the 2nd, LC filter cells body 100,200,300 of the third embodiment and The construction of LC wave filters 1100,1200,1300 and an example of its manufacture method are illustrated.However, the present invention LC filter cells body and LC wave filters are not limited to these contents, according to the purport of invention, can make various changes.
In addition, though LC wave filters 1100 play a role as bandpass filter, LC wave filters 1200,1300 are used as low pass Wave filter plays a role, but LC wave filters of the present invention can also play a role as high-pass filter.
Specifically, as shown in the equivalent circuit of Figure 20, in the LC wave filters 1400 to play a role as high-pass filter, Peripheral hardware capacitance can also be used to jump over the circuit element of coupling C13 as composition.As Figure 21 passes through characteristic (solid line side and dotted line Side is compared, the capacitance bigger of peripheral hardware capacitance C13) shown in, according to LC wave filters 1400, by the electricity for making peripheral hardware capacitance C13 Volume change, can obtain various attenuation characteristics.
In addition, though in LC wave filters 1100,1200,1300, the circuit element of coupling is jumped over as composition, has used electricity Hold C13b, C12b, C14, but as described below, it is possible to use inductance replaces capacitance.
Specifically, as shown in the equivalent circuit of Figure 22, in LC wave filters 1500, in connection input terminal IN and output On the path of terminal OUT, insertion peripheral hardware inductance L14 jumps over the circuit element of coupling as forming.As Figure 23 is (real by characteristic Line side is compared with dotted line side, the inductance value smaller of peripheral hardware inductance L14) shown in, according to LC wave filters 1500, by making peripheral hardware The inductance value change of inductance L14, can obtain various attenuation characteristics.
In addition, as shown in the equivalent circuit of Figure 24, in LC wave filters 1600, in connection input terminal IN and lead-out terminal On the path of OUT, insertion peripheral hardware inductance L13 jumps over the circuit element of coupling as forming.As Figure 25 passes through characteristic (solid line one Side is compared with dotted line side, the inductance value smaller of peripheral hardware inductance L13) shown in, according to LC wave filters 1600, by making peripheral hardware inductance The inductance value change of L13, can obtain various attenuation characteristics.
In addition, as shown in the equivalent circuit of Figure 26, in LC wave filters 1700, in connection input terminal IN and lead-out terminal On the path of OUT, insertion peripheral hardware inductance L13 jumps over the circuit element of coupling as forming.As Figure 27 passes through characteristic (dotted line one Side is compared with solid line side, the inductance value smaller of peripheral hardware inductance L13) shown in, according to LC wave filters 1700, by making peripheral hardware inductance The inductance value change of L13, can obtain various attenuation characteristics.
In addition, from equivalent circuit (Figure 24) illustrated above, two sections of low-pass filter includes：With inductance L1 and The first lc circuit of capacitance C1 and capacitance C2, the path of inductance L1 insertion connections input terminal IN and lead-out terminal OUT, electricity Hold between C1 and capacitance C2 insertion paths and ground terminal GND；The 2nd LC with inductance L2 and capacitance C2 and capacitance C3 Circuit, inductance L2 insertions path, between capacitance C2 and capacitance C3 insertion paths and ground terminal GND, in two sections low In bandpass filter, the coupling of jumping over that two sections of lc circuits are amounted to across the first lc circuit and the second lc circuit is made of inductance.Picture In this way, in the case where the hop count for jumping over the lc circuit being coupled across is even number, it can also connect inductance and jump over coupling as composition Circuit element.It is odd number jumping over the hop count of the lc circuit being coupled across in addition, from equivalent circuit (Figure 10, Figure 15) In the case of, it is not connection inductance, but connect the circuit element that capacitance jumps over coupling as composition.
On the other hand, equivalent circuit (Figure 20) as described above understands that lc circuit has：Connection input terminal IN and The capacitance of the path insertion of lead-out terminal OUT, and the inductance being inserted between the path and ground terminal GND, by the LC In the high-pass filter that circuits cascading connects even number section and formed, the hop count for jumping over the lc circuit being coupled across is the situation of even number Under, it can also connect the circuit element that capacitance jumps over coupling as composition.In addition, from equivalent circuit (Figure 22), coupling is jumped over It is not connection capacitance, but connect inductance and jump over coupling as composition in the case that the hop count of the lc circuit of leap is odd number Circuit element.
In addition, as described above, in the case where that should connect inductance conduct and jump over coupling, if being connected to capacitance to replace Inductance, then decay pole can not be formed by jumping over coupling by connection.In the case where capacitance should be connected, if being connected to inductance with generation For capacitance, then situation is identical.
Label declaration
10 (ceramics) layered products
11st, 21,31,41,51,61,71,81,91,101,111,121 ceramic layer
Inside 12a~12c, 22a, 22b, 32a~32d, 42a, 42b, 52a~52c, 62a~62c, 82a, 92a, 102a Electrode
23a, 23b, 33a~33b, 43a~43e, 53a~53f, 63a~63d, 93a, 103a cross pore electrod
64a, 64b, 74a, 74b, 121a, 121b installation electrode
25a, 35a grounding electrode
80th, 130 peripheral hardware capacitance
83rd, 84 peripheral hardware SAW resonator
80a, 80b, 83a, 83b, 84a, 84b, 130a, 130b terminal electrode
IN lead-out terminals
OUT lead-out terminals
GND ground terminals
100th, 200,300 LC filter cell bodies
1100th, 1200,1300,1400,1500,1600 LC wave filters
M1, M2 mutual inductance
L1~L3 inductance
C1~C4 capacitances
C12a, C12b, C12, C13a, C13b, C13, C14, L13, L14 jump over coupling
Q1~Q3 LC resonance circuits

Claims (4)

  1. A kind of 1. LC filter cells body, it is characterised in that including：
    The ceramic layer stack that multiple ceramic layers are laminated；
    In the LC filter circuits that the multilayered ceramic body is internally formed；And
    Input terminal, lead-out terminal, the ground terminal formed in the multilayered ceramic body surface face,
    As by be connected with the LC filter circuits to be formed decay pole, form and jump over the circuit element of coupling, described The surface of ceramic layer stack forms the installation electrode for the inductance for being used to install peripheral hardware, the side of the installation electrode with it is described Input terminal is connected, and opposite side is connected with the lead-out terminal,
    The LC filter circuits are the low-pass filter of the lc circuit of cascade Connection multistage,
    The lc circuit of the multistage is even number section lc circuit,
    Each section of circuit of the lc circuit of the multistage includes：Both ends, which are inserted in, connects the input terminal and the lead-out terminal Inductance in path, and the capacitance being inserted between the path and the ground terminal,
    Across the multistage lc circuit connection described in jump over coupling.
  2. A kind of 2. LC filter cells body, it is characterised in that including：
    The ceramic layer stack that multiple ceramic layers are laminated；
    In the LC filter circuits that the multilayered ceramic body is internally formed；And
    Input terminal, lead-out terminal, the ground terminal formed in the multilayered ceramic body surface face,
    As by be connected with the LC filter circuits to be formed decay pole, form and jump over the circuit element of coupling, described The surface of ceramic layer stack forms the installation electrode for the inductance for being used to install peripheral hardware, the side of the installation electrode with it is described Input terminal is connected, and opposite side is connected with the lead-out terminal,
    The LC filter circuits are the high-pass filter of the lc circuit of cascade Connection multistage,
    The lc circuit of the multistage is odd number section lc circuit,
    Each section of circuit of the lc circuit of the multistage includes：Both ends, which are inserted in, connects the input terminal and the lead-out terminal Capacitance in path, and the inductance being inserted between the path and the ground terminal,
    Across the multistage lc circuit connection described in jump over coupling.
  3. A kind of 3. LC filter cells body, it is characterised in that including：
    The ceramic layer stack that multiple ceramic layers are laminated；
    In the LC filter circuits that the multilayered ceramic body is internally formed；And
    Input terminal, lead-out terminal, the ground terminal formed in the multilayered ceramic body surface face,
    As by be connected with the LC filter circuits to be formed decay pole, form and jump over the circuit element of coupling, described The surface of ceramic layer stack forms the installation electrode for the capacitance for being used to install peripheral hardware, the side of the installation electrode with it is described Input terminal is connected, and opposite side is connected with the lead-out terminal,
    The LC filter circuits are the high-pass filter of the lc circuit of cascade Connection multistage,
    The lc circuit of the multistage is even number section lc circuit,
    Each section of circuit of the lc circuit of the multistage includes：Both ends, which are inserted in, connects the input terminal and the lead-out terminal Capacitance in path, and the inductance being inserted between the path and the ground terminal,
    Across the multistage lc circuit connection described in jump over coupling.
  4. 4. such as any one of them LC filter cell bodies of claims 1 to 3, it is characterised in that in the ceramic layer stack Be internally formed it is at least one in inductance and capacitance, as forming by being connected to form decay with the LC filter circuits Other of pole jump over the circuit element of coupling.
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CN107408931B (en) * 2015-07-28 2020-06-19 株式会社村田制作所 Circuit board, filter circuit using the same, and capacitor element
CN110429920A (en) * 2019-09-04 2019-11-08 研创光电科技（赣州）有限公司 A kind of miniature multilayer ceramic band-pass filter
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433654B1 (en) * 1999-05-25 2002-08-13 Murata Manufacturing Co., Ltd. Laminated piezoelectric component
CN1577953A (en) * 2003-06-30 2005-02-09 太阳诱电株式会社 Filter circuit and laminate filter
CN102549690A (en) * 2010-03-18 2012-07-04 株式会社村田制作所 High-frequency laminated component and laminated type high-frequency filter

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283284A (en) * 2002-03-20 2003-10-03 Hosiden Corp Flat filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433654B1 (en) * 1999-05-25 2002-08-13 Murata Manufacturing Co., Ltd. Laminated piezoelectric component
CN1577953A (en) * 2003-06-30 2005-02-09 太阳诱电株式会社 Filter circuit and laminate filter
CN102549690A (en) * 2010-03-18 2012-07-04 株式会社村田制作所 High-frequency laminated component and laminated type high-frequency filter

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