CN104749892B - 一种具有碰撞保护功能的硅片边缘保护装置 - Google Patents
一种具有碰撞保护功能的硅片边缘保护装置 Download PDFInfo
- Publication number
- CN104749892B CN104749892B CN201310734687.7A CN201310734687A CN104749892B CN 104749892 B CN104749892 B CN 104749892B CN 201310734687 A CN201310734687 A CN 201310734687A CN 104749892 B CN104749892 B CN 104749892B
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- chip edge
- drive sleeve
- protection
- collision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D7/00—Slip couplings, e.g. slipping on overload, for absorbing shock
- F16D7/04—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type
- F16D7/048—Slip couplings, e.g. slipping on overload, for absorbing shock of the ratchet type with parts moving radially between engagement and disengagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
本发明提出一种具有碰撞保护功能的硅片边缘保护装置,与交接机械手连接,硅片边缘保护装置包括电气控制模块、垂向运动机构,其特征在于:还包括碰撞保护机构,连接于所述电气控制模块和垂向运动机构之间;当工作过程中发生意外碰撞时,所述碰撞保护机构将所述电气控制模块的伺服电机与所述垂向运动机构的丝杆分离。本发明具有碰撞保护功能的硅片边缘保护装置具有碰撞过载保护功能,杜绝了事故隐患,提高了光刻机的安全可靠性,消除了硅片的破损率。
Description
技术领域
本发明涉及半导体制造装备技术领域,特别地涉及一种用于光刻机的具有碰撞保护功能的硅片边缘保护装置。
背景技术
硅片边缘保护装置是集成电路制造技术领域中,为提高硅片生产效率,对负胶工艺硅片曝光加工制造的同时对硅片边缘进行保护的一种装置,是实现硅片曝光及边缘保护同步进行的必备装置。该装置需安装在曝光设备(光刻机)内部,需与工件台保持着正确的相对位置关系,工件台携带硅片进行快速运动至交接位置,由该装置将边缘保护环放置在欲曝光的硅片上方,从而实现对硅片曝光时的边缘保护功能。在这种工况及空间环境工作下的装置,需具有很高的可靠性,无论什么原因,产生什么形式的碰撞,碰撞的冲击力或大或小,都会造成硅片的报废,降低光刻机的性能,甚至是损坏光刻机的后果。因此,提供一种更安全、更可靠的边缘保护装置显得尤为重要。
中国发明专利200910055394X公开的一种硅片边缘保护方法与装置及中国发明专利201010102423.6硅片边缘保护装置及其应用方法所提及的边缘保护装置,无论在机械方面还是气动控制方面,均无碰撞安全保护功能,工作过程中发生碰撞无法对硅片及光刻机进行保护,存在潜在危险。
发明内容
为克服现有技术中的不足,本发明提出一种具有碰撞保护功能的硅片边缘保护装置,与交接机械手连接,硅片边缘保护装置包括电气控制模块、垂向运动机构,其特征在于:还包括碰撞保护机构,连接于所述电气控制模块和垂向运动机构之间;当工作过程中发生意外碰撞时,所述碰撞保护机构将所述电气控制模块的伺服电机与所述垂向运动机构的丝杆分离。
优选地,所述碰撞保护机构包括传动滑销、压缩弹簧、传动套,在压缩弹簧作用下,传动滑销与传动套相啮合,传动套将运动传递至垂向运动机构,当工作过程中发生意外碰撞时,传递的扭矩超过限定值,所述传动滑销移动压缩弹簧与传动套脱开,中断伺服电机输出扭矩的传递。
优选地,所述碰撞保护机构还包括联轴器、定位销与行程开关,当所述传动滑销移动压缩弹簧与传动套脱开时,联轴器与传动套产生相对的转动,所述定位销与行程开关接触发出信号,控制所述伺服电机停止工作。
优选地,当所述碰撞解除,驱动电机或手动旋转传动套至定位销进入联轴器的内斜槽,恢复正常工作。
优选地,所述扭矩限定值通过调节压缩弹簧在联轴器内的位置来设定。
优选地,所述电气控制模块包括电流过载保护。
本发明具有碰撞保护功能的硅片边缘保护装置具有碰撞过载保护功能,杜绝了事故隐患,提高了光刻机的安全可靠性,消除了硅片的破损率。
附图说明
关于本发明的优点与精神可以通过以下的发明详述及所附图式得到进一步的了解。
图1为本发明具有碰撞保护功能的硅片边缘保护装置结构示意图;
图2为本发明硅片边缘保护装置的碰撞保护机构的结构示意图。
具体实施方式
下面结合附图详细说明本发明的具体实施例。
如图1所示,本发明提出一种具有碰撞保护功能的硅片边缘保护装置,与交接机械手4连接,硅片边缘保护装置由电气控制模块(包括伺服电机)1、碰撞保护机构2及垂向运动机构3组成。由电气控制模块控制的伺服电机安装于碰撞保护机构2之上,伺服电机的旋转运动通过防碰撞保护机构2,传递给垂向运动机构3,垂向运动机构3将伺服电机的旋转运动变为直线运动,从而携带交接机械手4运动到预定的交接位置,进行硅片边缘保护环交接工作,最终实现硅片曝光的边缘保护。
如图2所示,碰撞保护机构2是由电机座201、联轴器202、传动套203、传动滑销204、弹簧座205、压缩弹簧206、定位销207、定位轴承209以及行程开关208组成。碰撞保护机构2安装在伺服电机与垂向运动机构3之间,其上端由伺服电机将运动及所需扭矩输入给碰撞保护机构2,其下端将运动及所需扭矩输出给垂向运动机构3的丝杆301,当工作过程中发生意外碰撞时,会自动地将输入与输出分离,即将驱动的伺服电机与垂向运动机构3丝杆301分开,安全分离并停止驱动,从而起到保护光刻机、保护硅片的作用。
具体实施方式如下:
伺服电机通过螺钉安装于碰撞保护机构2的电机座201之上,碰撞保护机构2的电机座201刚性地安装于垂向运动机构3之上。碰撞保护机构2,将伺服电机的旋转运动,传递给垂向运动机构3。垂向运动机构3,将电机的旋转运动变为直线运动,从而携带装在垂向运动机构3下端的交接机械手4进入、移出边缘保护环交接位置,交接机械手4完成放置、抓取边缘保护环于硅片上部的动作,最终实现硅片曝光时的边缘保护功能。
工作时,启动伺服电机,电机轴旋转,带动防碰撞保护机构2的与电机轴配合的联轴器202等速旋转。三个传动滑销204装在联轴器202内,在压缩弹簧206作用下,三个传动滑销204的锥部与传动套203的内槽面相啮合,传动套203与垂向运动机构3的丝杠301相配合,从而将运动传递至垂向运动机构3,通过垂向运动机构3,将交接机械手4由初始位置到交接位置,硅片曝光完成后,再由交接位置到初始位置的循环工作。在送入、移出的工作过程中,如突遇碰撞,电机扭矩增大,当所传递的扭矩超过限定值时,传动滑销204在超负载力的作用下,移动压缩弹簧206,直至传动滑销204与传动套203脱开,从而中断伺服电机输出扭矩的传递,实现碰撞保护功能。与此同时联轴器202与传动套203产生了相对的转动,定位销207与行程开关208接触发出信号,以控制伺服电机1停止。当碰撞解除,慢速点动伺服电机或手动旋转传动套203至定位销207进入下一个联轴器202的内斜槽,恢复正常工作。扭矩限定值可通过调节弹簧座205在联轴器202孔内的位置来设定。
当然,除了机械的碰撞保护外,本发明可选的具有常规电流过载保护,电流过大时,可以中止电机的旋转。该技术相对成熟,在本发明中不作详细说明。
本说明书中所述的只是本发明的较佳具体实施例,以上实施例仅用以说明本发明的技术方案而非对本发明的限制。凡本领域技术人员依本发明的构思通过逻辑分析、推理或者有限的实验可以得到的技术方案,皆应在本发明的范围之内。
Claims (5)
1.一种具有碰撞保护功能的硅片边缘保护装置,与交接机械手连接,硅片边缘保护装置包括电气控制模块、垂向运动机构,其特征在于:还包括碰撞保护机构,连接于所述电气控制模块和垂向运动机构之间;当工作过程中发生意外碰撞时,所述碰撞保护机构将所述电气控制模块的伺服电机与所述垂向运动机构的丝杆分离,所述碰撞保护机构包括传动滑销、压缩弹簧、传动套,在压缩弹簧作用下,传动滑销与传动套相啮合,传动套将运动传递至垂向运动机构,当工作过程中发生意外碰撞时,传递的扭矩超过限定值,所述传动滑销移动压缩弹簧与传动套脱开,中断伺服电机输出扭矩的传递。
2.如权利要求1所述的具有碰撞保护功能的硅片边缘保护装置,其特征在于:所述碰撞保护机构还包括联轴器、定位销与行程开关,当所述传动滑销移动压缩弹簧与传动套脱开时,联轴器与传动套产生相对的转动,所述定位销与行程开关接触发出信号,控制所述伺服电机停止工作。
3.如权利要求2所述的具有碰撞保护功能的硅片边缘保护装置,其特征在于:当所述碰撞解除,驱动伺服电机或手动旋转传动套至定位销进入联轴器的内斜槽,恢复正常工作。
4.如权利要求1所述的具有碰撞保护功能的硅片边缘保护装置,其特征在于:所述扭矩限定值通过调节压缩弹簧在联轴器内的位置来设定。
5.如权利要求1所述的具有碰撞保护功能的硅片边缘保护装置,其特征在于:所述电气控制模块包括电流过载保护。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310734687.7A CN104749892B (zh) | 2013-12-27 | 2013-12-27 | 一种具有碰撞保护功能的硅片边缘保护装置 |
PCT/CN2014/095044 WO2015096795A1 (zh) | 2013-12-27 | 2014-12-26 | 一种具有碰撞保护功能的硅片边缘保护装置 |
JP2016542929A JP2017504202A (ja) | 2013-12-27 | 2014-12-26 | 衝突防止機能付きシリコンウエハエッジ保護装置 |
US15/108,083 US10041548B2 (en) | 2013-12-27 | 2014-12-26 | Silicon wafer edge protection device with collision protection function |
KR1020167018798A KR20160098379A (ko) | 2013-12-27 | 2014-12-26 | 충돌 보호 기능을 구비하는 실리콘 웨이퍼 엣지 보호장치 |
SG11201605214UA SG11201605214UA (en) | 2013-12-27 | 2014-12-26 | Silicon wafer edge protection device with collision protection function |
EP14873788.5A EP3088956A4 (en) | 2013-12-27 | 2014-12-26 | SILICON WAFER PROTECTION DEVICE WITH COLLISION PROTECTION FUNCTION |
TW103145909A TWI584077B (zh) | 2013-12-27 | 2014-12-27 | A Silicon Chip Edge Protection Device with Collision Protection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310734687.7A CN104749892B (zh) | 2013-12-27 | 2013-12-27 | 一种具有碰撞保护功能的硅片边缘保护装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104749892A CN104749892A (zh) | 2015-07-01 |
CN104749892B true CN104749892B (zh) | 2017-02-01 |
Family
ID=53477584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310734687.7A Active CN104749892B (zh) | 2013-12-27 | 2013-12-27 | 一种具有碰撞保护功能的硅片边缘保护装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10041548B2 (zh) |
EP (1) | EP3088956A4 (zh) |
JP (1) | JP2017504202A (zh) |
KR (1) | KR20160098379A (zh) |
CN (1) | CN104749892B (zh) |
SG (1) | SG11201605214UA (zh) |
TW (1) | TWI584077B (zh) |
WO (1) | WO2015096795A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105366627B (zh) * | 2015-11-24 | 2017-03-22 | 中北大学 | 一种适应高过载环境的mems器件保护机构 |
CN105937051A (zh) * | 2015-11-27 | 2016-09-14 | 上海广奕电子科技股份有限公司 | 一种立式扩散炉的安全防护装置 |
US10016901B2 (en) * | 2016-05-04 | 2018-07-10 | X Development Llc | Sprung worm gripper for a robotic device |
CN106926511B (zh) * | 2017-05-11 | 2018-06-29 | 荣成华东锻压机床股份有限公司 | 机械压力机机电过载保护及拉伸装置及方法 |
CN108193386B (zh) * | 2018-04-09 | 2023-12-15 | 浙江鸿立缝制设备有限公司 | 一种缝纫机抬压脚的压力调节机构 |
CN111075850A (zh) * | 2020-01-11 | 2020-04-28 | 沈阳工具标准件制造有限公司 | 一种抗机械冲击过载保护装置 |
US11295973B2 (en) * | 2020-02-11 | 2022-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for automated wafer carrier handling |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740009A (en) * | 1996-11-29 | 1998-04-14 | Applied Materials, Inc. | Apparatus for improving wafer and chuck edge protection |
CN102012639A (zh) * | 2009-09-04 | 2011-04-13 | 上海微电子装备有限公司 | 一种硅片边缘保护方法与装置 |
CN102141735A (zh) * | 2010-01-28 | 2011-08-03 | 上海微电子装备有限公司 | 硅片边缘保护装置及其应用方法 |
CN102203930A (zh) * | 2008-10-30 | 2011-09-28 | 朗姆研究公司 | 触觉晶片升降器及其操作方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3012783C2 (de) * | 1980-04-02 | 1982-03-18 | Jean Walterscheid Gmbh, 5204 Lohmar | Ausrückkupplung |
JPS6392824A (ja) * | 1986-10-02 | 1988-04-23 | Mitsubishi Electric Corp | トルクリミツタ |
JP2523145B2 (ja) * | 1987-11-17 | 1996-08-07 | 東京エレクトロン東北株式会社 | 被処理体の押し上げ機 |
JP3563227B2 (ja) * | 1997-03-14 | 2004-09-08 | 大日本スクリーン製造株式会社 | 駆動装置およびそれを用いた基板処理装置 |
US5916325A (en) * | 1997-04-03 | 1999-06-29 | Dresser Industries, Inc. | Actuator assembly and torque limiting system for same |
JP2000199530A (ja) * | 1998-07-24 | 2000-07-18 | Matsushita Electric Ind Co Ltd | トルクリミッタ及びトルク伝達装置 |
JP2000240382A (ja) * | 1999-02-24 | 2000-09-05 | Yamato Tape Kk | 電動機及び電動シャッター |
TW446858B (en) * | 1999-04-21 | 2001-07-21 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using such a lithographic projection apparatus, and device made by such a method of manufacturing |
EP1111471B1 (en) * | 1999-12-21 | 2005-11-23 | ASML Netherlands B.V. | Lithographic projection apparatus with collision preventing device |
JP2003017430A (ja) * | 2001-06-28 | 2003-01-17 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
EP1457829A1 (en) * | 2003-03-11 | 2004-09-15 | ASML Netherlands B.V. | Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate |
JP2008016825A (ja) * | 2006-06-09 | 2008-01-24 | Canon Inc | 露光装置、除去方法及びデバイス製造方法 |
FR2931131B1 (fr) * | 2008-05-19 | 2010-08-13 | Eurocopter France | Dispositif d'accouplement escamotable et verin de trim associe |
CN101487990B (zh) | 2009-02-27 | 2011-04-13 | 上海微电子装备有限公司 | 带边缘曝光保护的工件台 |
JP2010203129A (ja) * | 2009-03-03 | 2010-09-16 | Nabtesco Corp | 自動ドア開閉装置及びトルクリミッタ |
CN101609193B (zh) | 2009-07-24 | 2011-05-11 | 上海微电子装备有限公司 | 一种可动光学元件调节定位装置 |
US8672110B2 (en) * | 2010-09-29 | 2014-03-18 | Actuant Corporation | Automatic torque overload clutch |
TWI419778B (zh) * | 2011-03-16 | 2013-12-21 | Ind Tech Res Inst | 順應性關節 |
SE1100498A1 (sv) * | 2011-06-27 | 2012-12-28 | Curt Gunnar Falk | Säkerhetskoppling |
-
2013
- 2013-12-27 CN CN201310734687.7A patent/CN104749892B/zh active Active
-
2014
- 2014-12-26 JP JP2016542929A patent/JP2017504202A/ja active Pending
- 2014-12-26 EP EP14873788.5A patent/EP3088956A4/en not_active Withdrawn
- 2014-12-26 US US15/108,083 patent/US10041548B2/en active Active
- 2014-12-26 WO PCT/CN2014/095044 patent/WO2015096795A1/zh active Application Filing
- 2014-12-26 KR KR1020167018798A patent/KR20160098379A/ko not_active Application Discontinuation
- 2014-12-26 SG SG11201605214UA patent/SG11201605214UA/en unknown
- 2014-12-27 TW TW103145909A patent/TWI584077B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740009A (en) * | 1996-11-29 | 1998-04-14 | Applied Materials, Inc. | Apparatus for improving wafer and chuck edge protection |
CN102203930A (zh) * | 2008-10-30 | 2011-09-28 | 朗姆研究公司 | 触觉晶片升降器及其操作方法 |
CN102012639A (zh) * | 2009-09-04 | 2011-04-13 | 上海微电子装备有限公司 | 一种硅片边缘保护方法与装置 |
CN102141735A (zh) * | 2010-01-28 | 2011-08-03 | 上海微电子装备有限公司 | 硅片边缘保护装置及其应用方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2017504202A (ja) | 2017-02-02 |
CN104749892A (zh) | 2015-07-01 |
TW201531815A (zh) | 2015-08-16 |
WO2015096795A1 (zh) | 2015-07-02 |
TWI584077B (zh) | 2017-05-21 |
US20160341256A1 (en) | 2016-11-24 |
EP3088956A1 (en) | 2016-11-02 |
US10041548B2 (en) | 2018-08-07 |
EP3088956A4 (en) | 2016-12-28 |
KR20160098379A (ko) | 2016-08-18 |
SG11201605214UA (en) | 2016-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104749892B (zh) | 一种具有碰撞保护功能的硅片边缘保护装置 | |
CN105946063B (zh) | 一种木料切割打磨装置 | |
CN102951489B (zh) | 一种变压器磁芯半自动贴胶设备 | |
CN107482377A (zh) | 一种电力供电装置 | |
CN107069538A (zh) | 基于多旋翼无人机技术的导线走行式线路巡检装置 | |
CN202780747U (zh) | 倒角机保护装置 | |
CN106995060B (zh) | 一种无人机自动切伞器 | |
CN104766731B (zh) | 高压开关动触头机构及使用该机构的高压开关 | |
CN107569101A (zh) | 一种水杯 | |
CN203343893U (zh) | 一种防爆砂轮机 | |
CN101879561A (zh) | 冲压加工用的片料毛坯送料设备 | |
CN206040558U (zh) | 断路器熔焊保护机构 | |
CN206126269U (zh) | 一种智能卡的过渡拨送装置 | |
CN102813317B (zh) | 一种节能安全钉扣机 | |
CN209448193U (zh) | 一种用于精密加工超高速全自动双头端子机 | |
CN103302593B (zh) | 一种防爆砂轮机 | |
CN103899488A (zh) | 风力发电机 | |
CN207009320U (zh) | 一种模内自动铆接机 | |
CN207773478U (zh) | 空投式机器人 | |
CN207773479U (zh) | 空投式灾难搜救机器人 | |
CN201760331U (zh) | 用于制样粉碎机的自动夹紧机构 | |
CN105197582A (zh) | 大输液软袋的自动下袋机 | |
CN209466171U (zh) | 一种新型皮带拆卸装置 | |
CN103928252B (zh) | 一种隔离开关和断路器的联锁机构 | |
CN103500690B (zh) | 一种断路器贮能装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |