CN104747952B - A kind of high-power LED lamp with heat conduction compound medium layer - Google Patents
A kind of high-power LED lamp with heat conduction compound medium layer Download PDFInfo
- Publication number
- CN104747952B CN104747952B CN201510138743.XA CN201510138743A CN104747952B CN 104747952 B CN104747952 B CN 104747952B CN 201510138743 A CN201510138743 A CN 201510138743A CN 104747952 B CN104747952 B CN 104747952B
- Authority
- CN
- China
- Prior art keywords
- radiator
- power led
- heat conduction
- medium layer
- compound medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/30—Pivoted housings or frames
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to high-power LED lamp technical field, a kind of high-power LED lamp with heat conduction compound medium layer is referred in particular to；Include radiator, high-power LED light source and light-passing board, the high-power LED light source and the light-passing board lower section for being fixed on radiator sequentially stacked on top of one another, radiator is provided with heat conduction compound medium layer with high-power LED light source, and heat conduction compound medium layer has at least pressed copper dielectric layer and aluminium dielectric layer；In assembling, the copper dielectric layer is fitted with the back side of high-power LED light source, and aluminium dielectric layer is fitted with the lower surface of radiator.When at work, the heat that high-power LED light source is produced rapidly is derived to heat conduction compound medium layer, then heat is conducted to radiator by heat conduction compound medium layer again so that heat transmission passage is constantly in outside positive transmission, will not accumulate on LED chip；Under the same conditions, the present invention has more rapid heat dissipation, and lamp luminescence efficiency is high, the advantage of long service life.
Description
Technical field
The present invention relates to high-power LED lamp technical field, a kind of big work(with heat conduction compound medium layer is referred in particular to
Rate LED lamp.
Background technology
It is well known that high-power LED lamp needs to distribute amount of heat when working, if radiating is not smooth, LED will be had a strong impact on
The performance and used life of light fixture.Because LED chip is very sensitive to temperature, junction temperature is higher, and light decay is bigger, and the life-span is shorter.
And high-powered LED lamp, heat of light source concentration, in unit area, the radiating rate of high-powered LED lamp is constant, and big work(
The heat that rate LED is operationally produced is more and more, causes produced partial heat to be accumulated in LED lamp panel, therefore
The heat of high-powered LED lamp is effectively dissipated not in time for a long time, may result in LED light effect rapid decay.Therefore, it is high-power
The heat dissipation problem of LED turns into the key of design.And widespread practice is to increase radiator, so, not only radiating effect is not
Ideal, also increases product weight, while increased cost.
The content of the invention
The present invention provides a kind of high-power LED lamp with heat conduction compound medium layer for problem of the prior art.
In order to solve the above-mentioned technical problem, the present invention is adopted the following technical scheme that：
A kind of high-power LED lamp with heat conduction compound medium layer, include radiator, high-power LED light source and thoroughly
Tabula rasa, the high-power LED light source and the light-passing board lower section for being fixed on radiator sequentially stacked on top of one another, the radiator and big work(
Rate LED light source is provided with heat conduction compound medium layer, and the heat conduction compound medium layer has at least pressed copper dielectric layer and aluminium dielectric layer；
In assembling, the copper dielectric layer is fitted with the back side of high-power LED light source, and aluminium dielectric layer is fitted with the lower surface of radiator.
Further, the heat conduction compound medium layer also includes graphite linings, and the graphite linings are pressed is arranged at copper Jie
Matter layer and the centre of aluminium dielectric layer.
Used as preferred, the thickness of the copper dielectric layer is 3~6mm, and the thickness of graphite linings is 2~3mm, aluminium dielectric layer
Thickness is 3~5mm.
Further, the high-power LED light source includes pcb board and located at the positive number row LED chip of pcb board,
Multiple screw through-holes are provided with the pcb board, the high-power LED light source passes through screw through-hole and heat conduction by using screw
Compound medium layer is fixed together.
Further, the light-passing board is being provided with convex surface with each LEDs chip corresponding position.
Wherein, the radiator is made up of the left radiator of structure identical and right radiator, in left radiator and right radiating
The side of body has the staged for being easy to mutual docking to plug together portion, and the staged portion of plugging together is provided with fixed via and fastener,
After left radiator is plugged together in place mutually with right radiator, the fastener passes through fixed via by left radiator and right radiating
Body is connected to one.
Further, radiator lower section is provided with two groups of high-power LED light sources and light-passing board, two groups of light-passing boards it
Between be provided with middle compression bar.
Further, the left radiator and right radiator are respectively equipped with semicircle shoulder hole, after fixation is plugged together mutually,
A circular shape through hole is centrally formed in the radiator；Round end cap is installed in the manhole, in circle
It is provided with end cap and is easy to for wire to penetrate interior wire through-hole.
Further, be additionally provided with the round end cap be easy to by whole light fixture lift suspension ring, the suspension ring with
Round end cap is integrally formed.
Further, the upper end of the radiator is provided with the support frame of rotatably adjustable light fixture irradiating angle, described
Support frame includes Qian type link, has been respectively articulated with two tops of Qian type link and has been fixedly connected piece.
Beneficial effects of the present invention：
A kind of high-power LED lamp with heat conduction compound medium layer provided by the present invention, includes radiator, big work(
Rate LED light source and light-passing board, the high-power LED light source and the light-passing board lower section for being fixed on radiator sequentially stacked on top of one another, institute
State radiator and high-power LED light source is provided with heat conduction compound medium layer, the heat conduction compound medium layer has at least pressed copper and has been situated between
Matter layer and aluminium dielectric layer；Assembling when, the copper dielectric layer fit with the back side of high-power LED light source, aluminium dielectric layer and radiate
The lower surface laminating of device.When at work, the heat that high-power LED light source is produced rapidly is derived to heat conduction compound medium layer,
Then heat is conducted to radiator by heat conduction compound medium layer again so that heat transmission passage is constantly in outside positive biography
It is defeated, will not accumulate on LED chip；Under the same conditions, the present invention has more rapid heat dissipation, and lamp luminescence efficiency is high, uses
The advantage of long lifespan.The present invention is especially suitable for more than 300W high-power LED lamps.
Brief description of the drawings
Fig. 1 is a kind of structural representation one of the high-power LED lamp with heat conduction compound medium layer of the present invention.
Fig. 2 is a kind of structural representation two of the high-power LED lamp with heat conduction compound medium layer of the present invention.
Fig. 3 is a kind of structure of the high-power LED lamp with heat conduction compound medium layer of the present invention when light-passing board is hidden
Schematic diagram.
Fig. 4 is a kind of structure decomposition figure of the high-power LED lamp with heat conduction compound medium layer of the present invention.
Fig. 5 is the interface schematic diagram of heat conduction compound medium layer in the present invention.
Reference in Fig. 1 to Fig. 5 includes：
1-radiator 11-left radiator 12-right radiator
13-staged plugs together portion's 2-high-power LED light source, 21-pcb board
22-LED chip, 3-light-passing board, 31-convex surface
4-heat conduction compound medium layer 41-copper dielectric layer 42-aluminium dielectric layer
43-graphite linings 5-centre compression bar 6-semicircle shoulder hole
7-round end cap, 8-suspension ring, 9-support frame
91-Qian type link 92-be fixedly connected piece.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further with reference to embodiment and accompanying drawing
It is bright, the content that implementation method is referred to not limitation of the invention.Referring to Fig. 1 to Fig. 5, the present invention is carried out below in conjunction with accompanying drawing
Detailed description.
A kind of high-power LED lamp with heat conduction compound medium layer that the present invention is provided, includes radiator 1, big work(
Rate LED light source 2 and light-passing board 3, the high-power LED light source 2 and light-passing board 3 is sequentially stacked on top of one another is fixed under radiator 1
Side, as shown in Fig. 2 spiral shell through hole is provided with around light-passing board 3, it is of the invention to be fixed on light-passing board 3 by using screw
The lower section of radiator 1, and high-power LED light source 2 is encapsulated.The radiator 1 is set with high-power LED light source 2
There is heat conduction compound medium layer 4, the heat conduction compound medium layer 4 is at least pressed copper dielectric layer 41 and aluminium dielectric layer 42；In assembling
When, the copper dielectric layer 41 is fitted with the back side of high-power LED light source 2, and aluminium dielectric layer 42 is fitted with the lower surface of radiator 1.
Further, the heat conduction compound medium layer 4 also includes graphite linings 43, and the graphite linings 43 are arranged at copper dielectric layer by pressing
41 with the centre of aluminium dielectric layer 42.Used as preferred, the thickness of heretofore described copper dielectric layer 41 is 3~6mm；Graphite linings 43
Thickness be 2~3mm, the thickness of aluminium dielectric layer 42 is 3~5mm, and the thermal conductivity factor of aluminium dielectric layer 42 is more than 2.0.
The Main Function of radiator 1 is that the heat produced during LED chip 22 is worked constantly is derived and is dispersed into environment,
The temperature of LED chip 22 is set to be maintained in required scope, so as to ensure that LED being capable of normal work.The quality of radiator 1
The thermal resistance of radiator 1 is depended primarily on, thermal resistance is smaller, LED junction temperature is lower under the same terms；The junction temperature of LED chip 22 is lower,
The service life of LED chip 22 will be more long.
The thermal conductivity factor of metallic copper and aluminium is higher, and proportion is small, and easy processing is cheap, and with good ductility；
In the present invention, copper dielectric layer 41 and aluminium dielectric layer 42 clamp in centre thermal conductivity factor graphite linings 43 higher, form heat conduction
Coefficient heat conduction compound medium layer 4 higher.The LED lamp panel of typical high power light fixture is directly fixed on the lower section of radiator, works as LED
Lamp plate toward the heat of heat sink reach certain value when, the transmission speed between LED lamp panel and radiator slows down, in addition both
Between heat transfer be not positive transmission, cause LED junction temperature serious.Heat conduction compound medium layer 4 of the present invention is in radiator 1
With the effect for serving as heat transfer protective layer in high-power LED light source 2, when at work, the heat that high-power LED light source 2 is produced
Amount can be derived rapidly to heat conduction compound medium layer 4, and then heat is conducted to radiator 1 by heat conduction compound medium layer 4 again,
Heat is outwards during transmission, and the heat conduction compound medium layer 4 is first quick from high-power LED light source 2 by copper dielectric layer 41
Heat is drawn through to come, then graphite linings 43 and aluminium dielectric layer 42 discharge heat to radiator 1 toward the direction of radiator 1 so that heat
Transmission channel is constantly in outside positive transmission, so that heat will not be being accumulated on LED chip 21；In the same terms
Under, the present invention has more rapid heat dissipation, and lamp luminescence efficiency is high, the advantage of long service life.Therefore, the present invention is than conveniently application
Used in the great power LED of more than 300W.
Further, the high-power LED light source 2 includes pcb board 21 and located at the positive number row LED of pcb board 21
Chip 22, is provided with multiple screw through-holes on the pcb board 21；Because the average heat transfer of radiator 1 distance is shorter, the heat of radiator 1
Resistance is smaller, and high-power LED light source of the invention 2 is fixed with heat conduction compound medium layer 4 through screw through-hole by using screw and connected
It is connected together, high-power LED light source 2 and heat conduction compound medium layer 4 is tightly affixed on the lower section of radiator 1, can effectively reduces
Thermal resistance in heat transfer process.
Further, the light-passing board 3 is being provided with convex surface 31 with each corresponding position of LEDs chip 22.LED chip
22 light the gathering by convex surface 31 projected, light utilization can be improved and light is outranged.
In the present invention, the radiator 1 is made up of the left radiator 11 of structure identical and right radiator 12, in left radiating
The side of body 11 and right radiator 12 has the staged for being easy to mutual docking to plug together portion 13, and plugging together portion 13 in staged is provided with
Fixed via and fastener（Do not marked in figure）, it is described after left radiator 11 is plugged together in place mutually with right radiator 12
With right radiator 12 be connected to one left radiator 11 through fixed via by fastener.Typical high power LED dissipate
To increase radiating efficiency, its volume is typically designed larger hot device, and so, not only radiating effect is unsatisfactory, also increases product
Product weight, while increased cost.This radiator 1 is made up of the left radiator 11 of structure identical and right radiator 12, is easy to factory
Family's die sinking production, effectively reduces the production cost of radiator.
Further, because radiator 1 is combined by two halves, its volume and surface are larger；Below the radiator 1
Two groups of high-power LED light sources 2 and light-passing board 3 are provided with, are so easy to be split the light emitting source of high-power LED light source 2, that
Produced heat is also just independent of each other, and is conducive to further lifting to increase the power of LED lamp.Two groups of light-passing boards 3 it
Between be provided with middle compression bar 5, the gap between two groups of light-passing boards 3 can be covered, prevent dust or water from entering in lamp, protect
Shield LED lamp is not influenceed by external environment.
Further, the left radiator 11 and right radiator 12 are respectively equipped with semicircle shoulder hole 6, when the He of left radiator 11
Right radiator 12 is plugged together mutually after fixing, and a circular shape through hole is centrally formed in the radiator 1；It is described circular logical
Round end cap 7 is installed in hole, is provided with round end cap 7 and is easy to for wire to penetrate interior wire through-hole.Further
, the suspension ring 8 for being easy to lift whole light fixture, the suspension ring 8 and the one of round end cap 7 are additionally provided with the round end cap 7
Shaping.By the present invention in that round end cap 7 is fixed on into circular shape through hole outward from interior with screw, suspension ring 8 are located at round nose
The top center of lid 7, this is facilitated carries out vertical lifting by this high-power LED lamp, need to only pass through suspension ring 8 real suspender
The now installation of this high-power LED lamp, simple and fast.
Further, the upper end of the radiator 1 is provided with the support frame 9 of rotatably adjustable light fixture irradiating angle, institute
Stating support frame 9 includes Qian type link 91, has been respectively articulated with two tops of Qian type link 91 and has been fixedly connected piece 92.When this
When high-power LED lamp is as stage or outdoor projecting lamp, general degree needs to need to be adjusted light according to actual illumination
Angle.When in use, support frame 9 is installed in the upper end of radiator 1, by its slant setting.The Qian type link 91 is fixed and connected
It is connected on falsework or ground, in adjustment angle, only firmly need to holds radiator 1, makes radiator 1 around Qian type link
91 rotations, you can adjustment light angle.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to of the invention
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Limitation.
Claims (7)
1. a kind of high-power LED lamp with heat conduction compound medium layer, includes radiator, high-power LED light source and printing opacity
Plate, the high-power LED light source is located between radiator and light-passing board, it is characterised in that：The radiator and great power LED light
Source sets heat conduction compound medium layer, and the heat conduction compound medium layer has at least pressed copper dielectric layer and aluminium dielectric layer；In assembling,
The copper dielectric layer is fitted with the back side of high-power LED light source, and aluminium dielectric layer is fitted with the lower surface of radiator；
The heat conduction compound medium layer also includes graphite linings, and the graphite linings are pressed is arranged at copper dielectric layer and aluminium dielectric layer
Centre；
The thickness of graphite linings is 2~3mm；
The radiator is made up of the left radiator of structure identical and right radiator, equal in the side of left radiator and right radiator
There is the staged for being easy to mutual docking to plug together portion, the staged portion of plugging together is provided with fixed via and fastener, when left radiator
After being plugged together in place mutually with right radiator, with right radiator be fixedly connected left radiator through fixed via by the fastener
It is integrated.
2. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, it is characterised in that：Institute
High-power LED light source is stated including pcb board and located at the positive number row LED chip of pcb board, multiple is provided with the pcb board
Screw through-hole, the high-power LED light source is fixedly connected on through screw through-hole by using screw with heat conduction compound medium layer
Together.
3. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 2, it is characterised in that：Institute
State light-passing board and each LEDs chip corresponding position is being provided with convex surface.
4. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, it is characterised in that：Institute
State radiator lower section and be provided with two groups of high-power LED light sources and light-passing board, middle compression bar is provided between two groups of light-passing boards.
5. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, it is characterised in that：Institute
State left radiator and right radiator is respectively equipped with semicircle shoulder hole, after fixation is plugged together mutually, at the center of the radiator
Form a circular shape through hole；Round end cap is installed in the circular shape through hole, is provided with just in round end cap
Wire through-hole in wire is penetrated.
6. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 5, it is characterised in that：Institute
The suspension ring for being additionally provided with round end cap and being easy to lift whole light fixture are stated, the suspension ring are integrally formed with round end cap.
7. a kind of high-power LED lamp with heat conduction compound medium layer according to claim 1, it is characterised in that：Institute
The upper end for stating radiator is provided with the support frame of rotatably adjustable light fixture irradiating angle, and support frame as described above includes Qian type link,
It has been respectively articulated with two tops of Qian type link and has been fixedly connected piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510138743.XA CN104747952B (en) | 2015-03-27 | 2015-03-27 | A kind of high-power LED lamp with heat conduction compound medium layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510138743.XA CN104747952B (en) | 2015-03-27 | 2015-03-27 | A kind of high-power LED lamp with heat conduction compound medium layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104747952A CN104747952A (en) | 2015-07-01 |
| CN104747952B true CN104747952B (en) | 2017-07-04 |
Family
ID=53588044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510138743.XA Active CN104747952B (en) | 2015-03-27 | 2015-03-27 | A kind of high-power LED lamp with heat conduction compound medium layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104747952B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901865A (en) * | 2009-05-28 | 2010-12-01 | 三星电机株式会社 | Metallic laminate and manufacturing method of light emitting diode package using the same |
| CN202791620U (en) * | 2012-06-08 | 2013-03-13 | 四川华体照明科技股份有限公司 | Light-emitting diode (LED) light source |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109116B (en) * | 2010-12-27 | 2016-06-22 | 秦彪 | Led light module and led chip |
| CN202221067U (en) * | 2011-01-14 | 2012-05-16 | 赖日旺 | Composite metal heat-dissipating structure formed by mono-metal layers |
| CN202757052U (en) * | 2012-08-16 | 2013-02-27 | 湖南普斯赛特光电科技有限公司 | Grading structure of light-emitting diode (LED) lamp |
| CN202927591U (en) * | 2012-12-11 | 2013-05-08 | 西安尚华电子科技有限公司 | LED (Light-emitting diode) illuminating lamp |
| CN204513035U (en) * | 2015-03-27 | 2015-07-29 | 浙江磐安绿光电子有限公司 | A kind of high-power LED lamp with heat conduction compound medium layer |
-
2015
- 2015-03-27 CN CN201510138743.XA patent/CN104747952B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901865A (en) * | 2009-05-28 | 2010-12-01 | 三星电机株式会社 | Metallic laminate and manufacturing method of light emitting diode package using the same |
| CN202791620U (en) * | 2012-06-08 | 2013-03-13 | 四川华体照明科技股份有限公司 | Light-emitting diode (LED) light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104747952A (en) | 2015-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101761812B (en) | Lamp tube type LED lamp | |
| CN205264758U (en) | High heat dissipating LED filament | |
| CN102506331B (en) | Ultrahigh-power LED bulb replacing gas discharge lamp | |
| CN101387391A (en) | LED lamp | |
| CN202992715U (en) | Light emitting diode (LED) bulb | |
| CN104747952B (en) | A kind of high-power LED lamp with heat conduction compound medium layer | |
| CN201739875U (en) | LED bulb light with heat radiation structure | |
| CN204513035U (en) | A kind of high-power LED lamp with heat conduction compound medium layer | |
| CN205877760U (en) | LED (Light -Emitting diode) radiating module | |
| CN205261246U (en) | LED (light -emitting diode) lamp component | |
| CN204785723U (en) | LED lamp plate of copper cooling is applied in adoption | |
| CN203024114U (en) | Heat radiator of LED (Light Emitting Diode) lamp | |
| CN202349651U (en) | Ultrahigh power light-emitting diode (LED) bulb capable of replacing gas discharge lamp | |
| CN208794112U (en) | A kind of novel deformation bulb lamp | |
| CN203586163U (en) | Heat radiator of LED (Light Emitting Diode) lamp | |
| CN105910035A (en) | Smart home spotlighting equipment with good heat dissipation performance | |
| CN201284939Y (en) | LED lamp | |
| CN101718401A (en) | LED lamp | |
| CN207213667U (en) | A kind of big efficient low light attenuation LED light source component of lighting angle | |
| CN105003868A (en) | LED streetlamp module | |
| CN201547725U (en) | Heat dissipation device of LED lamp | |
| CN202675223U (en) | Heat conduction and dissipation system of LED (light-emitting diode) lamp | |
| CN204100202U (en) | A kind of radiator structure of LEDbulb lamp | |
| CN204062753U (en) | Hollow convection heat dissipation type LED head ceiling fitting | |
| CN201652066U (en) | LED streetlamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Jun Inventor before: Liu Jun Inventor before: Deng Zhixiong Inventor before: Yang Honglan |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160722 Address after: Panan County, Zhejiang province 322300 Chang Jinhua City Road 15 Applicant after: ZHEJIANG PAN'AN GREEN LIGHT ELECTRONIC CO.,LTD. Address before: 322300, Jinhua County, Zhejiang province Jianshan Panan Industrial Zone Zhejiang Panan green light Electronics Co., Ltd. Applicant before: ZHEJIANG PAN'AN GREEN LIGHT ELECTRONIC CO.,LTD. Applicant before: Liu Jun Applicant before: Deng Zhixiong Applicant before: Yang Honglan |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230914 Address after: No. 1 Damaiwu 6th Road, Xinwu Street, Pan'an County, Jinhua City, Zhejiang Province, 322305 Patentee after: ZHEJIANG LUOQI TAIKE TECHNOLOGY Co.,Ltd. Address before: No.15, Changwen Road, Pan'an County, Jinhua City, Zhejiang Province 322300 Patentee before: ZHEJIANG PAN'AN GREEN LIGHT ELECTRONIC CO.,LTD. |
|
| TR01 | Transfer of patent right |