CN104737313A - LED package with multiple element light source and encapsulant having planar surfaces - Google Patents

LED package with multiple element light source and encapsulant having planar surfaces Download PDF

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Publication number
CN104737313A
CN104737313A CN201380053182.2A CN201380053182A CN104737313A CN 104737313 A CN104737313 A CN 104737313A CN 201380053182 A CN201380053182 A CN 201380053182A CN 104737313 A CN104737313 A CN 104737313A
Authority
CN
China
Prior art keywords
led
sealant
emitter package
light
encapsulation piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380053182.2A
Other languages
Chinese (zh)
Inventor
西奥多·洛韦斯
埃里克·塔尔萨
斯滕·海克曼
贝恩德·凯勒
杰西·赖尔策
霍莫泽·本杰明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/649,052 external-priority patent/US9048396B2/en
Priority claimed from US13/770,389 external-priority patent/US20130328074A1/en
Application filed by Cree Inc filed Critical Cree Inc
Publication of CN104737313A publication Critical patent/CN104737313A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.

Description

There is the LED encapsulation piece of polynary light source and there is the sealant of flat surfaces
The application is u.s. patent application serial number 13/649,067 and u.s. patent application serial number 13/649, the part of 052 continues and requires its interests, these two apply for submission on October 10th, 2012, and require the U.S. Provisional Patent Application sequence number 61/658 submitted on June 11st, 2012,271, the U.S. Provisional Patent Application sequence number 61/660,231 submitted on June 15th, 2012 and the interests of U.S. Provisional Patent Application sequence number 61/696,205 submitted on September 2nd, 2012.
Technical field
The invention belongs to solid-state light emitters and especially belong to light-emitting diode (LED) packaging part with multiple LED, described packaging part can produce the efficiency light with wider transmitting pattern and launch from the device with less overlay area.
Background technology
Usual use incandescent lamp or based on the light fixture of filament or bulb, as living and the light source of commercial facility.But the low-down light source of this luminaire efficiency, consumes the input energy up to 95%, mainly has the form of heat energy or infrared energy.The common alternative of of incandescent lamp (so-called compact fluorescent lamp (CFL)) is more effective when electric power being converted to light, but need to use toxic material, these toxic materials can cause chronic and acute poisoning and can cause environmental pollution together with its various element.The a solution improving the efficiency of light fixture or bulb uses solid-state device (such as, light-emitting diode (one or more LED), but not metallic filament) to produce light.
Light-emitting diode generally includes one or more active layers of the semi-conducting material be clipped between contrary doped layer.When doped layer is applied bias force, by hole and electron injection active layer, wherein, hole and electronics reconfigure, to generate light.Utilizing emitted light from active layer and from the various surfaces of LED.
In order to circuit or other similar arrange in use LED chip, as everyone knows, LED chip is loaded in packaging part, to provide environment and/or mechanical protection, color selecting, optically focused etc.LED encapsulation piece also comprises electrical lead, contact or track, for being electrically connected LED encapsulation piece and external circuit.In typical LED encapsulation piece 10 in FIG, single led chip 12 is arranged on reflector 13 by welding or conducting epoxy.One or more wire-bonded 11 connects ohmic contact and lead-in wire 15A and/or 15B of LED chip 12, and these lead-in wires can be connected to reflector 13 or be integrally formed with it.Reflector can be equipped with the sealant material 16 that can comprise material for transformation of wave length (such as, phosphor).The light with first wave length launched by LED can be absorbed by phosphor, and this phosphor can responsively launch the light with second wave length.Then, whole component package is in transparency protected resin 14, and this resin can be molded as the lensed shape of tool, to calibrate the light launched by LED chip 12.Although reflector 13 can guide light in direction upwards, when reverberation, light loss (that is, because the reflector surface of reality has the reflectivity being less than 100%, so reflector can absorbent portion light splitting) can be there is.In addition, owing to being difficult to extract heat by lead-in wire 15A, 15B, so heat insulating ability can be the problem of packaging part, such as, the packaging part 10 in FIG.
Traditional LED encapsulation piece 20 in fig. 2 can be more suitable for the high power operation that can generate more heats.In LED encapsulation piece 20, one or more LED chip 22 is arranged on carrier, such as, and printed circuit board (PCB) (PCB) carrier, substrate or substrate 23.The solid metal reflector 24 be arranged on substrate 23 surrounds LED chip 22 and reflects the light launched by the LED chip 22 away from packaging part 20.Reflector 24 is also for LED chip 22 provides mechanical protection.Ohm contact on LED chip 22 is connected 27 with the one or more wire-bonded of carrying out between electrical trace 25A, 25B on substrate 23.Then, the LED chip 22 of installation is coated with sealant 26, and sealing agent can provide environment and mechanical protection for chip, is also used as lens simultaneously.Solid metal reflector 24 is connected to carrier by solder or epoxy adhesive usually.
LED chip (such as, the chip found out in the LED encapsulation piece 20 of Fig. 2) can be included coated by the transition material of one or more phosphor, absorbs at least part of LED light to make phosphor.LED chip can launch the light of different wave length, to launch the light of LED and the combination of phosphor.LED chip can use multiple diverse ways to scribble phosphor, by the people such as Chitnis all and be entitled as the u.s. patent application serial number 11/656 of " Wafer Level Phosphor Coating Method and DevicesFabricated Utilizing Method ", 759 and 11/899, in 790, describe a kind of suitable method.Or, use additive method (such as, electrophoretic deposition (EPD)), LED can be applied, by all U.S. Patent Application No. 11/473 being entitled as " Close LoopElectrophoretic Deposition of Semiconductor Devices " of the people such as Tarsa, in 089, describe a kind of suitable EPD method.
The LED encapsulation piece 30 that another kind shown is in figure 3 traditional comprises LED32 on substrate 34, defines hemispherical lens 36 thereon.Can by can the transition material of all or most of light of conversion LED, coating LED 32.Hemispherical lens 36 is set to the total internal reflection reducing light as far as possible.Compared with LED 32, make lens larger, so that LED 32 is close to the point-source of light under lens.As a result, increase the amount of the LED light on the surface arriving lens 36 as far as possible, to increase the light quantity of first launching from lens 36 as far as possible.This can cause larger device, wherein, increase the distance at the edge from LED to lens as far as possible, and the edge of substrate can extend outwardly beyond the edge of sealant.And these devices produce generally for the not desirable all the time Lambert emission pattern (pattern) of wide emitting area application.In the packaging part of parts of traditional, launch profile (profile) and 120 degree of fulls width at half maximum (full width at half maximum, halfwidth) (FWHM) can be solved.
Still further developed the light fixture utilizing the solid state light emitter (such as, LED) be separated with LED or combine away from the transition material of LED.By all U.S. Patent number 6,350 being entitled as " High Output RadialDispersing Lamp Using a Solid State Light Source " of the people such as Tarsa, in 041, disclose this set.The light fixture described in this patent can comprise solid state light emitter, this solid state light emitter by separator by optical transport to the disperser with phosphor.Disperser can in the pattern expected dispersed light and/or convert at least part of light to different wavelength by phosphor or other transition materials and change its color.In some embodiments, separator makes light source and disperser separate sufficient distance, so that when light source carries the higher electric current required for room lighting, the heat of light source can not be transferred to disperser.At the U.S. Patent number 7,614,759 being entitled as " Lighting Device " that the people such as Negley are all, describe extra remote phosphorescence body technique.
Summary of the invention
Present invention relates in general to reflector or LED encapsulation piece, it is compact and utilizing emitted light effectively, and can comprise the sealant with flat surfaces, and described flat surfaces reflects and/or reverberation in packaging part sealant.In some embodiments, described packaging part can also comprise the substrate with a LED, and other execution modes can comprise multiple LED.In the execution mode of single LED, covering (blanket) transition material layer can cover LED, and in the execution mode of many LED, covering transition material layer can be positioned on one or more LED.Covering transition material can also cover substrate at least partially.Sealant can be positioned in substrate, is positioned at above LED, and is positioned at least partially above covering transition material.Due to the total internal reflection of the encapsulant surface of (such as) flat surfaces or other shapes, so can transition material be arrived at the part light of sealant internal reflection, wherein, can omni-directional scattering or absorption, conversion and then utilizing emitted light.This allows utilizing emitted light, to overflow from sealant now.Compared with having the conventional package of hemisphere sealant or lens time, this allows to have effectively launches and broader transmitting profile.
In some embodiments, LED encapsulation piece provides the ratio of higher chip area and LED encapsulation piece area.By using the sealant with flat surfaces, LED encapsulation piece can provide unique size relationship between various packaging part feature, when using packaging part in different application (such as, for replacing the linear LED of linear fluorescent lamp), greater flexibility can be had.Different LED packaging part according to the present invention can have different shapes, such as, and rectangle, and can have than highly larger width.Different execution modes can provide unique size relationship, and these relations can comprise: sealant height, width and with the distance of the border of LED chip, distance in multi-chip execution mode between LED chip, LED epi region to packaging part region, each packaging part overlay area has wider transmitting pattern, each packaging part overlay area has more optical output power, the mixing or mixture or uniformity of the raising of different colours of being launched by packaging part.
In some LED or emitter package part execution mode, covering transition material layer can be provided, as the layer comprising the adhesive with transition material.In other embodiments, can provide transition material in sealant, described transition material occupies and not all sealant.In other words, a part of sealant can have transition material, and the remainder of sealant does not have transition material.
The one or more solid state light emitters on substrate can be included according to the some embodiments of emitter package part of the present invention.Comprise sealant in solid state light emitter and described surface, sealant has one or more flat surfaces.Sealant also has the transition material occupying also not all sealant
Can use according to different reflector of the present invention and LED encapsulation piece be of different sizes, the Different Light of shape and feature.The covering transition material layer being arranged on the one or more LED on substrate and the surface at least one LED is comprised according to the some embodiments of emitter package part of the present invention.Substrate comprises sealant, and sealant has one or more flat surfaces.At least one LED has geometry, and this geometry has one or more surfaces of at least part of inclination at least one surface facing to sealant.
Comprise the one or more LED be arranged on substrate according to other execution modes of emitter package part of the present invention, substrate has sealant.Sealant can have one or more flat surfaces.Above substrate and at least one LED, also comprise covering transition material layer, wherein, at least one LED has surface of the texture.
The one or more LED be arranged on substrate are comprised according to another execution mode of emitter package part of the present invention.Can comprise sealant on substrate, sealant has one or more flat surfaces.Can comprise covering transition material layer above described substrate and at least one LED, wherein, at least one LED has Sapphire Substrate.
By following detailed description and the accompanying drawing that feature of the present invention is described by example, these and other aspects of the present invention and advantage apparent.
Accompanying drawing explanation
Fig. 1 shows the cutaway view of an execution mode of prior art LED encapsulation piece;
Fig. 2 shows the cutaway view of another execution mode of prior art LED encapsulation piece;
Fig. 3 shows the cutaway view of another execution mode of prior art LED encapsulation piece;
Fig. 4 is the top perspective of an execution mode according to LED encapsulation piece of the present invention;
Fig. 5 is the bottom perspective view of LED encapsulation piece shown in the diagram;
Fig. 6 is the end view of LED encapsulation piece shown in the diagram;
Fig. 7 is another end view of LED encapsulation piece shown in the diagram;
Fig. 8 is the top view of LED encapsulation piece shown in the diagram;
Fig. 9 is the bottom view of LED encapsulation piece shown in the diagram;
Figure 10 is another top view of LED encapsulation piece shown in the diagram, shows an execution mode of its size;
Figure 11 is another end view of LED encapsulation piece shown in the diagram, shows an execution mode of its size;
Figure 12 is another top view of LED encapsulation piece shown in the diagram, shows an execution mode of its size;
Figure 13 is another perspective view of LED encapsulation piece shown in the diagram;
Figure 14 shows an execution mode of the pad that can be used for LED encapsulation piece according to the present invention to use;
Figure 15 shows an execution mode of the track layout that can be used for LED encapsulation piece according to the present invention to use;
Figure 16 is the top view of traditional LED belt carrier;
Figure 17 is the cutaway view of an execution mode according to LED encapsulation piece of the present invention;
Figure 18 is the transmitting profile diagram of an execution mode according to LED encapsulation piece of the present invention;
Figure 19 is the colour temperature profile diagram of an execution mode according to LED encapsulation piece of the present invention;
Figure 20 is the top perspective of an execution mode according to LED encapsulation piece of the present invention;
Figure 21 is the bottom perspective view of LED encapsulation piece shown in fig. 20;
Figure 22 is the end view of LED encapsulation piece shown in fig. 20 to 25;
Figure 26 is the top view of LED encapsulation piece shown in fig. 20;
Figure 27 is the bottom view of LED encapsulation piece shown in fig. 20;
Figure 28 is the top perspective of an execution mode according to LED encapsulation piece of the present invention;
Figure 29 is the bottom perspective view of the LED encapsulation piece shown in Figure 28;
The end view that Figure 30 is the LED encapsulation piece shown in Figure 28 to 33;
Figure 34 is the top view of the LED encapsulation piece shown in Figure 28;
Figure 35 is the bottom view of the LED encapsulation piece shown in Figure 28;
Figure 36 is the top view of an execution mode according to substrate of the present invention;
Figure 37 is the top view of an execution mode according to substrate of the present invention;
Figure 38 is the top view of another execution mode according to substrate of the present invention;
Figure 39 is the top view of another execution mode according to substrate of the present invention;
Figure 40 is the top view of another execution mode according to substrate of the present invention;
Figure 41 is the top view of another execution mode according to substrate of the present invention;
Figure 42 is the top view of an execution mode according to sealant mould of the present invention;
Figure 43 is the top view of another execution mode according to LED encapsulation piece of the present invention;
Figure 44 is the end view of the LED encapsulation piece shown in Figure 43;
Figure 45 is the bottom view of the LED encapsulation piece shown in Figure 43;
Figure 46 is the perspective view of the LED encapsulation piece shown in Figure 43;
Figure 47 illustrates the diagram replacing the performance characteristic of pipe for LED-based fluorescence according to the present invention;
Figure 48 illustrates another diagram replacing the performance characteristic of pipe for LED-based fluorescence according to the present invention;
Figure 49 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 50 is the end view of the LED encapsulation piece shown in Figure 49;
Figure 51 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 52 is the end view of the LED encapsulation piece shown in Figure 51;
Figure 53 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 54 is the end view of the LED encapsulation piece shown in Figure 53;
Figure 55 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 56 is the end view of the LED encapsulation piece shown in Figure 55;
Figure 57 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 58 is the end view of the LED encapsulation piece shown in Figure 57;
Figure 59 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 60 is the end view of the LED encapsulation piece shown in Figure 59;
Figure 61 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 62 is the end view of LED encapsulation piece shown in figure 61;
Figure 63 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 64 is the end view of the LED encapsulation piece shown in Figure 63;
Figure 65 is the top perspective of an execution mode according to LED encapsulation piece of the present invention;
Figure 66 is the bottom perspective view of the LED encapsulation piece shown in Figure 65;
Figure 67 is the top view of the LED encapsulation piece shown in Figure 65;
Another end view that Figure 68 is the LED encapsulation piece shown in Figure 65;
Figure 69 is the bottom view of the LED encapsulation piece shown in Figure 65;
Figure 70 is the end view of the LED encapsulation piece shown in Figure 65;
Figure 71 is another transmitting profile diagram according to LED encapsulation piece of the present invention;
Figure 72 is the colour temperature profile diagram of an execution mode according to LED encapsulation piece of the present invention;
Figure 73 is the diagram that the luminous flux according to different LED packaging part of the present invention with different input currents is shown;
Figure 74 is the diagram that the effect according to different LED packaging part of the present invention with different input currents is shown;
Figure 75 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 76 is the bottom perspective view of the LED encapsulation piece shown in Figure 75;
Figure 77 is the top view of the LED encapsulation piece shown in Figure 75;
Another end view that Figure 78 is the LED encapsulation piece shown in Figure 75;
Figure 79 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 80 is the bottom perspective view of the LED encapsulation piece shown in Figure 79;
Figure 81 is the top view of the LED encapsulation piece shown in Figure 79;
Figure 82 is the end view of the LED encapsulation piece shown in Figure 79;
Figure 83 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 84 is the bottom perspective view of the LED encapsulation piece shown in Figure 83;
Figure 85 is the top view of the LED encapsulation piece shown in Figure 83;
Figure 86 is the end view of the LED encapsulation piece shown in Figure 83;
Figure 87 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 88 is the bottom perspective view of the LED encapsulation piece shown in Figure 87;
Figure 89 is the top view of the LED encapsulation piece shown in Figure 87;
Figure 90 is the end view of the LED encapsulation piece shown in Figure 87;
Figure 91 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 92 is the top view of the bonding wafer liner in the LED encapsulation piece shown in Figure 91;
Figure 93 is the top view of the pad in the LED encapsulation piece shown in Figure 91;
Figure 94 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 95 is the top view of the bonding wafer liner in the LED encapsulation piece shown in Figure 94;
Figure 96 is the top view according to another substrate of the present invention;
Figure 97 is the top view according to another substrate of the present invention;
Figure 98 is the cutaway view of an execution mode according to mixing chamber of the present invention;
Figure 99 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 100 is the end view of the LED encapsulation piece shown in Figure 99;
Figure 101 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 102 is the end view of the LED encapsulation piece shown in Figure 101;
Figure 103 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 104 is the end view of the LED encapsulation piece shown in Figure 103;
Figure 105 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 106 is the end view of the LED encapsulation piece shown in Figure 105;
Figure 107 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 108 is the end view of the LED encapsulation piece shown in Figure 107;
Figure 109 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 110 is the end view of the LED encapsulation piece shown in Figure 109;
Figure 111 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 112 is the end view of the LED encapsulation piece shown in Figure 111;
Figure 113 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 114 is the end view of the LED encapsulation piece shown in Figure 113;
Figure 115 is the top perspective of another execution mode according to LED encapsulation piece of the present invention;
Figure 116 is the end view of the LED encapsulation piece shown in Figure 115;
Figure 117 is the top perspective of another execution mode according to LED encapsulation piece of the present invention; And
Figure 118 is the end view of the LED encapsulation piece shown in Figure 117.
Embodiment
The present invention relates to the different execution modes of the LED encapsulation piece structure with light source, this light source comprises multiple LED chip.LED encapsulation piece can be arranged by different modes, and smaller, has efficiency, reliable and calculate simultaneously.Compared with the similar LED encapsulation piece with hemisphere sealant, can same or analogous efficiency emission be passed through according to some embodiments of the present invention, but can be less, and manufacture more cheap.
By transition material and sealant being arranged and being configured as the total internal reflection (TIR) of the light utilized in packaging part, these can be provided to improve according to packaging part of the present invention.That is, sealant can be shaped, can be reflected back towards the transition material in packaging part by the light that the angle of the critical angle being greater than TIR is incident on packaging part sealant, so that conversion or " recirculation " light.The light omni-directional scattering of recirculation or conversion and again launch from transition material, so that the light of part conversion is rebooted and can be arrived the surface of sealant by the angle being less than critical angle, and launch from packaging part.By LED encapsulation piece being set to the recirculation providing reverberation to this photon, such as, TIR light, can provide the different sealant shape and size of the shape and size closer to packaging part light source, and the edge of light source can closer to the edge of sealant to LED encapsulation piece.
In some embodiments, LED encapsulation piece can have flat surfaces, and these flat surfaces produce a certain amount of TIR light in sealant.Use flat surfaces, greater flexibility can be provided in different shapes, these shapes can be used, exceed traditional hemispherical lens, these lens are set to reduce TIR light as far as possible usually, and use flat surfaces, can allow the LED encapsulation piece that local is compacter.Some embodiments can be included in the one or more LED (" LED ") on substrate, and it has for the signal of telecommunication being applied to contact in described one or more LED and track.LED and the surface around LED can be covered by one deck transition material.Sealant can be included in the transparent material with cubic shaped of LED and surface.Transition material layer can be the type of the light light of LED being converted to another kind of color or wavelength, and conversion layer can have certain thickness and concentration, so that first by transition material conversion also not all LED.
Some embodiments can be included in LED encapsulation piece substrate with blue emission LED, has yellow conversion material layer on the surface of LED and surface, a part of blue light of transition material layer conversion LED chip.Cube sealant can be comprised at LED and surface, there is this layer of transition material between sealant and LED/ substrate.With compared with in traditional LED encapsulation piece, thinner phosphor layer or lower phosphor concentration can be comprised at identical color dot place according to packaging part of the present invention, so that more blue light is first through transition material layer.Due to typical conversion layer also scattering and converting blue light, so this can cause the packaging part efficiency of raising, this is because the conversion layer of less thickness or concentration causes the blue light of the first passage launched by LED to be less scattered back in LED, wherein, this light can be absorbed.Compared with traditional LED encapsulation piece, by realizing similar color, but there is thinner or lower concentration conversion layer, when manufacturing LED encapsulation piece constructed in accordance, can also realize saving cost.The part blueness of transition material and sodium yellow arrive the surface of sealant and launch from LED encapsulation piece in critical angle.Compared with having the conventional LED packages of hemisphere sealant, blueness and the sodium yellow of larger percentage stand TIR, so that light is in sealant internal reflection.This produces final blueness and the sodium yellow arriving transition material after TIR; That is, this light of TIR recirculation.The top of the bright conversion layer of blue TIR illumination, and the blue light of LED illuminates the lower surface of conversion layer, to illuminate the both sides of conversion layer." covering " effect limits blueness provided by transition material layer and sodium yellow reenter in chip or on substrate, impact other absorption regions.When light stands TIR in packaging part, which reducing can the amount of absorbent light.
At conversion layer converting blue light, omni-directional from transition material layer is caused again to launch gold-tinted.The both sides illuminating transition material layer are caused and are converted TIR blue light to omni-directional gold-tinted.This provide the chance allowing other TIR light to overflow from packaging part this advantage larger.The all right scattered light of this recirculation, this can cause the LED encapsulation piece wider than conventional apparatus to launch pattern, and conventional apparatus provides main Lambert emission pattern.This scattering can also cause the change being reduced colour temperature by different visual angles.
It being understood that in other embodiments, transition material layer only can apply LED, makes transition material layer not covered substrate.For multiple LED execution mode, different transition material layer can be comprised on different LED.It is also to be understood that, in other execution modes with different transition material layer execution modes, the all right coated portion of different transition materials or all substrates, this can produce and cover the different materials transition material of all or part substrate or the different switching material in the zones of different of substrate.Therefore, it being understood that in various embodiments, transition material can be positioned on LED, is positioned on substrate and/or is positioned at sealant.These different execution modes can also have the various combination of transition material position.Other execution modes can have the multiple phosphors on LED, substrate and/or in sealant.Part in these execution modes can comprise the mixture of three phosphors, such as, and yellow (such as, YAG), green (such as, LuAg) and red (such as, nitride).This is an only example of the multiple phosphor blends that can be used in different execution modes.
Partial encapsulation part execution mode according to the present invention can comprise the LED encapsulation piece with sealant, and sealant has multiple flat surfaces, and at least part of flat surfaces is set to strengthen TIR.The light of the LED light source of packaging part can unlikely be arrived flat surfaces by the angle being less than critical angle and can be stood TIR.Flat surfaces can smoother, so that the light arriving surface outside critical angle stands TIR, and can't help the feature such as physics or shaping and reboots or scattering.Substrate and the conductive traces of LED light source and surrounding can be covered by one deck covering transition material.TIR light can return towards LED and substrate reflection, and comprises in the conventional package of sorbent surface at substrate, can absorb light.By the surface using transition material to cover LED and surrounding, TIR light can scattering or conversion and recirculation, before arrival sorbent surface, to launch from LED encapsulation piece, thus improves packaging part efficiency.
Can comprising according to LED encapsulation piece of the present invention and be positioned at multiple LED on substrate or LED chip, there is contact, bonding liner and/or track, for the signal of telecommunication being applied to described one or more LED.Multiple LED can launch the light of same color or can launch the light of different colours, so that the combination of LED encapsulation piece radiative desired color from LED chip.LED can be provided with the LED chip with different patterns, and in some embodiments, LED chip can be the identical type of the same color launching operable each type, and in other embodiments, can use extra LED, these LED produce the light of additional color.In some embodiments, all or part LED chip can be covered by transition material, does not cover other LED chips.By using one or more LED of the one or more additional color of transmitting and/or making part LED wherein be covered by material for transformation of wave length, the color rendering index (CRI) of lighting unit can increase.As mentioned above and as described below in more detail, transition material layer can comprise one or more transition material, such as, phosphor, to provide the LED encapsulation piece of expectation to launch, such as, has the temperature of expectation and the white light of CRI.The United States Patent (USP) 7,213 issued, in 940, can find out the further detailed example using the LED of the light launching different wave length to produce white light in fact, this patent is incorporated herein, with for referencial use.
Part LED encapsulation piece according to the present invention can comprise the first group of LED chip covered by the transition material layer comprising at least one transition material.Packaging part also comprises the LED chip of the photoemissive one or more Second Type by different wave length, and transition material does not cover the second LED chip.Each first group of LED chip (if illumination) can launch blue light, and blue light has the dominant wavelength in the scope from 430nm to 480nm.Transition material layer by blue-light excited, can also can absorb at least part of blue light, and again can launch the light of the dominant wavelength had in from about 555nm to the scope of about 585nm.This light can be called Lan Zhuanhuang (BSY) light.Transition material layer can not cover the second LED chip type, and if by current electrifying, so the second LED chip type can launch the ruddiness of the dominant wavelength had in the scope from 600nm to 650nm or orange light.
Due to the first and second LED chip utilizing emitted lights, so LED encapsulation piece can be launched, (1) leaves the blue light of the packaging part of first group of LED chip, (2) leave the packaging part of the light comprising the first LED chip absorbed by transition material layer and the combination of the light of the lighting device of second group of LED chip in red or orange wavelength system is left in the BSY light then again launched and (3).When without any extra light, this on the 1931CIE chromatic diagram different from dominant emission device wavelength and in the polygon that x, y color coordinate of the transmitting by first, second LED chip and independent transition material composition creates, can produce the LED encapsulation piece with the light of x, y coordinate and launches mixture.The light launch coordinate of combination can be limited to the point in 10 MacAdam's ellipses of at least one point on black body locus on 1931CIE chromatic diagram.In some embodiments, the combination of this light also creates the sub-mixture of the light with x, y color coordinate, and described coordinate is limited by first, second, third, fourth and first, second, third, fourth and the 5th, the 1931CIE chromatic diagram closed of the line segment of connection is limited to the point in region at the 5th.First can have 0.32,0.40 x, y coordinate, second point can have x, y coordinate of 0.36,0.48, thirdly can have x, y coordinate of 0.43,0.45,4th can have 0.42,0.42 x, y coordinate, and the 5th can have 0.36,0.38 x, y coordinate.
Different packaging part according to the present invention can have the one or more LED comprising multiple difformity, size and feature.In partial encapsulation part execution mode, LED chip can have surface of the texture, and other execution modes can have LED and sealant, and sealing agent can be shaped, so that chip has the surface inclined towards each other.In other other execution modes, LED chip can be made up of material and be shaped, so that LED chip surface is parallel with the surface of sealant generally.
As described below in more detail, sealant can comprise the multiple different shape with flat surfaces, and in some embodiments, sealant can have cubical shape, and can be included in LED chip and surface.Transition material layer can be included in sealant and between LED array and substrate.In other embodiments, transition material can be included in sealant, but be formed in occupy and not all sealant a layer region in.In some embodiments, transition material layer can be formed in sealant in the lower part of sealant, and in other embodiments, transition material layer can be formed as being positioned at the bottom of sealant or neighbouring layer.
With compared with in traditional LED encapsulation piece, thinner phosphor layer or lower phosphor concentration can be comprised at identical color dot place according to LED encapsulation piece of the present invention, so that more blue light is first through transition material layer.Due to typical conversion layer also scattering and converting blue light, so this can cause the packaging part efficiency of raising, this is because the conversion layer of less thickness or concentration causes the blue light of the first passage launched by LED to be less scattered back in LED, wherein, this light can be absorbed.Compared with traditional LED encapsulation piece, by realizing similar color, but there is thinner or lower concentration conversion layer, when manufacturing LED encapsulation piece constructed in accordance, can also realize saving cost.The part blueness of transition material and sodium yellow arrive the surface of sealant and launch from LED encapsulation piece in critical angle.Compared with having the conventional LED packages of hemisphere sealant, blueness and the sodium yellow of larger percentage stand TIR, so that light is in sealant internal reflection.This produces final blueness and the sodium yellow arriving transition material after TIR; That is, this light of TIR recirculation.The top of the bright conversion layer of blue TIR illumination, and the blue light of LED illuminates the lower surface of conversion layer, to illuminate the both sides of conversion layer." covering " effect limits blueness provided by transition material layer and sodium yellow reenter in chip or on substrate, impact other absorption regions.When light stands TIR in packaging part, which reducing can the amount of absorbent light.
At conversion layer converting blue light, omni-directional from transition material layer is caused again to launch gold-tinted.The both sides illuminating transition material layer are caused and are converted TIR blue light to omni-directional gold-tinted.This provide the chance allowing other TIR light to overflow from packaging part this advantage larger.The all right scattered light of this recirculation, this can cause the LED encapsulation piece wider than conventional apparatus to launch pattern, and conventional apparatus provides main Lambert emission pattern.This scattering can also cause the change being reduced colour temperature by different visual angles.
It being understood that in other embodiments, transition material layer only can apply LED, makes transition material layer not covered substrate.For multiple LED execution mode, different transition material layer can be comprised on different LED.It is also to be understood that, in other execution modes with different transition material layer execution modes, the all right coated portion of different transition materials or all substrates, this can produce and cover the different materials transition material of all or part substrate or the different switching material in the zones of different of substrate.Therefore, it being understood that in various embodiments, transition material can be positioned on LED, is positioned on substrate and/or is positioned at sealant.These different execution modes can also have the various combination of transition material position.Other execution modes can have the multiple phosphors on LED, substrate and/or in sealant.Part in these execution modes can comprise the mixture of three phosphors, such as, and yellow (such as, YAG), green (such as, LuAg) and red (such as, nitride).This is an only example of the multiple phosphor blends that can be used in different execution modes.In other other execution modes, reflector and substrate can be provided, there is no transition material layer, or transition material can only be included on substrate.In these embodiments, packaging part can comprise the LED of the light launching different colours, and these light combine, and launches with the LED encapsulation piece producing expectation.Such as, this can comprise the LED of redness, green and blue emission, and its transmitting can be combined, to produce white light.The same with other execution modes discussed in this article, these different LED can addressable individually.
Light is rebooted (such as in packaging part, scattering or refraction) other mechanisms can combine with TIR or replace TIR to use, such as, in one embodiment, scattering material can add in sealant, to strengthen color homogeneity further in the light launched by packaging part, or produce beam intensity profiles widely, keep high packaging part efficiency simultaneously.LED encapsulation piece according to the present invention can be used for multiple different light fixture to use, and LED encapsulation piece causes raising blend of colors.Do not need mixing chamber, or use the mixing chamber highly reduced, this can cause light fixture to produce the transmitting expected.
Different execution modes can also comprise the LED encapsulation piece with smaller overlay area, and part LED encapsulation piece wherein has the overlay area being less than 3 square millimeters, and other execution modes can have the overlay area being less than 2 square millimeters.These execution modes can also provide to be had dimensionally closer to the device of the overlay area in the region covered by LED.Execution mode can also show be compared to each other close height and overlay area size, as described further below.
For those execution modes with multiple LED light source, independent LED can addressable or control individually, or the difference string of multiple LED or subset can addressable or controls individually.A string can be a LED or different be connected in parallel and/or be connected in series in multiple LED of being coupled, to realize the operating voltage expected or the packaging part that realizes expecting launches colour temperature.This goes for multiple different packaging part and arranges, and such as, has and launches the LED of different colours or the setting with the LED of phosphor coating from different containers.
In this article, with reference to some execution mode, describe the present invention, but it being understood that the present invention can embody and should not be construed as the execution mode being limited to and proposing in this article in multiple different form.In particular, below about some LED encapsulation piece of the LED had in different configurations, describe the present invention, but it being understood that the present invention may be used for having in other LED encapsulation piece multiple of other LED configuration.Except those shapes described below, LED encapsulation piece can also have multiple different shape, such as, and rectangle, and pad and bonding liner can be set by multiple different mode.In other embodiments, the emissive porwer of dissimilar LED chip can be controlled, launch to change overall LED encapsulation piece.
In this article, according to transition material, material for transformation of wave length, remote phosphors, phosphor, phosphor layer and relevant term, the present invention can be described.The use of these terms should not be construed as and limits.It being understood that and use term remote phosphors, phosphor or phosphor layer are intended to comprise and are equally applicable to all wavelengths transition material.
According to one or more LED descriptions execution mode below, but it being understood that this is intended to comprise LED chip, and these terms can use convertibly.Except shown shape and size, these elements can have different shape and size, and can comprise the LED of or varying number.It is also to be understood that execution mode described below utilizes coplanar light source, but it being understood that and can also use non-co-planar light source.It is also to be understood that LED light source can comprise multiple LED can with different emission wavelengths.As mentioned above, in some embodiments, at least part of LED can comprise the blue emission LED and red emission LED that are coated with yellow phosphor, causes the white light emission being derived from LED encapsulation piece.In multiple LED encapsulation piece, LED mutually can be connected in series or interconnect with the combination of different series and parallel connections.
It is also to be understood that, the features such as layer, region, sealant or substrate or element can be called another element " on " time, can be located immediately on other elements, or can also neutral element be had.And, " inside ", " outside ", " top ", " above ", " bottom ", " under " and the relative terms such as " below " and similar term may be used for the relation in a description layer or another region in this article.It being understood that these terms are intended to except the direction described in the drawings, also comprise the different directions of this device.
Although first, second grade of term may be used for describing various parts, element, region, layer and/or part in this article, these parts, element, region, layer and/or part should not be subject to the restriction of these terms.These terms are only for distinguishing parts, element, region, layer or part and another region, layer or part.Therefore, when without departing the teaching of the invention content, first component discussed below, element, region, layer or part can be called second component, element, region, layer or part.
In this article with reference to the cutaway view as the schematic diagram of embodiments of the present invention, embodiments of the present invention are described.Equally, the actual (real) thickness of layer can be different, and expect that (such as) causes the shape of diagram to have change by manufacturing technology and/or tolerance.Embodiments of the present invention should not be construed as the given shape being limited to the region illustrated in this article, but will comprise (such as) by the deviation manufacturing the shape produced.Due to normal manufacturing tolerance, so there is circle or bending feature usually as square or rectangle explanation or description region.Therefore, the region illustrated in the drawings is inherently schematic, and its shape not intended to be illustrate the accurate shape in the region of device, and not intended to be limits the scope of the invention.
Fig. 4 to Figure 13 shows an execution mode according to LED encapsulation piece 50 of the present invention, and this packaging part comprises LED 52, installs on the substrate 54.LED encapsulation piece 50 also comprises the first and second bottom contact/pad 60a and 60b on the bottom being positioned at substrate 54, through first and second conductive through hole 62a, 62b of substrate 54 and first and second bonding wafer liner 64a, 64b of being positioned on the top surface of substrate 54.LED encapsulation piece comprises transition material layer 56 further, and it covers the exposed portion of LED52, the exposing surface of bonding wafer liner 64a, 64b and the top surface of substrate 54.Sealant 58 is included in above LED 52, bonding wafer liner 64a, 64b and substrate 54.The above feature of LED encapsulation piece is described below in detail.
LED 52 is shown as single led, but it being understood that (such as, those execution modes described below) in other embodiments, and light source can comprise a more than LED.Multiple different LED can be used, such as, from those LED that Cree company can buy, especially under the LED chip of its DA, EZ, GaN, MB, RT, TR, UT and XT race.LED encapsulation piece 50 is set to the chip for DA race especially, such as, can be that flip-chip is installed and allows wireless bonding DA850 chip.By all u.s. patent application serial number 12/463 being entitled as " Semiconductor Light Emitting Diodes Having Reflective Structures andMethods of Fabricating Same " of the people such as Donofrio, in 709, generally describe the chip of these types, this patent is incorporated herein, with for referencial use.LED 52 can launch the light of a lot of different colours, preferred LED 52 utilizing emitted light in blue wavelength spectrum.It being understood that in some embodiments, after its growth substrates of removal, can LED be provided.In other embodiments, the growth substrates of LED can remain on LED 52, and the part in these execution modes has the growth substrates of shaping or weavy grain.
In other embodiments, a more than LED can be used as light source, and in other embodiments, solid-state laser can use individually or with one or more LED in combination.In some embodiments, LED can comprise transparent growth substrates, such as, and carborundum, sapphire, GaN, GaP etc.LED chip can also comprise three-dimensional structure, and in some embodiments, LED can have the structure comprising the flat surfaces tilted wholly or in part on one or more surfaces of chip.
LED encapsulation piece 50 comprises substrate 54, LED 52 further and is installed in substrate 54.Substrate 54 can have multiple different material to form, a kind of preferred material electric insulation, such as, and dielectric material.Substrate 54 can comprise pottery (such as, aluminium oxide, aluminium nitride, carborundum) or polymeric material (such as, polyamide and polyester).In a preferred embodiment, substrate 54 can comprise the dielectric material with higher thermal conductivity, such as, and aluminium nitride and aluminium oxide.In other embodiments, substrate 54 can comprise printed circuit board (PCB) (PCB), sapphire or silicon or any other suitable material, such as, from The Bergquist Company of Chanhassen, the insulating substrate material that the T-Clad heat that Minn can buy covers.For PCB execution mode, different PCB types can be used, such as, the printed circuit board (PCB) of the FR-4PCB of standard, metal-cored PCB or any other type.
The top surface of substrate 54 is shown as the flat surfaces having and comprise pattern conductive feature, and this flat surfaces can comprise first and second bonding wafer liner 64a, 64b.There is provided space bonding between liner 64a, 64b, LED chip 52 is installed in pad 64a, 64b, so that the various piece of LED 52 is installed in each pad 64a and 64b, and LED 52 strides across in bonding space between liner 64a, 64b.Multiple different installation method can be used, such as, utilize the method for traditional welding material.The LED chip of other types can, according to the geometry of LED 52, use known surface installation or wire bonding to be electrically connected to bonding liner 64a, 64b or other conductive traces.
Pad 64a, 64b can comprise multiple different material, such as, metal or other electric conducting materials, and in one embodiment, pad can comprise the copper using known technology (such as, electroplating) to deposit.In other embodiments, mask can be used to sputter pad 64a, 64b, to form the pattern of expectation, and in other embodiments, known photoetching process can be used, form pad.Pad 64a, 64b can extend beyond the edge of LED 52, with most of top surface of covered substrate 54.By being propagated in pad 64a, 64b from LED 52 by heat, so that heat propagates in the more multizone of substrate 54 more than the edge of LED 52, this contributes to the heat management of LED encapsulation piece 50.This allows heat less to localize, and allows heat to be dissipated in surrounding environment more effectively by substrate 54.
Transition material layer 56 is comprised above the exposed portion of LED 52, the exposed portion of pad 64a, 64b and the top surface of substrate.Multiple different transition material may be used for generating the LED encapsulation piece light expected and launches, and the present invention is particularly suitable for the LED encapsulation piece of transmitting white.Partial white launch execution mode in, LED 52 can in blue wavelength spectrum utilizing emitted light.Transition material can be the type absorbing blue light and again launch gold-tinted, so that packaging part launches white light combination that is blue and sodium yellow.In some embodiments, although according to (Gd, Y) 3(Al, Ga) 5o 12: Ce system (such as, Y 3al 5o 12: Ce (YAG)), use the conversion particles be made up of phosphor, the yellow spectrum can with the broadness of complete series is launched, but transition material can comprise commercial YAG:Ce phosphor.Other yellow phosphors operable include but not limited to:
Tb 3-xrE xo 12: Ce (TAG); RE=Y, Gd, La, Lu; Or
Sr 2-x-yBa xCa ySiO 4:Eu。
In other embodiments, transition material layer 56 can be set to have more than that mix or in individual course a phosphor material.In some embodiments, each in these two phosphors can absorb LED light, and again can launch the light of different colours.In these embodiments, the color of these two phosphor layers can combine, for the higher CRI white of different white color (warm white).This can comprise the light of the above yellow phosphor that can combine with the light of red-emitting phosphor.Different red-emitting phosphors can be used, comprising:
Sr xCa 1-xS:Eu，Y；Y＝halide；
CaSiAlN 3: Eu; Or
Sr 2-yCa ySiO 4:Eu。
By substantially converting specific color to by all light, other phosphors may be used for producing color emission.Such as, following phosphor may be used for generating green glow:
SrGa 2S 4:Eu；
Sr 2-yba ysiO 4: Eu; Or
SrSi 2O 2N 2:Eu。
Although other phosphors can be used, following is a list as the extra suitable phosphor of the part of conversion particles.Each phosphor show and excites in blue and/or UV emission spectrum, provides desirable peak emission, has the conversion of effective light, and have acceptable Stokes shift:
yellow/green
(Sr，Ca，Ba)(Al，Ga) 2S 4:Eu 2+
Ba 2(Mg，Zn)Si 2O 7:Eu 2+
Gd 0.46Sr 0.31Al 1.23O xF 1.38:Eu 2+ 0.06
(Ba 1-x-ySr xCa y)SiO 4:Eu
Ba 2SiO 4:Eu 2+
red
Lu 2O 3:Eu 3+
(Sr 2-xLa x)(Ce 1-xEu x)O 4
Sr 2Ce1 -xEu xO 4
Sr 2-xEu xCeO 4
SrTiO 3:Pr 3+，Ga 3+
CaAlSiN 3:Eu 2+
Sr 2Si 5N 8:Eu 2+
In other some other execution modes, transition material layer can comprise at least three phosphors, and some embodiments comprises the combination of yellow, redness and green phosphor.Can have other combinations, and other execution modes can comprise more than three phosphors.Multiple different yellow, redness and green phosphor can be used, such as, those phosphors above-described.
Transition material can comprise the phosphor particles of different size, includes but not limited to particle in 10 nanometers (nm) to the scope of 30 nanometers (nm) or larger.Less granularity usually than larger sized particle scattering and blend color better, to provide evenly light.With less Particle Phase ratio, the usual more effectively convert light of larger particle, but launch not too uniform light.In some embodiments, phosphor can at adhesive internal fixtion in transition material layer, and phosphor can also have the phosphor material of variable concentrations or load in adhesive.The phosphor of the typical concentration in adhesive normally percentage by weight is the scope of 30-70%.In one embodiment, the percentage by weight of phosphor concentration is approximately 65%, and is preferably evenly dispersed in remote phosphors.Transition material layer 56 can also have the zones of different of the phosphor particles comprising variable concentrations.
The material for transformation of wave length replaced can also be used for lower convert light, to generate white emission.This material can be but be not limited to organic fluorescence materials or dyestuff or inorganic-quantum-dot material, such as, and CdSe/ZnS, InP/InAs, CdS/CdSe, CdTe/CdSe etc.
The light of the desired amount will changed according to the concentration of transition material, the size of transition material particle and transition material at least partly, transition material layer 56 can have multiple different thickness.Can in adhesive according to transition material layer of the present invention, phosphor concentration grade (phosphor load) is higher than 30%.Other execution modes can have the concentration scale higher than 50%, and in other execution modes other, concentration scale can higher than 60%.In some embodiments, phosphor binder combination can have the thickness in the scope of 10-100 micron, and in other embodiments, can have the thickness in the scope of 40-50 micron.Thickness can also change above layer, and different regions has different thickness.As described below in more detail, compared with the similar encapsulation part with hemisphere sealant, different packaging part according to the present invention can comprise the conversion layer with less phosphor material (such as, thinner or lower concentration), still keeps the transmitting color dot expected simultaneously.Multiple different factor is depended in this reduction of thickness, such as, and the concentration of the size of phosphor type, phosphor particles and the phosphor particles in layer.In some embodiments, compared with the similar LED encapsulation piece with hemispherical lens, this minimizing can be 10% or larger.In other execution modes other, can be 20% or larger, and in other embodiments, can be 30% or larger.
Transition material layer 56 can also comprise adhesive, and different materials can be used for bonding, material preferably sane after solidification and in visible wavelength spectrum substantial transparent.Suitable material comprises silicones, epoxy resin, glass, room and pineapple, dielectric, BCB, polyamide, polymer and composition thereof, and preferred material is silicones, this is because silicones has the high grade of transparency and reliability in high-power LED.From the suitable silicones based on phenyl and methyl can be bought in Chemical.According to different factors (such as, the type of the adhesive used), multiple different curing can be used, cure adhesive.Different curings includes but not limited to heat, ultraviolet (UV), infrared ray (IR) or air curing.It is to be appreciated, however, that, can phosphor particles be applied, without the need to adhesive.
Can use different technique, application transition material layer, especially includes but not limited to spraying, dispersion, rotary coating, sputtering, printing, powder coating, electrophoretic deposition (EPD) and electrostatic precipitation.These techniques can also comprise solvent in phosphor binder combination, and this solvent can liquefy and reduce the viscosity of mixture.Multiple different solvent can be used, include but not limited to toluene, benzene, dimethylbenzene or from Dow the OS-20 that can buy, and the solvent that can use variable concentrations.When spraying solvent-phosphor-binder combination, the heat of vaporization solvent of toppling over from remote phosphors or disperse, and can in mixture cure adhesive, the remaining phosphor layer fixed.All by people such as Donofrio be entitled as " Systems and Methods for Applicationof Optical Materials to Optical Elements " and assignee also in the U.S. Patent Application Publication No. 2010/0155763 of Cree company, describe various deposition process and system.
Sealant 58 is included in transition material layer 56 and above LED 52 and substrate 54, sealant 58 provides environment and mechanical protection, and allows recirculation light, as mentioned above and be described in more detail below.The sealant traditional from the major part be formed in above LED is different, and sealant 58 has flat surfaces, and in shown execution mode, sealant 58 has roughly cubic shaped.Sealant comprises and has the vertical of cubic shaped and horizontal planar surface, but it being understood that sealant can adopt multiple different shape, such as, has flat top and comprises any shape of vertical sidewall of flat surfaces.These can include but not limited to different prisms or polygonal shape, such as, and triangle, pentagon, hexagon, octangle etc.These shapes can comprise horizontal planar surface, and the quantity of vertical surface is in 3 to 12 or more scope.In other other execution modes, sealant can be have different cross sections cylindrical, such as, circular or oval.
It being understood that sealant 58 and LED 52 can be aimed at by multiple different mode, LED 52 is shown as and the center of sealant 58 or longitudinal axis rough alignment.In other embodiments, LED 52 can closer to of sealant 58 edge.
Multiple different material may be used for sealant 58, such as, and silicones, plastics, epoxy resin or glass, suitable material and molding process compatibility.Silicones is suitable for molded and provides suitable optical transmission performance.Follow-up reflux technique can also be resisted, and obviously can not degenerate along with the time.Multiple diverse ways can also be used to form sealant, and in some embodiments, can use molding process (being described in more detail below), this technique forms sealant 58 being positioned at above the multiple LED 52 on substrate panel simultaneously.
In various embodiments, sealant can have multiple different thickness, and segment thickness provides the sealant material being only enough to cover LED and phosphor layer.In these embodiments, this layer can be as thin as 10 μm or thinner.In other execution modes other, sealant can be that three times of substrate edges size are high.These are only the certain embodiments of sealant height, and other execution modes are thinner or higher.
In some embodiments, the top surface of sealant can have than the slightly less region in the bottom of sealant and/or the overlay area of LED encapsulation piece.In other execution modes other, the upper part of sealant can have the region larger than lower part or the region larger than the overlay area of LED encapsulation piece.
LED chip 50 also comprise be formed in substrate 54 lower surface on first and second pad 60a, 60b, these pads may be used for use known installation method LED encapsulation piece 52 is installed in place.It being understood that (as described below) in other embodiments can have more than two pads according to LED encapsulation piece of the present invention.Pad 60a, 60b can be made up of identical material and can be made up of the mode identical with bonding wafer liner 64a, 64b.First and second conductive through hole 62a, 62b through substrate 54 can be comprised, through hole is made up of electric conducting material, such as, for the material of bonding wafer liner and pad, and through hole is set to provide conductive path at pad 60a, 60b and between bonding wafer liner 64a, 64b.In shown execution mode, the first through hole 62a forms conductive path between the first pad 60a and the first bonding wafer liner 64a, and the second through hole 62b provides conductive path between the second pad 60b and the second bonding wafer liner 64b.This allows the signal of telecommunication be applied in pad 60a, 60b to be transmitted in bonding wafer liner 64a, 64b along through hole 62a, 62b by substrate 54.Then, signal is transmitted in LED 52 by bonding wafer liner.It being understood that in other embodiments, by other means by electric signal transmission to LED, such as, by being arranged on conductive traces in the diverse location in LED encapsulation piece or wire bond pad, and run in mounting surface or between substrate and LED.
As mentioned above, LED encapsulation piece according to the present invention is smaller, and when LED encapsulation piece becomes less, can use less space, comprises the designator of the polarity of display LED encapsulation piece.When utilizing LED encapsulation piece to manufacture final products, these designators can outbalance.Traditional polarity designator can be included in the mark on the top surface of LED encapsulation piece, or wherein, a pad can be larger than another pad.By less LED encapsulation piece, less space can be had and make marks on the top, and a pad can be made inadvisablely to be less than another pad, this is because cause the danger of weld defect to increase.
LED encapsulation piece according to the present invention provides structure and the method for improvement, provides polarity to indicate by forming one or more indicating grooves 66 in a pad.As shown in the best in Fig. 5 and Fig. 9, along the inward flange of pad 64a, V-arrangement polarity indicating grooves 66 can be formed.During manufacture, camera can be looked on automatic Picking and place apparatus, detect this groove 66.In shown execution mode, groove 66, close to the center of the inward flange of pad, places it in the immediate vicinity of substrate 54.Now, with reference to Figure 16, show traditional LED encapsulation piece belt carrier 80, comprise the hole 82 be positioned under its each LED encapsulation piece of carrying.Groove 66 in figs. 8 and 9, in the region of the substrate 54 of immediate vicinity, can see this groove by the hole 82 in belt carrier 80.This allows groove (and corresponding LED encapsulation piece polarity) to become visible and the carrier with holes 82 of checking, and from belt carrier 80, does not remove LED encapsulation piece.
Except V-arrangement, groove 66 can have multiple different shape, such as, and U-shaped, I shape, W shape, square, rectangular shape, star, plus sign shape, minus-shape etc.Can also comprise groove in multiple different position on pad 60a, 60b, as described further below, and this groove can be detected by the camera of traditional pickup and place apparatus equally.It should be noted that the polarity designator of other types can be used, such as, difform hole or other perforates in pad, and in other embodiments, LED encapsulation piece can have designator in other positions, such as, on the substrate 54.
Referring again to Fig. 4 to Fig. 9, the polarity designator on the top surface of LED encapsulation piece 50 can also be included according to some embodiments of the present invention.In shown execution mode, when from top viewing LED encapsulation piece 50, the second bonding liner 64b can have plus sige (+) designator 68, to show polarity.These designators can adopt multiple different shape and size, such as, and those shape and size above-described, and in some embodiments, above-described groove or hole can be comprised.Also described above, for show in the accompanying drawings and the LED encapsulation piece of the size described in this article, top polarity designator can have limited space, and manufacturing installation needs to rely on bottom polarity designator.
With reference to Figure 10 and Figure 13, show LED encapsulation piece 50, substrate 54 can not be seen by sealant 58.This is done to be convenient to illustrate, but it being understood that can have opaque for various reasons sealant according to some embodiments of the present invention.In some embodiments, sealant can have the phosphor and/or scattering particles that disperse in the ad-hoc location all the time or in sealant.This can make sealant partly or completely opaque.Figure 14 shows a pad into part LED encapsulation piece recommendation according to the present invention, and Figure 15 shows recommended track layout.
As mentioned above, be that the TIR of the LED light caused by the flat surfaces of sealant can cause LED encapsulation piece emission effciency significantly to reduce at the traditional knowledge of this area.Especially true for the LED encapsulation piece with vertical flat surface.It is believed that, TIR light can contact with the light absorption characteristics of LED encapsulation piece and can cause the light absorbing suitable vast scale.This traditional knowledge concentrates the LED encapsulation piece providing the sealant reducing TIR as far as possible, such as, and hemisphere sealant.Also concentrate the packaging part light source being provided in the immediate vicinity of the substrate of sealant, to simulate the point source at immediate vicinity.But, by providing covering transition material layer being positioned at above the top surface under sealant 58, be included on LED 52, the region of bonding wafer liner 64a, 64b around LED 52 and the top surface of substrate 54 that exposes around LED 52 and bonding liner 64a, 64b, the loss in efficiency of this expection can be reduced or eliminated as far as possible.
Now, with reference to Figure 17, show according to an exemplary L ED packaging part 90 of the present invention, there is sample blueness and sodium yellow track 92,94.LED encapsulation piece 90 comprises same or analogous multiple feature with the feature in LED encapsulation piece 50, and, for those features, use identical reference number in this article.LED encapsulation piece 90 comprises LED 52, substrate 54, transition material layer 56 and sealant 58.LED encapsulation piece 90 can be set to the light launching different colours, and in shown execution mode, LED chip 52 launches blue light, and transition material layer 56 comprises transition material blue light being converted to gold-tinted.With reference to blue light track 92, when arriving sealant 58 surperficial, a part of blue light is through transition material layer 56 and stand TIR.Other parts of blue light 92 pass from sealant, to help to launch from LED encapsulation piece.
Blue TIR light in sealant internal reflection, and is finally led back to towards substrate 54.Do not arrive the light absorption part of LED encapsulation piece, TIR arrives transition material layer 56.This blue light have passed through conversion layer 56, and after TIR, blue LED light contacts with transition material layer second time.This can be called " recirculation " of blue light, causes the top surface illuminating transition material layer 56, so that during operation, the both sides of this layer are illuminated by blue light.The transition material layer 56 blue and sodium yellow of restriction of offering help reenters chip or impacts " covering " effect of absorption region.When blue light 92 second time impact transition material layer 56, all or a part of light is by the transition material scattering in this layer or absorption and again launch as gold-tinted.Again launching is omni-directional or isotropism, to reboot a part of TIR light, to launch from LED encapsulation piece.This omni-directional is again launched and is equivalent to other TIR light of scattering, arrives the encapsulant surface in critical angle to allow light and launches from sealant.
When blue light first time passes transition material layer, a part of blue light converts gold-tinted to, as shown in optical track mark 94.First part gold-tinted is launched from packaging part, and remainder stands TIR.When contacting with phosphor material second time, this light can also stand scattering, and augmenting portion light is launched and contributed to the possibility of total emission from sealant.
As a result, TIR allows similar to traditional hemispherical lens LED according to the emission effciency of LED encapsulation piece of the present invention with recirculation.Due to recirculation effect, so embodiments of the present invention have the less transition material of concentration in transition material layer, to realize identical color dot.This can allow more blue light first through phosphor.Because typical conversion layer can scattering and converting blue light, so thickness on chip or the less transition material of concentration can represent that less this blue light first passed through is scattered back in LED, wherein, this blue light can be absorbed, thus improve packaging part efficiency.Then, when second time arrives transition material layer 56, this blue light first passed through with scattering can be changed.This scattering allows more light to overflow from LED encapsulation piece, keeps suitable transmitting balance between blueness and sodium yellow simultaneously, to realize the color dot expected.Compared with traditional LED encapsulation piece, different execution modes can comprise less transition material of 20-30%.Compared with traditional LED, other execution modes can comprise less transition material of 10-40%.This minimizing of transition material and the reduction of package size can cause the LED encapsulation piece that cost is less, have same or analogous emission effciency.This set allows to have less device, and this can also reduce costs.
In some embodiments, the scattering during the recirculation of light can also provide the additional advantage of wider transmitting profile.In the LED encapsulation piece that major part is traditional, launching profile is lambert's type generally, and major part has the transmitting profile of about 120 °F of WHM or less.Compared with standing with in traditional lambert's emission of ions profile, the larger angle that is scattering through of the light provided in embodiments of the present invention provides from the more light transmittings sealant.In some embodiments, launching profile can more than 120 degree of FWHM, and in other embodiments, can more than 130 degree of FWHM.In other other execution modes, launching section can in the scope of 130 to 170 °F of WHM or 130 to 160 °F WHM or 130 to 150 °F of WHM in other embodiments.Figure 18 is the diagram 100 illustrated for the transmitting profile 102 of an execution mode of LED encapsulation piece according to the present invention and the transmitting profile of about 150 °F of WHM.In other embodiments, launch profile can be greater than 135 °F of WHM, have visual angle be-90 ° to+90 ° be less than 10% aberration.
As mentioned above, scattering material can add in sealant, to increase the width of transmitting profile further and to improve color homogeneity, minimum on the impact of packaging part efficiency.This wider transmitting profile allows LED encapsulation piece according to the present invention to be specially adapted to need the illumination of wider emission angle to apply, such as, and area illumination.For the LED illumination relying on mixing chamber to mix the light of LED encapsulation piece, wider transmitting pattern can cause the illuminating equipment with the less mixing chamber degree of depth.
According to LED encapsulation piece of the present invention can also by different visual angles launch have evenly the light of color emission.In some embodiments, the change of packaging part transmitting colour temperature is less than-400 to+400 Kelvins and visual angle is approximately-100 to+100 light of spending.In other execution modes other, colour temperature change can be less than-300 to+300 Kelvins and visual angle is approximately-100 to+100 light of spending.Figure 19 illustrates that colour temperature 112 for an execution mode of LED encapsulation piece according to the present invention is along with the diagram 110 of the change at visual angle.Along with the change from-100 to+100 at visual angle is spent, and generally in the scope of-100 to+200 Kelvins.
Covering transition material layer also allows transition material layer to be used as to have the long-range layer of good thermal diffusion.That is, the heat generated during conversion process or the heat entering the LED 52 in transition material layer 56 can spread above transition material layer 56.Then, heat can be transmitted in substrate 54 and sealant 58, to be dissipated in surrounding environment.Compared with having the conventional package of the LED only on LED with transition material, this allows more effectively to dissipate heat.
Compared with having the conventional LED packages of hemisphere sealant, some embodiments according to the present invention provides the LED encapsulation piece with less overlay area, simultaneously still by same or analogous efficiency emission.In some embodiments, LED encapsulation piece area coverage can be less than 3mm and be multiplied by 3mm or larger, and in other embodiments, can be that 2mm is multiplied by 2mm or larger.In other execution modes other, can be that 1mm is multiplied by 1mm or larger, some embodiments according to the present invention be approximately 1.6mm and be multiplied by 1.6mm.In some embodiments, overlay area can be less than 12 square millimeters.In other other execution modes, overlay area can have and is less than about 9 square millimeters, is less than 6 square millimeters or be less than the area of 4 square millimeters.In some embodiments, packaging part can have the area coverage in 1 scope to 4mm.In some embodiments, LED encapsulation piece can have the substrate that about 1.6mm is multiplied by 1.6mm, and area coverage is approximately 2.56 square millimeters.
Multiple different greater or lesser size can be expanded to according to LED encapsulation piece of the present invention.Sealant in LED encapsulation piece according to the present invention can extend up to the edge of substrate, and the LED encapsulation piece with hemisphere sealant can have the substrate at the edge extending beyond sealant, thus increases the overall dimension of packaging part overlay area.
Effective light can also be provided to launch to device according to LED encapsulation piece of the present invention, LED chip region and LED encapsulation piece overlay area have less ratio.This allows the edge of edge closer to sealant of LED, so that each LED encapsulation piece overlay area provides larger LED emission area.In some embodiments, the edge of LED chip (or LED chip array) can approximately be positioned at sealant edge or near so that LED encapsulation piece has substantially the same overlay area with LED chip (or LED chip array).In some embodiments, the ratio of LED chip (or array) region and LED encapsulation piece overlay area can be less than 6, and in other embodiments, can be less than 5.In other execution modes other, can be less than 4, some embodiments has the ratio of about 3.5.With shown in Fig. 4 to Fig. 9 and above-described LED encapsulation piece 50 is same or analogous according in an embodiment of the invention, LED chip 52 can be approximately 850 squares μm, and LED encapsulation piece overlay area is approximately 1.6 square millimeters.This causes the ratio of LED chip region and LED encapsulation piece overlay area to be approximately 3.54.In the multiple LED execution mode of the part be described below, this ratio can be less than 3.
In other other execution modes, for having single led LED encapsulation piece and having the substrate regions of LED encapsulation piece of multiple LED, substrate overlay area can be low to moderate the twice that LED region adds the transition material layer thickness at the edge of substrate.In the execution mode with single 1mm LED, substrate regions can be low to moderate 1.21mm, causes the ratio of LED chip region and LED encapsulation piece overlay area to be 1.21.In multiple LED chip execution mode, such as, there is the execution mode of the chip that edge-to-edge places, identical ratio can be reached.Can also realize different ratios, substrate has different shapes.In the execution mode with 16 DA240LED, these LED be arranged on there is a length of side (this length of side is the twice that 16 times of 0.240mm add 0.05mm) rectangular substrate on, and other execution modes are 16 times of 0.320mm adds the twice of 0.05mm.In these embodiments, the ratio of LED chip (or array) region and LED encapsulation piece overlay area can be low to moderate about 1.046.
In other execution modes other, this ratio can up to 20 or larger.In various embodiments, this ratio can drop in the scope of 1 to 20,1 to 15,1 to 10,1 to 5,1 to 3 or 1 to 2.1.6mm substrate has in the execution mode of two DA240LED, the ratio of LED region and substrate overlay area is approximately 16.67.The ratio of this identical improvement is applicable to the LED encapsulation piece with smaller or greater overlay area.The present invention also allows these packaging parts to show the ratio of identical improvement, but as the case may be, has the LED chip of greater or lesser area.
Because packaging part overlay area has larger LED region, so can LED encapsulation piece be used, replace traditional LED encapsulation piece, and for the region of identical amount, larger LED emitting area can be provided.In many applications, this permission drives LED encapsulation piece of the same area by lower signal, to realize identical emissive porwer.Equally, identical drive current can be used, and LED encapsulation piece according to the present invention may be used for generating higher emissive porwer.
The various combination of overlay area ratio size and height dimension can also be had according to the embodiment of the present invention.In some embodiments, the ratio covering region-wide size can be 1:1, and corresponding aspect ratio is less than 1.In some embodiments, LED encapsulation piece can have overlay area and estimate 1.6:1.6, is highly approximately 1.3mm, provides 1:1: the dimensional ratios of about 0.8125.In other execution modes other, overlay area can be approximately 1:1 with the ratio of height, and the overlay area that some embodiments has 1.6:1.6 is estimated, and has the height of about 1.6mm.Other execution modes can comprise the ratio of more than 1:1:1, and other execution modes can have the size of more than 1:1:1.5.Other execution modes can have more than 1:1:1.5 or 1:1:2 or size that is larger or 1:1:3 or larger in addition.
Other execution modes according to the present invention can have different sealant height, measure this height from the bottom or top surface of substrate.In some embodiments, the height of sealant can be low to moderate 0.3mm to up to 5mm or larger.In other execution modes other, sealant can have the height of 2mm or larger.In other execution modes other, the height of 1mm or larger can be had.It should be noted that in some embodiments, the transmitting pattern of packaging part can change along with the height of sealant, and some embodiments has wider transmitting pattern for higher sealant.Such as, in the execution mode with single led and cube sealant, the transmitting pattern (measuring from the top surface of substrate) for the packaging part with the sealant of 0.625mm height can have the transmitting pattern of more roomy than the same package part with 0.525mm sealant about 8%.For the packaging part with 0.725mm sealant, launching pattern width can increase further, until about 5% wide.Can realize this transmitting pattern increased and have higher sealant, emission effciency does not have in a substantial change.
Different LED encapsulation piece execution modes can operate from different drive singal, and some embodiments operates to the signal of tens watts from being low to moderate 50m watt.In some embodiments, drive singal can in the scope of 500m watt to about 2 watts.Different execution modes can also provide different luminous fluxes to export, and some embodiments launches 100 lumens or larger.Other execution modes can launch 110 lumens or larger, and other execution modes can launch 150 lumens or larger.Different execution modes can also be transmitted in the different-colour in the scope of 2000 to 6000K, and some embodiments launches about 3000K and other execution modes launch about 5000K.By example, there are 1.6 LED encapsulation piece according to the present invention being multiplied by the packaging part overlay area of 1.6mm can launch about 120 lumens at the temperature of 3000K.Other execution modes with same size can launch about 140 lumens under 5000K.The area of packaging part overlay area is 2.56mm 2, under 3000K, cause 47 lumens/mm 2and under 5000K, cause 55 lumens/mm 2transmitting.Can generally at 35 to 65 lumens/mm according to different packaging part of the present invention 2scope in launch.The packaging part being highly approximately 1.6mm can have about 4.096mm 3volume, cause by about 29.27 lumens/mm under 3000K 3and cause by 34.18 lumens/mm under 5000K 3operate.Can generally at 20 to 45 lumens/mm according to different packaging part of the present invention 3scope in launch.This can change along with drive singal (or drive current), but, but really under 3000K, cause every watt of 115 lumen (LPW) and under 5000K, cause the operation of 135LPW.Other execution modes with different drive singal can also show similar LPW operation under identical colour temperature.Scope for the LPW of different execution modes can generally in 100 scopes to 150LPW.
As mentioned above, different packaging part according to the present invention can have a more than LED, as its light source.Figure 20 to Figure 27 shows another execution mode according to LED encapsulation piece 150 of the present invention, comprises substrate 54, transition material layer 56, sealant 58, pad 60a, 60b and conductive through hole 62a, 62b.In this embodiment, light source comprises first and second LED 152a, 152b, and it is seated in first and second bonding wafer liner 154a, 154b on substrate.LED 152a, 152b can comprise multiple different commercial LED, and such as, above-described LED, some embodiments utilizes the DA350LED that can buy from Cree company.LED 152a, 152b can have different execution modes, and some embodiments is approximately 350 μm and is multiplied by 470 μm.
Bonding wafer liner 154a, 154b can be made up of identical material as mentioned above, and can use identical method deposition.In this embodiment, the first bonding wafer liner 154a is U-shaped, and the second bonding wafer liner 154b is slender type and is arranged between the supporting leg of the first bonding wafer liner 154a.Bondingly provide space between liner 154a, 154b first and second, each LED152a, 152b are installed in first and second bonding liner 154a, 154b and the space all striden across between both.LED 152a, 152b can be arranged in the diverse location on bonding liner 154a, 154b, and a LED 152a is arranged in a corner of substrate 54 generally, and the 2nd LED is arranged in the opposite corner of substrate 54.During operation, the signal of telecommunication is applied in pad 60a, 60b, gives bonding liner 154a, 154b by through hole 62a, 62b by this electric signal transmission.Then, by this Signal transmissions to LED 152a, 152b, impel its utilizing emitted light.LED encapsulation piece is operated by the mode almost identical with LED encapsulation piece 50, and can have above-described same size and ratio.
Figure 28 to Figure 35 shows another execution mode according to LED encapsulation piece 160 of the present invention, comprise substrate 54, transition material layer 56, sealant 58, pad 60a, 60b, conductive through hole 62a, 62b and bonding wafer liner 154a, 154b, the same with those in above-described LED encapsulation piece 150.In this embodiment, LED encapsulation piece light source comprises first, second and the 3rd LED 162a, 162b, 162c, each LED and is installed to bonding liner 154a, 154b above the space between both.LED can be arranged in multiple different position, and a supporting leg along bonding liner 154a installs first and second LED 162a, 162b, and installs the 3rd LED 162c along another supporting leg.The spacial alignment of 3rd LED 162c generally and between first and second LED162a, 162b, but it being understood that LED relative to each other can be installed by multiple different mode.LED encapsulation piece 160 is operated by the mode almost identical with above-described LED encapsulation piece, and can have same size and dimensional ratios.
LED encapsulation piece 150 and 160 has multiple LED be electrically connected in parallel, but it being understood that LED also can be connected in series.For the packaging part with multiple LED, LED can be connected in the different combinations being connected in parallel with being connected in series.The different LED that is connected in series can control (that is, independently addressable) individually, and in these embodiments, substrate can comprise more than two discs, so that multiple signal can be applied in LED chip.
As mentioned above, these LED encapsulation piece can be set to operate from different voltage, include but not limited to 3V, 6V, 12V or 24V.Packaging part can also have the chip being connected in series or being connected in parallel, and in addition to white, also launches the light of different colours, such as, and blueness, green, redness, Chinese red etc.Each in these packaging parts can be the multiple chip implementation be coupled by different modes.Some embodiments can launch the light of a kind of color in these colors, and can comprise and being coupled abreast and 2 that operate from 3V signal or 3 LED.Other execution modes can comprise 2 LED being connected in series coupling, so that LED encapsulation piece operates from 6V signal.Both can be formed on different substrates, such as, and the substrate be made up of aluminium oxide.Other execution modes can comprise be connected in series 4 LED chips being set to operate from 12V.These execution modes can be positioned on the substrate that is made from a variety of materials, such as, and aluminium nitride (AlN) or sapphire (Al 2o 3).Other execution modes can comprise two strings of 4 LED launching same color (such as, red) and the parallel coupling be made up of two LED be connected in series in addition.These execution modes can be set to operation from 6v signal and can be positioned on substrate, such as, and aluminium oxide.
Figure 36 shows an execution mode according to substrate 170 of the present invention, has first, second and the bonding liner 172a of wafer, 172b, 172c, first and second conductive through hole 174a, 174b and first and second LED 176a, 176b.Multiple different commercial LED can be used, such as, above-described DA350LED chip.In this embodiment, the first bonding liner 172a is connected to the first conductive through hole 174a, and the bonding liner 172c of wafer is connected to the second conductive through hole 174b.Second bonding wafer liner 172b is not attached to through hole.One LED 176a is arranged on above first and second bonding liner 172a, 172b, and the 2nd LED 176b is connected to above second and the 3rd bonding liner 172b, 172c.This causes first and second LED 176a, 176b to be connected in series, electrical signal conduction on the first through hole 174a is in the first bonding wafer liner 172a, then, by a LED 176a, then, enter in the second bonding wafer liner 172b, then, by the 2nd LED 176b, and finally enter in the bonding liner 172c of wafer.Use the LED of 3 volts, this execution mode can use the drive singal of 6 volts, but according to LED electrical pressure, driving voltage can be different.
Figure 37 shows another execution mode of substrate 180, and this substrate is similar with the substrate 170 shown in Figure 36 and comprise first, second and the bonding liner 182a of wafer, 182b, 182c, first and second conductive through hole 184a, 184b and the first to the six LED 186a, 186b, 186c, 186d, 186e, 186f.The first to the three LED 186a, 186b, 186c is arranged on above first and second bonding liner 182a, 182b, and the four to the six LED 186d, 186e, 186f is arranged on second and the 3rd above bonding liner 182b, 182c.This causes being connected in series/being connected in parallel of LED, and the first to the three LED 186a, 186b, 186c of first group is connected in parallel, and second group of the four to the six LED 186d, 186e, 186f are also connected in parallel installation.First and second groups are connected in series.Electrical signal conduction on the first through hole 184a, in the first bonding wafer liner 182a, then, by first group, then, enters in the second bonding wafer liner 182b, then, by second group, and finally enters in the bonding liner 172c of wafer.Use 3 volts of LED, this execution mode can use the drive singal of 6 volts, but as mentioned above, these can be different.
Figure 38 shows another execution mode of the substrate 190 with bonding wafer pattern 192, and this pattern may be used for being connected in series up to 6 LED (not shown)s, above the space between the adjacent component that each LED is arranged on pattern 192.For the LED of 3 volts, this execution mode can have the drive singal up to about 18 volts.For the LED encapsulation piece had less than 6 LED, or when using the LED of more low-voltage, this drive singal can be less, and if use more high-tension LED, and so can be more.Figure 39 shows another execution mode having and be set to the substrate 200 installing U-shaped bonding wafer liner 202a, 202b of crossing one another up to first and second of 6 LED, although substrate can also keep less LED.Each LED is arranged on above the first and second bonding spaces between liner 202a, 202b, so that LED is connected in parallel, can use the drive singal of 3 volts.As mentioned above, according to the voltage of used specific LED, this drive singal can be higher or lower.Execution mode in Figure 38 and 39 can use different LED, such as, and above-described DA350LED.Be arranged in coverage be 1.6mm be multiplied by the LED encapsulation piece of 1.6mm this arrange, the ratio of chip area and overlay area lower than 3, and in some embodiments, can be approximately 2.59.
Other execution modes can be set to keep even more LED.Figure 40 shows another execution mode with the substrate 210 that can be used for the bonding wafer pattern 212 be connected in series up to 16 LED (not shown)s, above the space between the adjacent component that each LED is arranged on pattern 192.In the execution mode utilizing 3 volts of LED, the drive singal of 48 volts can be used.As mentioned above, according to voltage and the quantity of the LED be installed in substrate, this drive singal can be higher or lower.Figure 41 shows another execution mode of substrate 220, comprises the bonding liner 222a of the first U-shaped, and it crosses one another with the bonding liner 222b of the 2nd W shape, can be connected in parallel up to 16 LED.The same with above execution mode, each LED can be arranged on above the first and second bonding spaces between liner 222a, 222b.Use the device of 3 volts, this packaging part can use the drive singal of 3 volts, and this signal is higher or lower, as mentioned above.As mentioned above, the execution mode in Figure 40 and 41 can use different LED.Shown execution mode is configured such that the DA240LED with buying from Cree especially, and these LED have the area of 240 μm to 320 μm.Be multiplied by the packaging part of the overlay area of 1.6mm having 1.6mm, the ratio of chip area and packaging part overlay area can be approximately 2.13, but should be understood that, according to multiple factor, the ratio submitted in this article can be different, such as, size, the quantity of LED, the size etc. of substrate of LED.
It should be noted that in multiple LED encapsulation piece execution mode, can advantageously LED be placed as far as possible close to the edge of substrate.When using LED encapsulation piece in linear setting (such as, LED-based fluorescent tube is arranged), especially true.Such as, for two the LED execution modes described in this article, can advantageously LED be placed in the opposite corner on substrate.
As mentioned above, sealant can use diverse ways to be formed in according in LED encapsulation piece of the present invention, and some embodiments uses different molding process.So a kind of molding process is called compression molded, wherein, provides the mould with multiple cavity, the lensed inverse shape of each cavity tool.Figure 42 shows an execution mode of the mould 230 with multiple cavity 232.In the molded period of lens, provide substrate panel, this panel can have the region roughly the same with the region covered by cavity 232.It being understood that to use and cover and the substrate of not all cavity.Substrate panel can comprise multiple LED (or group of multiple LED) and each cavity 232 is set to aim at each LED (or one group of LED) on substrate panel.Mould is mounted with the sealant material with liquid form of cavity filling, and some embodiments utilizes liquid curing silicones.Substrate panel can move towards cavity, and each LED (or one group of LED) embeds the liquid silicone being positioned at a cavity.Then, known curing process can be used, solidified liquid silicones.Then, can remove panel from mould, and panel can comprise multiple sealants of the shape with cavity, each sealant is positioned at above each LED.Then, independent LED encapsulation piece can use known technology separate with substrate panel or be separated.
Referring again to above-described execution mode, and in particular, with reference to the LED encapsulation piece 150 shown in Fig. 4 to Figure 13, provide little sealant coupling part 69 in the substrate of sealant 58.This is the byproduct of molding process.Cavity in a molding process can not extend to the top surface of substrate 54, thus leaves the sealant part between the adjacent packages of LED encapsulation piece.When making LED encapsulation piece be separated, separating technology is cut and is worn coupling part 69 and substrate 54.
It being understood that and can use other manufacturing process, a this technique comprises covered substrate panel and has the LED of one deck sealant material.Then, independent LED encapsulation piece can be separated by diverse ways, such as, cuts or cuts and wear sealant and substrate.That the packaging part produced can have a perpendicular and the sealant side surface aimed at the edge of substrate.In other execution modes other, sealant can be molded individually, then, above phosphor conversion material layer, is connected to substrate.It being understood that and diverse ways (such as, cutting, grinding, sandblasting or etching) can be used to make the smooth surface of sealant or be shaped further.
As mentioned above, the flat surfaces of smoother can be had according to the embodiment of the present invention to strengthen TIR.These surfaces should smooth enough, so that LED is high-visible by sealant.In other words, the surface of sealant have very little or there is no roughness, to cover or to reboot the light through sealant.In some embodiments, the surface of sealant has part weavy grain, roughness or defect, specially comprises these, or as the result of manufacturing process.For these execution modes, these surface characteristics preferably can have the size of not obvious scattered light.In some embodiments, the size of surface characteristics has root mean square (RMS), and this root mean square is close or be greater than the wavelength with the light of this surface contact.There is the characteristic size light that usually scattering is less of the RMS of the wavelength being greater than light, and there is the characteristic size usually more light of scattering of the RMS of the wavelength being less than light.For the execution mode of blue light and surface contact, surface characteristics can have the RMS being greater than about 500 nanometers, to reduce scattering as far as possible.According to the wavelength of the light contacted with encapsulant surface, this RMS value can change.
Figure 43 to Figure 46 shows another execution mode according to LED encapsulation piece 240 of the present invention, has the substantially vertical side surface 242 with the edge rough alignment of substrate 244.This execution mode also has the polarity designator of the groove 246 in the corner being included in pad 248.In addition, this is only in the polarity designator of the number of different types that can comprise in embodiments of the present invention.
LED encapsulation piece can also be used in other illumination application multiple, such as, and light-emitting diode display, LED street lighting, house LED down etc.Part LED encapsulation piece execution mode of the present invention be specially adapted to fluorescent lamp replace LED illumination, the transmitting pattern of LED encapsulation piece preferably for linear array, such as, for fluorescent lamp replace in array.Figure 47 is the diagram 300 that the first and second drawing 302,304 are shown, first drawing 302 shows the performance (lumen of every watt is to input power) according to LED encapsulation piece execution mode of the present invention, and LED encapsulation piece execution mode has 2 LED and it launches pattern preferably for fluorescence replacement pipe.LED encapsulation piece can comprise multiple different LED, and as mentioned above, some embodiments comprises 2 DA350LED.Second drawing 304 shows the performance (lumen of every watt is to input power) according to the second LED encapsulation piece of the present invention, and the second LED encapsulation piece has single led and its transmitting pattern is also desirable.Multiple different single LED can be used, such as, as mentioned above, a DA850.First and second ledges 306,308 respectively illustrate that to replace in pipe operation at the fluorescence of 21 watts and 31 watts can the operating characteristics of these devices detectable.Figure 48 is the diagram 310 also showing the first and second drawing 312,314, to draw 312 extra performance (lumen of every watt is to the current density) data showing the first LED encapsulation piece, and 314 performance datas showing the second LED encapsulation piece of drawing.
Except those features above-described, LED encapsulation piece can also be provided with multiple different feature.Some embodiments can comprise static discharge (ESD) guard block or device.Other parts of LED encapsulation piece can be provided with secondary optics device, are shaped further to make packaging part beam profile.
Can comprise one or more LED according to LED encapsulation piece of the present invention, in addition to those described above, these LED can also have multiple different shape and size, and can have multiple different feature.Figure 49 and 50 show to shown in Fig. 4-9 and another execution mode according to LED encapsulation piece 350 of the present invention that above-described LED encapsulation piece 50 is similar.LED encapsulation piece 350 comprises substrate 54, sealant 58 and transition material layer 58.These parts are similar to above-described corresponding component and can comprise the same material arranged as mentioned above.But in this embodiment, LED 352 can comprise the feature extracted for strengthening light, such as, weavy grain top surface 354.Each LED 352 can also comprise current spread structure 356, for by current spread in the top surface of LED 352.In some embodiments, wire-bonded (not shown) can be comprised, for being transmitted in current spread structure from the bonding wafer liner on substrate or conductive traces by the signal of telecommunication.
Multiple different LED may be used for a LED 352, and some embodiments utilizes commercial LED, such as, from those LED in the EZ race LED of Cree company.Although in other embodiments, these surfaces can tilt facing to its corresponding surface, and these LED 352 provide weavy grain top surface parallel with the top surface of sealant 58 generally and side surface parallel with the side surface of sealant 58 generally.It being understood that other surfaces of LED 352 can have weavy grain, and for all surface, the different characteristic strengthening light and extract can be comprised.It being understood that and can comprise LED 352 in the multiple different LED arranged by different modes, some embodiments has horizontal and vertical flat surfaces as mentioned above.
Figure 51 and 52 shows another execution mode according to LED encapsulation piece 370 of the present invention comprising substrate 54, has transition material layer 56 and sealant 58.This execution mode comprises LED372, and this LED has territory, rectangular foot-print, and this overlay area has at least part of angled side surface, so that side surface tilts facing to the side surface of sealant 58 at least partially.In this embodiment, LED side surface is angled, so that the lower part of LED 372 is less than upper part.This causes and increases with the side surface of sealant 58 distance apart, and the side surface along LED 372 moves down.Multiple different LED can be used for territory, rectangular foot-print to use, such as, from those LED that Cree company can buy under the LED of TR race.These LED 372 to may be used in multiple different LED encapsulation piece shape and arrange as mentioned above, comprise sealant and have those of horizontal and vertical sidewall.
Figure 53 and 54 shows according to LED encapsulation piece 390 of the present invention, has substrate 54, transition material layer 56 and sealant 58.Comprise the LED 392 with territory, square foot print further, side surface is angled at least partly, so that side surface tilts facing to the side surface of sealant 58 at least partially.The same with above execution mode, LED side surface is angled, so that the lower part of LED 392 is less than upper part.This causes and increases with the side surface of sealant 58 distance apart, and the side surface along LED 392 moves down.Multiple different LED may be used for LED 392, such as, from those LED that Cree company can buy under the LED chip of ultra-thin race.
Figure 55 and 56 shows another execution mode according to LED encapsulation piece 410 of the present invention, also comprises substrate 54, transition material layer 56 and sealant 58.LED encapsulation piece 410 comprises the LED 412 with general square shape overlay area and side surface parallel with top surface with the side surface of sealant 58 generally and top surface further.Multiple dissimilar LED can use together with shape with this overlay area, such as, has those LED of the substrate be made up of insulating material (such as, sapphire).LED 412 can also be used in dissimilar LED encapsulation piece, such as, has those LED encapsulation piece of smooth side surface and top surface.
It being understood that dissimilar LED may be used for having in the different packaging part execution mode of multiple LED further, and packaging part can have the LED of the varying number arranged by different modes.Figure 57 and 58 shows another execution mode according to LED encapsulation piece 430 of the present invention, its to show in Figure 28-33 and above-described LED encapsulation piece 160 is similar.LED encapsulation piece comprises substrate 54, transition material layer 56 and sealant 58.LED encapsulation piece 430 comprises three LED 432, each LED can to shown in Figure 49 and above-described LED 325 is similar.Each LED can comprise weavy grain top surface 434 and current spread structure 436, and each light can launching identical or different wavelength.Figure 59 and 60 shows another execution mode had to the LED encapsulation piece 450 at Figure 53 three LEDs 435 similar with the LED 392 shown in 54, and Figure 61 and 62 shows another execution mode according to LED encapsulation piece 470 of the present invention had at Figure 55 three LEDs 472 similar with the LED 412 shown in 56.
Different LED encapsulation piece execution modes can also have dissimilar LED in identical packaging part, and to realize the transmitting profile expected, some embodiments has the various combination of the LED comprising parallel surfaces, inclined surface and/or surface of the texture.Figure 63 and 64 shows the further execution mode according to LED encapsulation piece 490 of the present invention with first, second and the 3rd LED 492,494,496, and each LED is different from other LED.This may be used for only according in the multiple different LED combination in LED encapsulation piece of the present invention, and it being understood that different packaging parts can have the LED of varying number, and these LED have different shape and size.Each in LED 492,494,496 can have multiple different feature, such as, and wire-bonded, current spread structure and light extraction features (not shown).This be can be used according to the invention multiple various combinations in only one.These different combinations can also be used for dissimilar with in any one in the above-mentioned LED encapsulation piece of shape, and packaging part has flat surfaces, such as, and side surface and top surface.
It being understood that and can be arranged by multiple different mode according to different multi-chip execution mode of the present invention, the LED of number of different types can launch the light of similar and different color.For the LED encapsulation piece of LED with the light launching different colours, these packaging parts can launch the light combination of expectation from LED.
Figure 65 to Figure 69 shows another execution mode according to LED encapsulation piece 550 of the present invention, this packaging part comprises LED 552, be arranged on substrate 554, LED encapsulation piece 550 can also comprise be positioned at substrate 554 bottom on first, second, third and four contact/pad 560a-d, first, second, third and the 4th conductive through hole 562a-d through substrate 54.These through holes are set to electrical signal conduction to the bonding wafer liner (do not show in this article, but be described in more detail below) on the top surface being positioned at substrate 554.LED encapsulation piece comprises transition material layer 556 (showing best in Figure 68) further, and it is covered to the exposed portion of small part LED 552, the exposing surface of bonding wafer liner and the top surface of substrate 554.Sealant 558 is included in above substrate 554, has LED 552 and bonding wafer liner between substrate 554 and sealant 558.The above feature of LED encapsulation piece is described below in detail.
LED 552 can comprise the different LED of the light launching different wave length, and in shown execution mode, LED 552 can comprise the LED 552a of blue emission and the LED552b of red emission.It being understood that the LED that can use varying number, and in other embodiments, dissimilar LED can be used.Multiple different LED can be used, such as, those LED above-described, the LED that can buy from Cree company under the LED chip being included in its DA, EZ, GaN, MB, RT, TR, UT and XT race.LED substrate can be carborundum (SiC), sapphire, gallium nitride (GaN) etc.LED encapsulation piece 550 is set to use the LED of the blue emission of the chip being derived from above-mentioned DA race especially, and these chips can be installed in substrate by wireless bonding flip-chip.Commercial red LED 552b can be used for the LED of these blue emission to use.It being understood that in some embodiments, after its growth substrates of removal, LED 552a, 552b can be provided.In other embodiments, the growth substrates of LED can remain on LED552a, 552b, and the part in these execution modes has the growth substrates of shaping or weavy grain.
In other embodiments, more or less LED can be used as light source, and in other embodiments, solid-state laser can combine with one or more LED and use.In some embodiments, LED can comprise transparent growth substrates, such as, and carborundum, sapphire, GaN, GaP etc.LED chip can also comprise three-dimensional structure or geometry, and in some embodiments, LED can have the structure comprising the flat surfaces tilted wholly or in part on one or more surfaces of chip.
LED 552a, 552b are installed in the bonding wafer liner on substrate 554.Substrate 554 can be made up of multiple different material as mentioned above, and can be arranged by multiple different mode.The top surface of substrate 554 has top flat surface, and bonding wafer liner comprises the pattern conductive feature that can also comprise conductive traces.Bonding wafer liner can be arranged by multiple traditional mode and can be arranged by the mode identical with conductive traces with above-mentioned bonding wafer liner.In shown execution mode, LED can be installed in bonding liner, so that each LED strides across the space between adjacent bonding liner.Can use different bonding wafer pattern of pads or setting, and in some embodiments, the identical signal of telecommunication can be applied in all LED chips.In other embodiments, bonding liner can is and for allow different signals is being applied in different LED chips.Multiple different installation method may be used for LED chip 552a, 552b to be installed in bonding wafer liner, such as, utilizes the method for traditional welding material.LED chip known surface can also be used to install according to the geometry of LED chip 552 or lead connecting method is electrically connected to bonding liner or other conductive traces.Pad 560a-d, conductive through hole 562a-d and bonding liner can comprise multiple different material, such as, and those materials above-described.
Space or gap is provided, to reduce the possibility that electric short circuit occurs between pad as far as possible between pad 560a-d.In shown execution mode, the space between pad can in the scope between 400 to 600 μm, and shown execution mode has the space of about 500 μm.In other embodiments, pad can be thinner, and this can allow to have less space between pad 560a-d.In other embodiments, this space can be less than 400 μm, and in other embodiments, can be less than 300 μm.In other execution modes other, this space can be less than 200 μm, and some embodiments has enough thin pad, to provide the spacing of about 50 μm.
In shown execution mode, pad 560a-d is essentially square, and is arranged in the corner of substrate 554.It is to be appreciated, however, that in other embodiments, pad can have different shapes and can arrange in various positions.Such as, in some embodiments, pad can have rectangular shape and can be arranged in the diverse location of the perimeter of substrate, to increase spacing in-between the electrodes as far as possible.In other embodiments, pad can be triangular shaped, and can be arranged in the corner of substrate, again to increase spacing in-between the electrodes as far as possible.Pad can also have different shapes on the same substrate, and part pad combines different shapes, to separate pad most effectively.In the execution mode that these are different, can through hole be provided, with by electrical signal conduction in bonding wafer liner.
In some embodiments, bonding liner can extend beyond the edge of LED 552 as mentioned above, with most of top surface of covered substrate 554.By being propagated in pad from LED 552 by heat, so that heat propagates in the more multizone of substrate 554 more than the edge of LED 552, this can contribute to the heat management of LED encapsulation piece 550.This allows heat less to localize, and allows heat to be dissipated in surrounding environment more effectively by substrate 554.
Transition material layer 556 is comprised above the exposed portion of LED 552a, the exposed portion of bonding liner and the top surface of substrate.Use different process discussed above, transition material layer 556 can be applied.In shown execution mode, transition material layer can not cover the LED552b of red emission, but it being understood that in other embodiments, can be covered by one or more transition material.Unlapped red LED chips can show the surface that can absorb light (and non-recirculated light), but in shown execution mode, compared with the general area of the top surface of substrate, this sorbent surface can be smaller, so that display can the light absorption of receiving amount.
Multiple different transition material may be used in transition material layer 556, launches with the LED encapsulation piece light generating expectation, such as, and any above-mentioned transition material or its combination.The present invention can be particularly suitable for the LED encapsulation piece of transmitting white.Partial white launch execution mode in, LED 552 can in blue wavelength spectrum utilizing emitted light.In other embodiments, LED can in the purple of spectrum to ultraviolet part utilizing emitted light, such as, in the wave-length coverage between 360nm and 440nm.Transition material can be the type absorbing blue light or other wavelength light and again launch (such as) gold-tinted, combines so that packaging part launches white light that is blue and sodium yellow.In various embodiments, transition material can comprise multiple different type, includes but not limited to above-mentioned transition material.
It being understood that a more than transition material may be used for having in the different LED encapsulation piece of dissimilar reflector.In some embodiments, the quantity of transition material and type can depend on the emission wavelength of solid state light emitter.Such as, transition material layer can comprise at least three phosphors of cover part or all visible wavelength region, and some embodiments comprises the combination of yellow, redness and green phosphor.Solid state light emitter is launched for purple and ultraviolet, can blue phosphor be increased.Can have other combinations, and other execution modes can comprise more than three phosphors.Multiple different yellow, redness and green phosphor can be used, such as, those phosphors above-described.
Transition material can be included in the phosphor particles of the different size in scope discussed above, and transition material can at adhesive internal fixtion in transition material layer.Adhesive can comprise material listed above, and as mentioned above, can provide the phosphor with variable concentrations in adhesive.Transition material layer 556 can also have the zones of different of the phosphor particles comprising variable concentrations.The material for transformation of wave length replaced can also be used for lower convert light, to generate white emission.This material can be but be not limited to organic fluorescence materials or dyestuff or inorganic-quantum-dot material, such as, and CdSe/ZnS, InP/InAs, CdS/CdSe, CdTe/CdSe etc.In the same manner as above, the light of the desired amount will changed according to the concentration of transition material, the size of transition material particle and transition material at least partly, transition material layer 556 can also have multiple different thickness.Thickness can also change above layer, and different regions has different thickness.
The same with execution mode discussed above, compared with the similar encapsulation part with hemisphere sealant, different packaging part according to the present invention can comprise the conversion layer with less phosphor material (such as, thinner or lower concentration), still keeps the transmitting color dot expected simultaneously.Multiple different factor is depended in this reduction of thickness, such as, and the concentration of the size of phosphor type, phosphor particles and the phosphor particles in layer.In some embodiments, compared with the similar LED encapsulation piece with hemispherical lens, this minimizing can be 10% or larger.In other execution modes other, can be 20% or larger, and in other embodiments, can be 30% or larger.
With reference to Figure 65 to 69, sealant 558 is included in transition material layer 556 and above LED 552 and substrate 554, sealant 558 provides environment and mechanical protection, and allows recirculation light, as mentioned above and be described in more detail below.The same with above execution mode, sealant 558 has flat surfaces, and in shown execution mode, sealant 558 has roughly cubic shaped.It being understood that sealant can adopt multiple different shape, such as, those shapes above-mentioned, comprise triangle, pentagon, hexagon, octangle etc. and comprise the shape of the vertical surface of quantity in 3 to 12 or more scope.In other other execution modes, sealant can be have different cross sections cylindrical, such as, circular or oval.
It being understood that sealant 558 and LED 552 can be aimed at by multiple different mode, shown execution mode has its red LED 552b, and this red LED is shown as and the center of sealant 558 or longitudinal axis rough alignment.Blue (or BSY) LED chip 552a can be positioned at the corner of substrate 554 and sealant 558.It being understood that this is only used for only one in the multiple different pattern of LED chip, partial pattern has the arbitrary placement of the LED chip of different transmittings, and other patterns can have the texture pattern of the LED chip of different transmittings.
Multiple different material may be used for sealant 558, such as, those materials above-mentioned, and sealant can have the performance similar to above-mentioned sealant.In various embodiments, sealant can have multiple different thickness as mentioned above, and in some embodiments, and the top surface of sealant can have than the slightly less region in the bottom of sealant and/or the overlay area of LED encapsulation piece.In other execution modes other, the upper part of sealant can have the region larger than lower part or the region larger than the overlay area of LED encapsulation piece.
Pad 560a-d is formed in the lower surface of substrate 554, and may be used for using known installation method LED encapsulation piece 552 to be installed in place, and for one or more signal of telecommunication is applied in LED encapsulation piece.Shown execution mode comprises four contact pins 560a-d, and these pads allow the different signals of telecommunication to be applied in LED encapsulation piece 550, to control the emissive porwer of different bluenesss and red LED chips 552a, 552b.In some embodiments, two pads may be used for being applied to by the signal of telecommunication in the LED 552a of blue emission, and two other pad may be used for being applied to by the signal of telecommunication in the LED 552b of red emission.This allows to control respectively the emissive porwer of blue and red LED chips 552a, 552b.Should be understood that, in other embodiments (as described below), two pads can be had according to LED encapsulation piece of the present invention, so that all LED chips respond to the identical signal of telecommunication, or more than two pads can be had, to allow the transmitting controlling each LED 552a, 552b more.
Pad 560 can be made up of identical material and can be made up of the mode identical with bonding wafer liner.The same with above execution mode, conductive through hole 562a-d can pass substrate 554, and through hole is made up of electric conducting material, such as, for the material of bonding wafer liner and pad 560a-d.The same with above execution mode, through hole is set to provide conductive path between pad 560a-d and bonding wafer liner.Shown execution mode comprises four through holes, and each through hole provides conductive path between each pad 560a-d liner bonding with each.This allows the signal of telecommunication be applied in pad 560a-d to be transmitted in bonding wafer liner along through hole 562a-d by substrate 554.Then, by intracellular signaling in one of the expectation in LED 552a, 552b, its utilizing emitted light is impelled.Should be understood that; in other embodiments, can by other means by electric signal transmission to LED, such as; by being arranged on conductive traces in the diverse location in LED encapsulation piece or wire bond pad, and run in mounting surface or between substrate and LED.
The same with above execution mode, LED encapsulation piece 550 provides the structure of improvement, for providing polarity to indicate by forming one or more indicating grooves 566 in a pad.Groove 566 can be formed in the corner of pad 560c, during manufacture, can look camera, detect this groove in automatic Picking and place apparatus.The same with above, polarity designator can be arranged in multiple different position, can have multiple different shape, and can be arranged by multiple different mode.Polarity designator can also be comprised on the top surface of LED encapsulation piece 550 according to some embodiments of the present invention, similar to polarity designator discussed above, with when from top viewing LED encapsulation piece 550, display polarity.
The same with above execution mode, LED encapsulation piece 550 can be set to utilize the TIR light in sealant, to increase light emission effciency.Compared with the conventional LED packages with sealant, sealant can be set to promote at least part of TIR light in sealant, to reduce TIR light as far as possible.It is believed that, by providing covering transition material layer above the top surface under sealant 558, comprise blue led 552a, the region of bonding wafer liner around LED 552 and the top surface of substrate 554 that exposes around LED 552, this any loss in efficiency of expecting from TIR can be reduced or eliminated as far as possible.The all right scattered light of covering transition material layer, to allow TIR to overflow from sealant in subsequent step, and can provide the LED of improvement to launch pattern.
Now, with reference to Figure 70, show according to an exemplary L ED packaging part 590 of the present invention, there is sample blueness, yellow and red light track 592,594,596.LED encapsulation piece 590 comprises same or analogous multiple feature with the feature in LED encapsulation piece 550, and, for those features, use identical reference number in this article.LED encapsulation piece 590 comprises the LED 552a of blue emission, the LED 552b of red emission, substrate 554, transition material layer 556 and sealant 558.LED encapsulation piece 590 can be set to the light launching different colours, and in shown execution mode, LED chip 552a, 552b launch blue and red light, and transition material layer 556 comprises transition material some blue light being converted to gold-tinted.This causes blueness, yellow and red light through sealant, and arrives its surface.With reference to blue light track 592, when arriving sealant 558 surperficial, a part of blue light is through transition material layer 556 and stand TIR.Other parts of blue light 592 pass from sealant, to help to launch from LED encapsulation piece.
Blue TIR light in sealant internal reflection, and is finally led back to towards substrate 554.Do not arrive the light absorption part of LED encapsulation piece, TIR arrives transition material layer 556.This blue light have passed through conversion layer 556, and after TIR, blue LED light contacts with transition material layer second time.As mentioned above, this can be called " recirculation " of blue light, causes the top surface illuminating transition material layer 556, so that during operation, the both sides of this layer are illuminated by blue light.The transition material layer 556 blue and sodium yellow of restriction of offering help reenters chip or impacts " covering " effect of absorption region.When blue light 592 second time impact transition material layer 556, all or a part of light is by the transition material scattering in this layer or absorption and again launch as gold-tinted.Again launching is omni-directional or isotropism, to reboot a part of TIR light, to launch from LED encapsulation piece.This omni-directional is again launched and is equivalent to other TIR light of scattering, arrives the encapsulant surface in critical angle to allow light and launches from sealant.
When blue light first time passes transition material layer, a part of blue light converts gold-tinted to, as shown in optical track mark 594.Ruddiness is also direct to be launched from red LED, as shown in optical track mark 596.First part blueness, yellow and red light launch from packaging part, and remainder stands TIR.When contacting with phosphor material second time, this light can also stand scattering, and augmenting portion light is launched and contributed to the possibility of total emission from sealant.In shown execution mode, LED encapsulation piece launches the white light combination of the expectation of blueness, yellow and red light.
The same with above execution mode, result, TIR allows similar to traditional hemispherical lens LED according to the emission effciency of LED encapsulation piece of the present invention with recirculation.Due to recirculation effect, so embodiments of the present invention have the less transition material of concentration in transition material layer, to realize identical color dot.This can allow more blue light first through phosphor.Because typical conversion layer can scattering and converting blue light, so thickness on chip or the less transition material of concentration can represent that less this blue light first passed through is scattered back in LED, wherein, this blue light can be absorbed, thus improve packaging part efficiency.Then, when second time arrives transition material layer 556, this blue light first passed through with scattering can be changed.This scattering allows more light to overflow from LED encapsulation piece, keeps suitable transmitting balance, to realize the color dot expected between blue and yellow (and red) light simultaneously.Compared with traditional LED encapsulation piece, different execution modes can comprise 20-30% less transition material and can be less, this can cause the LED encapsulation piece that cost is less, has same or analogous emission effciency.
In some embodiments, the scattering during the recirculation of light can also provide the additional advantage of wider transmitting profile as mentioned above.This can cause above-mentioned increase in transmitting pattern FWHM, and the part in these execution modes also show the aberration being less than 10%, has the visual angle of different range, such as, and-90 to+90 degree.
Some embodiments of the present invention can have with show in figure 18 and the transmitting profile of transmitting profile similarity discussed above.Figure 71 is for illustrating the diagram 612 launching profile 613 for first of LED encapsulation piece according to the present invention when directly watching packaging part (that is, 0 degree) from above and visual angle being moved to about 100 degree.Profile 614,615 and 616 shows the transmitting profile from 45,90 and 135 degree.As mentioned above, scattering material can add in sealant, to increase the width of transmitting profile further and to improve color homogeneity, minimum on the impact of packaging part efficiency.As mentioned above, according to LED encapsulation piece of the present invention can also by different visual angles launch have evenly the light of color emission.Figure 72 is the diagram 620 of the change of colour temperature above the visual angle of an execution mode for LED encapsulation piece according to the present invention.Change from-100 to+100 above visual angle is spent, and generally in the scope of-100 to+200 Kelvins.Show and be used for launching profile 622 according to first of LED encapsulation piece of the present invention when directly watching packaging part (that is, 0 degree) from above and visual angle being moved to about 100 degree.Profile 624,626 and 628 shows the transmitting profile from 45,90 and 135 degree.As mentioned above, covering transition material layer can also allow transition material layer to be used as to have the long-range layer of good thermal diffusion.
Some embodiments according to the present invention provides LED encapsulation piece, and compared with having the conventional LED packages of hemisphere sealant, these LED encapsulation piece have less overlay area, simultaneously still by same or analogous efficiency emission.These especially can comprise above-mentioned overlay area size and area.Effective light can also be provided to launch to device according to LED encapsulation piece 550 of the present invention, LED chip region and LED encapsulation piece overlay area have less ratio.This allows the edge of edge closer to sealant of the LED in LED array, so that the LED encapsulation piece overlay area of each combination of this array provides larger LED emission area.In the same manner as above, in some embodiments, the ratio of LED chip array region and LED encapsulation piece overlay area can be less than 6, and in other embodiments, can be less than 5.In other execution modes other, can be less than 4, some embodiments has the ratio of about 3.5.In other execution modes other, this ratio can be less than 3.The various combination of overlay area ratio size and height dimension can also be had according to the embodiment of the present invention as mentioned above.In the packaging part with non-square substrate, the height of sealant can be greater than maximum substrate overlay area size, and for rectangular substrate, this highly can be greater than length and/or the width of substrate.Different sealant height can be had as mentioned above according to other execution modes of the present invention, and in some embodiments, the transmitting pattern of sealant can change along with the height of sealant, and some embodiments has wider transmitting pattern, for higher sealant.
The same with above execution mode, the LED region that the substrate regions with the LED encapsulation piece of multiple LED can be low to moderate combined all LED chips adds the twice of the transition material layer thickness at the edge of substrate.Can also realize different ratios, substrate has different shapes.In other embodiments, when having multiple LED chip, LED chip region can be low to moderate about 1.046 with the ratio of LED encapsulation piece overlay area in these embodiments.In other execution modes other, this ratio can up to 20 or larger.In various embodiments, this ratio can drop in the scope of 1 to 20,1 to 15,1 to 10,1 to 5,1 to 3 or 1 to 2.
Packaging part overlay area has larger LED region, can allow to have higher packed bulk density.Can LED encapsulation piece be used, replace traditional LED encapsulation piece, and for the region of identical amount, larger LED emitting area can be provided.In many applications, this permission drives LED encapsulation piece of the same area by lower signal, to realize identical emissive porwer.This can produce higher emission effciency.In other embodiments, identical drive current can be used, and LED encapsulation piece according to the present invention may be used for generating higher emissive porwer.There is provided according to the embodiment of the present invention by larger efficiency as LED encapsulation piece launches the flexibility providing high light flux or provide lower luminous flux.
The invention provides the various combinations of LED shape and encapsulant surface setting.The LED chip 552a of blue emission can comprise angled surface, and for increasing strong light emission, these surfaces combine with the sealant with vertical and/or horizontal planar surface now.Red LED chips 552b has the horizontal and vertical surface combining with the horizontal surface of sealant and flat surfaces and use.As described below in more detail, these are only the incorporating aspects of the surface combination provided in different execution mode according to the present invention.
Sealant 558 is above described as being included in transition material layer 556 and above LED 552 and substrate 554.Transition material layer 556 is also described as comprising transition material in adhesive, and sealant is positioned at above transition material layer.It being understood that in other embodiments, transition material can be included in sealant, and some embodiments has the transition material occupying also not all sealant.Some embodiments can have the transition material of sealant occupied less than 80%.In other execution modes other, transition material layer can occupy the sealant less than 50%, and in other embodiments, can occupy the sealant less than 25%.In other execution modes other, transition material can occupy the sealant less than 10%.
In various embodiments, transition material can occupy the sealant region of difformity and size, and, in some embodiments, transition material can be included in the layer in diverse location, to be derived from least part of light of packaging part LED through transition material.Transition material layer can be arranged by multiple different mode and can have different shapes, thickness and concentration.In various embodiments, transition material can occupy the zones of different of sealant.That is, the subregion of sealant can have transition material, and in other regions, remaining area is without any transition material.In part sealant execution mode, transition material can be arranged in the lower part of sealant, and the upper part of sealant does not have transition material.In some embodiments, transition material can be positioned at the bottom 3/4ths of sealant, and in other embodiments, can be positioned at the latter half of sealant.In other execution modes other, the bottom 1/4th of sealant can be positioned at, and in other embodiments, the bottom 1/10th of sealant can be arranged in.
Referring again to Figure 68 and 70, transition material layer 556 can be included in sealant 558 and can to occupy the lower part of sealant 558.In shown execution mode, transition material layer can be included in the transition material layer in sealant in the bottom of sealant 558.The same with above-mentioned transition material layer, the transition material be included in sealant can comprise the transition material of number of different types.In some embodiments, different materials can mix, and in other embodiments, transition material can be divided into the zones of different with different switching material.
As mentioned above, different LED encapsulation piece execution modes can operate from different drive singal, and some embodiments operates to the signal of tens watts from being low to moderate 50m watt.As mentioned above, LED encapsulation piece can also operate under different colour temperatures.Other performance characteristics can also be shown according to LED encapsulation piece of the present invention.Figure 73 shows the diagram 630 of the luminous flux of the different input current of display, and Figure 74 illustrates in response to the diagram 640 of different input currents for effect of different execution mode according to the present invention.
As mentioned above, the LED of the varying number that different modes is arranged can be provided with according to LED encapsulation piece of the present invention.Figure 75 shows another execution mode according to LED encapsulation piece 650 of the present invention to 78, comprises substrate 554, transition material layer 556, sealant 558, pad 560a-d and conductive through hole 562a-d.The LED 652b of the LED 652a that this execution mode comprises four blue emission and two red emission in being installed on substrate 554 bonding wafer liner.LED 652a, 652b can comprise above-mentioned multiple different commercial LED, the LED652a of multiple blue emission and preferably include the LED being derived from the DA race that can buy from Cree company.In this embodiment, the LED 652a of each blue emission can be arranged on each corner of substrate 554, and the LED 652b of red emission is arranged between the LED 652a of blue emission along the opposite edge of substrate 554.The same with above execution mode, transition material layer 556 is included in the exposing surface of blue led 652a and substrate 554 and the bonding liner around blue led.Red LED can't help transition material layer cover.This transition material layer transition material layer same as described above is similarly arranged, and as mentioned above, provides the recirculation of TIR light.It should be noted that in LED encapsulation piece 650 and other execution modes of describing in this article, red LED chips can be can't help transition material layer and be covered.
Bonding wafer liner (not shown) can be arranged in multiple different position, can be made up of identical material as mentioned above, and can use identical method deposition.The same with above execution mode, during operation, the signal of telecommunication can be applied to and be transferred in the pad 560a-d of bonding liner by through hole 562a-d.Then, by this Signal transmissions to LED 652a, 652b, impel its utilizing emitted light.LED encapsulation piece is operated by the mode almost identical with LED encapsulation piece 550, and can have above-described same size and ratio.In shown execution mode, LED 652a, 652b are arranged on periphery, but in other embodiments, part LED can be set to away from periphery, a little closer to the center of substrate.
The LED encapsulation piece described in this article can have with the LED of series and parallel connections combination interconnection.In shown execution mode, blue led can by being connected in series or being connected in parallel or its combination being coupled, and for having the execution mode of multiple red LED, the interconnection that red LED can be similar.Blue and red LED can control individually, and each LED type is controlled by each signal of telecommunication in two that are applied on the back side of substrate 554 in four pads 560.That is, the different signals of telecommunication can be applied in pad, to change the emissive porwer of blue and red LED, changes the overall emission color according to LED encapsulation piece of the present invention.This can allow to change LED encapsulation piece under different conditions and launch.Such as, human eye can be more responsive to blue light at night, and by day can be more responsive to green glow.Independent control allows the transmitting in a whole day tuning LED encapsulation piece, to meet the change sensitivity of human eye.This is only an example of the multiple varying environments that can exist needing the transmitting changing LED encapsulation piece.
Figure 79 shows another execution mode according to LED encapsulation piece 660 of the present invention to 82, comprises substrate 554, transition material layer 556, sealant 558, pad 560a-d and conductive through hole 562a-d.This execution mode comprises three LED, and comprise the LED 662b of a LED 662a and red emission of two blue emission, each LED is installed in bonding liner.LED can be arranged in multiple different position, and this execution mode has the LED 662a of the blue emission in the opposite corner being arranged on substrate 554 and is arranged on the LED 662b of red emission of immediate vicinity of the substrate 554 between the LED 662a of blue emission.The same with above execution mode, transition material layer can cover the top surface of blue led 662a and substrate 554, and does not cover red LED 662b.LED encapsulation piece 660 is operated by the mode almost identical with above-mentioned LED encapsulation piece, and can have identical size and dimension ratio.
It being understood that different LED packaging part execution mode according to the present invention can have multiple different shape, some embodiments has less or more side surface.Figure 83 shows the LED encapsulation piece 680 with rectangular shape to 86, has substrate and sealant overlay area, and two sides are longer than remaining two sides.LED encapsulation piece can have multiple different size, and LED encapsulation piece 680 is similar to above execution mode in addition, and can comprise substrate 554, transition material layer 556, sealant 558.In this embodiment, the lower surface of substrate 554 comprises 6 pad 682a-f and conductive through hole 684a-f.The LED686b of the LED686a that this execution mode comprises 4 blue emission further and two red emission in being installed on substrate 554 bonding wafer liner.In this embodiment, the LED 686a of each blue emission is arranged on each corner of substrate 554, and red LED 686b is installed to penetrate the diagonal between the LED 686a of two blue emission.This is only that LED 686a, 686b can be arranged on according in the multitude of different ways in different packaging part of the present invention.
Pad is arranged by the mode almost identical with above execution mode, is applied to by the signal of telecommunication in pad 682a-f, and these pads are transmitted in LED 686a, 686b by through hole 684a-f and bonding liner.But, in this embodiment, three different signals of telecommunication can be applied, to provide extra control above the transmitting of LED686a, 686b.In some embodiments, the subset of blue or red LED 686a, 686b can by different signal controlling, to change the transmitting of subset individually.
As mentioned above, in multiple LED encapsulation piece execution mode, can advantageously LED be placed as far as possible close to the edge of substrate, such as, the LED of blue emission.When using LED encapsulation piece in linearly arranging, especially true.Such as, for three the LED execution modes described in this article, can advantageously blue led be placed in the opposite corner on substrate, and the LED encapsulation piece with four LED can have a LED in the every nook and cranny of substrate.
As mentioned above, sealant can use diverse ways to be formed in according in LED encapsulation piece of the present invention, and some embodiments uses different molding process.So a kind of molding process is called compression molded, wherein, provides the mould with multiple cavity, as mentioned above and as shown in Figure 42, and the lensed inverse shape of each cavity tool.Identical molding process may be used for the LED encapsulation piece with multiple LED.Referring again to above-mentioned execution mode, and by example, that is, the LED encapsulation piece 550 shown in Figure 65 to 69, can comprise little sealant coupling part 569 in the bottom of sealant 58.This is the byproduct of molding process as above.
It being understood that and can use other manufacturing process, a this technique comprises covered substrate panel and has the LED of one deck sealant material, and then, independent LED encapsulation piece can be separated by diverse ways, such as, cuts or cuts and wear sealant and substrate.That the packaging part produced can have a perpendicular and the sealant side surface aimed at the edge of substrate.Figure 87 shows another execution mode according to LED encapsulation piece 720 of the present invention to 90, comprises LED 552, substrate 554, transition material layer 556, pad 560a-d and conductive through hole 562a-d.In this embodiment, the sidewall of sealant does not have coupling part, and vertical with the outward flange substantial registration of substrate 554.This set can be the result of coating and segmentation manufacturing process, and side surface is smooth, to promote the TIR in sealant.In other execution modes other, sealant can be molded individually, then, above phosphor conversion material layer, is connected to substrate.It being understood that and diverse ways (such as, cutting, grinding, sandblasting or etching) can be used to make the smooth surface of sealant or be shaped further.
The same with above execution mode, the surface of sealant can smooth enough, so that LED is high-visible by sealant, and has very little on the surface of sealant or does not have roughness, to cover or to reboot the light through sealant.In some embodiments, when having part weavy grain, roughness or defect, surface characteristics should have size, and these sizes have close to or are greater than and the root mean square of the wavelength of the light of this surface contact (RMS).
Figure 91 shows another execution mode according to LED encapsulation piece 750 of the present invention, has six LED 752, substrate 754, sealant 756 and through hole 757a-d.Figure 92 shows the bonding wafer liner 758 for packaging part 750, and Figure 93 shows the pad 760a-d for packaging part 750.Sealant 756 can be made up of identical material and can be arranged by the mode identical with above-mentioned sealant.The LED 752b of LED 752a and two red emission of four blue emission that can be commercial LED can be comprised with reference to Figure 91, LED 752, such as, those LED above-mentioned.The LED 752a of two blue emission can be set along of substrate 754 edge, and two other is set along contrary substrate edges.The LED 752b of these two red emission is arranged between the LED 752a of these two groups of blue emission.LED encapsulation piece can comprise transition material layer as above, the exposing surface of this transition material layer covering blue led 752a, substrate 754 and bonding liner 758, but does not cover red LED 752b.Do not show transition material in this embodiment, to allow to be convenient to describe bonding wafer liner 758.
Through hole 757a-d is the conductive path between bonding liner 758 and pad 760 by substrate 754.With reference to Figure 91,92 and 93, first group of bonding liner 758a is set to interconnect continuously with blue led 752a, and the signal of third and fourth pad 760c, 760d is applied in blue led 752a, this signal, through third and fourth through hole 757c, 757d, enters in bonding liner 758b.Each blue led 752a strides across the space between the adjacent part of bonding liner 758a, and the signal of telecommunication is through each blue led 752.Second group of bonding liner 758b is set to the signal of telecommunication of first and second pad 760a, 760b to be applied in red LED 752b.Can by first and second through hole 757a, 757b by intracellular signaling in the red LED 752b interconnected continuously with bonding liner 758b and wire-bonded 762.It should be noted that, in shown execution mode, red LED 752b can have dielectric substrate, so that the signal of telecommunication be applied in red LED 752b does not penetrate the bonding liner 758b of part be positioned under LED, and the signal of telecommunication on these bonding liner 758b does not penetrate in red LED chips 752b, except passing through wire-bonded 762.
LED encapsulation piece 750 can also comprise polarity designator as mentioned above, and different execution modes has the designator in diverse location.Now, with reference to Figure 93, can second and the 3rd pad 760b, 760c corner in comprise the polarity designator of the form with groove 764a, 764b.During manufacture, camera can be looked on automatic Picking and place apparatus, detect these grooves 764a, 764b.In shown execution mode, groove 764a, 764b can be positioned on the interior angle of pad, to be positioned at the immediate vicinity of substrate 754.Now, with reference to Figure 16 above, traditional belt carrier 80 is shown, one or two groove 764a, the 764b that can be seen in the region of the substrate 54 of immediate vicinity by the hole 82 in belt carrier 80.This allows groove (and corresponding LED encapsulation piece polarity) to become visible and the carrier with holes 82 of checking, and from belt carrier 80, does not remove LED encapsulation piece.
Groove 764a, 764b can have multiple different shape as mentioned above, and can be included in multiple different position.LED encapsulation piece 750 can also be included in the polarity designator at the top of substrate, and this designator can comprise above-mentioned multiple different shape.In shown execution mode, the top polarity designator that can comprise plus sige 766 is bonding wafer liners 758.
Figure 94 shows another execution mode according to of the present invention LED encapsulation piece 850 similar to above-mentioned LED encapsulation piece 750.This execution mode comprises 9 LED 852, substrate 854, sealant 856 and through hole 857a-d.Figure 95 shows the bonding wafer liner 858 for this execution mode, and pad is similar to above-mentioned one or more execution mode.The LED 852 shown in Figure 94 can comprise the LED 852b of LED 852a and 3 red emission of 6 blue emission.The LED 852a of three blue emission is along an edge of substrate 854, and remaining three along contrary edge.The LED 852b of these 3 red emission is arranged between two groups of blue led 852a.Now, in conjunction with reference to Figure 94 and 95, in the same manner as above, blue led to be installed in first group of bonding wafer liner 858a and to interconnect continuously.Be applied to intracellular signaling in pad in blue led 852a, impel its utilizing emitted light.Red LED is also connected in series by wire-bonded 862 between second group of bonding wafer liner 858b.Be applied to intracellular signaling in pad in bonding liner 858b, and conducted by red LED 852b along wire-bonded 862.It should be noted that, a part of first bonding wafer liner 858a is passed under a red LED 852b, but in this embodiment, the electrical bottom insulation of red LED 852b, so that the signal of telecommunication does not pass between red LED 852b liner 858a bonding with this part.
Other execution modes can be set to keep even more LED.Figure 96 shows another execution mode with the substrate 910 that can be used for the bonding wafer pattern 912 be connected in series up to 16 LED (not shown)s, above the space between the adjacent component that each LED is arranged on pattern.This pattern may be used for the different LED of installing the light launching different colours.In the execution mode utilizing 3 volts of LED, the drive singal of 48 volts can be used.In the same manner as above, according to voltage and the quantity of the LED be installed in substrate, this drive singal can be higher or lower.Figure 97 shows another execution mode of substrate 920, comprises the bonding liner 922a of the first U-shaped, and it crosses one another with the bonding liner 922b of the 2nd W shape, can be connected in parallel up to 16 LED.The same with above execution mode, each LED can be arranged on above the first and second bonding spaces between liner 922a, 922b.Use the device of 3 volts, this packaging part can use the drive singal of 3 volts, and this signal is higher or lower, as mentioned above.
With reference to some execution mode arranged by different modes, describe above execution mode, but it being understood that in the different packaging parts that above-mentioned different feature may be used for being arranged by different modes.Such as, above feature may be used for, in the packaging part similar to those packaging parts can bought from Cree company, including but not limited to the LED encapsulation piece of XLampCX, XLampM and XLampX race.
In the multiple different illumination application that above-mentioned LED encapsulation piece may be used for using single led packaging part or multiple LED encapsulation piece or light fixture.In the illumination application using multiple traditional LED encapsulation piece, especially in those execution modes of LED encapsulation piece utilizing the light (then, these light mixes, to provide the light of desired color) launching different colours, can mixing chamber be needed, mix the light of LED encapsulation piece.In the certain applications of these traditional illuminations application, the minimum-depth of mixing chamber can be roughly the same with the distance between the LED encapsulation piece of light of launching same color.The use of mixing chamber adds cost and the complexity of conventional lamp.
Using in the light fixture according to LED encapsulation piece of the present invention, major part mixing is occurring in LED encapsulation piece.As a result, for the part in these application, can mixing chamber be eliminated, but in other embodiments, for aesthetic reason and in order to help blend color, can mixing chamber be comprised.In these are arranged, the degree of depth of mixing chamber can significantly reduce.Figure 98 shows an execution mode of the light fixture mixing chamber 940 with LED encapsulation piece 942 arranged according to the present invention.Mixing chamber 940 can have height 944, and LED encapsulation piece can have height 946, and in some embodiments, mixing chamber height 944 and LED encapsulation piece can be less than four times of the height of LED encapsulation piece 942.In other embodiments, three times of the height of LED encapsulation piece can be less than.In other embodiments, 1.5 times of the height of LED encapsulation piece can be less than.Do not provide mixing chamber for light fixture or the mixing chamber with the less degree of depth is provided, the light fixture that cost is lower, complexity is less, thinner and/or less can be caused.
As mentioned above, can comprise according to LED encapsulation piece of the present invention and can have multiple different shape and size and one or more LED can with multiple different feature.Figure 99 and 100 shows another execution mode according to LED encapsulation piece 1000 of the present invention, comprises LED 1002, is arranged on substrate 1004, has transition material layer 1006 and sealant 1008.These parts are similar to above-mentioned corresponding parts, and can comprise the same material arranged as mentioned above.But, in this embodiment, LED 1002 can comprise a LED 1002a and a kind of the 2nd dissimilar LED 1002b, and in some embodiments, as mentioned above, a LED 1002a can launch blue light and the 2nd LED 1002b can red-emitting.But in this embodiment, a LED 1002a has surface of the texture 1010, the light that this surface can be set to strengthen LED 1002a extracts.Each LED 1002a can also comprise current spread structure 1012, with by current spread in the top surface of LED.In some embodiments, wire-bonded (not shown) can be comprised, for being transmitted in current spread structure 1012 from bonding wafer liner or the conductive traces on substrate by the signal of telecommunication.
Multiple different LED may be used for a LED 1002a, and some embodiments utilizes above-mentioned commercial LED, such as, from those LED in the EZ race LED of Cree company.Although in other embodiments, these surfaces can tilt facing to its corresponding surface, but these LED1002a provide weavy grain top surface parallel with the top surface of sealant 1008 generally and side surface parallel with the side surface of sealant 1008 generally.It being understood that other surfaces of LED 1002a can have weavy grain, and for all surface, the different characteristic strengthening light and extract can be comprised.LED 1002a can be comprised in the multiple different LED encapsulation piece arranged by different modes.
It being understood that LED encapsulation piece 1000 and the every other LED encapsulation piece execution mode described in this article can have the multiple different parts arranged by different modes.Figure 101 and 102 shows another execution mode of LED encapsulation piece 1020, and this packaging part is similar to LED encapsulation piece 1000, but has the sealant 1022 comprising smooth side surface.Each LED1024a has weavy grain top surface 1026 and the top surface parallel with side surface with the top surface of sealant 1022 and side surface.
Figure 103 and 104 shows another execution mode according to LED encapsulation piece 1040 of the present invention, comprises the LED 1042 be arranged on substrate 1044, has transition material layer 1046 and sealant 1048.In this embodiment, LED comprises a LED1042a and the 2nd LED 1042b of the light can launching different colours.In this embodiment, the angled side surface of part that a LED 1042a has, so that side surface tilts facing to the side surface of sealant at least partly.In this embodiment, LED side surface is angled, so that the lower part of LED 1042a is less than upper part.This causes and increases with the side surface of sealant 1048 distance apart, and the side surface along LED 1042a moves down.Multiple different LED may be used for LED 1042a, such as, from those LED that Cree company can buy under the LED chip of ultra-thin race.These LED 1042a to may be used in multiple different LED encapsulation piece shape and arrange as mentioned above.Figure 105 and 106 shows LED encapsulation piece 1060, and this packaging part is similar to LED encapsulation piece 1040, but has the sealant 1062 comprising flat surfaces.LED encapsulation piece 1060 comprises a LED1062a further, and each LED has the angled side surface that the side surface facing to sealant 1062 tilts.
Display and describe LED encapsulation piece 1000,1020,1040 and 1060, LED has general square shape overlay area.It being understood that different LED encapsulation piece can have the LED comprising different overlay area shapes.Figure 107 and 108 shows another execution mode according to LED encapsulation piece 1080 of the present invention, comprises the LED 1082 be arranged on substrate 1084, has transition material layer 1086 and sealant 1088.In this embodiment, LED comprises a LED 1082a with the angled side surface that the side surface facing to sealant 1088 tilts.One LED1082a has territory, rectangular foot-print, but not territory, square foot print.Multiple different LED can be used for territory, rectangular foot-print to use, and such as, states those LED that can buy from Cree company under the LED of TR race thereon.These LED can also be used in dissimilar LED encapsulation piece, Figure 109 and 110 shows another execution mode according to LED encapsulation piece 1100 of the present invention, this packaging part is similar to LED encapsulation piece 1080, but has the sealant 1102 comprising smooth side surface.
Figure 111 and 112 shows another execution mode according to LED encapsulation piece 1120 of the present invention, also comprises the LED 1122 be arranged on substrate 1124, has transition material layer 1126 and sealant 1128.In this embodiment, a LED 1122a has general square shape overlay area and the side surface parallel generally with top surface with the side surface of sealant 1128 and top surface.The LED of number of different types can use together with shape with this overlay area, such as, has those LED of the substrate be made up of insulating material (such as, sapphire).LED 1122a can also comprise other features, such as, and wire-bonded or light extraction features (not shown).These LED can also be used in dissimilar LED encapsulation piece, Figure 113 and 114 shows another execution mode according to LED encapsulation piece 1140 of the present invention, this packaging part is similar to LED encapsulation piece 1120, but has the sealant 1142 comprising smooth side surface.The side surface of LED 1122 is parallel generally with top surface with the side surface of sealant 1142 with top surface.
It being understood that different LED encapsulation piece execution modes can have the various combination of above-mentioned LED, some embodiments has the various combination of the LED comprising parallel surfaces, inclined surface and/or surface of the texture.Figure 115 and 116 shows an execution mode according to LED encapsulation piece 1160 of the present invention, comprises the LED 1162 be arranged on substrate 1164, has transition material layer 1166 and sealant 1168.In this embodiment, LED 1162 comprise a LED 1162a with weavy grain top surface, the territory, square foot print with the side surface comprising inclination the 2nd LED 1162b, there is the 3rd LED 1162c of territory, square foot print and the side surface of inclination and there is the 4th LED 1162d of territory, square foot print and the top surface parallel generally with side surface with the top surface of sealant 1168 and side surface.Each LED 1162 can have multiple different feature, such as, and wire-bonded, current spread structure and light extraction features (not shown).This be can be used according to the invention multiple various combinations in only one.These different combinations can also be used for dissimilar with in any one in the above-mentioned LED encapsulation piece of shape.Figure 117 and 118 shows LED encapsulation piece 1180, and this packaging part has first, second, third and the 4th like combinations of LED 1162a, 1162b, 1163c, 1162d, but as mentioned above, has the sealant 1182 comprising flat surfaces.
It being understood that above-mentioned different LED is only that it is several to may be used for according in the multiple different LED in LED encapsulation piece of the present invention.It is also to be understood that, can have according to LED encapsulation piece of the present invention and comprise the single led of above-mentioned shape and feature.
The light source of light fixture can be used as according to packaging part of the present invention, such as, by all u.s. patent application serial number 13/034 being entitled as " Solid State Lamp " of the people such as Le, 501 and by all u.s. patent application serial number 13/028 being entitled as " High Efficacy LED Lamp With Remote Phosphor and DiffuserConfiguration " of the people such as Le, those light fixtures described in 946, these two patents are incorporated herein, with for referencial use.
LED encapsulation piece can also be used in concealed light trough light fixture, such as, by all U.S. Patent Application No. 13/368 being entitled as " Multiple Panel Troffer Style Light Fixture " of the people such as Pickard, 217 and by all U.S. Patent Application No. 12/873 being entitled as " Troffer-Style Fixture " of the people such as Edmond, those light fixtures described in 303, these two patents are incorporated herein, with for referencial use.
LED encapsulation piece can also be used for multiple other illumination application in, such as, light-emitting diode display, LED street lighting, house LED down etc.Part LED encapsulation piece execution mode of the present invention be specially adapted to fluorescent lamp replace LED illumination, the transmitting pattern of LED encapsulation piece preferably for linear array, such as, for fluorescent lamp replace in array.
Except those features above-described, LED encapsulation piece can also be provided with multiple different feature.Some embodiments can comprise static discharge (ESD) guard block or device.Other parts of LED encapsulation piece can be provided with secondary optics device, disperse further to make packaging part beam profile, spread or focus on.In other execution modes other, the different LED in packaging part can be installed as higher than other LED, launches pattern to provide the LED encapsulation piece of expectation.
Although describe above execution mode with reference to the LED encapsulation piece with transition material layer in this article, it being understood that other execution modes that can provide and not have conversion layer.Some embodiments in these execution modes can comprise the sealant with one or more flat surfaces and comprise blueness, redness or green LED chip individually, to provide the LED encapsulation piece of launching blue, red or green light.Other execution modes can also comprise multiple LED chips of the light launching different colours, such as, and red, the green or LED of blue emission or the LED of redness, green, blueness and white emission.These are only the incorporating aspects that can have in different execution mode according to the present invention.LED encapsulation piece can be provided with multiple extra feature, such as, for allowing the adapter processing and install these less packaging parts.
LED encapsulation piece can be provided with multiple extra feature, such as, for allowing the adapter or the connector that process and install these less packaging parts.Different LED encapsulation piece execution modes can comprise not isolabeling or other features for helping aligning, or installation region can have mark or feature for helping to aim at and install LED encapsulation piece.
Although some preferably configures and describes the present invention in detail with reference to it, other version can be had.The present invention may be used in any light fixture, wherein, needs even light or close to uniform light source.In other embodiments, the light intensity distributions of LED module can be the customization of specific light fixture, launches pattern with the light fixture producing expectation.Therefore, the spirit and scope of the present invention should not be limited to above-mentioned version.

Claims (72)

1. an emitter package part, comprising:
One or more solid state light emitter, it is positioned on substrate;
Sealant, it is positioned at described solid state light emitter and described surface, and described sealant has one or more flat surfaces, and described sealant has the transition material occupying also sealant described in not all.
2. emitter package part according to claim 1, wherein, described transition material occupies the described sealant less than 80%.
3. emitter package part according to claim 1, wherein, described transition material occupies the described sealant less than 50%.
4. emitter package part according to claim 1, wherein, described transition material occupies the described sealant less than 25%.
5. emitter package part according to claim 1, wherein, described transition material occupies the described sealant less than 10%.
6. emitter package part according to claim 1, wherein, described transition material is positioned at the lower part of described sealant.
7. emitter package part according to claim 6, wherein, described sealant comprises the upper part not having transition material.
8. emitter package part according to claim 6, wherein, described transition material is positioned at lower 3/4ths parts of described sealant.
9. emitter package part according to claim 6, wherein, described sealant is positioned at the latter half of described sealant.
10. emitter package part according to claim 6, wherein, described transition material is positioned at lower four/part of described sealant.
11. emitter package parts according to claim 6, wherein, described transition material is positioned at lower ten/part of described sealant.
12. emitter package parts according to claim 1, wherein, described solid state light emitter comprises a light-emitting diode.
13. emitter package parts according to claim 1, wherein, described solid state light emitter comprises multiple light-emitting diode (LED), and at least part of described light-emitting diode launches the light of different colours.
14. emitter package parts according to claim 13, wherein, LED described at least one has the geometry on one or more surface with inclined plane wholly or in part.
15. emitter package parts according to claim 13, wherein, the white light combination of described source emissioning light.
16. emitter package parts according to claim 13, wherein, LED red-emitting described at least one and described at least one LED launch blue light.
17. emitter package parts according to claim 16, wherein, described at least one blue-light-emitting LED is covered by described transition material layer.
18. emitter package parts according to claim 16, wherein, described at least one emitting red light LED can't help described transition material layer cover.
19. emitter package parts according to claim 1, wherein, described sealant comprises planar top surface and flat side surface.
20. emitter package parts according to claim 1, wherein, described sealant comprises horizontal planar surface and vertical flat surface.
21. emitter package parts according to claim 1, wherein, described flat surfaces causes the TIR of at least part of light from described solid state light emitter.
22. emitter package parts according to claim 12, wherein, at least part of described LED strip connection connects.
23. emitter package parts according to claim 12, wherein, at least part of described LED is connected in parallel.
24. emitter package parts according to claim 12, wherein, described LED being connected with series and parallel connections.
25. emitter package parts according to claim 1, wherein, described sealant comprises flat-top and has the vertical sidewall of flat surfaces.
26. emitter package parts according to claim 1, wherein, described sealant shape is selected from and comprises cube, polygon, prismatic, cylindrical, triangle, pentagon, hexagon and octagonal group.
27. emitter package parts according to claim 1, wherein, described sealant comprises a horizontal surface and the vertical surface of sum in the scope of 3 to 12.
28. emitter package parts according to claim 1, comprise the transmitting pattern being greater than 120 ° of fulls width at half maximum.
29. emitter package parts according to claim 1, have the transmitting pattern being greater than 135 degree of fulls width at half maximum, during at visual angle between-90 and+90 degree, have and are less than 10% aberration.
30. emitter package parts according to claim 1, have the transmitting profile wider than similar packaging part, described similar packaging part has the sealant not having flat surfaces.
31. emitter package parts according to claim 1, have the substrate overlay area being less than 12 square millimeters.
32. emitter package parts according to claim 1, wherein, the ratio of the overlay area of described substrate and the overlay area of described one or more solid state light emitter is in the scope of a little higher than 1 to about 20.
33. emitter package parts according to claim 1, wherein, described substrate has the overlay area ratio of about 1:1, and described packaging part has the corresponding height ratio in the scope of about 0.5 to 5.
34. emitter package parts according to claim 1, wherein, the light of at least two described emitted different colours, and wherein, described different transmitting illuminant is independent controlled.
35. emitter package parts according to claim 33, comprise pad further, and wherein, single in the group of the transmitting solid state light emitter of described different colours or many groups are connected to a special assembly welding dish.
36. emitter package parts according to claim 35, wherein, the described pad that is emitted through that different colours launches described many groups of solid state light emitter connects to be controlled as and is in black body locus place in CIE figure or the neighbouring white point place specified.
37. 1 kinds of emitter package parts, comprising:
One or more light-emitting diode (LED), it is arranged on substrate;
Covering transition material layer, it is positioned at described substrate and the top of LED described at least one; And
Sealant, it is positioned on described substrate, described sealant has one or more flat surfaces and has LED described at least one of geometry, and described geometry has the one or more surfaces tilted at least partly at least one surface of described sealant.
38. according to emitter package part according to claim 37, and wherein, described sealant has smooth side surface, and wherein, and described LED described at least one has the side surface tilted at least partly to described sealant side surface.
39. according to emitter package part according to claim 38, wherein, and the adjacent side of the described sealant that the side surface of described portions incline moves down along the side surface of described inclination further away from each other.
40. according to emitter package part according to claim 38, wherein, and the adjacent side of the described sealant that the side surface of described portions incline moves up along the side surface of described inclination further away from each other.
41. according to emitter package part according to claim 37, and wherein, described at least one, LED comprises surface of the texture.
42. according to emitter package part according to claim 37, and wherein, described at least one, LED comprises Sapphire Substrate.
43. according to emitter package part according to claim 37, and wherein, described LED comprises the feature being selected from the group be made up of the surface tilted at least partly, weavy grain and Sapphire Substrate.
44. according to emitter package part according to claim 37, and wherein, the transmitting profile that the similar packaging part of described packaging part transmitting ratio is wider, described similar packaging part has the sealant not having flat surfaces.
45. according to emitter package part according to claim 38, and wherein, the transmitting profile that the similar packaging part of described packaging part transmitting ratio is wider, described similar packaging part has hemisphere sealant.
46. emitter package parts according to claim 45, wherein, described transmitting profile is more than 120 degree of fulls width at half maximum (FWHM).
47. emitter package parts according to claim 45, wherein, described transmitting profile is more than 130 degree of fulls width at half maximum (FWHM).
48. emitter package parts according to claim 45, wherein, described transmitting profile is in the scope of 130 to 170 degree full width at half maximum (FWHM).
49. emitter package parts according to claim 45, wherein, described transmitting profile is in the scope of 130 to 160 degree full width at half maximum (FWHM).
50. emitter package parts according to claim 45, wherein, described transmitting profile is in the scope of 130 to 150 degree full width at half maximum (FWHM).
51. emitter package parts according to claim 45, wherein, described transmitting profile has about 150 degree of fulls width at half maximum (FWHM).
52. emitter package parts according to claim 45, wherein, described transmitting profile has and is greater than 135 degree of fulls width at half maximum (FWHM), during at visual angle between-90 and+90 degree, has the aberration being less than 10%.
53. according to emitter package part according to claim 37, and the change of transmitting colour temperature is less than-300 to+300 Kelvins and visual angle is approximately-100 to+100 light of spending.
54. according to emitter package part according to claim 37, and the change of transmitting colour temperature is less than-400 to+400 Kelvins and visual angle is approximately-100 to+100 light of spending.
55. according to emitter package part according to claim 37, launches colour temperature change and is less than the light that approximately-200 to+200 Kelvins and visual angle are approximately-100 to+100 degree.
56. according to emitter package part according to claim 37, and wherein, described sealant is cubic shaped.
57. according to emitter package part according to claim 37, and wherein, described substrate has the overlay area being less than 12 square millimeters.
58. according to emitter package part according to claim 37, and wherein, described overlay area has the area being less than about 6 square millimeters.
59. according to emitter package part according to claim 37, and wherein, described overlay area has the area within the scope of 1 to 4 square millimeters.
60. according to emitter package part according to claim 37, and wherein, described overlay area is approximately 2.56 square millimeters.
61. according to emitter package part according to claim 37, and wherein, the ratio of the overlay area of described substrate and the overlay area of described one or more LED is in the scope of a little higher than 1 to about 20.
62. according to emitter package part according to claim 37, and wherein, described substrate has the overlay area ratio of about 1:1, has the corresponding height ratio in the scope of about 0.5 to 5.
63. according to emitter package part according to claim 37, and wherein, described sealant has the height in the scope of about 0.3mm to 5mm.
64. 1 kinds of emitter package parts, comprising:
One or more LED, it is arranged on substrate;
Sealant, it is positioned on described substrate, and described sealant has one or more flat surfaces; And
Covering transition material layer, it is positioned at described substrate and the top of LED described at least one, and wherein, described at least one, LED has surface of the texture.
65. emitter package parts according to claim 64, wherein, described surface of the texture is the top surface of described LED described at least one.
66. emitter package parts according to claim 65, wherein, described sealant has planar top surface, and wherein, described surface of the texture is parallel with described top surface.
67. emitter package parts according to claim 64, wherein, described surface of the texture is the side surface of described LED described at least one.
68. emitter package parts according to claim 67, wherein, described sealant has flat side surface, and wherein, described weavy grain side surface is parallel with described flat surfaces sealant side surface.
69. emitter package parts according to claim 64, wherein, LED described at least one has the surface tilted to a described sealant flat surfaces.
70. emitter package parts according to claim 64, wherein, LED described at least one has the parallel surface of sealant flat surfaces described with.
71. emitter package parts according to claim 64, wherein, described at least one, LED comprises Sapphire Substrate.
72. 1 kinds of emitter package parts, comprising:
One or more LED, it is arranged on substrate;
Sealant, it is positioned on described substrate, and described sealant has one or more flat surfaces; And
Covering transition material layer, it is positioned at described substrate and the top of LED described at least one, and wherein, described at least one, LED has Sapphire Substrate.
CN201380053182.2A 2012-10-10 2013-09-30 LED package with multiple element light source and encapsulant having planar surfaces Pending CN104737313A (en)

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US13/649,052 2012-10-10
US13/649,067 2012-10-10
US13/649,052 US9048396B2 (en) 2012-06-11 2012-10-10 LED package with encapsulant having planar surfaces
US13/649,067 US9818919B2 (en) 2012-06-11 2012-10-10 LED package with multiple element light source and encapsulant having planar surfaces
US13/770,389 2013-02-19
US13/770,389 US20130328074A1 (en) 2012-06-11 2013-02-19 Led package with multiple element light source and encapsulant having planar surfaces
PCT/US2013/062640 WO2014058641A2 (en) 2012-10-10 2013-09-30 Led package with multiple element light source and encapsulant having planar surfaces

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