CN104733346A - Wet etching device - Google Patents

Wet etching device Download PDF

Info

Publication number
CN104733346A
CN104733346A CN201310717976.6A CN201310717976A CN104733346A CN 104733346 A CN104733346 A CN 104733346A CN 201310717976 A CN201310717976 A CN 201310717976A CN 104733346 A CN104733346 A CN 104733346A
Authority
CN
China
Prior art keywords
transmission axle
described roller
roller
diameter
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310717976.6A
Other languages
Chinese (zh)
Inventor
王冰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Kunshan Guoxian Photoelectric Co Ltd
Original Assignee
Kunshan Guoxian Photoelectric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Guoxian Photoelectric Co Ltd filed Critical Kunshan Guoxian Photoelectric Co Ltd
Priority to CN201310717976.6A priority Critical patent/CN104733346A/en
Publication of CN104733346A publication Critical patent/CN104733346A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a wet etching device which comprises a spraying device, a transmission shaft and a plurality of wheels arranged on the transmission shaft. Of the wheels located on the same transmission shaft, the diameter of the wheel in the middle is larger than the diameters of the wheels on the two sides of the transmission shaft. According to the wet etching device, with the aid of the flexibility of a thin base plate, by changing the relative diameters of the wheels on the same transmission shaft, in other words, by making the diameter of the wheel in the middle of the transmission shaft larger than the diameters of the wheels on the two sides, the height, in the vertical direction, of the middle of the base plate 3 is larger than the heights of the two sides in the direction perpendicular to the transmission direction of the base plate when the base plate is transmitted, etchant can not be accumulated on the base plate, the etchant replacement rate is effectively increased, and therefore the etching uniformity is improved, and the product yield is increased. In addition, the etchant replacement can be achieved by only changing the diameters of the wheels, and the device is simple in structure, low in accuracy requirement, high in production efficiency and high in product yield.

Description

A kind of wet-method etching equipment
Technical field
The present invention relates to panel display apparatus and manufacture field, be specifically related to a kind of wet-method etching equipment for base plate carving and corrosion.
Background technology
Wet-etching technology mainly refers to the lithographic technique adopting liquid chemical medicine to remove engraving, chemical reaction is carried out specifically by etching liquid and engraving, change the structure of engraving, the engraving part covered without photoresist is made to depart from substrate surface, and the engraving region having photoresist to cover is preserved, on substrate, obtain required engraving figure like this.
Wet-method etching equipment is generally in wet method etching groove, utilize acidic liquid to treat etch substrate by nozzle spray, thus reaches etching object.Along with the increase of substrate size in flat panel display industry, in wet etching process, the liquid that substrate surface gathers gets more and more thus the liquid displacement property of substrate surface is deteriorated, thus causes the homogeneity of the engraving etching be arranged on substrate to be deteriorated, and has a strong impact on the yield of product.
Chinese patent literature CN101814424A discloses a kind of substrate board treatment, described substrate board treatment comprises substrate transport path, between the 1st delivery area that described substrate transport path has a transport path of formation level, formed and between above-mentioned 1st delivery area the acclivitous transport path of continuous print the 2nd delivery area between and formed and between above-mentioned 2nd delivery area the transport path that continuous print is downward-sloping the 3rd delivery area between; That is, in the conveyance process of substrate, substrate there will be the inclination of certain angle, can be convenient to accumulate in the etching liquid on substrate or the outflow of other liquid, to improve the replacement rate of substrate surface liquid.But, aforesaid substrate processing unit needs the relative altitude between the different transmission shafts of appropriate design, need under the prerequisite not affecting board carrying, can make substrate in conveyance process, present certain angle can make etching liquid or other liquid flow out, complex structure, equipment precision requirement are high, less error just may affect the uniformity of substrate conveyance or base plate carving and corrosion, thus affects production efficiency and product yield.
Summary of the invention
For this reason, to be solved by this invention is the high problem of existing wet-method etching equipment complex structure, required precision, and the problem affecting production efficiency and product yield caused, and provides the wet-method etching equipment that a kind of structure is simple, production efficiency is high, yields is high.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of wet-method etching equipment of the present invention, comprise injection apparatus, transmission axle and fit and be arranged on multiple rollers on transmission axle outer wall, be arranged in the multiple described roller on same described transmission axle, the diameter being arranged on middle described roller is greater than the diameter of each described roller being arranged at described transmission axle both sides.
Each described transmission axle specification is identical, and is arranged in same level; The quantity being arranged on the described roller on each described transmission axle is equal.
On same described transmission axle, the quantity of described roller is 2n+1, and n is non-zero natural number; The diameter of described roller successively decreases from being arranged on middle described roller successively respectively to the described roller being arranged on both sides.
Along each described transmission axle length direction, the diameter being arranged on m described roller on described transmission axle equals the diameter of 2n+2-m described roller, and m is less than or equal to n.
Along each described transmission axle length direction, m the described roller be arranged on described transmission axle is equal with the distance between roller described in 2n+2-m described roller to n-th, and m is less than or equal to n.
On same described transmission axle, the quantity of described roller is i, i be greater than 3 natural number; Along each described transmission axle length direction, be arranged on the equal diameters of the middle i-2j of described transmission axle described roller, i-2j is greater than 0 and j is non-zero natural number.
Along each described transmission axle length direction, the diameter of described roller increases progressively successively from 1 to the described roller of jth+1, successively decreases successively from the i-th-j to i-th described roller.
The difference of the maximum gauge and minimum diameter that are arranged on the described roller on same described transmission axle is 15 ~ 45mm.
The difference in diameter being arranged on adjacent two the described rollers on same described transmission axle is more than or equal to 0, is less than 3 ~ 9mm.
Technique scheme of the present invention has the following advantages compared to existing technology:
A kind of wet-method etching equipment of the present invention, the roller comprising injection apparatus, transmission axle and be arranged on transmission axle, on same described transmission axle, the diameter of the described roller of the centre of setting is greater than the diameter being arranged on each described roller in both sides, the substrate to be etched that panel display apparatus manufactures field is usually thinner, be generally 0.3 ~ 0.5 millimeter, there is certain pliability (bending), wet-method etching equipment of the present invention is by the flexibility of thin base itself, by changing the relative diameter being arranged on same transmission axle upper roller, namely the roller diameter be arranged in the middle of transmission axle is greater than the roller diameter being arranged on both sides, during transmission base plate, along the transmission direction perpendicular to substrate, the middle part in the vertical direction height of substrate is greater than the height of its both sides, etching liquid cannot be piled up in surface, effectively improve the replacement rate of etching liquid, thus improve the uniformity of etching, improve the yield of product.And only need to change the displacement that roller diameter just can realize etching liquid, device structure is simple, and required precision is low, and production efficiency is high, product yield is high, effectively can reduce production cost.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
State diagram when Fig. 1 is the conveyance of wet-method etching equipment described in embodiment 1 substrate;
Fig. 2 is the end view of structure shown in Fig. 1;
State diagram when Fig. 3 is the conveyance of wet-method etching equipment described in embodiment 2 substrate.
In figure, Reference numeral is expressed as: 1-roller, 2-transmission axle, 3-substrate.
Embodiment
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
The present invention can implement in many different forms, and should not be understood to be limited to embodiment set forth herein.On the contrary, provide these embodiments, make the disclosure to be thorough and complete, and design of the present invention fully will be conveyed to those skilled in the art, the present invention will only be limited by claim.In the accompanying drawings, for clarity, the size in layer and region and relative size can be exaggerated.
Embodiment 1
A kind of wet-method etching equipment described in the present embodiment, as illustrated in fig. 1 and 2, comprise injection apparatus (not shown), transmission axle 2 and fit and be arranged on multiple rollers 1 on transmission axle 2 outer wall, be arranged in the multiple described roller 1 on same described transmission axle 2, the diameter being arranged on middle described roller 1 is greater than the diameter of each described roller 1 being arranged at described transmission axle 2 both sides.
Panel display apparatus manufactures the substrate to be etched in field, as the glass substrate of rigidity or the polymeric substrates of flexibility, usually thinner, be generally 0.3 ~ 0.5 millimeter, there is certain pliability (bending), wet-method etching equipment described in the present embodiment is by the flexibility of thin base 3 itself, by changing the relative diameter being arranged on same transmission axle 2 upper roller 1, namely, roller 1 diameter be arranged in the middle of transmission axle 2 is greater than the diameter of the roller 1 being arranged on both sides, during transmission base plate 3, along the transmission direction perpendicular to substrate 3, the middle part in the vertical direction of substrate 3 is higher than the height of its both sides, etching liquid is from after injection apparatus is ejected into substrate 3, along the runs down both sides that substrate 3 is highly relatively low, cannot just pile up on the substrate 3, effectively improve the replacement rate of etching liquid, thus improve the uniformity of etching, improve the yield of product.And the Wet-method etching device described in the present embodiment only needs to change the displacement that roller 1 diameter just can realize etching liquid, and device structure is simple, and required precision is low, and production efficiency is high, product yield is high.
In the present embodiment, each described transmission axle 2 specification is identical, and is arranged in same level; The quantity being arranged on the described roller 1 on each described transmission axle 2 is equal.As shown in Figure 1, on same described transmission axle 2, the quantity of described roller 1 is 9, along described transmission axle 2 length direction, the diameter of each roller is followed successively by 90mm, 95mm, 100mm, 105mm, 110mm, 105mm, 100mm, 95mm, 90mm, and namely the diameter of described roller 1 successively decreases from being arranged on middle described roller 1 successively respectively to the described roller 1 being arranged on both sides.
As other embodiments of the present invention, on same described transmission axle 2, the quantity of described roller 1 can also be 2n+1, and n is non-zero natural number; The diameter of described roller 1 successively decreases from being arranged on middle described roller 1 successively respectively to the described roller 1 being arranged on both sides, can realize object of the present invention, belong to protection scope of the present invention.
Along each described transmission axle 2 length direction, the diameter being arranged on m described roller 1 on described transmission axle 2 equals the diameter of 2n+2-m described roller 1, and m the described roller 1 be arranged on described transmission axle 2 is equal with the distance between roller 1 described in 2n+2-m described roller 1 to the n-th, m is less than or equal to n.Be arranged so that the both sides level height in the transmission direction of substrate 3 opposing substrate 3 is equal like this, be conducive to etching liquid and evenly drain from substrate 3 both sides, reach the object of evenly etching.
As other embodiments of the present invention, in order to described substrate 3 effectively can be transmitted and make the etching liquid accumulated on described substrate 3 effectively to get rid of while can not fractureing, be arranged on the maximum gauge of described roller 1 on same described transmission axle 2 and the difference of minimum diameter should be 15 ~ 45mm; The difference in diameter being arranged on adjacent two the described rollers 1 on same described transmission axle 2 should be more than or equal to 0 and be less than 3 ~ 9mm.
Embodiment 2
A kind of wet-method etching equipment described in the present embodiment, as shown in Figure 3, comprise injection apparatus, transmission axle 2 and fit and be arranged on multiple rollers 1 on transmission axle 2 outer wall, be arranged in the multiple described roller 1 on same described transmission axle 2, the diameter being arranged on middle described roller 1 is greater than the diameter of each described roller 1 being arranged at described transmission axle 2 both sides.On same described transmission axle 2, the quantity of described roller 1 is 10, along described transmission axle 2 length direction, the diameter of each roller is followed successively by 90mm, 95mm, 100mm, 105mm, 110mm, 110mm, 105mm, 100mm, 95mm, 90mm, and namely the diameter of described roller 1 successively decreases along described transmission axle 2 both sides respectively successively from being arranged on middle 5 and the 6th the described roller 1.
As other embodiments of the present invention, on same described transmission axle 2, the quantity of described roller 1 can also be i, i be greater than 3 natural number; Along each described transmission axle 2 length direction, be arranged on the equal diameters of the middle i-2j of described transmission axle 2 described roller, i-2j is greater than 0 and j is non-zero natural number.The diameter meeting described roller 1 increases progressively successively from 1 to the described roller 1 of jth+1, successively decreases successively, can realize object of the present invention, belong to protection scope of the present invention from the i-th-j to i-th described roller 1.
In the present embodiment, each described transmission axle 2 specification is identical, and be arranged in same level, by changing the relative diameter being arranged on same transmission axle 2 upper roller 1, by the flexibility of thin base 3 itself, the height that can realize in the middle part of substrate 3 is greater than the level height of both sides; Etching liquid is from after injection apparatus is ejected into substrate 3, and etching liquid, along the relatively low runs down both sides of substrate 3 level height, just cannot be piled up on the substrate 3, effectively improve the replacement rate of etching liquid, thus improve the uniformity of etching, improve the yield of product.And the Wet-method etching device described in the present embodiment only needs to change roller 1 diameter without the need to changing the relative altitude of each described transmission axle 2, and just can realize the displacement of etching liquid, device structure is simple, and required precision is low, and production efficiency is high, product yield is high.
As other embodiments of the present invention, in order to described substrate 3 effectively can be transmitted and make the etching liquid accumulated on described substrate 3 effectively to get rid of while can not fractureing, be arranged on the maximum gauge of described roller 1 on same described transmission axle 2 and the difference of minimum diameter should be 15 ~ 45mm; The difference in diameter being arranged on adjacent two the described rollers 1 on same described transmission axle 2 should be more than or equal to 0 and be less than 3 ~ 9mm.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among protection scope of the present invention.

Claims (9)

1. a wet-method etching equipment, comprise injection apparatus, many transmission axles and fit and be arranged on multiple rollers on transmission axle outer wall, it is characterized in that, be arranged in the multiple described roller on same described transmission axle, the diameter being arranged on middle described roller is greater than the diameter of each described roller being arranged at described transmission axle both sides.
2. wet-method etching equipment according to claim 1, is characterized in that, each described transmission axle specification is identical, and is arranged in same level; The quantity being arranged on the described roller on each described transmission axle is equal.
3. wet-method etching equipment according to claim 2, is characterized in that, on same described transmission axle, the quantity of described roller is 2n+1, and n is non-zero natural number; The diameter of described roller successively decreases from being arranged on middle described roller successively respectively to the described roller being arranged on both sides.
4. wet-method etching equipment according to claim 3, is characterized in that, along each described transmission axle length direction, the diameter being arranged on m described roller on described transmission axle equals the diameter of 2n+2-m described roller, and m is less than or equal to n.
5. wet-method etching equipment according to claim 4, it is characterized in that, along each described transmission axle length direction, m the described roller be arranged on described transmission axle is equal with the distance between roller described in 2n+2-m described roller to n-th, and m is less than or equal to n.
6. wet-method etching equipment according to claim 2, is characterized in that, on same described transmission axle, the quantity of described roller is i, i be greater than 3 natural number; Along each described transmission axle length direction, be arranged on the equal diameters of the middle i-2j of described transmission axle described roller, i-2j is greater than 0 and j is non-zero natural number.
7. wet-method etching equipment according to claim 6, is characterized in that, along each described transmission axle length direction, the diameter of described roller increases progressively successively from 1 to the described roller of jth+1, successively decreases successively from the i-th-j to i-th described roller.
8., according to the arbitrary described wet-method etching equipment of claim 1-7, it is characterized in that, the difference of the maximum gauge and minimum diameter that are arranged on the described roller on same described transmission axle is 15 ~ 45mm.
9. wet-method etching equipment according to claim 8, is characterized in that, the difference in diameter being arranged on adjacent two the described rollers on same described transmission axle is more than or equal to 0, is less than 3 ~ 9mm.
CN201310717976.6A 2013-12-23 2013-12-23 Wet etching device Pending CN104733346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310717976.6A CN104733346A (en) 2013-12-23 2013-12-23 Wet etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310717976.6A CN104733346A (en) 2013-12-23 2013-12-23 Wet etching device

Publications (1)

Publication Number Publication Date
CN104733346A true CN104733346A (en) 2015-06-24

Family

ID=53457131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310717976.6A Pending CN104733346A (en) 2013-12-23 2013-12-23 Wet etching device

Country Status (1)

Country Link
CN (1) CN104733346A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108682620A (en) * 2018-06-07 2018-10-19 通威太阳能(安徽)有限公司 A kind of improvement method and its device of the idler wheel with liquid etched quarter
CN112309913A (en) * 2020-09-28 2021-02-02 晶澳(扬州)太阳能科技有限公司 Liquid-carrying roller for wet etching and wet etching method
CN114411150A (en) * 2022-01-24 2022-04-29 常州高光半导体材料有限公司 Etching line roller, etching transmission line and etching device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3930278B2 (en) * 2001-09-20 2007-06-13 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
KR20080062117A (en) * 2006-12-29 2008-07-03 삼성에스디아이 주식회사 Wet etching equipment
CN102586779A (en) * 2011-11-30 2012-07-18 常州亿晶光电科技有限公司 Liquid-separation type wet etching device for silicon wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3930278B2 (en) * 2001-09-20 2007-06-13 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
KR20080062117A (en) * 2006-12-29 2008-07-03 삼성에스디아이 주식회사 Wet etching equipment
CN102586779A (en) * 2011-11-30 2012-07-18 常州亿晶光电科技有限公司 Liquid-separation type wet etching device for silicon wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108682620A (en) * 2018-06-07 2018-10-19 通威太阳能(安徽)有限公司 A kind of improvement method and its device of the idler wheel with liquid etched quarter
CN108682620B (en) * 2018-06-07 2020-01-14 通威太阳能(安徽)有限公司 Method and device for improving roller liquid-carrying etching overetch
CN112309913A (en) * 2020-09-28 2021-02-02 晶澳(扬州)太阳能科技有限公司 Liquid-carrying roller for wet etching and wet etching method
CN114411150A (en) * 2022-01-24 2022-04-29 常州高光半导体材料有限公司 Etching line roller, etching transmission line and etching device

Similar Documents

Publication Publication Date Title
CN101985752B (en) Spray etching device
CN102453915B (en) Etching apparatus and method of applying same in etching substrate
CN102560494B (en) Etching device and etching method
CN104733346A (en) Wet etching device
JP5860222B2 (en) Non-contact etching of moving glass plates
US10157754B2 (en) Liquid knife cleaning device
CN203760432U (en) Wet etching device
CN203631508U (en) Cover plate used for wet etching
JP5701551B2 (en) Substrate processing equipment
CN210117422U (en) Spraying device for substrate treatment and substrate treatment equipment
KR20120053319A (en) Cleaning system for substrate and clening method for the same
CN205961592U (en) Reduce pool effect 's etching device
CN210093691U (en) Etching system
JP2573396B2 (en) Etching and developing method
CN204652787U (en) A kind of etching machine etching the uniformity for improving FPC
CN114411150A (en) Etching line roller, etching transmission line and etching device
US20110284162A1 (en) Apparatus for wet processing substrate
CN110106504B (en) Etching equipment
US20190382225A1 (en) Developing machine and transmission device thereof
CN203037996U (en) Novel photoresist membrane-stripping liquid nozzle
JP3180385U (en) Substrate etching equipment
CN206322678U (en) The producing device of Wet-method etching device and array base palte
CN102323695B (en) Method for coating liquid crystal alignment film for TFT-LCD (Thin Film Transistor Liquid Crystal Display)
CN206705253U (en) Sheet devices on a kind of cleaning glass substrate
KR101007688B1 (en) Nozzle for jetting a cleaning solution and apparatus for cleaning a substrate having the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20150624

RJ01 Rejection of invention patent application after publication