CN104728811A - LED lamp shell device - Google Patents
LED lamp shell device Download PDFInfo
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- CN104728811A CN104728811A CN201510163107.2A CN201510163107A CN104728811A CN 104728811 A CN104728811 A CN 104728811A CN 201510163107 A CN201510163107 A CN 201510163107A CN 104728811 A CN104728811 A CN 104728811A
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- heat
- conducting base
- lamp body
- led
- housing apparatus
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Abstract
The invention provides an LED lamp shell device and belongs to the technical field of LED lamp heat dissipation. The LED lamp shell device comprises a lamp shell body, a heat conducting base and multiple cooling fins arranged on the outer side face of the lamp shell body. The first surface of the heat conducting base is mounted on the inner side face of the lamp shell body in an attached mode, the second surface, opposite to the first surface, of the heat conducting base is directly attached to an LED light source chip, and the second surface of the heat conducting base is a flat surface which is machined. The heat conducting effect of the heat conducting base is improved through machining, the multiple streamline cooling fins are arranged on the lamp shell body and a transition structure is arranged between the heat conducting base and the outer shell, so that heat conducted from the heat conducting base is conducted to the larger area of the outer shell as even as possible, heat generated by the LED light source chip is released layer by layer, the heat dissipation effect of a high-power LED lamp is effectively improved, and the service life of the high-power LED lamp can be prolonged.
Description
Technical field
The present invention relates to a kind of LED housing apparatus, belong to LED technical field of heat dissipation.
Background technology
LED luminescence technology has been widely used in the various field needing illumination, generally adopts LED chip as luminescent device in prior art.The same with traditional semiconductor devices, LED chip can produce heat during operation, and its heat produced depends on overall luminous efficiency.Combination current injection efficiency, radioluminescence quantum efficiency, chip exterior light extraction efficiency etc., the photoelectric transformation efficiency of common LED chip is about 54%, and in the course of work of reality, only have the electric energy conversion of 15-25% to be luminous energy, remaining energy mainly comes out in the mode of heat, and therefore radiating efficiency just becomes guarantee LED chip illumination effect and the key in service life preferably.
Existing LED heat dissipation technology mainly adopts independent cellular formula module heat dissipating and splits slotted eye up and down at lamp housing, inside installs the radiator of split additional, rely on cross-ventilation the heat that LED produces to be shed, or install heat-pipe radiator additional and dispel the heat below the aluminium alloy base plate that LED light source chip is fitted.But, due to one deck the air gap can be produced between LED chip and the contact surface of heat dissipation base, cause reaching good radiating effect.But the use in recent years along with high-powered LED lamp is more extensive, when LED constancy of volume, its heat produced is more than the twice of common LED lamp, therefore existing LED heat dissipation technology is applied to high-powered LED lamp and cannot meets the demands.
Summary of the invention
The present invention is that the pyroconductivity solved between the LED light source chip of existing high-power integrated LED lamp heat dissipation technology existence and heat dissipation base is lower, causes the problem of the cooling requirements that cannot meet high-powered LED lamp, and then proposes a kind of LED housing apparatus.
In order to achieve the above object, the embodiment of the present invention provides a kind of LED housing apparatus, and described device comprises: lamp body, heat-conducting base and the multiple radiating fins be arranged on described lamp body lateral surface; The first surface laminating of described heat-conducting base is arranged on the medial surface of described lamp body, and the second surface relative to described first surface of described heat-conducting base and LED light source chip are directly fitted, the second surface of described heat-conducting base is the flat surface through machining.
Further, between the medial surface of described heat-conducting base and described lamp body, there is transition structure, for the heat that described LED light source chip produced from described heat-conducting base uniform conductive to the more large regions of described lamp body.
Further, described multiple radiating fin and described lamp body are integrated design, and described radiating fin is streamlined structure.
Further, the second surface of described heat-conducting base is the feasible value obtained by milling or grinding is the flat surface of 0.04-0.08mm/m.
Further, described lamp body adopts thermal conductivity factor to be greater than the die-cast aluminum alloy material die casting manufacture of 200W/mK.
Further, the zone line height of described radiating fin is 36mm ~ 40mm, and the maximum height to ambient radiation is 23mm ~ 27mm.
Further, the base thickness of described radiating fin is 4mm, and top thickness is 3mm.
Further, the center distance of two adjacent radiating fins is 13mm ~ 17mm.
In order to achieve the above object, the embodiment of the present invention also by a kind of LED housing apparatus, comprising: lamp body, be arranged on multiple radiating fin on the lateral surface of this lamp body and the heat-conducting base equal with the quantity of multiple LED light source chip; LED chip light source described in each all fit be arranged on corresponding heat-conducting base on the flat surface of machining, described in each, heat-conducting base is all arranged on the medial surface of described lamp body.
Further, described in each heat-conducting base and described lamp body medial surface between all there is transition structure, for by described in each LED light source chip produce heat from heat-conducting base uniform conductive described in each to the more large regions of described lamp body.
The present invention increases the heat-conducting effect of heat-conducting base by machining, lamp body arranges multiple streamlined radiating fin, and between heat-conducting base and shell, transition structure is set, make the more large regions conducting to shell from the heat of heat-conducting base conduction as far as possible equably, thus the heat that LED light source chip produces successively is discharged, effectively improve the radiating effect of high-powered LED lamp, and the service life of high-powered LED lamp can be extended.
Accompanying drawing explanation
Fig. 1 shows the structure chart of the LED housing apparatus in one embodiment of the invention in a schematic manner.
Fig. 2 shows the second direction structure chart of the LED housing apparatus in one embodiment of the invention in a schematic manner.
Fig. 3 shows the cross sectional figure of the LED housing apparatus in one embodiment of the invention in a schematic manner.
Fig. 4 shows the rip cutting sectional view of the LED housing apparatus in one embodiment of the invention in a schematic manner.
Fig. 5 shows the structure chart of the LED housing apparatus in another embodiment of the present invention in a schematic manner.
Fig. 6 shows the longitudinal sectional view of the LED housing apparatus in another embodiment of the present invention in a schematic manner.
Detailed description of the invention
Below in conjunction with drawings and the specific embodiments, the specific embodiment of the present invention is described in further detail.
The present embodiment proposes a kind of LED housing apparatus, as depicted in figs. 1 and 2, comprising: lamp body 31, heat-conducting base 21 and the multiple radiating fins 41 be arranged on described lamp body 31 lateral surface.The first surface laminating of described heat-conducting base 21 is arranged on the medial surface of described lamp body 31, and the second surface relative to described first surface of described heat-conducting base 21 and LED light source chip are directly fitted, the second surface of described heat-conducting base is the flat surface through machining.
As shown in Figure 2, described multiple radiating fin 41 can be designed as one with described lamp body 31, and described radiating fin is streamlined structure.
The manufacturing process of the LED housing apparatus that the present embodiment provides comprises: first LED light source chip 11 screw is installed the lower surface being fixedly mounted on heat-conducting base 21, due to very meagre one deck the air gap can be produced between two planes of contact, thermal conductivity is reduced, the lower surface of the heat-conducting base 21 therefore in the present embodiment is the flat surface through machining, decrease the area of the air gap to greatest extent, thus reach the object reducing thermal resistance.After LED light source chip 11 starts luminescence, the heat conduction of generation is to heat-conducting base 21, and heat-conducting base 21 again by multiple radiating fin 41 distributing even heat be arranged on lamp body 21, thus realizes the efficiently radiates heat to high-powered LED lamp.
Particularly, lamp body 31 can adopt thermal conductivity factor to be greater than the die-cast aluminum alloy material manufacture of 200.Due to existing lamp housing adopt die-cast aluminum alloy material (the common trade mark is ADC12) or steel plate punched shaping, because the coefficient of heat conduction scope of this bi-material is: 90-100 (W/m.k), so heat conductivility is poor, directly affect the heat radiation of lamp housing.And the lamp housing material that the present embodiment adopts is formed by pack alloy AL1070 die casting, the coefficient of heat conduction of this material is high, and its coefficient of heat conduction scope is: 210-230 (W/m.k).From the coefficient of heat conduction of bi-material, pack alloy AL1070 is much better than pack alloy ADC12, therefore, it is possible to improve heat-conducting effect further.
In the present embodiment, preferably, the surface of fitting with LED light source chip of heat-conducting base 21 is the flat configuration of 0.04-0.08mm/m by the feasible value that milling or grinding obtain, and can improve the laminating tightness degree of heat-conducting base 21 and LED light source chip 11 further.
The invention allows for another embodiment, the basis of the LED housing apparatus shown in Fig. 1 adds transition structure.As shown in Figure 3 and Figure 4, between described heat-conducting base 21 and the medial surface of described lamp body 31, there is transition structure 51, for the heat that described LED light source chip produced from described heat-conducting base 21 uniform conductive to the more large regions of described lamp body 31.Transition structure 51 is transition portions that heat-conducting base 21 is connected with lamp body 31, if there is no transition structure 51, that right angle is connected between heat-conducting base 21 with lamp body 31, be easy to the temperature Centralized of generation on heat-conducting base 21, thus the gradient of temperature can be produced, cause the conduction lamp body 31 that heat can not be very fast, do not reach good radiating effect.In the present embodiment, transition structure 51 is the entity structure of a fillet quadrangle, it is all identical with lamp housing with described heat-conducting base that it makes material, conduct to the heat of heat-conducting base 21 by radiating fin 41 heat conduction of transition structure 51 with greater number, make heat evenly distribute, avoid the gradient occurring temperature in radiation processes, thus improve radiating effect.
Further, multiple radiating fin 41 is streamlined structure, and fairshaped bonding structure makes ambient air flow around radiating fin 41, thus increases the efficiency of air flowing, increases radiating effect further.Preferably, in the present embodiment, the zone line height of radiating fin 41 is 36mm ~ 40mm, and the maximum height to ambient radiation is 23mm ~ 27mm.By the repeatedly simulated experiment of Solidworks software, according to the result of the actual test experiments of software, the radiating fin 41 arranged as mentioned above is formed middle high at the lateral surface of lamp body 31, the structure that both sides are low, can increase the efficiency of air flowing further.Preferred further, the base thickness of radiating fin 41 is decided to be 4mm, and the thickness at top is 3mm.Radiating fin is arranged to trapezoidal structure, is conducive to heat and rises to top from bottom and come out, improve radiating effect further.
Preferably, the center distance of two adjacent radiating fins 41 is 13mm ~ 17mm.Suitable center distance can either ensure that the heat that adjacent radiating fin 41 distributes can not disturb mutually, can arrange abundant radiating fin 41 again, thus reach better radiating effect on lamp body 31.
LED housing apparatus basis shown in Fig. 1 to Fig. 4 also proposed a kind of LED housing apparatus in the present invention, as shown in Figure 5 and Figure 6, comprising: lamp body 31`, be arranged on multiple radiating fin 41` on the lateral surface of this lamp body 31` and the heat-conducting base 21` equal with the quantity of multiple LED light source chip 11`.Fig. 5 and embodiment illustrated in fig. 6 in, LED light source chip is two, and corresponding heat-conducting base is also two; LED chip light source 11` described in each all fit be arranged on corresponding heat-conducting base 21` on the flat surface of machining, heat-conducting base 21` described in each is arranged on the medial surface of described lamp body 31`.
Concrete, to arrange two LED light source chip 11` on lamp body 31`, then the quantity of heat-conducting base 21` is also two.All fit due to each LED light source chip 11 and be arranged at a heat-conducting base 21, when two LED light source chips 11 are all luminous, the heat produced conducts to lamp body 31` respectively by a heat-conducting base 21`, heat on lamp body 31` is evenly distributed by multiple radiating fin 41` again, thus realizes the efficiently radiates heat to high-powered LED lamp.When the quantity of LED light source chip 11` is three or more, the quantity of heat-conducting base 21` also increases accordingly, thus ensures that the large LED light fixture being provided with multiple LED light source chip 11` has good radiating effect.
Further, as shown in Figure 6, be provided with in the inner side of lamp body 31` and equal with LED light source chip 11` quantity conduct to the transition structure 51` of the lateral surface of this lamp body 31 for the even heat by heat-conducting base 21`.
The quantity of transition structure 51` is also corresponding with the quantity of heat-conducting base 21`, heat on each heat-conducting base 21` is all by radiating fin 41 heat conduction of transition structure 51` (entity structure of a fillet quadrangle) with greater number, make heat evenly distribute, avoid the gradient occurring temperature in radiation processes, thus improve radiating effect further.
The present invention increases the heat-conducting effect of heat-conducting base by machining, lamp body arranges multiple streamlined radiating fin, and between heat-conducting base and shell, transition structure is set, make the more large regions conducting to shell from the heat of heat-conducting base conduction as far as possible equably, thus the heat that LED light source chip produces successively is discharged, effectively improve the radiating effect of high-powered LED lamp, and the service life of high-powered LED lamp can be extended.
Certainly; the above embodiment of the present invention only proposes for ease of understanding; according to foregoing teachings; those skilled in the art can carry out changing or combining for a certain or multinomial feature wherein when reality is implemented completely as the case may be; therefore, any those skilled in the art, the displacement of equivalent assemblies done under the prerequisite not departing from the spirit and scope of the present invention; or the equivalent variations to do according to scope of patent protection of the present invention and modification, all still should belong to the category that this patent is contained.
Claims (10)
1. a LED housing apparatus, it is characterized in that, described LED housing apparatus comprises: lamp body (31), heat-conducting base (21) and the multiple radiating fins (41) be arranged on described lamp body (31) lateral surface;
The first surface laminating of described heat-conducting base (21) is arranged on the medial surface of described lamp body (31), and the second surface relative to described first surface of described heat-conducting base (21) and LED light source chip are directly fitted, the second surface of described heat-conducting base is the flat surface through machining.
2. LED housing apparatus as claimed in claim 1, it is characterized in that, there is transition structure (51), for the heat that described LED light source chip produced from described heat-conducting base (21) uniform conductive to the more large regions of described lamp body (31) between the medial surface of described heat-conducting base (21) and described lamp body (31).
3. LED housing apparatus as claimed in claim 1, is characterized in that, described multiple radiating fin (41) and described lamp body (31) are integrated design, and described radiating fin is streamlined structure.
4. LED housing apparatus as claimed in claim 1, is characterized in that, the second surface of described heat-conducting base (21) is the feasible value obtained by milling or grinding is the flat surface of 0.04-0.08mm/m.
5. LED housing apparatus as claimed in claim 1, is characterized in that, described lamp body (31) adopts thermal conductivity factor to be greater than the die-cast aluminum alloy material die casting manufacture of 200W/mK.
6. LED housing apparatus as claimed in claim 5, it is characterized in that, the zone line height of described radiating fin (41) is 36mm ~ 40mm, and the maximum height to ambient radiation is 23mm ~ 27mm.
7. LED housing apparatus as claimed in claim 5, it is characterized in that, the base thickness of described radiating fin (41) is 4mm, and top thickness is 3mm.
8. LED housing apparatus as claimed in claim 5, is characterized in that, the center distance of two adjacent radiating fins (41) is 13mm ~ 17mm.
9. a LED housing apparatus, it is characterized in that, described LED housing apparatus comprises: lamp body (31 '), be arranged on multiple radiating fins (41`) on the lateral surface of this lamp body (31`) and the heat-conducting base (21`) equal with the quantity of multiple LED light source chip (11`);
LED chip light source described in each (11`) all fit be arranged on corresponding heat-conducting base (21`) on the flat surface of machining, described in each, heat-conducting base (21`) is all arranged on the medial surface of described lamp body (31`).
10. LED housing apparatus as claimed in claim 9, it is characterized in that, described in each heat-conducting base (21`) and described lamp body (31`) medial surface between all there is transition structure (51`), for the heat that produced by LED light source chip described in each from heat-conducting base described in each (21`) uniform conductive to the more large regions of described lamp body (31`).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510163107.2A CN104728811A (en) | 2015-04-08 | 2015-04-08 | LED lamp shell device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510163107.2A CN104728811A (en) | 2015-04-08 | 2015-04-08 | LED lamp shell device |
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| Publication Number | Publication Date |
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| CN104728811A true CN104728811A (en) | 2015-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510163107.2A Pending CN104728811A (en) | 2015-04-08 | 2015-04-08 | LED lamp shell device |
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Citations (9)
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| CN201100539Y (en) * | 2007-09-12 | 2008-08-13 | 代尉有限公司 | Lighting device with multi-angle lighting |
| TWI302821B (en) * | 2005-08-18 | 2008-11-01 | Ind Tech Res Inst | Flexible circuit board with heat sink |
| CN201396628Y (en) * | 2008-11-25 | 2010-02-03 | 董丽霞 | LED street lamp |
| CN201606745U (en) * | 2009-12-29 | 2010-10-13 | 上海环东光电科技有限公司 | LED street lamp cap |
| CN201652078U (en) * | 2010-05-07 | 2010-11-24 | 上海致达智利达***控制有限责任公司 | Energy-saving LED street lamp |
| CN201739898U (en) * | 2010-03-10 | 2011-02-09 | 湖南新曦电子有限公司 | Externally radiating type LED energy-saving street lamp |
| US20110176308A1 (en) * | 2010-01-20 | 2011-07-21 | Hsiang-Chen Wu | Illumination device and light-emitting module thereof |
| CN103998863A (en) * | 2012-01-25 | 2014-08-20 | 皇家飞利浦有限公司 | LED module and luminaire comprising said module |
| CN104089214A (en) * | 2014-05-05 | 2014-10-08 | 木林森股份有限公司 | Uniformly light-emitting unelectrified LED street lamp |
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2015
- 2015-04-08 CN CN201510163107.2A patent/CN104728811A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI302821B (en) * | 2005-08-18 | 2008-11-01 | Ind Tech Res Inst | Flexible circuit board with heat sink |
| CN201100539Y (en) * | 2007-09-12 | 2008-08-13 | 代尉有限公司 | Lighting device with multi-angle lighting |
| CN201396628Y (en) * | 2008-11-25 | 2010-02-03 | 董丽霞 | LED street lamp |
| CN201606745U (en) * | 2009-12-29 | 2010-10-13 | 上海环东光电科技有限公司 | LED street lamp cap |
| US20110176308A1 (en) * | 2010-01-20 | 2011-07-21 | Hsiang-Chen Wu | Illumination device and light-emitting module thereof |
| CN201739898U (en) * | 2010-03-10 | 2011-02-09 | 湖南新曦电子有限公司 | Externally radiating type LED energy-saving street lamp |
| CN201652078U (en) * | 2010-05-07 | 2010-11-24 | 上海致达智利达***控制有限责任公司 | Energy-saving LED street lamp |
| CN103998863A (en) * | 2012-01-25 | 2014-08-20 | 皇家飞利浦有限公司 | LED module and luminaire comprising said module |
| CN104089214A (en) * | 2014-05-05 | 2014-10-08 | 木林森股份有限公司 | Uniformly light-emitting unelectrified LED street lamp |
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Application publication date: 20150624 |
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