CN104727808A - Down-hole pressure meter - Google Patents
Down-hole pressure meter Download PDFInfo
- Publication number
- CN104727808A CN104727808A CN201510069413.XA CN201510069413A CN104727808A CN 104727808 A CN104727808 A CN 104727808A CN 201510069413 A CN201510069413 A CN 201510069413A CN 104727808 A CN104727808 A CN 104727808A
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- Prior art keywords
- pressure
- signal
- processing module
- signal processing
- temperature
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- 238000012545 processing Methods 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims description 37
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 230000003321 amplification Effects 0.000 claims description 15
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- 244000043261 Hevea brasiliensis Species 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229920003052 natural elastomer Polymers 0.000 claims description 3
- 229920001194 natural rubber Polymers 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 10
- 239000007788 liquid Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/06—Measuring temperature or pressure
Landscapes
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Geophysics (AREA)
- Environmental & Geological Engineering (AREA)
- Fluid Mechanics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a down-hole pressure meter. The down-hole pressure meter comprises a shell, a power assembly, a microcontroller, a signal processing module, a pressure sensor and a temperature sensor which are arranged in the shell, and a liquid inflow pipe connected with the shell. The power assembly is connected with the microcontroller, the signal processing module, the pressure sensor and the temperature sensor and used for supplying power. One end of the signal processing module is connected with the microcontroller, the other end of the signal processing module is connected with the pressure sensor and the temperature sensor, and the pressure sensor is used for detecting pressure information in the liquid inflow pipe and transmitting the pressure information to the signal processing module. The temperature sensor is used for detecting down-hole temperature information and transmitting the temperature information to the signal processing module. The signal processing module is used for processing pressure signals and temperature signals. The down-hole pressure meter is simple in structure, high in measurement accuracy, small in size and wide in application range.
Description
Technical field
The present invention relates to oil well rig technical field, particularly relate to a kind of pressure bomb.
Background technology
In recent years, along with development and the raising of Well Test Technology, downhole electronic pressure bomb presents the situation progressively replacing traditional mechanical underground pressure meter, and down-hole electronic pressure meter can use altogether with computer structure, tests more accurately the PRESSURE DATA of down-hole.
Current electronic pressure gauge progressively instead of the key instrument that traditional mechanical-type manometer becomes down-hole pressure Data Collection.The downhole electronic pressure bomb of the first generation is produced in the beginning of the nineties at the end of the eighties in last century, due to sensing technology and the relative backwardness of electronic technology, the most function singleness of pressure gauge of this generation, a pressure gauge only has direct-reading or stores a kind of function, certainty of measurement is lower, and the capacity of storage is also smaller, and pressure gauge volume is larger, energy consumption is also higher, easy circuit for generating fault.The very large raising that the sensor levels of the downhole electronic pressure bomb of the second generation has, function software by early stage DOS version progressively to the transition of WINDOWS version, add data processing function, but instrument price is higher, later maintenance expense is also higher, the downhole electronic pressure bomb of the third generation represents trend and the direction of the development of future electronic pressure gauge, the accuracy of sensor is higher, manometric circuit part adopts VLSI Design, increase manometric memory capacity, reduce energy consumption, extend the application life of instrument.But great majority remain expensive, later maintenance and repairing inconvenience.
In the prior art, the instrument for the change of underground survey pressure adopts data memory-type usually.When storage pressure gauge is by being hang after steel wire carries go back to ground, the defects such as the pressure being obtained surveyed layer position by data readback changes data, causes causing test period long, operating cost height.
Summary of the invention
Technical problem to be solved by this invention is to overcome existing pressure bomb and has that test period is long, operating cost is high, the defect of pressure test inaccuracy etc.
In order to solve the problems of the technologies described above, the invention provides a kind of pressure bomb, comprise housing, power supply module in housing is set, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube be connected with housing, described power supply module respectively with microcontroller, signal processing module, pressure sensor be connected with temperature pick up and for power supply, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor, described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module, described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module, described signal processing module is used for described pressure signal and temperature signal to process.
Further, described pressure sensor is diaphragm pressure sensor.
Particularly, described diaphragm pressure sensor comprises basic unit, tack coat, cushioned material layer, electrode and insulating layer, on the upper surface that described tack coat is formed at basic unit and soffit, described cushioned material layer is wrapped in be had in the basic unit of tack coat, described electrode is drawn by cushioned material layer, described insulating layer be formed at cushioned material layer surface and cover be positioned at cushioned material layer surface electrode on.
Particularly, described basic unit is flexbile base, and the thickness of described Rou Xing basic unit is 10-1000 μm, and described Rou Xing basic unit is polyvinyl alcohol, dimethyl silicone polymer, PET, polyimides and poly one.
Particularly, described cushioned material layer is one or more the combination in natural rubber, butadiene rubber, butadiene-styrene rubber, neoprene, EP rubbers, polyurethane rubber and silicon rubber.
Further, described microcontroller comprises communication interface.
Further, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, and described AD conversion unit is used for the pressure signal after amplifying and temperature signal to be converted to data signal and by digital data transmission to described communication interface.
Particularly, described signal processing module is controlled by microcontroller.
Further, described pressure gauge also comprises display screen, and described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
Further, described display screen is LCD display or LED display.
Pressure bomb of the present invention, has following beneficial effect:
1, pressure bomb of the present invention is relatively simple for structure, certainty of measurement is high, compact, applied widely.
2, pressure sensor certainty of measurement of the present invention is very high, and volume is very little, easy to carry, novel structure.
3, pressure bomb of the present invention solves existing most of pressure gauge by minimum physical dimension and lost efficacy in long-time measurement and the phenomenon that makes missing measurement.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of pressure sensor of the present invention.
In figure: 1-basic unit, 2-tack coat, 3-cushioned material layer, 4-electrode, 5-insulating layer.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
Embodiment one:
The invention provides a kind of pressure bomb, comprise housing, power supply module in housing is set, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube be connected with housing, described power supply module respectively with microcontroller, signal processing module, pressure sensor be connected with temperature pick up and for power supply, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor, described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module, described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module, described signal processing module is used for described pressure signal and temperature signal to process.
Wherein, described pressure sensor is diaphragm pressure sensor, described diaphragm pressure sensor comprises flexbile base 1, tack coat 2, cushioned material layer 3, electrode 4 and electrode 5, on the upper surface that described tack coat 2 is formed at basic unit 1 and soffit, described cushioned material layer 3 is wrapped in be had in the basic unit 1 of tack coat 2, described electrode 4 by cushioned material layer 3 draw, described electrode 5 be formed at cushioned material layer 3 surface and cover be positioned at cushioned material layer 3 surface electrode 4 on.Described Rou Xing basic unit 1 for thickness be the polyvinyl alcohol of 10 μm, described cushioned material layer 3 is natural rubber.
Described microcontroller comprises communication interface, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, and described AD conversion unit is used for the pressure signal after amplifying and temperature signal to be converted to data signal and by digital data transmission to described communication interface; Described signal processing module is controlled by microcontroller.
Described pressure gauge also comprises LCD display, and described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
Embodiment two:
The invention provides a kind of pressure bomb, comprise housing, power supply module in housing is set, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube be connected with housing, described power supply module respectively with microcontroller, signal processing module, pressure sensor be connected with temperature pick up and for power supply, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor, described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module, described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module, described signal processing module is used for described pressure signal and temperature signal to process.
Wherein, described pressure sensor is diaphragm pressure sensor, described diaphragm pressure sensor comprises flexbile base 1, tack coat 2, cushioned material layer 3, electrode 4 and electrode 5, on the upper surface that described tack coat 2 is formed at basic unit 1 and soffit, described cushioned material layer 3 is wrapped in be had in the basic unit 1 of tack coat 2, described electrode 4 by cushioned material layer 3 draw, described electrode 5 be formed at cushioned material layer 3 surface and cover be positioned at cushioned material layer 3 surface electrode 4 on.Described Rou Xing basic unit 1 for thickness be the dimethyl silicone polymer of 1000 μm, described cushioned material layer 3 is the combination of butadiene rubber and butadiene-styrene rubber.
Described microcontroller comprises communication interface, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, described AD conversion unit is used for the pressure signal after by amplification and temperature signal is converted to data signal and by digital data transmission to described communication interface, described signal processing module is controlled by microcontroller.
Described pressure gauge also comprises LED display, and described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
Embodiment three:
The invention provides a kind of pressure bomb, comprise housing, power supply module in housing is set, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube be connected with housing, described power supply module respectively with microcontroller, signal processing module, pressure sensor be connected with temperature pick up and for power supply, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor, described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module, described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module, described signal processing module is used for described pressure signal and temperature signal to process.
Wherein, described pressure sensor is diaphragm pressure sensor, described diaphragm pressure sensor comprises flexbile base 1, tack coat 2, cushioned material layer 3, electrode 4 and electrode 5, on the upper surface that described tack coat 2 is formed at basic unit 1 and soffit, described cushioned material layer 3 is wrapped in be had in the basic unit 1 of tack coat 2, described electrode 4 by cushioned material layer 3 draw, described electrode 5 be formed at cushioned material layer 3 surface and cover be positioned at cushioned material layer 3 surface electrode 4 on.The thickness of described Rou Xing basic unit 1 is 200 μm, and described Rou Xing basic unit 1 is PET, and described cushioned material layer 3 is the combination of neoprene and EP rubbers.
Described microcontroller comprises communication interface, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, described AD conversion unit is used for the pressure signal after by amplification and temperature signal is converted to data signal and by digital data transmission to described communication interface, described signal processing module is controlled by microcontroller.
Described pressure gauge also comprises LCD display, and described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
Embodiment four:
The invention provides a kind of pressure bomb, comprise housing, power supply module in housing is set, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube be connected with housing, described power supply module respectively with microcontroller, signal processing module, pressure sensor be connected with temperature pick up and for power supply, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor, described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module, described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module, described signal processing module is used for described pressure signal and temperature signal to process.
Wherein, described pressure sensor is diaphragm pressure sensor, described diaphragm pressure sensor comprises flexbile base 1, tack coat 2, cushioned material layer 3, electrode 4 and electrode 5, on the upper surface that described tack coat 2 is formed at basic unit 1 and soffit, described cushioned material layer 3 is wrapped in be had in the basic unit 1 of tack coat 2, described electrode 4 by cushioned material layer 3 draw, described electrode 5 be formed at cushioned material layer 3 surface and cover be positioned at cushioned material layer 3 surface electrode 4 on.Described Rou Xing basic unit 1 for thickness be the polyimides of 600 μm, described cushioned material layer 3 is silicon rubber.
Described microcontroller comprises communication interface, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, described AD conversion unit is used for the pressure signal after by amplification and temperature signal is converted to data signal and by digital data transmission to described communication interface, described signal processing module is controlled by microcontroller.
Described pressure gauge also comprises LED display, and described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
Pressure bomb of the present invention, has following beneficial effect:
1, pressure bomb of the present invention is relatively simple for structure, certainty of measurement is high, compact, applied widely.
2, pressure sensor certainty of measurement of the present invention is very high, and volume is very little, easy to carry, novel structure.
3, pressure bomb of the present invention solves existing most of pressure gauge by minimum physical dimension and lost efficacy in long-time measurement and the phenomenon that makes missing measurement.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a pressure bomb, it is characterized in that, comprise housing, the power supply module arranged in housing, microcontroller, signal processing module, pressure sensor, temperature pick up and the feed tube that is connected with housing, described power supply module is connected with microcontroller, signal processing module, pressure sensor and temperature pick up and respectively for powering, described signal processing module one end is connected with microcontroller, the other end is connected with temperature pick up with pressure sensor
Described pressure sensor is for the pressure information that detects in feed tube and described pressure information is transferred to signal processing module; Described temperature pick up is used for temperature information under detecting shaft and described temperature information is transferred to signal processing module; Described signal processing module is used for described pressure signal and temperature signal to process.
2. pressure bomb according to claim 1, is characterized in that, described pressure sensor is diaphragm pressure sensor.
3. pressure bomb according to claim 2, it is characterized in that, described diaphragm pressure sensor comprises basic unit (1), tack coat (2), cushioned material layer (3), electrode (4) and electrode (5), on the upper surface that described tack coat (2) is formed at basic unit (1) and soffit, described cushioned material layer (3) be wrapped in there are tack coat (2) basic unit (1) on, described electrode (4) is drawn by cushioned material layer (3), described electrode (5) is formed at cushioned material layer (3) surface and covers and is positioned on the surperficial electrode (4) of cushioned material layer (3).
4. pressure bomb according to claim 3, it is characterized in that, described basic unit (1) is flexbile base (1), the thickness of described Rou Xing basic unit (1) is 10-1000 μm, and described Rou Xing basic unit (1) is polyvinyl alcohol, dimethyl silicone polymer, PET, polyimides and poly one.
5. the pressure bomb according to claim 3 or 4, it is characterized in that, described cushioned material layer (3) is natural rubber, one or more combination in butadiene rubber, butadiene-styrene rubber, neoprene, EP rubbers, polyurethane rubber and silicon rubber.
6. the pressure bomb according to claim 1-4 any one, is characterized in that, described microcontroller comprises communication interface.
7. pressure bomb according to claim 6, it is characterized in that, described signal processing module comprises signal amplification unit and AD conversion unit, described signal amplification unit is used for the pressure signal that pressure sensor and temperature pick up detected and temperature signal and carries out amplifying and the pressure signal after amplifying and temperature signal are transferred to AD conversion unit, and described AD conversion unit is used for the pressure signal after amplifying and temperature signal to be converted to data signal and by digital data transmission to described communication interface.
8. pressure bomb according to claim 7, is characterized in that, described signal processing module is controlled by microcontroller.
9. pressure bomb according to claim 8, it is characterized in that, described pressure gauge also comprises display screen, described display screen is connected with microcontroller, after described microcontroller receives the pressure signal after signal processing module process and temperature signal, by the display of the numerical value of temperature and pressure on a display screen.
10. pressure bomb according to claim 9, is characterized in that, described display screen is LCD display or LED display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069413.XA CN104727808A (en) | 2015-02-10 | 2015-02-10 | Down-hole pressure meter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069413.XA CN104727808A (en) | 2015-02-10 | 2015-02-10 | Down-hole pressure meter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104727808A true CN104727808A (en) | 2015-06-24 |
Family
ID=53452149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510069413.XA Pending CN104727808A (en) | 2015-02-10 | 2015-02-10 | Down-hole pressure meter |
Country Status (1)
| Country | Link |
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| CN (1) | CN104727808A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111119860A (en) * | 2019-12-23 | 2020-05-08 | 山东科技大学 | Pressure bar for sensing pressure distribution state in hole |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0911623A2 (en) * | 1997-10-20 | 1999-04-28 | Delco Electronics Corporation | High pressure sensor and method of forming |
| CN200943488Y (en) * | 2006-04-29 | 2007-09-05 | 北京华油先锋石油装备技术有限公司 | Storage type continuous metering downhole meter for pressure and temperature |
| CN201184192Y (en) * | 2008-03-25 | 2009-01-21 | 西安思坦仪器股份有限公司 | Storage type electronic monometer |
| CN201620882U (en) * | 2009-12-17 | 2010-11-03 | 西安思坦仪器股份有限公司 | Permanent pressure measurement system |
| CN102754232A (en) * | 2010-02-16 | 2012-10-24 | 日立电线株式会社 | Piezoelectric thin film element, and piezoelectric thin film device |
| CN202531160U (en) * | 2012-05-04 | 2012-11-14 | 西安安特石油科技有限公司 | Downhole intelligent storage type pressure gauge of oil-water well |
| CN103221795A (en) * | 2010-09-20 | 2013-07-24 | 快捷半导体公司 | Microelectromechanical pressure sensor including reference capacitor |
-
2015
- 2015-02-10 CN CN201510069413.XA patent/CN104727808A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0911623A2 (en) * | 1997-10-20 | 1999-04-28 | Delco Electronics Corporation | High pressure sensor and method of forming |
| CN200943488Y (en) * | 2006-04-29 | 2007-09-05 | 北京华油先锋石油装备技术有限公司 | Storage type continuous metering downhole meter for pressure and temperature |
| CN201184192Y (en) * | 2008-03-25 | 2009-01-21 | 西安思坦仪器股份有限公司 | Storage type electronic monometer |
| CN201620882U (en) * | 2009-12-17 | 2010-11-03 | 西安思坦仪器股份有限公司 | Permanent pressure measurement system |
| CN102754232A (en) * | 2010-02-16 | 2012-10-24 | 日立电线株式会社 | Piezoelectric thin film element, and piezoelectric thin film device |
| CN103221795A (en) * | 2010-09-20 | 2013-07-24 | 快捷半导体公司 | Microelectromechanical pressure sensor including reference capacitor |
| CN202531160U (en) * | 2012-05-04 | 2012-11-14 | 西安安特石油科技有限公司 | Downhole intelligent storage type pressure gauge of oil-water well |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111119860A (en) * | 2019-12-23 | 2020-05-08 | 山东科技大学 | Pressure bar for sensing pressure distribution state in hole |
| CN111119860B (en) * | 2019-12-23 | 2023-01-10 | 山东科技大学 | Pressure bar for sensing pressure distribution state in hole |
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Application publication date: 20150624 |