CN104723621B - Composite - Google Patents

Composite Download PDF

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Publication number
CN104723621B
CN104723621B CN201510142330.9A CN201510142330A CN104723621B CN 104723621 B CN104723621 B CN 104723621B CN 201510142330 A CN201510142330 A CN 201510142330A CN 104723621 B CN104723621 B CN 104723621B
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parts
layer
heat
described heat
heat transfer
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CN104723621A (en
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叶伟炳
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Dongguan Wenyu Industrial Co Ltd
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Dongguan Wenyu Industrial Co Ltd
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Priority to CN201610319114.1A priority Critical patent/CN105949753B/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • C22C21/16—Alloys based on aluminium with copper as the next major constituent with magnesium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/349—Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite

Abstract

A kind of composite, including: insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer, heat-conducting layer is attached on insulating barrier, and heat transfer layer is attached on heat-conducting layer, and heat dissipating layer is attached on heat transfer layer, and protective layer is attached on heat dissipating layer.Heat-conducting layer includes each component of following mass parts: Graphene 80 parts～95 parts, CNT 0.1 part～20 parts and carbon nano-fiber 0.1 part～20 parts.Heat dissipating layer includes each component of following mass parts: copper 47 parts～50 parts, 49 parts～52 parts of aluminum, 0.2 part～0.7 part of magnesium, ferrum 0.2 part～0.7 part, 0.2 part～0.5 part of manganese, titanium 0.1 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.1 part～0.3 part.Above-mentioned composite arranges insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer by being sequentially overlapped, it is possible to obtain good insulating, the coefficient of expansion are low, heat conductivity is big, the advantage of good heat dissipation effect and light weight.

Description

Composite
Technical field
The present invention relates to technical field of heat dissipation, particularly relate to a kind of composite.
Background technology
The fast development of LED industry, has pulled the development of upstream materials industry significantly, also further promotes the breakthrough in high end materials field.Wherein, LED lamp can be used substantial amounts of heat sink material, including the potted element of LED wafer, LED light lens, light-scattering component, high efficiency and heat radiation element, luminous reflectance and light diffusing board etc..
All the time, bad meeting of dispelling the heat causes the problems such as power supply damage, light decay quickening, reduced lifetime, is the most important thing of LED illumination System performance boost all the time.Traditional three kinds are for the material of LED radiator, including aluminium, plastics and pottery, three is respectively arranged with quality, but good insulating needed for still cannot simultaneously meeting LED radiator material, the coefficient of expansion is low, heat conductivity is big, the advantage of good heat dissipation effect, light weight and good mechanical property.
Such as, Chinese patent 201310313412.6 discloses a kind of magnesium alloy LED bulb Radiator in Die Casting part and manufacture method thereof, the concrete present invention that discloses provides a kind of magnesium alloy LED bulb Radiator in Die Casting part, this die casting composition % by weight is: Al1.7～2.5, Zn≤0.2, Mn >=0.2, Cu≤0.008, Fe≤0.004, Ni≤0.001, other impurity sum 0.01, Mg surpluses of Si≤0.05.The manufacture method of a kind of magnesium alloy LED bulb Radiator in Die Casting part is provided simultaneously.The effect of the present invention is by using the magnesium alloy of this kind of composition to manufacture LED bulb radiator, LED illumination bulb is made to have good heat dispersion, weight substantially alleviates, technique is simple, dimensional accuracy is high, being shown by thermal diffusivity result of the test, under same test conditions, this magnesium alloy junction temperature compared with AZ31 magnesium alloy have dropped 1～2 DEG C, being equivalent to LED life and extend 4～16%, luminous flux attenuation slows down 1%～2%.Reduce the manufacturing cost of LED light device and the use cost of user.But, still there is poor insulativity in the material of above-mentioned patent disclosure, not easily crosses the defect of safety and heavier mass.
And for example, Chinese patent 201110043870.3 discloses a kind of heat-conducting thermosetting molding composite material and application thereof, specifically openly the invention discloses a kind of heat-conducting thermosetting molding composite material and application thereof, its base stock and weight percentage thereof are (1) thermoset substrate resin 15-65%；(2) conducting filler 20-80%, the heat conductivity of this filler is more than 1W/m. DEG C；(3) other additives, such as toughener, reinforcing agent, stabilizer etc..The invention also discloses aforementioned heat-conducting thermosetting molding composite material for preparing LED illumination radiating piece, its forming temperature can control to lower than generally carrying out 220 DEG C of scolding tin operation, the packaging technology making LED and radiator can unite two into one with the moulding process of thermosets radiator, the real estate of LED or heat-conducting metal support directly can be connected with Heat Conduction Material, its mould and its aid system have can effectively heat insulation and controlling temperature and feature easy to clean, can effectively reduce the processing of LED and make cost, improve the heat-sinking capability of LED radiator, thus reducing the running temperature of LED component.But, still there is the defect that heat conductivity is less and the coefficient of expansion is high in the material of above-mentioned patent disclosure.
And for example, Chinese patent 03126663.0 discloses a kind of modified model 6063 aluminum alloy materials, specifically openly the invention discloses a kind of modified model 6063 aluminum alloy materials, this material is to be added with mixed rare-earth elements La and the Ce that weight percentage is 0.11～0.2% in former 6063 aluminium alloys, and wherein the addition of rare-earth elements La is 0.036～0.14%.Rare earth element application result in aluminium alloy shows, aluminium alloy adds appropriate rare earth and can improve machinery, physics and processing performance, show as purification, strengthening and refinement, at the radiator of quasiconductor and air conditioner and condenser/evaporator device use material of the present invention making, there are good extrudability and electrical and thermal conductivity performance.But, still there is poor insulativity in the material of above-mentioned patent disclosure, not easily crosses safety, the not ideal enough defect with heavier mass of heat dispersion.
Summary of the invention
Based on this, it is necessary to provide that a kind of good insulating, the coefficient of expansion are low, heat conductivity is big, the composite of good heat dissipation effect and light weight.
A kind of composite, including: insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer,
Described heat-conducting layer is attached on described insulating barrier, and described heat transfer layer is attached on described heat-conducting layer, and described heat dissipating layer is attached on described heat transfer layer, and described protective layer is attached on described heat dissipating layer；
Described insulating barrier includes each component of following mass parts: carborundum 40 parts～70 parts, aluminium sesquioxide 13 parts～55 parts, silicon dioxide 2 parts～15 parts, binding agent 3 parts～25 parts, Kaolin 2 parts～20 parts, magnesium oxide 0.5 part～2 parts, 0.5 part～2 parts of Xinyang soil, light weight calcium 0.5 part～2 parts and rare earth oxide 0.2 part～0.5 part；
Described heat-conducting layer includes each component of following mass parts: Graphene 80 parts～95 parts, CNT 0.1 part～20 parts and carbon nano-fiber 0.1 part～20 parts；
Described heat transfer layer includes each component of following mass parts: copper 93 parts～97 parts, 2 parts～4.5 parts of aluminum, 0.1 part～0.3 part of nickel, vanadium 0.2 part～1.2 parts, 0.1 part～0.4 part of manganese, titanium 0.1 part～0.3 part, chromium 0.1 part～0.3 part and niobium 0.1 part～0.3 part；
Described heat dissipating layer includes each component of following mass parts: copper 47 parts～50 parts, 49 parts～52 parts of aluminum, 0.2 part～0.7 part of magnesium, ferrum 0.2 part～0.7 part, 0.2 part～0.5 part of manganese, titanium 0.1 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.1 part～0.3 part.
Wherein in an embodiment, described heat-conducting layer includes each component of following mass parts: Graphene 85 parts～90 parts, CNT 5 parts～15 parts and carbon nano-fiber 5 parts～15 parts.
Wherein in an embodiment, Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.
Wherein in an embodiment, described insulating barrier includes each component of following mass parts: carborundum 50 parts～60 parts, aluminium sesquioxide 30 parts～50 parts, silica 10 part～15 parts, binding agent 10 parts～20 parts, Kaolin 15 parts～20 parts, magnesium oxide 1 part～1.5 parts, 1 part～1.5 parts of Xinyang soil, light weight calcium 1 part～1.5 parts and rare earth oxide 0.3 part～0.4 part.
Wherein in an embodiment, described insulating barrier includes each component of following mass parts: carborundum 55 parts, aluminium sesquioxide 40 parts, silica 13 parts, binding agent 15 parts, Kaolin 18 parts, magnesium oxide 1.5 parts, 1.5 parts of Xinyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.
Wherein in an embodiment, described heat dissipating layer includes each component of following mass parts: copper 48 parts～49 parts, 50 parts～52 parts of aluminum, 0.2 part～0.5 part of magnesium, ferrum 0.2 part～0.5 part, 0.3 part～0.5 part of manganese, titanium 0.2 part～0.3 part, chromium 0.05 part～0.08 part and vanadium 0.2 part～0.3 part.
Wherein in an embodiment, described heat dissipating layer includes each component of following mass parts: copper 48 parts, 51 parts of aluminum, 0.3 part of magnesium, ferrum 0.3 part, 0.4 part of manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.
Wherein in an embodiment, described heat transfer layer includes each component of following mass parts: copper 94 parts～96 parts, 3 parts～4 parts of aluminum, 0.2 part～0.3 part of nickel, vanadium 0.5 part～1 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
Wherein in an embodiment, described heat transfer layer includes each component of following mass parts: copper 95 parts, 3.5 parts of aluminum, 0.3 part of nickel, vanadium 0.8 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
Wherein in an embodiment, the thickness ratio of described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer is 1～1.5:8～12:5～7:6～10:2～2.5.
Above-mentioned composite arranges insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer by being sequentially overlapped, it is possible to obtain good insulating, the coefficient of expansion are low, heat conductivity is big, the advantage of good heat dissipation effect and light weight.
Accompanying drawing explanation
Fig. 1 is the structural representation of the composite of an embodiment of the present invention；
Fig. 2 is the partial structurtes schematic diagram of the composite of another embodiment of the present invention；
Fig. 3 is the partial structurtes schematic diagram of the composite of another embodiment of the present invention；
Fig. 4 is the structural representation of the composite of another embodiment of the present invention；
Fig. 5 is the structural representation of the LED lamp of an embodiment of the present invention.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Elaborate a lot of detail in the following description so that fully understanding the present invention.But the present invention can implement being much different from alternate manner described here, and those skilled in the art can do similar improvement when without prejudice to intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Such as; the composite of an embodiment of the present invention; including: insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer; described heat-conducting layer is attached on described insulating barrier; described heat transfer layer is attached on described heat-conducting layer; described heat dissipating layer is attached on described heat transfer layer, and described protective layer is attached on described heat dissipating layer；Described insulating barrier includes each component of following mass parts: carborundum 40 parts～70 parts, aluminium sesquioxide 13 parts～55 parts, silicon dioxide 2 parts～15 parts, binding agent 3 parts～25 parts, Kaolin 2 parts～20 parts, magnesium oxide 0.5 part～2 parts, 0.5 part～2 parts of Xinyang soil, light weight calcium 0.5 part～2 parts and rare earth oxide 0.2 part～0.5 part；Described heat-conducting layer includes each component of following mass parts: Graphene 80 parts～95 parts, CNT 0.1 part～20 parts and carbon nano-fiber 0.1 part～20 parts；Described heat transfer layer includes each component of following mass parts: copper 93 parts～97 parts, 2 parts～4.5 parts of aluminum, 0.1 part～0.3 part of nickel, vanadium 0.2 part～1.2 parts, 0.1 part～0.4 part of manganese, titanium 0.1 part～0.3 part, chromium 0.1 part～0.3 part and niobium 0.1 part～0.3 part；Described heat dissipating layer includes each component of following mass parts: copper 47 parts～50 parts, 49 parts～52 parts of aluminum, 0.2 part～0.7 part of magnesium, ferrum 0.2 part～0.7 part, 0.2 part～0.5 part of manganese, titanium 0.1 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.1 part～0.3 part.
Referring to Fig. 1, it is the structural representation of composite 10 of an embodiment of the present invention.
Composite 10 includes: be sequentially overlapped the insulating barrier 100 of setting, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and protective layer 500; namely insulating barrier 100, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and protective layer 500 are sequentially overlapped attaching; that is; heat-conducting layer 200 is attached on insulating barrier 100; heat transfer layer 300 is attached on heat-conducting layer 200; heat dissipating layer 400 is attached on heat transfer layer 300, and protective layer 500 is attached on heat dissipating layer 400.
It should be noted that, described insulating barrier directly contacts with pyrotoxin, such as, described insulating barrier contacts with LED, namely LED is directly installed on described insulating barrier, and for example, described insulating barrier contacts with the substrate of mounted LED lamp, and for example, LED is positioned at the cavity that described insulating barrier surrounds, to guarantee that the heat that LED luminescence produces can be transferred directly to described insulating barrier, certainly, position and the structural relation of LED and described insulating barrier are not limited to above-mentioned situation, position and the structural relation of the described insulating barrier in the embodiment of the present invention and LED can also adopt other embodiments with same effect well known to those skilled in the art, do not repeat them here.
Such as, an embodiment of the present invention insulating barrier, it is good that it has insulation effect, the advantage that heat conductivity is big and thermal coefficient of expansion is low, so, when the heat of LED is directly delivered to described insulating barrier, described insulating barrier can quickly and in time lead away the heat that LED near zone is assembled, to guarantee the normal operation of LED.Secondly, closest due between described insulating barrier and LED, the heat conduction load that it undertakes is maximum, when the thermal coefficient of expansion of described insulating barrier is low, just can avoid generation gap between described insulating barrier and described heat-conducting layer, with avoid described insulating barrier self to produce gap, and then the problem that the heat conductivity produced after this gap and gap filling air reduces can be avoided.Finally, due to closest between described insulating barrier and LED, it is easy to there is the problem that electric elements directly contact with described insulating barrier, when the insulation effect of described insulating barrier is good, insulating barrier just can be avoided to be energized, thus improve the security performance of described composite, safety standard is higher.
Such as, the insulating barrier of an embodiment of the present invention, it includes each component of following mass parts: carborundum 40 parts～70 parts, aluminium sesquioxide 13 parts～55 parts, silicon dioxide 2 parts～15 parts, binding agent 3 parts～25 parts, Kaolin 2 parts～20 parts, magnesium oxide 0.5 part～2 parts, 0.5 part～2 parts of Xinyang soil, light weight calcium 0.5 part～2 parts and rare earth oxide 0.2 part～0.5 part.
Above-mentioned insulating barrier utilizes carborundum as primary raw material, and mix remaining raw material that may be used for preparation pottery, so that above-mentioned insulating barrier has been provided simultaneously with, heat conductivity height, good insulation preformance, thermal coefficient of expansion be low and the good advantage of heat resistance, additionally, above-mentioned insulating barrier also has is readily produced the advantage manufactured with low cost of manufacture.
Preferably, the insulating barrier of an embodiment of the present invention includes each component of following mass parts: carborundum 50 parts～60 parts, aluminium sesquioxide 30 parts～50 parts, silica 10 part～15 parts, binding agent 10 parts～20 parts, Kaolin 15 parts～20 parts, magnesium oxide 1 part～1.5 parts, 1 part～1.5 parts of Xinyang soil, light weight calcium 1 part～1.5 parts and rare earth oxide 0.3 part～0.4 part.
Preferably, the insulating barrier of an embodiment of the present invention includes each component of following mass parts: carborundum 55 parts, aluminium sesquioxide 40 parts, silica 13 parts, binding agent 15 parts, Kaolin 18 parts, magnesium oxide 1.5 parts, 1.5 parts of Xinyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.
Such as, the preparation method that the present invention also provides for the described insulating barrier of a kind of any of the above-described embodiment, it comprises the steps: carborundum, aluminium sesquioxide by said ratio, silicon dioxide, binding agent, Kaolin, magnesium oxide, Xinyang soil, light weight calcium and rare earth oxide mixing；Above-mentioned insulating barrier is obtained after plasticizing, extrusion forming, cooling and the demoulding.
It should be noted that, because above-mentioned heat-conducting layer is directly fitted with described insulating barrier, the heat absorbed from LED can be directly passed to described heat-conducting layer by so described insulating barrier, this just requires that described heat-conducting layer has high heat conductivity, can the heat that absorb from described insulating barrier be delivered to rapidly on described heat-conducting layer, additionally, also require that described heat-conducting layer has good heat dispersion and relatively low thermal coefficient of expansion simultaneously.
Such as, the heat-conducting layer of an embodiment of the present invention, it has heat conductivity height, the advantage of perfect heat-dissipating and good mechanical property, so, when the heat absorbed from LED is directly passed to described heat-conducting layer by described insulating barrier, the heat that so described insulating barrier absorbs just can be delivered to rapidly on described heat-conducting layer, and in the process of heat conduction, based on the heat dispersion that described heat-conducting layer is excellent, it is also possible to by the heat loss on described heat-conducting layer to extraneous air.Secondly as described heat-conducting layer is also in the distance with LED relative close, the temperature of itself also can be higher, but, based on the thermal coefficient of expansion that described heat-conducting layer is relatively low, it is possible to avoid generation gap between described heat-conducting layer and described heat transfer layer, it is ensured that the compactness of both laminatings.
Such as, the heat-conducting layer of an embodiment of the present invention, it includes each component of following mass parts: Graphene 80 parts～95 parts, CNT 0.1 part～20 parts and carbon nano-fiber 0.1 part～20 parts.
Above-mentioned heat-conducting layer is primary raw material by adopting Graphene so that its heat conductivity is greatly improved, and heat-conducting effect is preferably.Additionally, again through adding CNT and carbon fiber, it is possible to forming heat dissipation channel, heat dispersion is also preferably.
It is emphasized that at this, owing to above-mentioned heat-conducting layer have employed the Graphene good material of this conductive effect, therefore, the present invention is by described conductive layer and the laminating of described insulating barrier, to isolate the component within LED lamp, thus avoiding described heat-conducting layer directly charged, and then improve the security performance of described composite, safety standard is higher.
Preferably, heat-conducting layer includes each component of following mass parts: Graphene 85 parts～90 parts, CNT 5 parts～15 parts and carbon nano-fiber 5 parts～15 parts.
Preferably, heat-conducting layer includes each component of following mass parts: Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.
It should be noted that the heat produced because of LED luminescence is through front two-layer, namely after described insulating barrier and described heat-conducting layer, understand the heat loss of some in extraneous air.In addition, relatively costly due to described heat-conducting layer, it main reason is that, the primary raw material of described heat-conducting layer is the Graphene that preparation cost is higher, therefore, based on described heat transfer layer heat transfer and heat radiation burden relatively small when, described heat transfer layer can use the heat dissipation metal material that current market is the most frequently used, with reduce cost and obtain better heat transfer property effect.
Such as, the heat transfer layer of an embodiment of the present invention, it has heat conductivity height, perfect heat-dissipating, good mechanical property and lower-cost advantage, so, when the heat of described heat-conducting layer passes to described heat transfer layer, then the heat that described heat-conducting layer absorbs just can relatively rapidly be delivered on described heat transfer layer, and in the process of heat transfer, the heat of part can also be directly delivered in the air in the external world by described heat transfer layer.
Such as, the heat transfer layer of an embodiment of the present invention, it includes each component of following mass parts: copper 93 parts～97 parts, 2 parts～4.5 parts of aluminum, 0.1 part～0.3 part of nickel, vanadium 0.2 part～1.2 parts, 0.1 part～0.4 part of manganese, titanium 0.1 part～0.3 part, chromium 0.1 part～0.3 part and niobium 0.1 part～0.3 part.
Above-mentioned heat transfer layer contains copper (Cu) can make the heat conductivility of heat transfer layer be maintained at a high level of comparison.When the mass parts of copper is 93 parts～97 parts, the coefficient of heat conduction of described heat transfer layer can reach more than 380W/mK, can pass by the heat being transmitted on described heat-conducting layer more quickly, and then it is evenly dispersed in the structure that described heat transfer layer is overall, to prevent from heat contact position between described heat-conducting layer and described heat transfer layer accumulates, cause the generation of hot-spot phenomenon.And, the density of described heat transfer layer but only has 8.0kg/m3～8.1kg/m3, it is far smaller than the density of fine copper, so can effectively alleviate the weight of described heat transfer layer, be more conducive to manufacture is installed, also greatly reduce cost simultaneously.Additionally, described heat transfer layer contain the aluminum that mass parts is 2 parts～4.5 parts, the nickel of 0.1 part～0.3 part, the vanadium of 0.2 part～1.2 parts, the manganese of 0.1 part～0.4 part, the titanium of 0.1 part～0.3 part, the chromium of 0.1 part～0.3 part and the vanadium of niobium 0.1 part～0.3 part.Relative to fine copper, the ductility of heat transfer layer, toughness, intensity and resistance to elevated temperatures all improve significantly, and not easy-sintering.
In order to make described heat transfer layer have performance better, for instance, described heat transfer layer contains the nickel (Ni) that mass parts is 0.1 part～0.3 part, it is possible to improve the resistance to elevated temperatures of heat transfer layer.And for example, heat transfer layer contains the vanadium (V) that mass parts is 0.2 part～1.2 parts can suppress heat transfer layer grain growth, it is thus achieved that more uniform tiny grain structure, to reduce the fragility of described heat transfer layer, improve the mechanical property that described heat transfer layer is overall, to improve toughness and intensity.And for example, described heat transfer layer contains the titanium (Ti) that mass parts is 0.1 part～0.3 part, it is possible to make the crystal grain miniaturization of described heat transfer layer, to improve the ductility of described heat transfer layer；And for example, described heat transfer layer also includes the silicon (Si) that mass parts is 1 part～2.5 parts, when described heat transfer layer contains appropriate silicon, it is possible under the premise not affecting described heat transfer layer heat conductivility, effectively promotes hardness and the abrasion resistance of described heat transfer layer.But, find through repeatedly theory analysis and experiment evidence, when in heat transfer layer, the quality of silicon is too many, for instance when mass percent is more than more than 15 parts, the appearance distribution black particles of heat transfer layer can be made, and ductility reduces, and is unfavorable for the production molding of described heat transfer layer.
Preferably, described heat transfer layer includes each component of following mass parts: copper 94 parts～96 parts, 3 parts～4 parts of aluminum, 0.2 part～0.3 part of nickel, vanadium 0.5 part～1 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
Preferably, described heat transfer layer includes each component of following mass parts: copper 95 parts, 3.5 parts of aluminum, 0.3 part of nickel, vanadium 0.8 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
It should be noted that, when the heat of LED generation is through three first layers, i.e. respectively described insulating barrier, after described heat-conducting layer and described heat transfer layer, have relatively large a part of heat to be dissipated in transmission in air dielectric, in addition, owing to the primary raw material of described heat transfer layer is copper, its heavier mass, therefore, when bearing relatively small based on the heat radiation of described heat dissipating layer, described heat dissipating layer can use radiating effect preferably, lighter in weight, lower-cost material, to reduce cost and weight, and obtain the effect of better heat dispersion.
Such as, the heat dissipating layer of an embodiment of the present invention, it has radiating effect preferably, lighter in weight and lower-cost advantage, so, when the heat of described heat transfer layer transmits described heat dissipating layer, so described heat dissipating layer can by the heat loss of the overwhelming majority in air dielectric, to coordinate described insulating barrier, described heat-conducting layer and described heat transfer layer complete the effect of gradient heat transfer, so, can for different heat regions, namely measure with the distance with LED distance, the gradient transmission realizing heat and the effect scattered and disappeared, solve traditional heat sinks insulated with material poor, cost is high, quality weight, the problem of heat conduction and radiating effect difference.
Such as, the heat dissipating layer of an embodiment of the present invention, it includes each component of following mass parts: copper 47 parts～50 parts, 49 parts～52 parts of aluminum, 0.2 part～0.7 part of magnesium, ferrum 0.2 part～0.7 part, 0.2 part～0.5 part of manganese, titanium 0.1 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.1 part～0.3 part.
Above-mentioned heat dissipating layer contains the aluminum of copper that mass parts is 47 parts～50 parts and 49 parts～52 parts, can so that the coefficient of heat conduction of described heat dissipating layer be maintained at 300W/mK～350W/mK, to ensure that the heat passed over by described heat transfer layer can be dissipated in air dielectric by described heat dissipating layer rapidly, and then prevent heat from piling up on described heat dissipating layer, cause hot-spot phenomenon to produce.Relative to prior art, merely adopting price costly and copper that quality is bigger, above-mentioned heat dissipating layer had both had good heat dissipation effect, can have again lighter weight rapidly by heat loss to air, is easily installed casting, advantage that price is less expensive.Meanwhile, relative to prior art, merely adopting the aluminium alloy that radiating effect is poor, above-mentioned heat dissipating layer has heat transfer property more preferably.In addition, heat dissipating layer contain the magnesium that mass parts is 0.2 part～0.7 part, the ferrum of 0.2 part～0.7 part, the manganese of 0.2 part～0.5 part, the titanium of 0.1 part～0.3 part, the chromium of 0.05 part～0.1 part and 0.1 part～0.3 vanadium, improve the yield strength of heat dissipating layer, tensile strength and resistance to elevated temperatures.Such as, finding through many experiments evidence and theory analysis, heat dissipating layer contains the magnesium that mass parts is 0.2 part～0.7 part, it is possible to give heat dissipating layer yield strength and tensile strength to a certain extent.
Preferably, described heat dissipating layer includes each component of following mass parts: copper 48 parts～49 parts, 50 parts～52 parts of aluminum, 0.2 part～0.5 part of magnesium, ferrum 0.2 part～0.5 part, 0.3 part～0.5 part of manganese, titanium 0.2 part～0.3 part, chromium 0.05 part～0.08 part and vanadium 0.2 part～0.3 part.
Preferably, described heat dissipating layer includes each component of following mass parts: copper 48 parts, 51 parts of aluminum, 0.3 part of magnesium, ferrum 0.3 part, 0.4 part of manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.
In order to alleviate the weight of described heat dissipating layer further, and obtain good radiating effect, for instance, the present invention also provides for an auxiliary heat dissipation layer, and described auxiliary heat dissipation layer is arranged at described heat dissipating layer away from described heat transfer layer one side.
Such as, the auxiliary heat dissipation layer of an embodiment of the present invention, it includes each component of following mass parts: 88 parts～93 parts of aluminum, silicon 5.5 parts～10.5 parts, 0.3 part～0.7 part of magnesium, copper 0.05 part～0.3 part, ferrum 0.2 part～0.8 part, 0.2 part～0.5 part of manganese, titanium 0.05 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.05 part～0.3 part.
Above-mentioned auxiliary heat dissipation layer contains the aluminum that mass parts is 88 parts～93 parts, it is possible to making the coefficient of heat conduction of auxiliary heat dissipation layer be maintained at 200W/mK～220W/mK, radiating effect is preferably, the needs being delivered in air dielectric by after-heat can be met, meanwhile, its quality is lighter, is more conducive to transport.In addition, auxiliary heat dissipation layer contains the vanadium of the silicon that mass parts is 5.5 parts～10.5 parts, the magnesium of 0.3 part～0.7 part, the copper of 0.05 part～0.3 part, the ferrum of 0.2 part～0.8 part, the manganese of 0.2 part～0.5 part, the titanium of 0.05 part～0.3 part, the chromium of 0.05 part～0.1 part and 0.05 part～0.3 part, it is possible to significantly improve the heat dispersion of auxiliary heat dissipation layer.Such as, auxiliary heat dissipation layer contains the copper of silicon that mass parts is 5.5 parts～10.5 parts and 0.05 part～0.3 part, it can be ensured that auxiliary heat dissipation layer has the advantage of good mechanical properties and lighter weight, at the same time it can also be improve the heat dispersion of auxiliary heat dissipation layer further.And for example, auxiliary heat dissipation layer also includes the lead (Pb) that mass parts is 0.3 part～0.6 part, the lead containing 0.3 part～0.6 part when auxiliary heat dissipation layer can improve the tensile strength of auxiliary heat dissipation layer, so, be possible to prevent when auxiliary heat dissipation layer is cast strike out lamellar or membranaceous structure time, be subject to excessive punching press and pull stress and rupture.And for example, auxiliary heat dissipation layer also includes the niobium (Nb) that mass parts is 0.02 part～0.04 part, when the mass parts of niobium is more than 0.02 part, the antioxygenic property of auxiliary heat dissipation layer can be greatly enhanced, but, when the mass parts of niobium is more than 0.04 part, can cause that the magnetic of auxiliary heat dissipation layer sharply increases, the miscellaneous part in LED lamp can be produced impact.And for example, auxiliary heat dissipation layer also includes the germanium (Ge) that mass parts is 0.02 part～0.03 part, when the mass parts of germanium is more than 0.02 part, the raising of the heat dispersion of auxiliary heat dissipation layer can be played beyond thought effect, but, when the quality accounting of germanium is too much, for instance when the mass parts of germanium is more than 2 parts, the brittleness of auxiliary heat dissipation layer can be made again to increase.
It should be noted that because the heat of LED luminescence generation is through first four layers, namely after described insulating barrier, described heat-conducting layer, described heat transfer layer and described heat dissipating layer, greatly the heat of a part has been lost in the air in the external world.Therefore; heat radiation based on described protective layer is born relatively small; and self-temperature relatively low when; when the impact of the bigger generation of thermal coefficient of expansion is minimum; described heat transfer layer can use the plastic material that current market is the most frequently used; to reduce cost and weight, and obtain better surface protection performance.
Such as; the protective layer of an embodiment of the present invention; it is good that it has surface protection performance; lighter in weight, less costly advantage; so, when described protective layer is positioned at the outermost layer of described composite, it is possible to there is good heat dispersion; good surface protection performance, lighter weight and relatively low cost.
Such as; the protective layer of an embodiment of the present invention; it includes each component of following mass parts: described protective layer includes each component of following mass parts: 20 parts～40 parts of graphite; 20 parts～30 parts of carbon fiber, polyamide 40 parts～60 parts, water-soluble silicate 10 parts～20 parts; hexagonal boron nitride 1 part～8 parts; BMI 2 parts～5 parts, silane coupler 0.5 part～2 parts, 0.25 part～1 part of antioxidant.
When above-mentioned water-soluble silicate mixes with graphite and carbon fiber, with being copolymerized of polyamide, heat dissipation channel can be formed under the high temperature conditions, thus improving heat dispersion, and the structure of more fluffy sky, quality is lighter.Additionally, due to the addition of carbon fiber, its surface protection performance and mechanical performance are better, for instance, more antioxidation, more resistant to soda acid, more resistant to corrosion.
Preferably; described protective layer includes each component of following mass parts: 30 parts～35 parts of graphite; 25 parts～30 parts of carbon fiber; polyamide 45 parts～50 parts; water-soluble silicate 15 parts～20 parts, hexagonal boron nitride 4 parts～6 parts, BMI 3 parts～4 parts; silane coupler 1 part～1.5 parts, 0.5 part～1 part of antioxidant.
Preferably, described protective layer includes each component of following mass parts: 35 parts of graphite, 28 parts of carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, BMI 3.5 parts, silane coupler 1.8 parts, 0.7 part of antioxidant.
In order to make described insulating barrier better, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer heat conduction and sinking path more optimize, therefore, considering cost, weight, heat conduction and radiating effect, and when surface protection performance, the described heat-conducting layer of an embodiment of the present invention, described heat transfer layer, described heat dissipating layer and described protective layer thickness ratio are 1～1.5:8～12:5～7:6～10:2～2.5, so, can so that described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer heat conduction and sinking path more optimize.
So that each Rotating fields of described composite, i.e. described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer are fixed together better, to improve Stability Analysis of Structures performance, such as, as shown in Figure 2, described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer be provided with inserted tooth 110 and caulking groove 120 between two between adjacent interfaces, when adjacent two layers structure is fitted, inserted tooth 110 is embedded in caulking groove 120, so can so that each Rotating fields of described composite, i.e. described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer are fixed together better, to improve Stability Analysis of Structures performance.And for example; as shown in Figure 3; described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer be provided with buckle 210 and draw-in groove 220 between two between adjacent interfaces; when adjacent two layers structure is fitted; buckle 210 is embedded in draw-in groove 220; so can so that each Rotating fields of described composite, namely described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer are fixed together better, to improve Stability Analysis of Structures performance further.
In order to further such that described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer are fixed together, to improve structural stability further, and reduce the impact on described composite heat conduction and heat transfer property.
Such as; refer to Fig. 4; first filling adhesive layer 600 is set between insulating barrier 100 and heat-conducting layer 200; second filling adhesive layer 700 is set between heat-conducting layer 200 and heat transfer layer 300; it is provided with the 3rd filling adhesive layer 800 between heat transfer layer 300 and heat dissipating layer 400, the 4th filling adhesive layer 900 is set between heat dissipating layer 400 and protective layer 500.It is appreciated that; insulating barrier 100, heat-conducting layer 200, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and protective layer 500 also exist that structure is small and a fairly large number of gap between two between adjacent interfaces; its reason essentially consists in; binding face defective tightness due to above layers material; and these gaps can be filled preferably by arranging first filling adhesive layer the 600, second filling adhesive layer the 700, the 3rd filling adhesive layer 800 and the 4th filling adhesive layer 900, also function to the effect of bonding simultaneously.
Such as, described the first of an embodiment of the present invention fills adhesive layer, it includes each component of following mass parts: nano alumina particles 300 parts～1000 parts, methyl vinyl silicone rubber 5 parts～30 parts, vinyl silicone oil 10 parts～50 parts, dimethicone 10 parts～100 parts and MQ silicones 1 part～20 parts.
Preferably, described first fills adhesive layer includes each component of following mass parts: nano alumina particles 800 parts～1000 parts, methyl vinyl silicone rubber 20 parts～30 parts, vinyl silicone oil 40 parts～50 parts, dimethicone 80 parts～100 parts and MQ silicones 15 parts～20 parts.
Preferably, described first filling adhesive layer includes each component of following mass parts: nano alumina particles 900 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 45 parts, dimethicone 85 parts and MQ silicones 20 parts.
Such as, described the second of an embodiment of the present invention fills adhesive layer, it includes each component of following mass parts: nano alumina particles 200 parts～800 parts, methyl vinyl silicone rubber 10 parts～40 parts, vinyl silicone oil 10 parts～50 parts, dimethicone 10 parts～100 parts and MQ silicones 1 part～20 parts；
Preferably, described second fills adhesive layer includes each component of following mass parts: nano alumina particles 500 parts～700 parts, methyl vinyl silicone rubber 20 parts～30 parts, vinyl silicone oil 30 parts～40 parts, dimethicone 50 parts～80 parts and MQ silicones 10 parts～15 parts.
Preferably, described second filling adhesive layer includes each component of following mass parts: nano alumina particles 600 parts, methyl vinyl silicone rubber 15 parts, vinyl silicone oil 35 parts, dimethicone 65 parts and MQ silicones 15 parts.
Such as, the described 3rd of an embodiment of the present invention fills adhesive layer, it includes each component of following mass parts: nano alumina particles 200 parts～700 parts, methyl vinyl silicone rubber 10 parts～40 parts, vinyl silicone oil 10 parts～50 parts, dimethicone 10 parts～100 parts and MQ silicones 1 part～20 parts.
Preferably, described 3rd fills adhesive layer includes each component of following mass parts: nano alumina particles 200 parts～600 parts, methyl vinyl silicone rubber 20 parts～40 parts, vinyl silicone oil 20 parts～50 parts, dimethicone 30 parts～100 parts and MQ silicones 5 parts～10 parts.
Preferably, described 3rd filling adhesive layer includes each component of following mass parts: nano alumina particles 500 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 25 parts, dimethicone 30 parts and MQ silicones 8 parts.
Such as, the described 4th of an embodiment of the present invention fills adhesive layer, it includes each component of following mass parts: nano alumina particles 150 parts～700 parts, methyl vinyl silicone rubber 15 parts～45 parts, vinyl silicone oil 10 parts～50 parts, dimethicone 10 parts～100 parts and MQ silicones 1 part～20 parts.
Preferably, described 4th fills adhesive layer includes each component of following mass parts: nano alumina particles 150 parts～450 parts, methyl vinyl silicone rubber 15 parts～25 parts, vinyl silicone oil 10 parts～25 parts, dimethicone 80 parts～100 parts and MQ silicones 1 part～10 parts.
Preferably, described 4th filling adhesive layer includes each component of following mass parts: nano alumina particles 250 parts, methyl vinyl silicone rubber 18 parts, vinyl silicone oil 20 parts, dimethicone 95 parts and MQ silicones 5 parts.
Above-mentioned first fills adhesive layer 600, second fills adhesive layer the 700, the 3rd filling adhesive layer 800 and the 4th filling adhesive layer 900 all with organic siliconresin for matrix material, and adds the nano alumina particles with better heat-conducting effect.By at organic silicon resin-based internal addition conduction powder nano aluminium oxide; such that it is able to it is stronger to prepare bonding force; heat conductivity height fills jointing material; and then described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer can be made better to be fixed together, to improve structural stability further.
Require emphasis time; first fills the content of nano alumina particles in adhesive layer the 600, second filling adhesive layer the 700, the 3rd filling adhesive layer 800 and the 4th filling adhesive layer 900 successively decreases successively; being because heat load is also successively decrease successively from insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer to described protective layer; as such, it is possible to get the effect of gradient heat conduction and heat radiation better.
Described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer is held in order to viscous better; avoid increasing excessive thickness simultaneously; and reduce the impact on heat conduction and heat dispersion; such as; the described first thickness ratio filling adhesive layer, described second filling adhesive layer, described 3rd filling adhesive layer and the 4th filling adhesive layer is 1～1.5:2～2.5:3～3.5:4～4.5; and for example, described first the thickness of adhesive layer and described insulating barrier ratio is filled for 1:50～80.
Above-mentioned composite 10 arranges insulating barrier 100, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and protective layer 500 by being sequentially overlapped, it is possible to obtain good insulating, the coefficient of expansion are low, heat conductivity is big, the advantage of good heat dissipation effect and light weight.
One example is, the present invention also provides for a kind of LED lamp, and it includes the described composite of described any embodiment.
Such as, referring to Fig. 5, LED lamp 20 includes composite 10 and LED 30, and LED 30 is arranged on insulating barrier 100, and composite 10 is set to columnar structured.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a composite, it is characterised in that including: insulating barrier, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer,
Described heat-conducting layer is attached on described insulating barrier, and described heat transfer layer is attached on described heat-conducting layer, and described heat dissipating layer is attached on described heat transfer layer, and described protective layer is attached on described heat dissipating layer；
Described insulating barrier includes each component of following mass parts: carborundum 40 parts～70 parts, aluminium sesquioxide 13 parts～55 parts, silicon dioxide 2 parts～15 parts, binding agent 3 parts～25 parts, Kaolin 2 parts～20 parts, magnesium oxide 0.5 part～2 parts, 0.5 part～2 parts of Xinyang soil, light weight calcium 0.5 part～2 parts and rare earth oxide 0.2 part～0.5 part；
Described heat-conducting layer includes each component of following mass parts: Graphene 80 parts～95 parts, CNT 0.1 part～20 parts and carbon nano-fiber 0.1 part～20 parts；
Described heat transfer layer includes each component of following mass parts: copper 93 parts～97 parts, 2 parts～4.5 parts of aluminum, 0.1 part～0.3 part of nickel, vanadium 0.2 part～1.2 parts, 0.1 part～0.4 part of manganese, titanium 0.1 part～0.3 part, chromium 0.1 part～0.3 part and niobium 0.1 part～0.3 part；
Described heat dissipating layer includes each component of following mass parts: copper 47 parts～50 parts, 49 parts～52 parts of aluminum, 0.2 part～0.7 part of magnesium, ferrum 0.2 part～0.7 part, 0.2 part～0.5 part of manganese, titanium 0.1 part～0.3 part, chromium 0.05 part～0.1 part and vanadium 0.1 part～0.3 part.
2. composite according to claim 1, it is characterised in that described heat-conducting layer includes each component of following mass parts: Graphene 85 parts～90 parts, CNT 5 parts～15 parts and carbon nano-fiber 5 parts～15 parts.
3. composite according to claim 1, it is characterised in that Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.
4. composite according to claim 1, it is characterized in that, described insulating barrier includes each component of following mass parts: carborundum 50 parts～60 parts, aluminium sesquioxide 30 parts～50 parts, silica 10 part～15 parts, binding agent 10 parts～20 parts, Kaolin 15 parts～20 parts, magnesium oxide 1 part～1.5 parts, 1 part～1.5 parts of Xinyang soil, light weight calcium 1 part～1.5 parts and rare earth oxide 0.3 part～0.4 part.
5. composite according to claim 1, it is characterized in that, described insulating barrier includes each component of following mass parts: carborundum 55 parts, aluminium sesquioxide 40 parts, silica 13 parts, binding agent 15 parts, Kaolin 18 parts, magnesium oxide 1.5 parts, 1.5 parts of Xinyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.
6. composite according to claim 1, it is characterized in that, described heat dissipating layer includes each component of following mass parts: copper 48 parts～49 parts, 50 parts～52 parts of aluminum, 0.2 part～0.5 part of magnesium, ferrum 0.2 part～0.5 part, 0.3 part～0.5 part of manganese, titanium 0.2 part～0.3 part, chromium 0.05 part～0.08 part and vanadium 0.2 part～0.3 part.
7. composite according to claim 1, it is characterised in that described heat dissipating layer includes each component of following mass parts: copper 48 parts, 51 parts of aluminum, 0.3 part of magnesium, ferrum 0.3 part, 0.4 part of manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.
8. composite according to claim 1, it is characterized in that, described heat transfer layer includes each component of following mass parts: copper 94 parts～96 parts, 3 parts～4 parts of aluminum, 0.2 part～0.3 part of nickel, vanadium 0.5 part～1 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
9. composite according to claim 1, it is characterized in that, described heat transfer layer includes each component of following mass parts: copper 95 parts, 3.5 parts of aluminum, 0.3 part of nickel, vanadium 0.8 part, 0.2 part～0.3 part of manganese, titanium 0.2 part～0.3 part, chromium 0.2 part～0.3 part and niobium 0.2 part～0.3 part.
10. composite according to claim 1, it is characterised in that the thickness ratio of described insulating barrier, described heat-conducting layer, described heat transfer layer, described heat dissipating layer and described protective layer is 1～1.5:8～12:5～7:6～10:2～2.5.
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