CN104720784A

CN104720784A - Vibration sensor and production method thereof

Info

Publication number: CN104720784A
Application number: CN201310714985.XA
Authority: CN
Inventors: 王竹; 林同福; 赵豪
Original assignee: Nano New Energy Tangshan Co Ltd
Current assignee: Nano New Energy Tangshan Co Ltd
Priority date: 2013-12-20
Filing date: 2013-12-20
Publication date: 2015-06-24

Abstract

The invention provides a vibration sensor and a production method thereof. The vibration sensor comprises a first electrode layer, a first polymer insulating layer and a second electrode layer which are sequentially stacked, wherein a frame structure which can vibrate is disposed between the first polymer insulating layer and the second electrode layer; a second polymer insulating layer can be added between the first polymer insulating layer and the second electrode layer to allow frame structure to be formed between the first polymer insulating layer and the second polymer insulating layer; a middle electrode layer or a middle thin film layer can be further added between the first polymer insulating layer and the second polymer insulating layer, and the frame structures can be formed among the layers. The vibration sensor is excellent in low frequency response performance.

Description

Vibrating sensor and preparation method thereof

Technical field

The present invention relates to a kind of vibrating sensor, particularly relate to a kind of breathing, heart beating vibrating sensor and preparation method thereof.

Background technology

Vibrating sensor, or title piezoelectric transducer, be the sensor utilizing the piezoelectric effect of the stressed rear generation of piezoelectric to make, be widely used in the various fields such as acoustics, medical treatment, industry, traffic, security protection, just progressively change the live and work mode of people, become the trend of social development.When deformation (comprising bending and telescopic shape change) occurs being subject to the External Force Acting of a direction piezoelectric, due to the polarization phenomena of internal charge, electric charge can be produced on its surface.Piezoelectric can be divided into piezoelectric monocrystal, piezoelectricity polycrystalline and organic piezoelectric materials, and prior art adopts polarization Kynoar (PVDF), poly-difluoroethylene and poly-trifluoro-ethylene copolymer as piezoelectric usually.Because piezoelectric transducer operating frequency is by the impact of the factor such as material geometry, elastic properties of materials character, therefore the operating frequency of most of piezoelectric transducer is higher than 100Hz, simultaneously due to harmonic influence, piezoelectric transducer also has high requirement to follow-up signal filtering.At present, also not there is the vibrating sensor of excellent LF-response performance.

Especially, vibrating sensor is at present to breathing and one of common tool that heart beating detects, but due to the problem of existing vibrating sensor ubiquity LF-response poor performance, thus poor to the sensitivity of the detection of the low-frequency vibrations such as breathing, heart beating.

Summary of the invention

Technical problem to be solved by this invention is: for the defect existed in prior art, provides a kind of and has vibrating sensor of excellent LF-response performance and preparation method thereof.

On the one hand, the invention provides a kind of vibrating sensor, comprise the first electrode layer be cascading, the first high molecular polymer insulating barrier, and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and the second side surface of described first high molecular polymer insulating barrier is arranged towards the second side surface of described the second electrode lay;

Second side surface of described first high molecular polymer insulating barrier or the second side surface of described the second electrode lay are provided with at least one bulge-structure, described second side surface of the first high molecular polymer insulating barrier and the second side surface of described the second electrode lay are mutually permanently connected, form cavity thus; Described first high molecular polymer insulating barrier, described the second electrode lay and described bulge-structure form vibratile frame structure jointly;

Described first electrode layer and described the second electrode lay are two outfans of described vibrating sensor.

On the other hand, the invention provides a kind of vibrating sensor, comprise the first electrode layer be cascading, the first high molecular polymer insulating barrier, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier, and the second side surface of described second high molecular polymer insulating barrier is arranged towards the second side surface of described first high molecular polymer insulating barrier;

Second side surface of described first high molecular polymer insulating barrier or the second side surface of described second high molecular polymer insulating barrier are provided with at least one bulge-structure, second side surface of the second side surface of described first high molecular polymer insulating barrier and described second high molecular polymer insulating barrier is mutually permanently connected, forms cavity thus; Described first high molecular polymer insulating barrier, described second high molecular polymer insulating barrier and described bulge-structure form vibratile frame structure jointly;

On the other hand, the invention provides a kind of vibrating sensor, comprise the first electrode layer be cascading, the first high molecular polymer insulating barrier, intervening electrode layer, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier; Described intervening electrode layer is arranged between the second side surface of described first high molecular polymer insulating barrier and the second side surface of described second high molecular polymer insulating barrier, and the second side surface of the first side surface of described intervening electrode layer and described first high molecular polymer insulating barrier is oppositely arranged, the second side surface of described intervening electrode layer and the second side surface of described second high molecular polymer insulating barrier are oppositely arranged;

Second side surface of described first high molecular polymer insulating barrier or the first side surface of described intervening electrode layer are provided with at least one bulge-structure, second side surface of described first high molecular polymer insulating barrier and the first side surface of described intervening electrode layer are mutually permanently connected, form cavity thus, described first high molecular polymer insulating barrier, described intervening electrode layer and described bulge-structure form vibratile frame structure jointly, and/or, second side surface of described second high molecular polymer insulating barrier or the second side surface of described intervening electrode layer are provided with at least one bulge-structure, second side surface of described second high molecular polymer insulating barrier and the second side surface of described intervening electrode layer are mutually permanently connected, form cavity thus, described second high molecular polymer insulating barrier, described intervening electrode layer and described bulge-structure form vibratile frame structure jointly,

Both or three arbitrarily in described intervening electrode layer, described first electrode layer and described the second electrode lay form the outfan of described vibrating sensor.

On the other hand, the invention provides a kind of vibrating sensor, comprise the first electrode layer be cascading, the first high molecular polymer insulating barrier, between two parties thin layer, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier; Described thin layer is between two parties polymer film layer, be arranged between the second side surface of described first high molecular polymer insulating barrier and the second side surface of described second high molecular polymer insulating barrier, and the second side surface of the first side surface of described thin layer between two parties and described first high molecular polymer insulating barrier is oppositely arranged, the second side surface of described thin layer between two parties and the second side surface of described second high molecular polymer insulating barrier are oppositely arranged;

Second side surface of described first high molecular polymer insulating barrier or the first side surface of described thin layer are between two parties provided with at least one bulge-structure, second side surface of described first high molecular polymer insulating barrier and the first side surface of described thin layer are between two parties mutually permanently connected, form cavity thus, described first high molecular polymer insulating barrier, described thin layer between two parties and described bulge-structure form vibratile frame structure jointly, and/or, second side surface of described second high molecular polymer insulating barrier or the second side surface of described thin layer are between two parties provided with at least one bulge-structure, second side surface of described second high molecular polymer insulating barrier and the second side surface of described thin layer are between two parties mutually permanently connected, form cavity thus, described second high molecular polymer insulating barrier, described thin layer between two parties and described bulge-structure form vibratile frame structure jointly,

Aforesaid vibrating sensor, described in be fixedly connected be being fixedly connected with of being fixedly connected with by plasma treatment or using pressure sensitive adhesive to be fixedly connected with and realize.

Aforesaid vibrating sensor, the height of described bulge-structure is 1 μm of-1mm.

Aforesaid vibrating sensor, described bulge-structure forms the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure.

Aforesaid vibrating sensor, described bulge-structure connects on its surface that at least side is fixedly connected with, and each the width connected is 0.1mm-5mm.

Aforesaid vibrating sensor, described bulge-structure connects on the surface that its side is fixedly connected with; On the surface that its opposite side is fixedly connected with, point connects or line connection.

Aforesaid vibrating sensor, the distance between adjacent two bulge-structures is 0.1mm-1mm.

Aforesaid vibrating sensor, described first high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

Aforesaid vibrating sensor, described second high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

Aforesaid vibrating sensor, described thin layer is between two parties single polymers layer or composite polymer layer.

Aforesaid vibrating sensor, described single polymers layer material therefor is selected from polydimethylsiloxanefilm film, Kapton, polypropylene film, aniline-formaldehyde resin thin film, polyformaldehyde thin film, ethyl cellulose film, polyamide film, melamino-formaldehyde thin film, Polyethylene Glycol succinate thin film, cellulose membrane, cellulose acetate film, 10PE27 thin film, polydiallyl phthalate thin film, cellulose sponge thin film, renewable sponge thin film, elastic polyurethane body thin film, styrene-acrylonitrile copolymer copolymer film, styrene-butadiene-copolymer thin film, staple fibre thin film, polymethyl methacrylate film, polyvinyl alcohol film, polyisobutylene thin film, pet film, polyvinyl butyral film, formaldehyde-phenol condensation polymer thin film, neoprene thin film, butadiene-propylene copolymer thin film, natural rubber films, polyacrylonitrile thin film, any one in acrylonitrile vinyl chloride copolymer thin film,

Described composite polymer layer material therefor is polydimethylsiloxanefilm film, Kapton, polypropylene film, aniline-formaldehyde resin thin film, polyformaldehyde thin film, ethyl cellulose film, polyamide film, melamino-formaldehyde thin film, Polyethylene Glycol succinate thin film, cellulose membrane, cellulose acetate film, 10PE27 thin film, polydiallyl phthalate thin film, cellulose sponge thin film, renewable sponge thin film, elastic polyurethane body thin film, styrene-acrylonitrile copolymer copolymer film, styrene-butadiene-copolymer thin film, staple fibre thin film, polymethyl methacrylate film, polyvinyl alcohol film, polyisobutylene thin film, pet film, polyvinyl butyral film, formaldehyde-phenol condensation polymer thin film, neoprene thin film, butadiene-propylene copolymer thin film, natural rubber films, polyacrylonitrile thin film, the two composite polymer films formed arbitrarily in acrylonitrile vinyl chloride copolymer thin film.

On the other hand, the invention provides a kind of preparation method of vibrating sensor, the method comprises:

(1) at least one bulge-structure is set at high molecular polymer insulating barrier one side surface, obtains the high molecular polymer insulating barrier being with bulge-structure;

(2) at least one bulge-structure is set at electrode layer one side surface, obtains the electrode layer being with bulge-structure;

Wherein, step (1) or step (2) is only carried out;

(3) prepare vibrating sensor, this vibrating sensor comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, and the second electrode lay;

Wherein, the high molecular polymer insulating barrier of the band bulge-structure adopting step (1) to obtain is as the first high molecular polymer insulating barrier, or the electrode layer of the band bulge-structure adopting step (2) to obtain is as the second electrode lay;

Be arranged between the first high molecular polymer insulating barrier and the second electrode lay according to bulge-structure, the second electrode lay be arranged on the first high molecular polymer insulating barrier, and by bulge-structure with its towards side surface be fixed and be connected, form cavity thus; First high molecular polymer insulating barrier, the second electrode lay and bulge-structure form vibratile frame structure jointly;

Then, the side surface that the second electrode lay is not set at the first high molecular polymer insulating barrier arranges the first electrode layer, thus obtains vibrating sensor.

(2) prepare vibrating sensor, this vibrating sensor comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, the second high molecular polymer insulating barrier and the second electrode lay;

Wherein, the high molecular polymer insulating barrier of the band bulge-structure adopting step (1) to obtain is as the first high molecular polymer insulating barrier, make the side surface with bulge-structure towards the second high molecular polymer insulating barrier, and bulge-structure is fixedly attached to the second high molecular polymer insulating barrier, form cavity thus; First high molecular polymer insulating barrier, the second high molecular polymer insulating barrier and bulge-structure form vibratile frame structure jointly;

Then, the first electrode layer is not set with on the side surface of bulge-structure at the first high molecular polymer insulating barrier, the side surface that the second high molecular polymer insulating barrier is not fixedly connected with bulge-structure arranges the second electrode lay, thus obtains vibrating sensor.

(2) at least one bulge-structure is set at least one side surface of electrode layer, obtains the electrode layer being with bulge-structure;

Wherein, only carry out step (1) or step (2), or, carry out step (1) and step (2) simultaneously;

(3) prepare vibrating sensor, this vibrating sensor comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, intervening electrode layer, the second high molecular polymer insulating barrier and the second electrode lay;

Wherein, the high molecular polymer insulating barrier of the first high molecular polymer insulating barrier and/or the second high molecular polymer insulating barrier band bulge-structure that adopts step (1) to obtain; Or, the electrode layer of the band bulge-structure that intervening electrode layer adopts step (2) to obtain, the high molecular polymer insulating barrier of one deck band bulge-structure of adopting step (1) to obtain at the most in first high molecular polymer insulating barrier and the second high molecular polymer insulating barrier, and at the most one side has bulge-structure in the relative side surface of adjacent two layers;

Be arranged between the first high molecular polymer insulating barrier and intervening electrode layer according to bulge-structure, and/or, bulge-structure is arranged between the second high molecular polymer insulating barrier and intervening electrode layer, by the first high molecular polymer insulating barrier, intervening electrode layer and the second high molecular polymer insulating barrier are assembled, and by bulge-structure with its towards side surface be fixed and be connected, form cavity thus; First high molecular polymer insulating barrier, intervening electrode layer and bulge-structure therebetween, and/or, the second high molecular polymer insulating barrier, intervening electrode layer and bulge-structure therebetween, the vibratile frame structure of common formation;

Then, the first electrode layer and the second electrode lay are not set respectively on the side surface of intervening electrode layer at the first high molecular polymer insulating barrier and the second high molecular polymer insulating barrier, thus obtain vibrating sensor.

(2) in the both side surface of another high molecular polymer insulating barrier, be respectively provided to a few bulge-structure, obtain the high molecular polymer insulating barrier of both side surface all with bulge-structure;

Wherein, step (1) or step (2) is only carried out;

(3) prepare vibrating sensor, this vibrating sensor comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, between two parties thin layer, the second high molecular polymer insulating barrier and the second electrode lay;

Wherein, first high molecular polymer insulating barrier, the high molecular polymer insulating barrier of the band bulge-structure that any one deck between two parties in thin layer and the second high molecular polymer insulating barrier or two-layer employing step (1) obtain, and at the most one side has bulge-structure in the relative side surface of adjacent two layers; Or thin layer adopts the high molecular polymer insulating barrier of both side surface all with bulge-structure that step (2) obtains between two parties;

The first high molecular polymer insulating barrier is arranged at and between two parties between thin layer according to bulge-structure, and/or, bulge-structure is arranged at the second high molecular polymer insulating barrier and between two parties between thin layer, by the first high molecular polymer insulating barrier, thin layer and the second high molecular polymer insulating barrier are assembled between two parties, and by bulge-structure with its towards side surface be fixed and be connected, form cavity thus; First high molecular polymer insulating barrier, between two parties thin layer and bulge-structure therebetween, and/or, the second high molecular polymer insulating barrier, between two parties thin layer and bulge-structure therebetween, the vibratile frame structure of common formation;

Then, the first electrode layer and the second electrode lay are not set respectively on the side surface of thin layer between two parties at the first high molecular polymer insulating barrier and the second high molecular polymer insulating barrier, thus obtain vibrating sensor.

The preparation method of aforesaid vibrating sensor, described in be fixedly connected with and be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and realize.

The preparation method of aforesaid vibrating sensor, the described bulge-structure that arranges is realized by method for printing screen.

The preparation method of aforesaid vibrating sensor, is set to described bulge-structure connect on its surface that at least side is fixedly connected with, and each the width connected is 0.1mm-5mm.

The preparation method of aforesaid vibrating sensor, is set to described bulge-structure connect on the surface that its side is fixedly connected with, and on the surface that its opposite side is fixedly connected with, point connects or line connection.

The preparation method of aforesaid vibrating sensor, described first high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

The preparation method of aforesaid vibrating sensor, described second high molecular polymer insulating barrier is single polymers layer.

The preparation method of aforesaid vibrating sensor, described thin layer is between two parties single polymers layer or composite polymer layer.

Vibrating sensor of the present invention at least has following beneficial effect: vibrating sensor of the present invention is the forced vibration based on thin polymer film, because damping vibration done by thin polymer film, therefore the harmonic effects in the transducer architecture of vibrating sensor is efficiently reduced, there is excellent LF-response performance and signal waveform, be particularly suitable for the detection to the low-frequency vibration such as heart beating, breathing.

Accompanying drawing explanation

Fig. 1 is the perspective view of a kind of detailed description of the invention of vibrating sensor of the present invention.

Fig. 2 is the cross-sectional view of Fig. 1 vibrating sensor of the present invention.

Fig. 3 is the perspective view of the another kind of detailed description of the invention of vibrating sensor of the present invention.

Fig. 4 is the cross-sectional view of Fig. 3 vibrating sensor of the present invention.

Fig. 5 is the perspective view of the another kind of detailed description of the invention of vibrating sensor of the present invention.

Fig. 6 is the perspective view of Fig. 5 vibrating sensor of the present invention.

Fig. 7 is the perspective view of the another kind of detailed description of the invention of vibrating sensor of the present invention.

Fig. 8 is the perspective view of Fig. 7 vibrating sensor of the present invention.

Fig. 9 is acoustic vibration test schematic diagram.

The experiment measuring signal graph that Figure 10 (a) is PVDF piezoelectric transducer; The filtering signal figure that Figure 10 (b) is PVDF piezoelectric transducer.

The experiment measuring signal graph that Figure 11 (a) is vibrating sensor of the present invention; The filtering signal figure that Figure 11 (b) is vibrating sensor of the present invention.

Figure 12 is the spectrum signal figure of vibrating sensor of the present invention.

Figure 13 is the spectrum signal figure of PVDF piezoelectric transducer.

Detailed description of the invention

In order to fully understand object of the present invention, feature and effect, by following detailed description of the invention, the present invention is elaborated.

It is the vibrating sensor 1 of a kind of detailed description of the invention of the present invention shown in Fig. 1 and Fig. 2.This vibrating sensor 1 comprises the first electrode layer 11, the first high molecular polymer insulating barrier 12 be cascading, and the second electrode lay 13.Particularly, first electrode layer 11 is arranged on the first side surface of the first high molecular polymer insulating barrier 12, and the second side surface of the first high molecular polymer insulating barrier 12 is towards the second side surface setting of described the second electrode lay 13, second side surface of the first high molecular polymer insulating barrier 12 or the second side surface of the second electrode lay 13 are provided with at least one bulge-structure 14, second side surface of the first high molecular polymer insulating barrier 12 and the second side surface of the second electrode lay 13 are mutually permanently connected, form cavity thus, first high molecular polymer insulating barrier 12, the second electrode lay 13 and bulge-structure 14 form vibratile frame structure jointly, first electrode layer 11 and the second electrode lay 13 are the outfan of vibrating sensor 1.

In this detailed description of the invention, the height of bulge-structure 14 is 1 μm of-1mm.Bulge-structure 14 is preferably multiple, thus can form multiple cavity.The arrangement mode of multiple bulge-structure 14 can be rule also can be irregular, such as these multiple bulge-structures 14 can form the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure, and the distance between adjacent two bulge-structures is 0.1mm-1mm.

Bulge-structure 14 connects on its surface that at least side is fixedly connected with, such as, connect on the second side surface of the first high molecular polymer insulating barrier 12 and/or the second side surface of the second electrode lay 13, and each the width connected is 0.1mm-5mm.

Preferably, bulge-structure 14 connects on the surface that its side is fixedly connected with, on the surface that its opposite side is fixedly connected with, point connects or line connection, such as connect on the second side surface of the first high molecular polymer insulating barrier 12, on the second side surface of the second electrode lay 13, point connects or line connection; Or connect on the second side surface of the second electrode lay 13, on the second side surface of the first high molecular polymer insulating barrier 12, point connects or line connection.Be fixedly connected with the surperficial cavity formed by bulge-structure with it, that side surface that a connection or line connection bump structure 14 are supported has thickness direction displacement and radial direction displacement.This radial surface displacement much larger than thickness direction displacement, thus makes vibrating sensor have excellent low-frequency vibration characteristic.Therefore, good LF-response can be realized by the radial vibration of cavity.

The thickness of the first high molecular polymer insulating barrier 12 is 1 μm of-1mm, can be single polymers layer or composite polymer layer.

Single polymers layer material therefor is selected from polydimethylsiloxanefilm film, Kapton, polypropylene film, aniline-formaldehyde resin thin film, polyformaldehyde thin film, ethyl cellulose film, polyamide film, melamino-formaldehyde thin film, Polyethylene Glycol succinate thin film, cellulose membrane, cellulose acetate film, 10PE27 thin film, polydiallyl phthalate thin film, cellulose sponge thin film, renewable sponge thin film, elastic polyurethane body thin film, styrene-acrylonitrile copolymer copolymer film, styrene-butadiene-copolymer thin film, staple fibre thin film, polymethyl methacrylate film, polyvinyl alcohol film, polyisobutylene thin film, pet film, polyvinyl butyral film, formaldehyde-phenol condensation polymer thin film, neoprene thin film, butadiene-propylene copolymer thin film, natural rubber films, polyacrylonitrile thin film, any one in acrylonitrile vinyl chloride copolymer thin film, preferably from polydimethylsiloxanefilm film, any one in Kapton and polypropylene film, and be most preferably polydimethylsiloxanefilm film.

Composite polymer layer material therefor is polydimethylsiloxanefilm film, Kapton, polypropylene film, aniline-formaldehyde resin thin film, polyformaldehyde thin film, ethyl cellulose film, polyamide film, melamino-formaldehyde thin film, Polyethylene Glycol succinate thin film, cellulose membrane, cellulose acetate film, 10PE27 thin film, polydiallyl phthalate thin film, cellulose sponge thin film, renewable sponge thin film, elastic polyurethane body thin film, styrene-acrylonitrile copolymer copolymer film, styrene-butadiene-copolymer thin film, staple fibre thin film, polymethyl methacrylate film, polyvinyl alcohol film, polyisobutylene thin film, pet film, polyvinyl butyral film, formaldehyde-phenol condensation polymer thin film, neoprene thin film, butadiene-propylene copolymer thin film, natural rubber films, polyacrylonitrile thin film, arbitrarily the two composite polymer films formed in acrylonitrile vinyl chloride copolymer thin film, is preferably the composite polymer films that pet film and polydimethylsiloxanefilm film are formed, the composite polymer films that pet film and Kapton are formed, or the composite polymer films that pet film and polypropylene film are formed.

In this detailed description of the invention, the first electrode layer 11 pairs material therefor does not have particular provisions, and the material that can form conductive layer all within protection scope of the present invention, such as, is indium tin oxide, Graphene, nano silver wire film, metal or alloy; The second electrode lay 13 material therefor can be metal or alloy.Wherein, metal can be Au Ag Pt Pd, aluminum, nickel, copper, titanium, chromium, stannum, ferrum, manganese, molybdenum, tungsten or vanadium; Alloy can be aluminium alloy, titanium alloy, magnesium alloy, beryllium alloy, copper alloy, kirsite, manganese alloy, nickel alloy, metal, ashbury metal, cadmium alloy, bismuth alloy, indium alloy, gallium alloy, tungsten alloy, molybdenum alloy, niobium alloy or tantalum alloy.The thickness of the second electrode lay 13 preferably 100 μm-500 μm, more preferably 200 μm.

The preparation method of the vibrating sensor of this detailed description of the invention is described for the situation only arranging bulge-structure 14 on the second side surface of the first high molecular polymer insulating barrier 12 below.

Second side surface of the first high molecular polymer insulating barrier 12 prepares bulge-structure 14, and bulge-structure 14 adopts the material identical with the first high molecular polymer insulating barrier 12, and this step can adopt, but is not limited to, method for printing screen; The Altitude control of the bulge-structure 14 of preparation, at 1 μm of-1mm, can make the array of protrusions of fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure; Distance controlling between adjacent two bulge-structures is at 0.1mm-1mm.Bulge-structure 14 connects on the first high molecular polymer insulating barrier 12 surface, and each the width connected is 0.1mm-5mm.

Then be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and bulge-structure 14 and the second side surface of the second electrode lay 13 are fixed are connected, form cavity.Bulge-structure 14 can be that face connects at the second electrode lay 13 on the surface, also can be that a connection or line connect.The mode that is fixedly connected with that point connects or line connects, better can realize good LF-response by the radial vibration of cavity.

Then, on the first side surface of the first high molecular polymer insulating barrier 12, splash-proofing sputtering metal prepares the first electrode layer 11.

Plasma treatment is fixedly connected with and refers to that first use plasma processor processes by the surface connected that is fixed, then connection is being fixed, specific to this detailed description of the invention, refer to and first use second side surface of plasma processor to the second electrode lay 13 to process, then be connected being fixed with the second side surface of the second electrode lay 13 by bulge-structure 14, plasma processor Dongguan City such as can be adopted to shine model that the electric Science and Technology Ltd. in sky produces is the vertical Surface Treatment with Plasma machine of single rifle of CSM-SSC1; Pressure sensitive adhesive (PSA) is the abbreviation of pressure-sensitive adhesive, that a class has the adhesive of sensitivity to pressure, specific to this detailed description of the invention, using pressure sensitive adhesive to be fixedly connected with refers to second side surface of pressure-sensitive adhesives in the second electrode lay 13, after solidification to be cooled, by second side surface of the second side surface of the first high molecular polymer insulating barrier 12 towards the second electrode lay 13, light pressure viscosity knot, those skilled in the art can select suitable pressure sensitive adhesive according to practical operation, such as, can buy from Suzhou Jin Feng pressure sensitive adhesive company limited.

The manufacture method of the vibrating sensor in this detailed description of the invention in other situation is similar known.

Under the effect of extraneous vibration, thin film near the bulge-structure 14 that first high molecular polymer insulating barrier 12 of the vibrating sensor 1 of this detailed description of the invention is arranged vibrates, first high molecular polymer insulating barrier 12 and the second electrode lay 13 contact with each other the generation signal of telecommunication, and the generation of the signal of telecommunication can make to occur electric potential difference between the first electrode layer 11 and the second electrode lay 13.Due to the existence of electric potential difference between the first electrode layer 11 and the second electrode lay 13, free electron flows to the high side of electromotive force by by external circuit by the side that electromotive force is low, thus forms electric current in external circuit.When each layer of vibrating sensor 1 returns to original state, at this moment the built-in potential be formed between the first electrode layer 11 and the second electrode lay 13 disappears, now will again produce reverse electric potential difference between Balanced first electrode layer 11 and the second electrode lay 13, then free electron forms reverse current by external circuit.By said process repeatedly, just periodic ac signal can be formed in external circuit.

It is the vibrating sensor 2 of the another kind of detailed description of the invention of the present invention shown in Fig. 3 and Fig. 4.This vibrating sensor 2 comprises the first electrode layer 21, first high molecular polymer insulating barrier 22, second high molecular polymer insulating barrier 23 and the second electrode lay 24 be cascading.Particularly, first electrode layer 21 is arranged on the first side surface of the first high molecular polymer insulating barrier 22, the second electrode lay 24 is arranged on the first side surface of the second high molecular polymer insulating barrier 23, and the second side surface of the second high molecular polymer insulating barrier 23 is arranged towards the second side surface of the first high molecular polymer insulating barrier 22; Second side surface of the first high molecular polymer insulating barrier 22 or the second side surface of the second high molecular polymer insulating barrier 23 are provided with at least one bulge-structure 25, second side surface of the second side surface of the first high molecular polymer insulating barrier 22 and the second high molecular polymer insulating barrier 23 is mutually permanently connected, form cavity thus, the first high molecular polymer insulating barrier 22, second high molecular polymer insulating barrier 23 and bulge-structure 25 form vibratile frame structure jointly; First electrode layer 21 and the second electrode lay 24 are the outfan of vibrating sensor 2.

In this detailed description of the invention, the height of bulge-structure 25 is 1 μm of-1mm.Bulge-structure 25 is preferably multiple, thus can form multiple cavity.The arrangement mode of multiple bulge-structure 25 can be rule also can be irregular, such as these multiple bulge-structures 25 can form the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure.Distance between adjacent two bulge-structures is 0.1mm-1mm.

Bulge-structure 25 connects on its surface that at least side is fixedly connected with, such as connect on the second side surface of the first high molecular polymer insulating barrier 22 and/or the second side surface of the second high molecular polymer insulating barrier 23, each the width connected is 0.1mm-5mm.

Preferably, bulge-structure 25 connects on the surface that its side is fixedly connected with, be fixedly connected with at its opposite side and connect on the surface or line connection, such as connect on the second side surface of the first high molecular polymer insulating barrier 22, on the second side surface of the second high molecular polymer insulating barrier 23, point connects or line connection; Or connect on the second side surface of the second high molecular polymer insulating barrier 23, on the second side surface of the first high molecular polymer insulating barrier 22, point connects or line connection.Be fixedly connected with the surperficial cavity formed by bulge-structure with it, that side surface that a connection or line connection bump structure 25 are supported has thickness direction displacement and radial direction displacement.This radial surface displacement much larger than thickness direction displacement, thus makes vibrating sensor have low-frequency vibration characteristic.Therefore, good LF-response can be realized by the radial vibration of cavity.

The thickness of the first high molecular polymer insulating barrier 22 and the second high molecular polymer insulating barrier 23 is all 1 μm of-1mm, and can be single polymers layer or composite polymer layer.

In this embodiment, first electrode layer 21 and the second electrode lay 24 pairs of material therefors do not have particular provisions, the material of conductive layer can be formed all within protection scope of the present invention, be such as indium tin oxide, Graphene, nano silver wire film, metal or alloy, wherein metal is Au Ag Pt Pd, aluminum, nickel, copper, titanium, chromium, stannum, ferrum, manganese, molybdenum, tungsten or vanadium; Alloy is aluminium alloy, titanium alloy, magnesium alloy, beryllium alloy, copper alloy, kirsite, manganese alloy, nickel alloy, metal, ashbury metal, cadmium alloy, bismuth alloy, indium alloy, gallium alloy, tungsten alloy, molybdenum alloy, niobium alloy or tantalum alloy.

The preparation method of the vibrating sensor of this detailed description of the invention is described for the situation only arranging bulge-structure 25 on the second side surface of the first high molecular polymer insulating barrier 22 below.

Second side surface of the first high molecular polymer insulating barrier 22 arranges bulge-structure 25, and bulge-structure 25 adopts the material identical with the first high molecular polymer insulating barrier 22, and this step can adopt, but is not limited to, method for printing screen; The Altitude control of the bulge-structure 25 of preparation, at 1 μm of-1mm, can make the array of protrusions of fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure; Distance controlling between adjacent two bulge-structures is at 0.1mm-1mm.Bulge-structure 25 connects on the first high molecular polymer insulating barrier 22 surface, and each the width connected is 0.1mm-5mm.

Then be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and bulge-structure 25 and the second side surface of the second high molecular polymer insulating barrier 23 are fixed are connected, form cavity.Bulge-structure 25 can be that face connects at the second high molecular polymer insulating barrier 23 on the surface, also can be that a connection or line connect.The mode that is fixedly connected with that point connects or line connects, better can realize good LF-response by the radial vibration of cavity.

Then, respectively on the first side surface of the first high molecular polymer insulating barrier 22 and the first side surface of the second high molecular polymer insulating barrier 23 splash-proofing sputtering metal to form the first electrode layer 21 and the second electrode lay 24.Wherein, plasma treatment is fixedly connected with and refers to that first use plasma processor processes by the surface connected that is fixed, then connection is being fixed, specific to this detailed description of the invention, refer to and first use second side surface of plasma processor to the second high molecular polymer insulating barrier 23 to process, then be connected bulge-structure 25 is fixed with the second side surface of the second high molecular polymer insulating barrier 23, the model that plasma processor such as can adopt the Dongguan City credit electric Science and Technology Ltd. in sky to produce is the vertical Surface Treatment with Plasma machine of single rifle of CSM-SSC1, pressure sensitive adhesive (PSA) is the abbreviation of pressure-sensitive adhesive, that a class has the adhesive of sensitivity to pressure, specific to this detailed description of the invention, using pressure sensitive adhesive to be fixedly connected with refers to second side surface of pressure-sensitive adhesives in the second high molecular polymer insulating barrier 23, after solidification to be cooled, by second side surface of the second side surface of the first high molecular polymer insulating barrier 22 towards the second high molecular polymer insulating barrier 23, light pressure viscosity knot, those skilled in the art can select suitable pressure sensitive adhesive according to practical operation, such as, can buy from Suzhou Jin Feng pressure sensitive adhesive company limited.

Under the effect of extraneous vibration, thin film near the bulge-structure 25 that first high molecular polymer insulating barrier 22 of the vibrating sensor 2 of this detailed description of the invention is arranged vibrates, first high molecular polymer insulating barrier 22 and the second high molecular polymer insulating barrier 23 contact with each other the generation signal of telecommunication, can make to occur electric potential difference between the first electrode layer 21 and the second electrode lay 24.Due to the existence of electric potential difference between the first electrode layer 21 and the second electrode lay 24, free electron flows to the high side of electromotive force by by external circuit by the side that electromotive force is low, thus forms electric current in external circuit.When each layer of vibrating sensor 2 returns to original state, at this moment the built-in potential be formed between the first electrode layer 21 and the second electrode lay 24 disappears, now will again produce reverse electric potential difference between Balanced first electrode layer 21 and the second electrode lay 24, then free electron forms reverse current by external circuit.By said process repeatedly, just periodic ac signal can be formed in external circuit.

It is the vibrating sensor 3 of another detailed description of the invention of the present invention shown in Fig. 5 and Fig. 6.This vibrating sensor 3 comprises the first electrode layer 31, the first high molecular polymer insulating barrier 32 be cascading, thin layer 33 between two parties, the second high molecular polymer insulating barrier 34 and the second electrode lay 35.Particularly, the first electrode layer 31 is arranged on the first side surface of the first high molecular polymer insulating barrier 32, the second electrode lay 35 is arranged on the first side surface of the second high molecular polymer insulating barrier 34, and thin layer 33 is arranged between the second side surface of the first high molecular polymer insulating barrier 32 and the second side surface of the second high molecular polymer insulating barrier 34 between two parties, and the first side surface of thin layer 33 is relative with the second side surface of the first high molecular polymer insulating barrier 32 between two parties, the second side surface of thin layer 33 is relative with the second side surface of the second high molecular polymer insulating barrier 34 between two parties, first side surface of the second side surface of the first high molecular polymer insulating barrier 32 or between two parties thin layer 33 is provided with at least one bulge-structure 36, second side surface of the first high molecular polymer insulating barrier 32 is mutually permanently connected with the first side surface of thin layer 33 between two parties, form cavity thus, first high molecular polymer insulating barrier 32, thin layer 33 and bulge-structure 36 form vibratile frame structure jointly between two parties, and/or, second side surface of the second side surface of the second high molecular polymer insulating barrier 34 or between two parties thin layer 33 is provided with at least one bulge-structure 37, second side surface of the second high molecular polymer insulating barrier 34 is mutually permanently connected with the second side surface of thin layer 33 between two parties, form cavity thus, second high molecular polymer insulating barrier 34, thin layer 33 and bulge-structure 37 form vibratile frame structure jointly between two parties, first electrode layer 31 and the second electrode lay 35 are two outfans of vibrating sensor 3.

In this detailed description of the invention, the height of bulge-structure is 1 μm of-1mm.Bulge-structure is preferably multiple, thus can form multiple cavity.The arrangement mode of multiple bulge-structure can be rule also can be irregular, such as these multiple bulge-structures 25 can form the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure; Distance between adjacent two bulge-structures is 0.1mm-1mm.

Bulge-structure connects on its surface that at least side is fixedly connected with, such as connect on the second side surface of the first high molecular polymer insulating barrier 32 and/or the first side surface of thin layer 33 between two parties, and/or, connect above second side surface of the second side surface of the second high molecular polymer insulating barrier 34 and/or between two parties thin layer 33, each the width connected is 0.1mm-5mm.

Preferably, bulge-structure connects on the surface that its side is fixedly connected with, be fixedly connected with at its opposite side and connect on the surface or line connection, such as connect on the second side surface of the first high molecular polymer insulating barrier 32, on the first side surface of thin layer 33 between two parties, point connects or line connects; Or, between two parties thin layer 33 first high molecular polymer insulating barrier 32 the first side surface above connect, on the second side surface of the first high molecular polymer insulating barrier 32 point connect or line connect; Or connect on the second side surface of the second high molecular polymer insulating barrier 34, on the second side surface of thin layer 33 between two parties, point connects or line connects; Or, between two parties thin layer 33 the second side surface above connect, on the second side surface of the second high molecular polymer insulating barrier 34 point connect or line connect.

First high molecular polymer insulating barrier 32, thin layer 33 and the second high molecular polymer insulating barrier 34 can be single polymers layer or composite polymer layer between two parties, and the thickness of each polymer film layer is 1 μm of-1mm.

In this specific embodiment, first electrode layer 31 and the second electrode lay 35 pairs of material therefors do not have particular provisions, the material of conductive layer can be formed all within protection scope of the present invention, be such as indium tin oxide, Graphene, nano silver wire film, metal or alloy, wherein metal is Au Ag Pt Pd, aluminum, nickel, copper, titanium, chromium, stannum, ferrum, manganese, molybdenum, tungsten or vanadium; Alloy is aluminium alloy, titanium alloy, magnesium alloy, beryllium alloy, copper alloy, kirsite, manganese alloy, nickel alloy, metal, ashbury metal, cadmium alloy, bismuth alloy, indium alloy, gallium alloy, tungsten alloy, molybdenum alloy, niobium alloy or tantalum alloy.

The preparation method of the vibrating sensor of this detailed description of the invention is described for the situation only arranging bulge-structure on the second side surface of the first high molecular polymer insulating barrier 32 below.

Second side surface of the first high molecular polymer insulating barrier 32 arranges bulge-structure 36, and bulge-structure 36 adopts the material identical with the first high molecular polymer insulating barrier 32, and this step can adopt, but is not limited to, method for printing screen; The Altitude control of the bulge-structure 36 of preparation, at 1 μm of-1mm, can make the array of protrusions of fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure.Distance controlling between adjacent two bulge-structures is at 0.1mm-1mm.Bulge-structure 36 connects on the first high molecular polymer insulating barrier 32 surface, and each the width connected is 0.1mm-5mm.

Then be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and bulge-structure 36 and the first side surface of thin layer 33 are between two parties fixed are connected, form cavity.Between two parties, thin layer 33 can be that face connects to bulge-structure 36 on the surface, also can be that a connection or line connect.The mode that is fixedly connected with that point connects or line connects, better can realize good LF-response by the radial vibration of cavity.

On the first side surface of the first high molecular polymer insulating barrier 32, metallizing forms the first electrode layer 31, on the first side surface of the second high molecular polymer insulating barrier 34, metallizing forms the second electrode lay 35, then according to the first electrode layer 31, first high molecular polymer insulating barrier 32, thin layer 33 between two parties, the order of the second high molecular polymer insulating barrier 34 and the second electrode lay 35 is assembled.Wherein, plasma treatment is fixedly connected with and refers to that first use plasma processor processes by the surface connected that is fixed, then connection is being fixed, specific to this detailed description of the invention, refer to and first use first side surface of plasma processor to thin layer 33 between two parties to process, then be connected bulge-structure and the first side surface of thin layer 33 being between two parties fixed, plasma processor Dongguan City such as can be adopted to shine model that the electric Science and Technology Ltd. in sky produces is the vertical Surface Treatment with Plasma machine of single rifle of CSM-SSC1; Pressure sensitive adhesive (PSA) is the abbreviation of pressure-sensitive adhesive, that a class has the adhesive of sensitivity to pressure, specific to this detailed description of the invention, use pressure sensitive adhesive to be fixedly connected with and refer to first side surface of pressure-sensitive adhesives in thin layer 33 between two parties, after solidification to be cooled, by first side surface of the second side surface of the first high molecular polymer insulating barrier 32 towards thin layer 33 between two parties, light pressure viscosity knot, those skilled in the art can select suitable pressure sensitive adhesive according to practical operation, such as, can buy from Suzhou Jin Feng pressure sensitive adhesive company limited.

The making of the vibrating sensor in this detailed description of the invention in other situation is similar known.

Under the effect of extraneous vibration, thin film near first high molecular polymer insulating barrier 32 and the bulge-structure 36 that arranges between thin layer 33 between two parties vibrates, thus the first high molecular polymer insulating barrier 32 and thin layer 33 are between two parties contacted with each other the generation signal of telecommunication, and/or, thin film near second high molecular polymer insulating barrier 34 and the bulge-structure 37 that arranges between thin layer 33 between two parties vibrates, thus the second high molecular polymer insulating barrier 34 and thin layer 33 are between two parties contacted with each other the generation signal of telecommunication, thus make to occur electric potential difference between the first electrode layer 31 and the second electrode lay 35.Due to the existence of electric potential difference between the first electrode layer 31 and the second electrode lay 35, free electron flows to the high side of electromotive force by by external circuit by the side that electromotive force is low, thus forms electric current in external circuit.When each layer of vibrating sensor 3 returns to original state, at this moment the built-in potential be formed between the first electrode layer 31 and the second electrode lay 35 disappears, now will again produce reverse electric potential difference between Balanced first electrode layer 31 and the second electrode lay 35, then free electron forms reverse current by external circuit.By said process repeatedly, just periodic ac signal can be formed in external circuit.

It is the vibrating sensor 4 of another detailed description of the invention of the present invention shown in Fig. 7 and Fig. 8.This vibrating sensor 4 comprises the first electrode layer 41, the first high molecular polymer insulating barrier 42 be cascading, intervening electrode layer 43, second high molecular polymer insulating barrier 44 and the second electrode lay 45.Particularly, the first electrode layer 41 is arranged on the first side surface of the first high molecular polymer insulating barrier 42, the second electrode lay 45 is arranged on the first side surface of the second high molecular polymer insulating barrier 44, intervening electrode layer 43 is arranged between the second side surface of the first high molecular polymer insulating barrier 42 and the second side surface of the second high molecular polymer insulating barrier 44, and the second side surface of the first side surface of intervening electrode layer 43 and the first high molecular polymer insulating barrier 42 is oppositely arranged, the second side surface of intervening electrode layer 43 and the second side surface of the second high molecular polymer insulating barrier 44 are oppositely arranged, second side surface of the first high molecular polymer insulating barrier 42 or the first side surface of intervening electrode layer 43 are provided with at least one bulge-structure 46, second side surface of the first high molecular polymer insulating barrier 42 and the first side surface of intervening electrode layer 43 are mutually permanently connected, form cavity thus, first high molecular polymer insulating barrier 42, intervening electrode layer 43 and bulge-structure 46 form vibratile frame structure jointly, and/or, second side surface of the second high molecular polymer insulating barrier 44 or the second side surface of intervening electrode layer 43 are provided with at least one bulge-structure 47, second side surface of the second high molecular polymer insulating barrier 44 and the second side surface of intervening electrode layer 43 are mutually permanently connected, form cavity thus, second high molecular polymer insulating barrier 44, intervening electrode layer 43 and bulge-structure 47 form vibratile frame structure jointly.First electrode layer 41 and the second electrode lay 45 are connected as an outfan of vibrating sensor 4, intervening electrode layer 43 is another outfan of vibrating sensor 4, or, any two outfans as vibrating sensor 4 in the first electrode layer 41, the second electrode lay 45 and intervening electrode layer 43.

In this detailed description of the invention, the height of bulge-structure is 1 μm of-1mm.Bulge-structure is preferably multiple, thus can form multiple cavity.The arrangement mode of multiple bulge-structure can be rule also can be irregular, such as these multiple bulge-structures can form the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure; Distance between adjacent two bulge-structures is 0.1mm-1mm.

Bulge-structure connects on its surface that at least side is fixedly connected with, such as connect on the second side surface of the first high molecular polymer insulating barrier 42 and/or the first side surface of intervening electrode layer 43, and/or, connect above second side surface of the second high molecular polymer insulating barrier 44 and/or the second side surface of intervening electrode layer 43, each the width connected is 0.1mm-5mm.

Preferably, bulge-structure connects on the surface that its side is fixedly connected with, on the surface that its opposite side is fixedly connected with, point connects or line connection, such as connect on the second side surface of the first high molecular polymer insulating barrier 42, on the first side surface of intervening electrode layer 43, point connects or line connection; Or connect on the first side surface of intervening electrode layer 43, on the second side surface of the first high molecular polymer insulating barrier 42, point connects or line connection; Or connect on the second side surface of the second high molecular polymer insulating barrier 44, on the second side surface of intervening electrode layer 43, point connects or line connection; Or connect on the second side surface of intervening electrode layer 43, on the second side surface of the second high molecular polymer insulating barrier 44, point connects or line connection.Be fixedly connected with the surperficial cavity formed by bulge-structure with it, make that side surface of a connection or line connection bump support structure have thickness direction displacement and radial direction displacement.This radial surface displacement much larger than thickness direction displacement, thus makes vibrating sensor have low-frequency vibration characteristic.Therefore, good LF-response can be realized by the radial vibration of cavity.

The thickness of the first high molecular polymer insulating barrier 42 and the second high molecular polymer insulating barrier 44 is all 1 μm of-1mm, and can be single polymers layer or composite polymer layer.

In this embodiment, first electrode layer 41 and the second electrode lay 45 pairs of material therefors do not have particular provisions, the material of conductive layer can be formed all within protection scope of the present invention, be such as indium tin oxide, Graphene, nano silver wire film, metal or alloy, wherein metal is Au Ag Pt Pd, aluminum, nickel, copper, titanium, chromium, stannum, ferrum, manganese, molybdenum, tungsten or vanadium; Alloy is aluminium alloy, titanium alloy, magnesium alloy, beryllium alloy, copper alloy, kirsite, manganese alloy, nickel alloy, metal, ashbury metal, cadmium alloy, bismuth alloy, indium alloy, gallium alloy, tungsten alloy, molybdenum alloy, niobium alloy or tantalum alloy.

Described intervening electrode layer 43 is metal or alloy.Wherein, metal can be Au Ag Pt Pd, aluminum, nickel, copper, titanium, chromium, stannum, ferrum, manganese, molybdenum, tungsten or vanadium; Alloy can be aluminium alloy, titanium alloy, magnesium alloy, beryllium alloy, copper alloy, kirsite, manganese alloy, nickel alloy, metal, ashbury metal, cadmium alloy, bismuth alloy, indium alloy, gallium alloy, tungsten alloy, molybdenum alloy, niobium alloy or tantalum alloy.The thickness of intervening electrode layer 43 preferably 100 μm-500 μm, more preferably 200 μm.

The preparation method of the vibrating sensor of this detailed description of the invention is described for the situation arranging bulge-structure 46 on the second side surface of the first high molecular polymer insulating barrier 42 below.

Second side surface of the first high molecular polymer insulating barrier 42 arranges bulge-structure 46, and bulge-structure 46 adopts the material identical with the first high molecular polymer insulating barrier 42, and this step can adopt, but is not limited to, method for printing screen; The Altitude control of the bulge-structure 46 of preparation, at 1 μm of-1mm, can make the array of protrusions of fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure.Distance controlling between adjacent two bulge-structures is at 0.1mm-1mm.Bulge-structure 46 connects on the first high molecular polymer insulating barrier 42 surface, and each the width connected is 0.1mm-5mm.

Then be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and bulge-structure and the first side surface of intervening electrode layer 43 are fixed are connected, form cavity.Bulge-structure 46 can be that face connects at intervening electrode layer 43 on the surface, also can be that a connection or line connect.The mode that is fixedly connected with that point connects or line connects, better can realize good LF-response by the radial vibration of cavity.

On the first side surface of the first high molecular polymer insulating barrier 42, metallizing forms the first electrode layer 41, on the first side surface of the second high molecular polymer insulating barrier 44, metallizing forms the second electrode lay 45, then according to the first electrode layer 41, first high molecular polymer insulating barrier 42, the order of intervening electrode layer 43, second high molecular polymer insulating barrier 44 and the second electrode lay 45 is assembled.Wherein, plasma treatment is fixedly connected with and refers to that first use plasma processor processes by the surface connected that is fixed, then connection is being fixed, specific to this detailed description of the invention, refer to and first use first side surface of plasma processor to intervening electrode layer 43 to process, then be connected being fixed with the first side surface of intervening electrode layer 43 by bulge-structure 46, plasma processor Dongguan City such as can be adopted to shine model that the electric Science and Technology Ltd. in sky produces is the vertical Surface Treatment with Plasma machine of single rifle of CSM-SSC1; Pressure sensitive adhesive (PSA) is the abbreviation of pressure-sensitive adhesive, that a class has the adhesive of sensitivity to pressure, specific to this detailed description of the invention, using pressure sensitive adhesive to be fixedly connected with refers to first side surface of pressure-sensitive adhesives in intervening electrode layer 43, after solidification to be cooled, by first side surface of the second side surface of the first high molecular polymer insulating barrier 42 towards intervening electrode layer 43, light pressure viscosity knot, those skilled in the art can select suitable pressure sensitive adhesive according to practical operation, such as, can buy from Suzhou Jin Feng pressure sensitive adhesive company limited.

Under the effect of extraneous vibration, thin film near the bulge-structure 46 that first high molecular polymer insulating barrier 42 is arranged vibrates, thus the first high molecular polymer insulating barrier 42 and intervening electrode layer 43 are contacted with each other the generation signal of telecommunication, and/or, thin film near the bulge-structure 47 that second high molecular polymer insulating barrier 44 is arranged vibrates, thus the second high molecular polymer insulating barrier 44 and intervening electrode layer 43 are contacted with each other the generation signal of telecommunication, thus cause between the first electrode layer 41 and intervening electrode layer 43, and there is electric potential difference between intervening electrode layer 43 and the second electrode lay 45.Due between the first electrode layer 41 and intervening electrode layer 43, and the existence of electric potential difference between intervening electrode layer 43 and the second electrode lay 45, free electron flows to the high side of electromotive force by by external circuit by the side that electromotive force is low, thus forms electric current in external circuit.When each layer of vibrating sensor 4 returns to original state, at this moment be formed between the first electrode layer 41 and intervening electrode layer 43, and the built-in potential between intervening electrode layer 43 and the second electrode lay 45 disappears, now between Balanced first electrode layer 41 and intervening electrode layer 43, and again producing reverse electric potential difference between intervening electrode layer 43 and the second electrode lay 45, then free electron forms reverse current by external circuit.By said process repeatedly, just periodic ac signal can be formed in external circuit.

The frequency response of vibrating sensor of the present invention mainly concentrates on low frequency frequency range, and its responsive bandwidth mainly concentrates between 0Hz and 55Hz.From Figure 12 and Figure 13 spectral contrast, vibrating sensor of the present invention is far better than Kynoar (PVDF) sensor for the responding ability between 0Hz and 5Hz.For heart beating and breathing vibration, its frequency mainly concentrates on below 5Hz, and because vibrating sensor of the present invention has more excellent LF-response performance, thus it is more suitable for the detection to the low-frequency vibration such as heart beating, breathing.

In above-mentioned various detailed description of the invention, when composite polymer layer is used, its preparation method:

Optional step, (1) is solid material when polymeric base material, such as, during Kynoar, is dissolved in by polymeric base material in conventional organic solvent, such as, forms polymeric base material liquid solution in dimethyl acetylamide (DMA);

(2) by polymeric base material liquid solution film, dry solidification, thus obtain polymeric substrate layers; When polymeric base material is fluent material, such as, during polydimethylsiloxane, directly carry out step (2); And

(3) plasma treatment is adopted to polymeric substrate layers one side surface, apply the liquid solution (preparation method is with polymeric base material liquid solution) of another polymeric layer material afterwards thereon, then dry solidification, thus obtain composite polymer layer.

In addition to the above, all the other all adopt conventional method or the device of this area to process of the present invention.

Set forth the enforcement of method of the present invention below by specific embodiment, one skilled in the art will appreciate that this should not be understood to the restriction to the claims in the present invention scope.

Embodiment

Embodiment 1

The present embodiment vibrating sensor is of a size of 30mm × 12mm, and gross thickness is approximately 400 μm.This vibrating sensor comprises the first electrode layer 21, first high molecular polymer insulating barrier 22, second high molecular polymer insulating barrier 23 and the second electrode lay 24 be cascading, as shown in Figure 3 and Figure 4.

First electrode layer 21 and the second electrode lay 24 material therefor are aluminium foil, and thickness is 50 μm.First high molecular polymer insulating barrier 22 is composite polymer layer, and material therefor is the composite polymer films that pet film (Yongtai plastics) is formed with polydimethylsiloxanefilm film (Yongtai plastics), and thickness is 150 μm.Second high molecular polymer insulating barrier 23 is single polymers layer, and material therefor is pet film (Yongtai plastics), and thickness is 100 μm.The side that first high molecular polymer insulating barrier 22 is relative with the second high molecular polymer insulating barrier 23 is provided with striated bulge-structure, and height of projection is 30 μm, and the width of striated figure is 5mm, and the spacing of adjacent two striated figures is 1mm.First high molecular polymer insulating barrier 22 and the second high molecular polymer insulating barrier 23 carry out being wholely set in integral type.

That the acoustical behavior of vibrating sensor shown in polyvinylidene fluoride piezoelectric sensor (PVDF piezoelectric transducer, Jinzhou Ke Xin Electron Material Co., Ltd) Yu the present embodiment tests schematic diagram shown in Fig. 9.The area of PVDF piezoelectric transducer is 30mm × 1.2mm, PVDF thickness is 30 μm.

Two sensor parallel are fixed, under same sound source condition (1kHz, 40dB), adopts low pass filter to test.Being PVDF piezoelectric transducer detection acoustic performance measuring-signal figure shown in Figure 10 (a), is PVDF piezoelectric transducer detection acoustic performance filtering signal figure shown in Figure 10 (b).Being the present embodiment vibrating sensor detection acoustic performance measuring-signal figure shown in Figure 11 (a), is the present embodiment vibrating sensor detection acoustic performance filtering signal figure shown in Figure 11 (b).Comparison diagram 10(b) and Figure 11 (b) can find out, PVDF piezo sensor output signal output voltage is 1mV, has obvious humorous wave interference, cause signal distortion, and the present embodiment vibrating sensor output voltage is 1.5mV, and the output signal remained intact, there is not signal distortion.

Figure 12 is the present embodiment vibrating sensor spectrum signal figure, Figure 13 is PVDF piezoelectric transducer spectrum signal figure.Contrast Figure 12 and Figure 13 can find out, the frequency response of PVDF piezoelectric transducer has wider bandwidth, its responsive bandwidth is mainly between 50Hz and 200Hz, and the frequency response of the present embodiment vibrating sensor mainly concentrates on low frequency frequency range, and its responsive bandwidth mainly concentrates between 0Hz and 55Hz.For heart beating and breathing vibration, mainly concentrate on below 5Hz, from above-mentioned spectral contrast, the present embodiment vibrating sensor is far better than PVDF piezoelectric transducer for the responding ability between 0Hz and 5Hz, and thus it is more suitable for the detection to the low-frequency vibration such as heart beating, breathing.

Embodiment 2

The vibrating sensor of the present embodiment is of a size of 30mm × 12mm, and gross thickness is approximately 400 μm.This vibrating sensor comprises the first electrode layer 11, the first high molecular polymer insulating barrier 12 be cascading, and the second electrode lay 13, as depicted in figs. 1 and 2.

First electrode layer 11 and the second electrode lay 13 material therefor are Copper Foil, and thickness is 100 μm.First high molecular polymer insulating barrier 12 is composite polymer layer, and material therefor is the composite polymer films (Yongtai plastics) that pet film and polypropylene film are formed, and thickness is 130 μm.The side that first high molecular polymer insulating barrier 12 is relative with the second electrode lay 13 is provided with rhombus bulge-structure, and height of projection is 50 μm, and the long-diagonal length of rhombus is 0.1mm, and the spacing of adjacent two rhombuses is 0.1mm.First high molecular polymer insulating barrier 12 carries out being wholely set in integral type with the second electrode lay 13.

Be fixed on culture dish by parallel for the vibrating sensor of the present embodiment, under 1kHz, 40dB sound source condition, adopt low pass filter to test.Process after filtering, output voltage is 1.2mV, and the vibrating sensor of the present embodiment has excellent low frequency Detection results.

The frequency response of the present embodiment vibrating sensor mainly concentrates on low frequency frequency range, and its responsive bandwidth mainly concentrates between 0Hz and 55Hz.Be applicable to the detection to the low-frequency vibration such as heart beating, breathing.

Embodiment 3

The vibrating sensor of the present embodiment is of a size of 30mm × 12mm, and gross thickness is approximately 1mm.This vibrating sensor 3 comprises the first electrode layer 31, the first high molecular polymer insulating barrier 32 be cascading, thin layer 33 between two parties, the second high molecular polymer insulating barrier 34 and the second electrode lay 35, as shown in Figure 5 and Figure 6.

First electrode layer 31 material therefor is Copper Foil, and its thickness is 70 μm, and the second electrode lay 35 material therefor is tungsten, and its thickness is 130 μm.First high molecular polymer insulating barrier 32 and the second high molecular polymer insulating barrier 34 are single polymers layer, and material therefor is pet film (Yongtai plastics), and thickness is 100 μm.Thin layer 33 is composite polymer layer between two parties, and material therefor is the composite polymer films that pet film (Yongtai plastics) is formed with polypropylene film (Yongtai plastics), and thickness is 150 μm.Two side surfaces of thin layer 33 are between two parties equipped with striated bulge-structure, and height of projection is 0.9mm, and the width of striated figure is 4mm, and the spacing of adjacent two striated figures is 0.5mm.First high molecular polymer insulating barrier 32, thin layer 33 and the second high molecular polymer insulating barrier 34 carry out being wholely set in integral type between two parties.

Be fixed on culture dish by parallel for the present embodiment vibrating sensor, under 1kHz, 40dB sound source condition, adopt low pass filter to test.Process after filtering, output voltage is 1.2mV, and the present embodiment vibrating sensor has excellent low frequency Detection results.

Embodiment 4

The vibrating sensor of the present embodiment is of a size of 30mm × 12mm, and gross thickness is approximately 1mm.This vibrating sensor 4 comprises the first electrode layer 41, the first high molecular polymer insulating barrier 42 be cascading, intervening electrode layer 43, second high molecular polymer insulating barrier 44 and the second electrode lay 45, as shown in Figure 7 and Figure 8.

First electrode layer 41 and the second electrode lay 45 material therefor are Copper Foil, and its thickness is 100 μm, and intervening electrode layer 43 material therefor is aluminium foil, and its thickness is 100 μm; The composite polymer films that first high molecular polymer insulating barrier 42 adopts pet film (Yongtai plastics) and polydimethylsiloxanefilm film (Yongtai plastics) to form, thickness is 150 μm, second high molecular polymer insulating barrier 44 material therefor is pet film (Yongtai plastics), and thickness is 150 μm.The side surface that first high molecular polymer insulating barrier 42 is relative with intervening electrode layer 43 is provided with zigzag bulge-structure, and height of projection is 1mm, and the width of zigzag figure is 5mm, and the spacing of adjacent two zigzag figures is 1mm.First high molecular polymer insulating barrier 42 carries out being wholely set in integral type with intervening electrode layer 43.

Be fixed on culture dish by parallel for the vibrating sensor of the present embodiment, under 1kHz, 40dB sound source condition, adopt low pass filter to test.Process after filtering, output voltage is 1.0mV, and the present embodiment vibrating sensor has excellent low frequency Detection results.

Claims

1. a vibrating sensor, is characterized in that, comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and the second side surface of described first high molecular polymer insulating barrier is arranged towards the second side surface of described the second electrode lay;

2. a vibrating sensor, is characterized in that, comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier, and the second side surface of described second high molecular polymer insulating barrier is arranged towards the second side surface of described first high molecular polymer insulating barrier;

3. a vibrating sensor, is characterized in that, comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, intervening electrode layer, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier; Described intervening electrode layer is arranged between the second side surface of described first high molecular polymer insulating barrier and the second side surface of described second high molecular polymer insulating barrier, and the second side surface of the first side surface of described intervening electrode layer and described first high molecular polymer insulating barrier is oppositely arranged, the second side surface of described intervening electrode layer and the second side surface of described second high molecular polymer insulating barrier are oppositely arranged;

4. a vibrating sensor, is characterized in that, comprises the first electrode layer be cascading, the first high molecular polymer insulating barrier, between two parties thin layer, the second high molecular polymer insulating barrier and the second electrode lay; Wherein said first electrode layer is arranged on the first side surface of described first high molecular polymer insulating barrier, and described the second electrode lay is arranged on the first side surface of described second high molecular polymer insulating barrier; Described thin layer is between two parties polymer film layer, be arranged between the second side surface of described first high molecular polymer insulating barrier and the second side surface of described second high molecular polymer insulating barrier, and the second side surface of the first side surface of described thin layer between two parties and described first high molecular polymer insulating barrier is oppositely arranged, the second side surface of described thin layer between two parties and the second side surface of described second high molecular polymer insulating barrier are oppositely arranged;

5. the vibrating sensor according to any one of claim 1-4, is characterized in that, described in be fixedly connected be being fixedly connected with of being fixedly connected with by plasma treatment or using pressure sensitive adhesive to be fixedly connected with and realize.

6. the vibrating sensor according to any one of claim 1-5, is characterized in that, the height of described bulge-structure is 1 μm of-1mm.

7. the vibrating sensor according to any one of claim 1-6, is characterized in that, described bulge-structure forms the array that cross section is fringe-like structures, well shape structure, diamond shaped structure, Z-shaped structure or interdigital structure.

8. vibrating sensor according to claim 7, is characterized in that, described bulge-structure connects on its surface that at least side is fixedly connected with, and each the width connected is 0.1mm-5mm.

9. vibrating sensor according to claim 8, is characterized in that, described bulge-structure connects on the surface that its side is fixedly connected with; On the surface that its opposite side is fixedly connected with, point connects or line connection.

10. the vibrating sensor according to any one of claim 1-9, is characterized in that, the distance between adjacent two bulge-structures is 0.1mm-1mm.

11. vibrating sensors according to any one of claim 1-4, it is characterized in that, described first high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

12. vibrating sensors according to any one of claim 2-4, it is characterized in that, described second high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

13. vibrating sensors according to claim 4, is characterized in that, described thin layer is between two parties single polymers layer or composite polymer layer.

14. vibrating sensors according to any one of claim 11-13, it is characterized in that, described single polymers layer material therefor is selected from polydimethylsiloxanefilm film, Kapton, polypropylene film, aniline-formaldehyde resin thin film, polyformaldehyde thin film, ethyl cellulose film, polyamide film, melamino-formaldehyde thin film, Polyethylene Glycol succinate thin film, cellulose membrane, cellulose acetate film, 10PE27 thin film, polydiallyl phthalate thin film, cellulose sponge thin film, renewable sponge thin film, elastic polyurethane body thin film, styrene-acrylonitrile copolymer copolymer film, styrene-butadiene-copolymer thin film, staple fibre thin film, polymethyl methacrylate film, polyvinyl alcohol film, polyisobutylene thin film, pet film, polyvinyl butyral film, formaldehyde-phenol condensation polymer thin film, neoprene thin film, butadiene-propylene copolymer thin film, natural rubber films, polyacrylonitrile thin film, any one in acrylonitrile vinyl chloride copolymer thin film,

The preparation method of 15. 1 kinds of vibrating sensors, is characterized in that, the method comprises:

Wherein, step (1) or step (2) is only carried out;

The preparation method of 16. 1 kinds of vibrating sensors, is characterized in that, the method comprises:

The preparation method of 17. 1 kinds of vibrating sensors, is characterized in that, the method comprises:

The preparation method of 18. 1 kinds of vibrating sensors, is characterized in that, the method comprises:

Wherein, step (1) or step (2) is only carried out;

The preparation method of 19. vibrating sensors according to any one of claim 15-18, is characterized in that, described in be fixedly connected with and be fixedly connected with by plasma treatment or use pressure sensitive adhesive to be fixedly connected with and realize.

The preparation method of 20. vibrating sensors according to any one of claim 15-18, it is characterized in that, the described bulge-structure that arranges is realized by method for printing screen.

The preparation method of 21. vibrating sensors according to any one of claim 15-20, is characterized in that, be set to by described bulge-structure connect on its surface that at least side is fixedly connected with, and each the width connected is 0.1mm-5mm.

22. vibrating sensors according to claim 21, is characterized in that, are set to by described bulge-structure connect on the surface that its side is fixedly connected with, and on the surface that its opposite side is fixedly connected with, point connects or line connection.

The preparation method of 23. vibrating sensors according to any one of claim 15-18, it is characterized in that, described first high molecular polymer insulating barrier is single polymers layer or composite polymer layer.

The preparation method of 24. vibrating sensors according to any one of claim 16-18, it is characterized in that, described second high molecular polymer insulating barrier is single polymers layer.

The preparation method of 25. vibrating sensors according to claim 18, is characterized in that, described thin layer is between two parties single polymers layer or composite polymer layer.