CN104717851B - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
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- CN104717851B CN104717851B CN201310683454.9A CN201310683454A CN104717851B CN 104717851 B CN104717851 B CN 104717851B CN 201310683454 A CN201310683454 A CN 201310683454A CN 104717851 B CN104717851 B CN 104717851B
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Abstract
The embodiment of the invention discloses a kind of electronic equipment, the electronic equipment includes housing, the housing includes one layer or more of the material layer arranged in the form of first, one layer or more of the material layer arranged in the form of first is made to be connected as one to be molded by the first treatment process；Material layer in described one layer or more material layer includes more than one material；More than one the material includes at least the first material；Wherein, the first material in described one layer or more material layer is continuously arranged；First material has insulating properties.Using the technical solution of the embodiment of the present invention, effectively avoid electronic equipment housing be all made of conductor material caused by signal shielding, ensure that the communication quality of electronic equipment, and reduce industrial cost.
Description
Technical field
The present invention relates to terminal devices, and in particular to a kind of electronic equipment.
Background technology
At present, portable electronic equipment for it is light-weighted require it is higher and higher, carbon fibre material have high intensity and
The characteristics of low-density, is also more and more applied on electronic equipment.But carbon fiber is natural conductor, as shell
Main material can cause signal shielding, can not work normally the receiver of wireless signal.Although may be used embedment project into
Type technique solves the problems, such as the signal shielding of carbon fiber skin, but requirement of this technique to Tool and Die Technology is very high, the system of mold
Making need to be very fine, therefore industrial production cost is higher.
Invention content
To solve existing technical problem, the embodiment of the present invention provides a kind of electronic equipment, is avoided that electronic equipment
Housing be all made of conductor material caused by signal shielding, and reduce industrial cost.
In order to achieve the above objectives, the technical solution of the embodiment of the present invention is realized in：
An embodiment of the present invention provides a kind of electronic equipment, the electronic equipment includes housing, the housing include with
One layer or more of material layer of the first form arrangement makes described one layer or more to arrange in the form of first by the first treatment process
Material layer be connected as one and be molded；
Material layer in described one layer or more material layer includes more than one material；
More than one the material includes at least the first material；
Wherein, the first material in described one layer or more material layer is continuously arranged；First material has insulating properties.
Electronic equipment provided in an embodiment of the present invention, the electronic equipment include housing, and the housing is included with first
One layer or more of material layer of form arrangement makes the more than one material arranged in the form of first by the first treatment process
The bed of material is connected as one and is molded；Material layer in described one layer or more material layer includes more than one material；Described one kind
Above material includes at least the first material；Wherein, the first material in described one layer or more material layer is continuously arranged；Described
One material has insulating properties.In this way, the housing for effectively preventing electronic equipment is believed caused by being all made of conductor material
Number shielding, ensure that the communication quality of electronic equipment, and cost is greatly reduced in industrial processes.
Description of the drawings
Fig. 1 is the diagrammatic cross-section one of the housing of electronic equipment of the embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section two of the housing of electronic equipment of the embodiment of the present invention；
Fig. 3 is the diagrammatic cross-section three of the housing of electronic equipment of the embodiment of the present invention；
Fig. 4 is the diagrammatic cross-section four of the housing of electronic equipment of the embodiment of the present invention；
Fig. 5 is the diagrammatic cross-section five of the housing of electronic equipment of the embodiment of the present invention；
Fig. 6 is the diagrammatic cross-section six of the housing of electronic equipment of the embodiment of the present invention；
Fig. 7 is the diagrammatic cross-section seven of the housing of electronic equipment of the embodiment of the present invention；
Fig. 8 is the diagrammatic cross-section eight of the housing of electronic equipment of the embodiment of the present invention；
Fig. 9 is the diagrammatic cross-section nine of the housing of electronic equipment of the embodiment of the present invention；
Figure 10 is the diagrammatic cross-section ten of the housing of electronic equipment of the embodiment of the present invention；
Figure 11 is the diagrammatic cross-section 11 of the housing of electronic equipment of the embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.
Embodiment one
Fig. 1 is the diagrammatic cross-section one of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in Figure 1, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, by more than one the material
Prepreg presses default laying scheme superposition, by hot press forming technology by entire plate forming after the completion of superposition.
Wherein, more than one the material includes at least the first material, and first material has insulating properties, and institute
The first material stated in one layer or more material layer is continuously arranged；First material can be glass fibre, non-conductive hardness
The higher insulating materials of the hardness such as plastics, to protect electronic equipment.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved.
Embodiment two
Fig. 2 is the diagrammatic cross-section two of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in Fig. 2, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
In addition, more than one the material can also include other materials, Fig. 3 and Fig. 4 are electronics of the embodiment of the present invention
The diagrammatic cross-section three of the housing of equipment and schematic diagram four, more than one the material further include other materials such as third material
Material；The third material can intert laying with the second material and be superimposed, as shown in figure 3, can also with the second material laid out in parallel,
As shown in Figure 4；In the case of including third material, the first material in described one layer or more material layer may be contained within the material
The side of the bed of material, and the first material in described one layer or more material layer is continuously arranged；Similarly, including third material etc. its
In the case of his material, the moulding process of the material layer is identical with the moulding process of above two material, and details are not described herein again.
Wherein, first material has insulating properties；Wherein, first material can be glass fibre, it is non-conductive
The higher insulating materials of the hardness such as durometer plastic, to protect electronic equipment.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved.
Embodiment three
Fig. 5 is the diagrammatic cross-section five of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in figure 5, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in figure 5, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer material
The width y of the first material in material layer outside the bed of material has the range of 17mm to 25mm.
Wherein, first material has insulating properties；Wherein, first material can be glass fibre, it is non-conductive
The higher insulating materials of the hardness such as durometer plastic, to protect electronic equipment.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved.
Example IV
Fig. 6 is the diagrammatic cross-section six of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in fig. 6, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in fig. 6, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer material
The width y of the first material in material layer outside the bed of material has the range of 17mm to 25mm.
Wherein, in one Yi Shang material layer, first material and second material are arranged respectively by default fiber
Column direction is arranged, as shown in fig. 6, housing includes eight layer of material；Wherein, in the first layer of material, the fiber row of the first material
Column direction is set as 0 degree, and the fiber direction of the second material is set as 90 degree；In second layer of material, the fibre of the first material
Dimension orientation is set as 90 degree, and the fiber direction of the second material is set as 0 degree；In third layer of material, the first material
Fiber direction be set as 90 degree, the fiber direction of the second material is set as 90 degree；In 4th layer of material, first
The fiber direction of material is set as 0 degree, and the fiber direction of the second material is set as 90 degree；In layer 5 material layer,
The fiber direction of first material is set as 0 degree, and the fiber direction of the second material is set as 90 degree；Layer 6 material layer
In, the fiber direction of the first material is set as 90 degree, and the fiber direction of the second material is set as 90 degree；Layer 7 material
In the bed of material, the fiber direction of the first material is set as 90 degree, and the fiber direction of the second material is set as 0 degree；8th
In layer of material, the fiber direction of the first material is set as 0 degree, and the fiber direction of the second material is set as 90 degree；
Wherein, the fiber direction of the material is relative direction, if setting the fiber direction of a certain material as 0 degree, institute
The vertical direction of fiber direction for stating material is 90 degree.
Wherein, first material has insulating properties；Wherein, first material can be glass fibre, it is non-conductive
The higher insulating materials of the hardness such as durometer plastic, to protect electronic equipment.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved.
Embodiment five
Fig. 7 is the diagrammatic cross-section seven of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in fig. 7, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in fig. 7, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer material
The width y of the first material in material layer outside the bed of material has the range of 17mm to 25mm.
Wherein, first material has insulating properties；In the present embodiment, first material is glass fibre, to protect
Demonstrate,prove communication quality；
Wherein, second material is carbon fiber, and the second material in one Yi Shang material layer is that tensile modulus is
The carbon fiber of any one in 24 tons to 80 tons, it is 65 tons to 80 tons that the second material in outermost material layer, which is tensile modulus,
In the carbon fiber of any one；In the present embodiment, the second material in outermost material layer is the carbon that tensile modulus is 65 tons
Fiber, the second material in remaining each material layer are the carbon fiber that tensile modulus is 24 tons.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved；In addition, it can effectively be protected as outermost layer by using the higher carbon fibre material of hardness
Protect electronic equipment.
Embodiment six
Fig. 8 is the diagrammatic cross-section eight of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in figure 8, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in figure 8, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer material
The width y of the first material in material layer outside the bed of material has the range of 17mm to 25mm.
Wherein, first material has insulating properties；In the present embodiment, first material is glass fibre, to protect
Demonstrate,prove communication quality；
Wherein, second material is carbon fiber, and the second material in one Yi Shang material layer is that tensile modulus is
The carbon fiber of any one in 24 tons to 80 tons, it is 65 tons to 80 tons that the second material in outermost material layer, which is tensile modulus,
In the carbon fiber of any one；In the present embodiment, the second material in outermost material layer is the carbon that tensile modulus is 80 tons
Fiber.
This way it is possible to avoid the housing of electronic equipment be all made of conductor material caused by signal shielding, so as to protect
The communication quality of electronic equipment is demonstrate,proved；In addition, it can effectively be protected as outermost layer by using the higher carbon fibre material of hardness
Protect electronic equipment.
Embodiment seven
Fig. 9 is the diagrammatic cross-section nine of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in figure 9, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in figure 9, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer material
The width y of the first material in material layer outside the bed of material has the range of 17mm to 25mm.
Wherein, first material has insulating properties；In the present embodiment, first material is glass fibre, to protect
Demonstrate,prove communication quality；
Wherein, second material is carbon fiber, and the second material in one Yi Shang material layer is that tensile modulus is
The carbon fiber of any one in 24 tons to 80 tons, it is 65 tons to 80 tons that the second material in outermost material layer, which is tensile modulus,
In the carbon fiber of any one；In the present embodiment, the second material in outermost material layer is the carbon that tensile modulus is 65 tons
Fiber, the second material in addition to outermost material layer are the carbon fiber that tensile modulus is 24 tons.
Wherein, in one Yi Shang material layer, the glass fiber material and the carbon fibre material are respectively by default
Fiber direction is arranged, as shown in figure 9, housing includes ten layer of material；Wherein, in the first layer of material, glass fibre material
The fiber direction of material is set as 0 degree, and tensile modulus is that the fiber direction of 65 tons of carbon fibre material is set as 90 degree；
In second layer of material, the fiber direction of glass fiber material is set as 90 degree, and tensile modulus is 24 tons of carbon fiber material
The fiber direction of material is set as 0 degree；In third layer of material, the fiber direction of glass fiber material is set as 90
Degree, tensile modulus are that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；In 4th layer of material, glass fibre
The fiber direction of material is set as 90 degree, and tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90
Degree；In layer 5 material layer, the fiber direction of glass fiber material is set as 0 degree, and tensile modulus is 24 tons of carbon fiber
The fiber direction of material is set as 90 degree；In layer 6 material layer, the fiber direction of glass fiber material is set as 0
Degree, tensile modulus are that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；In layer 7 material layer, glass fibre
The fiber direction of material is set as 90 degree, and tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90
Degree；In 8th layer of material, the fiber direction of glass fiber material is set as 90 degree, and tensile modulus is 24 tons of carbon fiber
The fiber direction of material is set as 90 degree；In 9th layer of material, the fiber direction of glass fiber material is set as
90 degree, tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 0 degree；In tenth layer of material, glass fibers
The fiber direction of dimension material is set as 0 degree, and tensile modulus is that the fiber direction of 65 tons of carbon fibre material is set as
90 degree；Wherein, the fiber direction of the material is relative direction, if setting the fiber direction of material as 0 degree, institute
It is 90 degree to state the vertical direction of fiber direction.
Wherein, the number of plies of one Yi Shang material layer is related with the selection of the second material, in the present embodiment, described outer
The carbon fibre material of layer has chosen the carbon fibre material that tensile modulus is 65 tons, in the fiber direction for optimizing every layer material
Afterwards, the number of plies for making one Yi Shang material layer is ten layers, and ten layers of thickness of shell is about 1.3mm, and having reached effectively to protect
Shield electronic equipment can reduce the purpose of industrial production cost again；Also, the housing of electronic equipment can also be avoided all by conductor
Signal shielding caused by material composition, so as to ensure that the communication quality of electronic equipment.
Embodiment eight
Figure 10 is the diagrammatic cross-section ten of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be notes
This computer, tablet computer, mobile phone etc.；As shown in Figure 10, the housing includes one layer or more of material layer, described one layer or more
Material layer is arranged by the first form, and first form is the form of upper and lower laying；One to arrange in the form of first
Above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming work
Skill.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width；As shown in Figure 10, the width x of the first material in outermost material layer has the range of 12mm to 20mm；Except outermost layer
The width y of the first material in material layer outside material layer has the range of 17mm to 25mm.
Wherein, first material has insulating properties；In the present embodiment, first material is glass fibre, to protect
Demonstrate,prove communication quality；
Wherein, second material is carbon fiber, and the second material in one Yi Shang material layer is that tensile modulus is
The carbon fiber of any one in 24 tons to 80 tons, it is 65 tons to 80 tons that the second material in outermost material layer, which is tensile modulus,
In the carbon fiber of any one；In the present embodiment, the second material in outermost material layer is the carbon that tensile modulus is 80 tons
Fiber.
Wherein, in one Yi Shang material layer, the glass fiber material and the carbon fibre material are respectively by default
Fiber direction is arranged, as shown in figure 9, housing includes eight layer of material；Wherein, in the first layer of material, glass fibre material
The fiber direction of material is set as 0 degree, and tensile modulus is that the fiber direction of 80 tons of carbon fibre material is set as 90 degree；
In second layer of material, the fiber direction of glass fiber material is set as 90 degree, and tensile modulus is 80 tons of carbon fiber material
The fiber direction of material is set as 0 degree；In third layer of material, the fiber direction of glass fiber material is set as 0 degree,
Tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；In 4th layer of material, glass fibre material
The fiber direction of material is set as 0 degree, and tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；
In layer 5 material layer, the fiber direction of glass fiber material is set as 0 degree, and tensile modulus is 24 tons of carbon fibre material
Fiber direction be set as 90 degree；In layer 6 material layer, the fiber direction of glass fiber material is set as 0 degree,
Tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；In layer 7 material layer, glass fibre material
The fiber direction of material is set as 90 degree, and tensile modulus is that the fiber direction of 80 tons of carbon fibre material is set as 0 degree；
In 8th layer of material, the fiber direction of glass fiber material is set as 0 degree, and tensile modulus is 80 tons of carbon fibre material
Fiber direction be set as 90 degree；Wherein, the fiber direction of the material is relative direction, if the fibre of setting material
It is 0 degree to tie up orientation, then the vertical direction of the fiber direction is 90 degree.
Wherein, the number of plies of one Yi Shang material layer is related with the selection of the second material, in the present embodiment, described outer
The carbon fibre material of layer has chosen the carbon fibre material that tensile modulus is 80 tons, in the fiber direction for optimizing every layer material
Afterwards, the number of plies of one Yi Shang material layer is made to be reduced to eight layers, eight layers of thickness of shell is about 1mm, and having reached can be effective
The purpose that protection electronic equipment can make the housing of electronic equipment frivolous again；Also, the housing that can also avoid electronic equipment is whole
Signal shielding caused by being made of conductor material, so as to ensure that the communication quality of electronic equipment.
Embodiment nine
Figure 11 is the diagrammatic cross-section 11 of the housing of electronic equipment of the embodiment of the present invention, and the electronic equipment can be pen
Remember this computer, tablet computer, mobile phone etc.；As shown in figure 11, the housing includes one layer or more of material layer, described one layer or more
Material layer arranged by the first form, first form be upper and lower laying form；The one of the arrangement in the form of first
A above material layer is connected as one to be molded by the first treatment process, and first treatment process can be hot-forming
Technique.
Material layer in described one layer or more material layer includes more than one material, wherein, more than one the material
Material includes at least the first material, further includes the second material；The first material in described one layer or more material layer may be contained within described
The side of material layer, and the first material in described one layer or more material layer is continuously arranged；Wherein, positioned at the material layer one
First material of side can be set to the long side of the housing and both sides short side；Preferably, when the electronic equipment is notebook
During computer, it is set in the both sides long side of the casting of electronic device far from shaft positioned at the first material of the material layer side
The communication quality during long side of side is optimal.
The prepreg of first material and the second material by default laying scheme is overlapped, is passed through after the completion of superposition
Hot press forming technology is by entire plate forming；The default laying scheme is in described one layer or more material layer, per layer material
The capacity of first material of layer and the prepreg of the second material, in the case where every layer of material has equal length and thickness,
It is characterized by the width of the first material in every layer of material and the second material.
Wherein, in one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm
Degree；In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width（In the present embodiment, except the 4th material layer and the 5th material layer）；As shown in figure 11, the first material in outermost material layer
The width x of material has the range of 12mm to 20mm；The width y of the first material in material layer in addition to outermost material layer has
The range of 17mm to 25mm.
Wherein, first material has insulating properties；In the present embodiment, first material is glass fibre, to protect
Demonstrate,prove communication quality；
Wherein, second material is carbon fiber, and the second material in one Yi Shang material layer is that tensile modulus is
The carbon fiber of any one in 24 tons to 80 tons, it is 65 tons to 80 tons that the second material in outermost material layer, which is tensile modulus,
In the carbon fiber of any one；In the present embodiment, the second material in outermost material layer is the carbon that tensile modulus is 80 tons
Fiber.
In the present embodiment, in one Yi Shang material layer, the glass fiber material and carbon fibre material difference
It arranges by default fiber direction, as shown in figure 9, housing includes eight layer of material；Wherein, in the first layer of material, glass
The fiber direction of fibrous material is set as 0 degree, and tensile modulus is the fiber direction setting of 80 tons of carbon fibre material
It is 90 degree；In second layer of material, the fiber direction of glass fiber material is set as 90 degree, and tensile modulus is 80 tons of carbon
The fiber direction of fibrous material is set as 0 degree；In third layer of material, the fiber direction setting of glass fiber material
It it is 0 degree, tensile modulus is that the fiber direction of 24 tons of carbon fibre material is set as 90 degree；4th layer of material and layer 5
Material layer is glass fiber material, and 0 degree of glass fiber material is set as including fiber direction；Layer 6 material layer
In, the fiber direction of glass fiber material is set as 0 degree, and tensile modulus is the fiber alignment side of 24 tons of carbon fibre material
To being set as 90 degree；In layer 7 material layer, the fiber direction of glass fiber material is set as 90 degree, tensile modulus 80
The fiber direction of the carbon fibre material of ton is set as 0 degree；In 8th layer of material, the fiber alignment side of glass fiber material
To being set as 0 degree, tensile modulus is that the fiber direction of 80 tons of carbon fibre material is set as 90 degree；Wherein, the material
Fiber direction for relative direction, if setting the fiber direction of material as 0 degree, the fiber direction is vertical
Direction be 90 degree.
Wherein, the number of plies of one Yi Shang material layer is related with the selection of the second material, in the present embodiment, described outer
The carbon fibre material of layer has chosen the carbon fibre material that tensile modulus is 80 tons, in the fiber direction for optimizing every layer material
Afterwards, the number of plies of one Yi Shang material layer is made to be reduced to eight layers, eight layers of thickness of shell is about 1mm, and having reached can be effective
The purpose that protection electronic equipment can make the housing of electronic equipment frivolous again；Also, the housing that can also avoid electronic equipment is whole
Signal shielding caused by being made of conductor material, so as to ensure that the communication quality of electronic equipment；In addition, the intermediate the 4th
Glass fiber material is all had chosen in layer and layer 5 material layer, effectively reduces industrial cost.
In several embodiments provided herein, it should be understood that disclosed equipment can be by others side
Formula is realized.Apparatus embodiments described above are only schematical, can have other dividing mode in actual implementation, such as
Some features can be ignored.In addition, the mutual coupling of shown or discussed each component part or direct-coupling or logical
Letter connection can be by some interfaces, the INDIRECT COUPLING or communication connection of equipment or unit, can be it is electrical, mechanical or
Other forms.
The above-mentioned unit illustrated as separating component can be or may not be physically separate, be shown as unit
The component shown can be or may not be physical unit；Part or all of list therein can be selected according to the actual needs
Member realizes the purpose of this embodiment scheme.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in change or replacement, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of electronic equipment, the electronic equipment includes housing, which is characterized in that the housing includes arranging in the form of first
One layer or more of material layer of cloth connects one layer or more of the material layer arranged in the form of first by the first treatment process
It is connected in one and is molded；
Material layer in described one layer or more material layer includes more than one material；
More than one the material includes at least the first material and the second material；
Wherein, the first material in described one layer or more material layer is continuously arranged；First material has insulating properties；
The first material in described one layer or more material layer may be contained within the side of the material layer.
2. electronic equipment according to claim 1, which is characterized in that
In one Yi Shang material layer, the first material in outermost material layer has the width of 12mm to 20mm；
In one Yi Shang material layer, the first material in the material layer in addition to outermost material layer has 17mm to 25mm
Width.
3. electronic equipment according to claim 2, which is characterized in that in one Yi Shang material layer, first material
Material and second material are arranged respectively by default fiber direction.
4. electronic equipment according to claim 3, which is characterized in that in one Yi Shang material layer, outermost material
The second material in layer is that tensile modulus is the carbon fiber of any one in 65 tons to 80 tons.
5. electronic equipment according to claim 4, which is characterized in that when the second material in the outermost material layer is
When tensile modulus is 65 tons of carbon fiber, in one Yi Shang material layer, the in the material layer in addition to outermost material layer
Two materials are the carbon fiber that tensile modulus is 24 tons.
6. electronic equipment according to claim 4, which is characterized in that when the second material in the outermost material layer is
When tensile modulus is 80 tons of carbon fiber, in one Yi Shang material layer, the second material in first time cladding material layer is
Tensile modulus is 80 tons of carbon fiber；
The second material in addition to the outermost material layer and first time cladding material layer is the carbon fiber that tensile modulus is 24 tons.
7. electronic equipment according to claim 3, which is characterized in that one Yi Shang material layer includes eight layers；It is described
In more than one material layer, the 4th layer is formed with layer 5 by first material；
First layer, the second layer, third layer, layer 6, layer 7, the 8th layer formed by the first material and the second material.
8. electronic equipment according to claim 7, which is characterized in that first layer, the first material in the 8th layer have
The width of 12mm to 20mm；
The first material in the second layer, third layer, layer 6, layer 7 has 17mm to 25mm width.
9. electronic equipment according to claim 8, which is characterized in that first layer, the second layer, layer 7, in the 8th layer
Second material is the carbon fiber that tensile modulus is 80 tons；
The second material in third layer, layer 6 is the carbon fiber that tensile modulus is 24 tons.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310683454.9A CN104717851B (en) | 2013-12-12 | 2013-12-12 | A kind of electronic equipment |
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|---|---|---|---|
| CN201310683454.9A CN104717851B (en) | 2013-12-12 | 2013-12-12 | A kind of electronic equipment |
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| CN104717851A CN104717851A (en) | 2015-06-17 |
| CN104717851B true CN104717851B (en) | 2018-07-06 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056431A (en) * | 2009-10-29 | 2011-05-11 | 昆山同寅兴业机电制造有限公司 | Local structure of case at wireless equipment |
| CN202587628U (en) * | 2011-11-25 | 2012-12-05 | 曾凯熙 | Composite material housing of electronic product for preventing signal block |
| CN102970837A (en) * | 2011-08-31 | 2013-03-13 | 华硕电脑股份有限公司 | Rigid reinforced composite material and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI445483B (en) * | 2010-12-23 | 2014-07-11 | Compal Electronics Inc | Shell structure and electronic device having the same |
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2013
- 2013-12-12 CN CN201310683454.9A patent/CN104717851B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056431A (en) * | 2009-10-29 | 2011-05-11 | 昆山同寅兴业机电制造有限公司 | Local structure of case at wireless equipment |
| CN102970837A (en) * | 2011-08-31 | 2013-03-13 | 华硕电脑股份有限公司 | Rigid reinforced composite material and manufacturing method thereof |
| CN202587628U (en) * | 2011-11-25 | 2012-12-05 | 曾凯熙 | Composite material housing of electronic product for preventing signal block |
Also Published As
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| CN104717851A (en) | 2015-06-17 |
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