CN104717833A - Common mode inductor and manufacturing method thereof - Google Patents
Common mode inductor and manufacturing method thereof Download PDFInfo
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- CN104717833A CN104717833A CN201510141913.XA CN201510141913A CN104717833A CN 104717833 A CN104717833 A CN 104717833A CN 201510141913 A CN201510141913 A CN 201510141913A CN 104717833 A CN104717833 A CN 104717833A
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- coil
- common mode
- circuit board
- mode inductance
- chokes portion
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Abstract
The invention discloses a common mode inductor which comprises a coil and a circuit board. The coil comprises a choke flow portion, a first leading out portion connected to one end of the choke flow portion and a second leading out portion connected to the other end of the choke flow portion, the coil is of a double-wire structure, the choke flow portion is arranged on the first surface of the circuit board, the two wires of the choke flow portion are parallel to each other, the two wires are wound from inside to outside on the first surface to form a multi-coil structure from small to large, the tail end of an outermost coil of the multi-coil structure is connected with the first leading out portion, and two passing holes are formed in the circuit board and at the position of an innermost coil of the multi-coil structure. The second leading out portion is arranged on the second surface of the circuit board and penetrates through the two passing holes to be connected with the tail end of the innermost coil of the choke flow portion. The invention further discloses a manufacturing method of the common mode inductor. The common mode inductor is wound directly through wires of the circuit board, the cost of a framework and a magnetic core is saved, and the cost of the common mode inductor is further reduced.
Description
Technical field
The present invention relates to electronic devices and components field, particularly relate to a kind of common mode inductance, also relate to a kind of manufacture method of common mode inductance.
Background technology
Common mode inductance (Common mode Choke), is also common mode choke, is used to the conventional device suppressing electromagnetic radiation.Conventional manufacture method is coiling on magnet ring, and the magnetic line of force that two coils are produced is identical, causes mutual mould inductance to strengthen, thus weakens the size of common mode current.And the common mode inductance of device class is mainly made up of skeleton, magnetic core and coil at present, coil winding is on magnetic core.
Concerning this conventional device of common mode inductance, little by little the reduction of cost, has huge meaning for cost control.
Summary of the invention
Based on this, be necessary the common mode inductance that a kind of low cost is provided.
A kind of common mode inductance, comprise coil and circuit board, described coil comprises chokes portion, be connected to first lead division of one end, chokes portion and the second lead division of the chokes portion other end, described coil is two-conductor line structure, described chokes portion is located at the first surface of described circuit board, two wires in chokes portion be parallel to each other and in described first surface from inside to outside coiling form ascending multi-turn structure, the end of the outmost turns of described multi-turn structure is connected with described first lead division, described circuit board offers two via holes at the innermost circle place of described multi-turn structure, described second lead division is located at the second surface of circuit board, and be connected with the end of chokes portion innermost circle through described two via holes.
Wherein in an embodiment, described circuit board is printed circuit board (PCB).
Wherein in an embodiment, described circuit board is flexible PCB.
Wherein in an embodiment, described multi-turn structure is swirl shape structure.
Wherein in an embodiment, described multi-turn structure is square ring structure.
Wherein in an embodiment, described multi-turn structure is triangle coil structures.
Wherein in an embodiment, described coil, when logical differential signal, passes into the contrary signal of current direction for two wires from coil.
A manufacture method for common mode inductance, comprises step: provide circuit board substrate, hole on the substrate, comprise two via holes, form coil on the substrate, described coil comprises chokes portion, be connected to first lead division of one end, chokes portion and the second lead division of the chokes portion other end, described coil is two-conductor line structure, described chokes portion is located at the first surface of described substrate, two wires in chokes portion be parallel to each other and in described first surface from inside to outside coiling form ascending multi-turn structure, the end of described multi-turn structure innermost circle penetrates described two via holes, and the second surface worn to described substrate, be connected with the second lead division being located at described second surface, the end of the outmost turns of described multi-turn structure is connected with described first lead division.
Wherein in an embodiment, described circuit board is printed circuit board (PCB) or flexible printing plate.
Wherein in an embodiment, described multi-turn structure is swirl shape structure, square ring structure or triangle coil structures.
Above-mentioned common mode inductance and manufacture method thereof, directly carry out coiling with circuit board wiring, can save the cost of skeleton, magnetic core, thus reduce the cost of common mode inductance.
Accompanying drawing explanation
By the more specifically explanation of the preferred embodiments of the present invention shown in accompanying drawing, above-mentioned and other object of the present invention, Characteristics and advantages will become more clear.Reference numeral identical in whole accompanying drawing indicates identical part, and does not deliberately draw accompanying drawing by actual size equal proportion convergent-divergent, focuses on purport of the present invention is shown.
Fig. 1 is the structural representation of common mode inductance in an embodiment;
The structural representation of Fig. 2 is chokes portion when being swirl shape structure coil;
Fig. 3 is the flow chart of the manufacture method of common mode inductance in an embodiment.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.First-selected embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, the object of these embodiments is provided to be make to disclosure of the present invention more thoroughly comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Fig. 1 is the structural representation of common mode inductance in an embodiment, comprises circuit board 10 and coil.Coil comprises chokes portion, is connected to the second lead division of first lead division of one end, chokes portion and the chokes portion other end.Coil is two-conductor line structure, and chokes portion comprises wire 222 and wire 224, first lead division comprises wire 242 and wire 244, second lead division comprises wire 262 and wire 264.Chokes portion is located at the first surface of circuit board 10, the front namely in Fig. 1, the wire 222 in chokes portion and wire 224 be parallel to each other and in first surface from inside to outside coiling form ascending multi-turn structure.The end of the outmost turns of this multi-turn structure is connected with the first lead division, and namely wire 222 is connected with wire 242, and wire 224 is connected with wire 244.Circuit board 10 offers via hole 23 and via hole 25 at the innermost circle place of multi-turn structure.Second lead division is located at the second surface of circuit board, the back side namely in Fig. 1, and represented by dashed line.Second lead division is connected with the end of chokes portion innermost circle through two via holes, and namely wire 262 is connected with wire 222 through via hole 23, and wire 264 is connected with wire 264 through via hole 25.It is pointed out that in figure and represent chokes portion and lead division with the line that thickness is different, distinguish when being just convenient to see figure, do not represent actual weight relationship.
Above-mentioned common mode inductance, directly carries out coiling with circuit board wiring, can save the cost of skeleton, magnetic core, thus reduce the cost of common mode inductance.
When connecting up, two wires of coil should be close together as far as possible under the prerequisite of technique license, the inner ring diameter (r namely in Fig. 1) of coil under the prerequisite of space and technique license as much as possible greatly, to obtain larger mutual inductance.
When there being common mode current by above-mentioned common mode inductance, the electric current of coil two wire is identical, the magnetic direction produced is also identical, because two wires are close together tightly, make mutual inductance can reach about 80% of self-induction, its inductance value of the common mode inductance of such coiling can reach hundreds of nh rank, has good inhibition for common-mode noises more than hundred megahertzes.It should be noted that when carrying out circuit design, coil will be made when logical differential signal, and the current direction passed in two wires is contrary.Therefore, when logical differential signal, because two current in wire are contrary, cancelling out each other in magnetic field, does not affect differential signal.
The multi-turn structure in chokes portion, except can being the structure of square ring shown in Fig. 1, also can be swirl shape structure, triangle coil structures etc.The structural representation of Fig. 2 is chokes portion when being swirl shape structure coil, the semicircle that chokes portion is increased successively by two groups of radiuses forms.
In the embodiment shown in fig. 1, circuit board 10 is printed circuit board (PCB) (PCB), also can be flexible PCB (FPC) in other embodiments.
The present invention also provides a kind of manufacture method of common mode inductance, as shown in Figure 3, comprises the following steps:
S310, provides circuit board substrate.
Sawing sheet, obtain the circuit board substrate of required size, being printed circuit board (PCB) in the present embodiment, also can be flexible PCB etc. in other embodiments.
S320, substrate is holed.
On substrate, corresponding position gets out required aperture, comprises two via holes needed for common mode inductance.
S330, substrate forms coil.
On substrate, the copper conductor of required figure is formed as coil by figure transfer process, and corresponding formation green oil layer.Coil comprises chokes portion, is connected to the second lead division of first lead division of one end, chokes portion and the chokes portion other end.Coil is two-conductor line structure, and chokes portion is located at the first surface of substrate, two wires in chokes portion be parallel to each other and in first surface from inside to outside coiling form ascending multi-turn structure.The end of this multi-turn structure innermost circle penetrates two via holes formed in step S320, and wears the second surface to substrate, is connected with the second lead division being located at second surface.The end of the outmost turns of multi-turn structure is connected with the first lead division.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a common mode inductance, it is characterized in that, comprise coil and circuit board, described coil comprises chokes portion, be connected to first lead division of one end, chokes portion and the second lead division of the chokes portion other end, described coil is two-conductor line structure, described chokes portion is located at the first surface of described circuit board, two wires in chokes portion be parallel to each other and in described first surface from inside to outside coiling form ascending multi-turn structure, the end of the outmost turns of described multi-turn structure is connected with described first lead division, described circuit board offers two via holes at the innermost circle place of described multi-turn structure, described second lead division is located at the second surface of circuit board, and be connected with the end of chokes portion innermost circle through described two via holes.
2. common mode inductance according to claim 1, is characterized in that, described circuit board is printed circuit board (PCB).
3. common mode inductance according to claim 1, is characterized in that, described circuit board is flexible PCB.
4. common mode inductance according to claim 1, is characterized in that, described multi-turn structure is swirl shape structure.
5. common mode inductance according to claim 1, is characterized in that, described multi-turn structure is square ring structure.
6. common mode inductance according to claim 1, is characterized in that, described multi-turn structure is triangle coil structures.
7. common mode inductance according to claim 1, is characterized in that, described coil, when logical differential signal, passes into the contrary signal of current direction for two wires from coil.
8. a manufacture method for common mode inductance, comprises step:
Circuit board substrate is provided;
Hole on the substrate, comprise two via holes;
Form coil on the substrate, described coil comprises chokes portion, be connected to first lead division of one end, chokes portion and the second lead division of the chokes portion other end, described coil is two-conductor line structure, described chokes portion is located at the first surface of described substrate, two wires in chokes portion be parallel to each other and in described first surface from inside to outside coiling form ascending multi-turn structure, the end of described multi-turn structure innermost circle penetrates described two via holes, and the second surface worn to described substrate, be connected with the second lead division being located at described second surface, the end of the outmost turns of described multi-turn structure is connected with described first lead division.
9. the manufacture method of common mode inductance according to claim 8, is characterized in that, described circuit board is printed circuit board (PCB) or flexible printing plate.
10. the manufacture method of common mode inductance according to claim 8, is characterized in that, described multi-turn structure is swirl shape structure, square ring structure or triangle coil structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141913.XA CN104717833A (en) | 2015-03-27 | 2015-03-27 | Common mode inductor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141913.XA CN104717833A (en) | 2015-03-27 | 2015-03-27 | Common mode inductor and manufacturing method thereof |
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| CN104717833A true CN104717833A (en) | 2015-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510141913.XA Pending CN104717833A (en) | 2015-03-27 | 2015-03-27 | Common mode inductor and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112769248A (en) * | 2021-04-07 | 2021-05-07 | 西安电掣风云智能科技有限公司 | Close-range one-to-many wireless charging device and system |
| US11869700B2 (en) | 2019-09-11 | 2024-01-09 | Realtek Semiconductor Corporation | Inductor device |
| US11901399B2 (en) | 2019-09-11 | 2024-02-13 | Realtek Semiconductor Corporation | Enhanced sensing coil for semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716467A (en) * | 2004-07-01 | 2006-01-04 | Tdk株式会社 | Thin film coil, method of manufacturing the same, coil structure, and method of manufacturing the same |
| US20060055495A1 (en) * | 2004-09-15 | 2006-03-16 | Rategh Hamid R | Planar transformer |
| US20080120828A1 (en) * | 2006-11-28 | 2008-05-29 | Whitworth Adam J | High Density Planarized Inductor And Method Of Making The Same |
| US20080136574A1 (en) * | 2006-12-11 | 2008-06-12 | Industrial Technology Research Institute | Embedded inductor devices and fabrication methods thereof |
| CN203644754U (en) * | 2013-12-18 | 2014-06-11 | 江阴长电先进封装有限公司 | Packaging structure of integrated common mode inductor |
-
2015
- 2015-03-27 CN CN201510141913.XA patent/CN104717833A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716467A (en) * | 2004-07-01 | 2006-01-04 | Tdk株式会社 | Thin film coil, method of manufacturing the same, coil structure, and method of manufacturing the same |
| US20060055495A1 (en) * | 2004-09-15 | 2006-03-16 | Rategh Hamid R | Planar transformer |
| US20080120828A1 (en) * | 2006-11-28 | 2008-05-29 | Whitworth Adam J | High Density Planarized Inductor And Method Of Making The Same |
| US20080136574A1 (en) * | 2006-12-11 | 2008-06-12 | Industrial Technology Research Institute | Embedded inductor devices and fabrication methods thereof |
| CN203644754U (en) * | 2013-12-18 | 2014-06-11 | 江阴长电先进封装有限公司 | Packaging structure of integrated common mode inductor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11869700B2 (en) | 2019-09-11 | 2024-01-09 | Realtek Semiconductor Corporation | Inductor device |
| US11901399B2 (en) | 2019-09-11 | 2024-02-13 | Realtek Semiconductor Corporation | Enhanced sensing coil for semiconductor device |
| CN112769248A (en) * | 2021-04-07 | 2021-05-07 | 西安电掣风云智能科技有限公司 | Close-range one-to-many wireless charging device and system |
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Application publication date: 20150617 |
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