CN104701445A - PCB of LED indicator board for automobile instrument and design method of PCB - Google Patents
PCB of LED indicator board for automobile instrument and design method of PCB Download PDFInfo
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- CN104701445A CN104701445A CN201510130443.7A CN201510130443A CN104701445A CN 104701445 A CN104701445 A CN 104701445A CN 201510130443 A CN201510130443 A CN 201510130443A CN 104701445 A CN104701445 A CN 104701445A
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Abstract
The invention provides a PCB of an LED indicator board for an automobile instrument and a design method of the PCB and belongs to the field of the PCBs of the LED indicator boards. The PCB is used for solving the problem that the structure of the PCB of the LED indicator lamp is not advantageous for dissipating the LED heat. The PCB of the LED indicator board for the automobile instrument is characterized in that each of two bonding pads of each LED is covered with a large-area copper coating, and the area of the copper coating is three times larger than the area of the LED bonding pad. According to the design method of the PCB of the LED indicator board for the automobile instrument, the large-area copper coating is designed on each of two bonding pads of each LED and the area of the copper coating is three times larger than the area of the LED bonding pad. The LEDs are effectively prevented from damage due to that the temperature rises along with the working time, and the service life of the LEDs is prolonged. The PCB and the design method are suitable for the design field of the LED indicator boards for the automobile instruments.
Description
Technical field
The invention belongs to the pcb board design field of LED indicator board, particularly relate to the pcb board design field of the LED indicator board of meter for car.
Background technology
The LED of meter for car, i.e. light-emitting diode, be now widely used in this field, and which kind of reason is just damaged often to have some LED not know in the pcb board of LED indicator board, is once once causing manufacture field and is perplexing greatly.By carefully studying, have found the reason causing it to damage: there are two block pins LED inside, be called the support of LED, wherein negative bracket is larger, and reason is the chip that negative bracket holder carries LED, and two positive bracket are then relatively little, during LED work, itself can generate heat, and the negative bracket of LED support is large, and therefore this end temperature is high.Again because meter for car needs long-time unlatching, therefore along with the lengthening of operating time, temperature will be more and more higher, and when temperature is elevated to limiting value, negative pole chip will be damaged, causes LED not work.As shown in Figure 1, i.e. the pcb board screen printing layer of existing LED indicator board and the schematic diagram of top layer copper clad layers, as can be seen from the figure, in printed board, each LED two ends are directly welded on pad, and be unfavorable for the derivation of LED heat, therefore LED easily damages.
Summary of the invention
The present invention is the structure of the pcb board in order to solve existing LED indicator board, is unfavorable for the derivation of LED heat, and then causes LED to hold flimsy problem, now provides pcb board and the method for designing thereof of automobile instrument LED indicator board.
The automobile instrument pcb board of LED indicator board, two pad places of each LED are all coated with large-area copper clad layers, and the area of copper clad layers is greater than 3 times of LED bonding pad area.
The copper clad layers area equation at two pad places of same LED.
On pcb board, all LED are arranged in parallel, and parallel with the minor face of pcb board.
The automobile instrument method for designing of the pcb board of LED indicator board, the method is: design large-area copper clad layers at two pad places of each LED, and the area of this layers of copper is greater than 3 times of LED bonding pad area.
Two pad places of same LED cover the area equation of layers of copper.
LED all on pcb board are designed to the structure be parallel to each other, and all parallel with the minor face of pcb board.
The pcb board of automobile instrument LED indicator board of the present invention, two pad places of each LED are all designed with large-area copper clad layers, the thermal conductivity of copper is large, therefore the heat being conducive to LED electrical pole to produce is derived, the damage that can effectively prevent LED from raising along with operating time, temperature and causing, extends the useful life of LED.
In the present invention, the area equation of the copper clad layers at two pad places of same LED, makes LED two pins in welding process basically identical by thermal velocity, thus avoids occurring phenomenon of setting up a monument.
In the present invention, on pcb board, all LED be arranged in parallel mutually, and parallel with the minor face of pcb board, this kind of method for designing, loosening of the damage can avoiding causing due to the deformation of pcb board LED to cause due to longitudinal stress or pad, and then effectively extend the useful life of LED.
The method for designing of the pcb board of above-mentioned automobile instrument LED indicator board, large-area copper clad layers is designed respectively at two pad places of each LED, and the area of this layers of copper is greater than 3 times of LED bonding pad area, two pad places of same LED cover the area equation of layers of copper, LED all on pcb board are designed to the structure be parallel to each other, and all parallel with the minor face of pcb board.Adopt the LED indicator board of the method design acquisition in actual use, the heat that two electrodes being very beneficial for LED produce guides and causes copper clad layers and then distribute, effectively prevent the damage that LED raises along with operating time, temperature and causes, extend the useful life of LED; And the firing rate of LED two pads in welding process can be made consistent, thus the appearance of phenomenon of avoiding setting up a monument; When pcb board produces Bending Deformation, can also prevent the distance between two of LED pads from changing, and then the LED of welding can not be affected, and then avoid the damage to LED simultaneously, extend the useful life of LED.
Accompanying drawing explanation
Fig. 1 is the pcb board screen printing layer of existing LED indicator board and the schematic diagram of top layer copper clad layers;
The pcb board screen printing layer of Fig. 2 for the LED indicator board described in embodiment one and the schematic diagram of top layer copper clad layers.
Embodiment
Embodiment one: illustrate present embodiment with reference to Fig. 2, automobile instrument described in the present embodiment pcb board of LED indicator board, two pad places of each LED are all coated with large-area copper clad layers, and the area of copper clad layers is greater than 3 times of LED bonding pad area.
In the pcb board of automobile instrument described in present embodiment with LED indicator board, two pad places of each LED are all coated with large-area copper clad layers, because the thermal conductivity of copper is good, therefore the heat that two electrodes that this kind of structure is very beneficial for LED produce guides and causes copper clad layers and then distribute, effectively prevent the damage that LED raises along with operating time, temperature and causes, extend the useful life of LED.
Embodiment two: present embodiment is described further the pcb board of the automobile instrument LED indicator board described in embodiment one, in present embodiment, the copper clad layers area equation at two pad places of same LED.
Because the negative bracket of LED support is large, the temperature that negative pole produces in LED luminescence process can be higher, therefore, increases cover that copper face is long-pending can meet the manufacturing process characteristics requirement of LED own at the pad place that LED negative pole pin is corresponding.It is then to meet welding procedure characteristic that the pad place increase that on pcb board, LED positive pole pin is corresponding is covered copper face long-pending, because if the covering copper face product moment and more not greatly, then the firing rate of two pads in welding process can be caused inconsistent of two of LED pad places, and then increase the probability that phenomenon of setting up a monument occurs.In present embodiment same LED two pad places cover copper area equation, make the firing rate of LED two pads in welding process consistent, thus the appearance of phenomenon of avoiding setting up a monument.
Embodiment three: present embodiment is described further the pcb board of the automobile instrument LED indicator board described in embodiment one or two, and in present embodiment, on pcb board, all LED are arranged in parallel, and parallel with the minor face of pcb board.
The pcb board of vapour automobile-used LED indicator board is rectangle, and length can much larger than width, and the LED in present embodiment is arranged along the bond length direction arrangement of printed board.In the process of practical application, due to factors such as printed board intensifications, distortion can be caused, that is: rectangle base plate produces flexural deformation, mode of texturing is all that the generation of long limit is bending, if according to original method for designing, LED is parallel to long limit and places, this just causes under the prerequisite of the deformation of PCB version, distance between two pads of LED is elongated or shorten, and then cause producing stress between two of welded LED pins, and then will cause LED pad loosen, LED component damage, and even LED fractures.In order to avoid base plate deformation is to the damage of LED, in the pcb board of the LED indicator board described in present embodiment, the axle of all LED is all parallel with the minor face of pcb board.When pcb board produces Bending Deformation, the distance between two of LED pads can not be made to change, and then the LED of welding can not be affected, and then avoid the damage to LED, extend the useful life of LED.
Embodiment four: the method for designing of the pcb board of LED indicator board of the automobile instrument described in embodiment one, the method is: design large-area copper clad layers at two pad places of each LED, and the area of this layers of copper is greater than 3 times of LED bonding pad area.
In the method for designing of automobile instrument described in present embodiment with the pcb board of LED indicator board, large-area copper clad layers is designed at two pad places of each LED, because the thermal conductivity of copper is good, the LED indicator board of the acquisition therefore utilizing this method to design in actual use, the heat that two electrodes being very beneficial for LED produce guides and causes copper clad layers and then distribute, effectively prevent the damage that LED raises along with operating time, temperature and causes, extend the useful life of LED.
Embodiment five: present embodiment is described further the method for designing of the pcb board of the automobile instrument LED indicator board described in embodiment four, in present embodiment, two pad places of same LED cover the area equation of layers of copper.
Because the negative bracket of LED support is large, the temperature that negative pole produces in LED luminescence process can be higher, therefore, increases cover that copper face is long-pending can meet the manufacturing process characteristics requirement of LED own at the pad place that LED negative pole pin is corresponding.It is then to meet welding procedure characteristic that the pad place design increase that on pcb board, LED positive pole pin is corresponding is covered copper face long-pending, because if the covering copper face product moment and more not greatly, then the firing rate of two pads in welding process can be caused inconsistent of two of LED pad places, and then increase the probability that phenomenon of setting up a monument occurs.In present embodiment, two pad places of same LED cover the area equation of layers of copper, make the firing rate of LED two pads in welding process consistent, thus the appearance of phenomenon of avoiding setting up a monument.
Embodiment six: present embodiment is described further the method for designing of the pcb board of the automobile instrument LED indicator board described in embodiment four or five, in present embodiment, LED all on pcb board are designed to the structure be parallel to each other, and all parallel with the minor face of pcb board.
The pcb board of vapour automobile-used LED indicator board is rectangle, and LED all on pcb board much larger than width, can be designed to the structure be parallel to each other by length in present embodiment, and all parallel with the minor face of pcb board.In the process of practical application, due to factors such as printed board intensifications, distortion can be caused, that is: rectangle base plate produces flexural deformation, mode of texturing is all that the generation of long limit is bending, if according to original method for designing, LED is parallel to long limit and places, this just causes under the prerequisite of the deformation of PCB version, distance between two pads of LED is elongated or shorten, and then cause producing stress between two of welded LED pins, and then will cause LED pad loosen, LED component damage, and even LED fractures.In order to avoid base plate deformation is to the damage of LED, utilize in the pcb board of automobile instrument LED indicator board of the method design described in present embodiment, the axle of all LED is all parallel with the minor face of pcb board.When pcb board produces Bending Deformation, the distance between two of LED pads can not be made to change, and then the LED of welding can not be affected, and then avoid the damage to LED, extend the useful life of LED.
Claims (6)
1. the automobile instrument pcb board of LED indicator board, is characterized in that, two pad places of each LED are all coated with large-area copper clad layers, and the area of copper clad layers is greater than 3 times of LED bonding pad area.
2. the pcb board of automobile instrument LED indicator board according to claim 1, is characterized in that, the copper clad layers area equation at two pad places of same LED.
3. the pcb board of automobile instrument LED indicator board according to claim 1 and 2, it is characterized in that, on pcb board, all LED are arranged in parallel, and parallel with the minor face of pcb board.
4. the method for designing of the pcb board of automobile instrument LED indicator board according to claim 1, it is characterized in that, the method is: design large-area copper clad layers at two pad places of each LED, and the area of this layers of copper is greater than 3 times of LED bonding pad area.
5. the method for designing of the pcb board of automobile instrument LED indicator board according to claim 4, is characterized in that, two pad places of same LED cover the area equation of layers of copper.
6. the method for designing of the pcb board of LED indicator board of the automobile instrument according to claim 4 or 5, is characterized in that, LED all on pcb board is designed to the structure be parallel to each other, and all parallel with the minor face of pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130443.7A CN104701445A (en) | 2015-03-24 | 2015-03-24 | PCB of LED indicator board for automobile instrument and design method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130443.7A CN104701445A (en) | 2015-03-24 | 2015-03-24 | PCB of LED indicator board for automobile instrument and design method of PCB |
Publications (1)
| Publication Number | Publication Date |
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| CN104701445A true CN104701445A (en) | 2015-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510130443.7A Pending CN104701445A (en) | 2015-03-24 | 2015-03-24 | PCB of LED indicator board for automobile instrument and design method of PCB |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997016948A1 (en) * | 1995-10-31 | 1997-05-09 | Sumitomo Bakelite Company Limited | Multilayer printed circuit board and process for producing the same |
| CN101795533A (en) * | 2009-12-11 | 2010-08-04 | 福建星网锐捷网络有限公司 | Circuit board and copper-spreading method thereof |
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Six-pin 5050 LED lamp welding pad |
-
2015
- 2015-03-24 CN CN201510130443.7A patent/CN104701445A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997016948A1 (en) * | 1995-10-31 | 1997-05-09 | Sumitomo Bakelite Company Limited | Multilayer printed circuit board and process for producing the same |
| CN101795533A (en) * | 2009-12-11 | 2010-08-04 | 福建星网锐捷网络有限公司 | Circuit board and copper-spreading method thereof |
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Six-pin 5050 LED lamp welding pad |
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Application publication date: 20150610 |