CN104701278B - The cooling mechanism of common type of power module - Google Patents
The cooling mechanism of common type of power module Download PDFInfo
- Publication number
- CN104701278B CN104701278B CN201310667286.4A CN201310667286A CN104701278B CN 104701278 B CN104701278 B CN 104701278B CN 201310667286 A CN201310667286 A CN 201310667286A CN 104701278 B CN104701278 B CN 104701278B
- Authority
- CN
- China
- Prior art keywords
- heat sink
- cooling chamber
- pinboard
- base
- sink body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of cooling mechanism of common type of power module：Heat sink body includes base, top plate and the shrouding being fixed on the inside of between base and top plate simultaneously form a cooling space, at least two dividing plates are fixed on base, between top plate and shrouding, cooling space is separated into the cooling chamber of two or more independence, base bottom is provided with the lower pipe connection communicated with respective cooling chamber, top plate top is provided with the upper pipe joint communicated with respective cooling chamber, the front portion of each cooling chamber has the mounting surface of heat sink body, first power model or/and pinboard are sealingly mounted on each self-corresponding mounting surface, second power model is sealingly mounted on pinboard.Of the invention reasonable, simple, versatility is good, and using flexible is convenient, by the installation of polymorphic type power model centralization and can radiate, and radiating effect is stable, adapts to power model generalization, centralization and diversified development trend.
Description
Technical field
The present invention relates to a kind of cooling mechanism of common type of power module, belong to power model technical field.
Background technology
Semi-conductor power module mainly include copper base, cover cermet substrate, semiconductor chip and electrode terminal and
Housing.In semi-conductor power module in the course of the work, heat caused by semiconductor chip by copper base and can be transferred to
On the radiator of its underpart, the heat in semiconductor chip is shed.But with the development of technology, the power of power device is more next
Higher, the power consumption of semiconductor chip is also gradually increasing, and often heat caused by semiconductor chip is also increasing, therefore needs
The heat of semiconductor chip to be shed in time.Power model is used cooperatively in the installing space very little of postorder in addition at present
The use of power module package diversification of forms and multi-quantity power model, all cause the density of power model gradually whole
Add, this also proposes higher requirement to the external cooling condition of power model.
It is a kind of using conventional finned radiator for power model cooling mechanism at present, radiator is connected to copper
The bottom of substrate, the height of one side radiator is higher, therefore can increase the setting height(from bottom) of power device, makes its volume larger,
For some narrow and small installing spaces, then can not be applicable.Especially user needs the power model by multiple standards to enter when in use
Row combination is, it is necessary to design large-size radiator to place multiple power models respectively, and not only space-consuming is big, and this knot
The radiator of structure also limit the application of power model.The cooling mechanism of another structure is to be combined fan and radiator,
But the cooling mechanism of this structure not only needs to take larger space, nor can fit also for single power model
Answer power model generalization, centralization and diversified development trend.
The content of the invention
It is an object of the invention to provide a kind of rational in infrastructure, simple, versatility is good, and using flexible is convenient, can be by multiclass
The power model of type is installed concentratedly and radiated, and the cooling mechanism of the common type of power module of radiating effect stabilization.
The present invention is that the technical scheme for reaching above-mentioned purpose is：A kind of cooling mechanism of common type of power module, its feature
It is：Including a heat sink body, the heat sink body includes base, top plate and is fixed between base and top plate and is located at
The shrouding at middle part forms a cooling space, and heat sink body is through hole in prismatic and prismatic middle parts more than three sides,
At least two dividing plates are fixed between base, top plate and shrouding, and cooling space is separated into the cooling chamber of two or more independence, dissipated
Hot main body is provided with 3~8 mounting surfaces, and base bottom is provided with the lower pipe connection communicated with respective cooling chamber, and top plate top is provided with
The upper pipe joint communicated with respective cooling chamber, the front portion of each cooling chamber have a mounting surface of heat sink body, the first power model or/
It is sealingly mounted at pinboard on each self-corresponding mounting surface, the second power model is sealingly mounted on pinboard.
The heat sink body of the present invention is provided with the cooling chamber of two or more independence, and each cooling chamber of heat sink body forms an installation
Face, therefore the three-dimensional mounting surface of two or more can be formed on heat sink body, the first power model or/pinboard are arranged on respective
Mounting surface on, and the second power model is arranged on heat sink body again by pinboard, therefore can be by different model and size
Multiclass power model install concentratedly on heat sink body, by upper, lower tube joint by outside cooling medium be passed through each cooling
Intracavitary, forces that caused heat carries out forced heat radiation at work to each hot block of power mould by cooling medium, rational in infrastructure,
Simply, the present invention can not only increase the area of dissipation of power model, and to improve radiating effect, and radiating effect is stable.This hair
It is bright that heat sink body is designed with multiple mounting surfaces, can installation dimension is identical or size differs multiclass on a heat sink body
Power model, can be three-dimensional on heat sink body by multiclass power model, has preferable versatility, can significantly save peace
Space is filled, the quantity of power model combination and the flexibility of combination is also increased, facilitates the postorder of user to install, adapt to power
Module generalization, centralization and diversified development trend.
Brief description of the drawings
Embodiments of the invention are described in further detail below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the cooling mechanism of common type of power module of the present invention.
Fig. 2 is Fig. 1 A to structural representation.
Fig. 3 is that the cooling mechanism of common type of power module of the present invention opens the structural representation of the first cover plate.
Fig. 4 is that the cooling mechanism of common type of power module of the present invention removes the second cover plate and the structure of both sides and the first cover plate
Schematic diagram.
Wherein：1-the first power model, 2-heat sink body, 2-1-upper pipe joint, 2-2-upper connecting base, 2-3-top
Plate, 2-4-shrouding, 2-5-leg, 2-6-and around flowing plate, 2-7-dividing plate, 2-8-base, 2-9-preceding seal groove, 2-10-under
Pipe joint, 2-11-mounting surface, 2-12-lower connecting base, 3-fastener, the 4-the first cover plate, 5-pinboard, 5-l-switching
Connecting seat, the 6-the second power model, the 7-the second cover plate, the 8-the first sealing ring, the 9-the second sealing ring.
Embodiment
As shown in Fig. 1~4, the cooling mechanism of common type of power module of the invention, including a heat sink body 2.This hair
Bright heat sink body 2 includes base 2-8, top plate 2-3 and is fixed between base 2-8 and top plate 2-3 and positioned at the envelope at middle part
Plate forms a cooling space, and at least two dividing plate 2-7 are fixed between base 2-8, top plate 2-3 and shrouding 2-4, and cooling is empty
Between be separated into the cooling chamber of two or more independence, therefore multiple three-dimensional cooling units can be formed on a heat sink body 2.This hair
Bright base 2-8, top plate 2-3 and shrouding and dividing plate 2-7 can integral manufacturing, or base 2-8, top plate 2-3 and shrouding 2-4 and
Dividing plate 2-7 partial installations, base 2-8 bottoms are provided with least three leg 2-5, and leg 2-5 can be fixed leg, or for can
The leg of mode.Base 2-8 bottoms of the present invention are provided with the lower pipe connection 2-10 communicated with respective cooling chamber, and top plate 2-3 tops are set
There is the upper pipe joint 2-1 communicated with respective cooling chamber, each cooling unit of the present invention is using upper water inlet and lower water outlet, heat sink body 2
Each upper pipe joint 2-1 be connected respectively by pipeline with each self-corresponding magnetic valve；Each cooling unit of the present invention can also use
Lower water inlet and upper water-out, each lower pipe connection 2-10 of heat sink body 2 are connected with each self-corresponding magnetic valve by pipeline, made respectively
Each cooling unit has independent magnetic valve controlled feed, visual specific cooling requirements, the quantity for the magnetic valve opened.
As shown in Fig. 1~4, the front portion of each cooling chamber of the present invention has the mounting surface 2-11 of heat sink body 2, the first power mould
Block 1 or/and pinboard 5 are sealingly mounted on each self-corresponding mounting surface 2-11, and the second power model 6 is sealingly mounted at pinboard
On 5, heat sink body 2 is on the other mounting surface 2-11 for being fitted without the first power model 1 or/and pinboard 5, also sealing installation
There is the first cover plate 4, on the one hand can keep the overall appearance of cooling mechanism, on the other hand, cooling medium can also be passed through and indirect
The second power model 6 to the first power model 1 or/and on pinboard 5 cools down.The heat sink body 2 of the present invention
It is through hole in prismatic and prismatic middle parts more than three sides, heat sink body 2 is provided with 3~8 mounting surface 2-11, sees figure
1st, shown in 2, the hexagon of heat sink body 2 of the invention, heat sink body 2 is provided with six mounting surface 2-11, can be by multiple power
Module is installed concentratedly on the heat sink body 2 and cooled down.
As shown in Fig. 2~4, the present invention is staggered provided with more than three around flowing plate 2- on two dividing plate 2-7 of each cooling chamber
6, cooling chamber is separated by the flow channel for liquids to form bending, by respectively around flowing plate 2-6 to extend cooling medium in each cooling chamber
Time, the heat of power model can fully be exchanged, and improve radiating efficiency.
As shown in Fig. 1~3, base 2-8 bottoms of the present invention are provided with lower connecting base 2-12 corresponding with respective cooling chamber, top plate
2-3 tops are provided with upper connecting base 2-2 corresponding with respective cooling chamber, and the mounting surface 2-11 of heat sink body 2 is close before being provided with first
Sealing groove 2-9, or the back side of the first power model 1 are provided with rear seal groove, before the first sealing ring 8 is arranged on first seal groove 2-9 or
Afterwards in seal groove, the first power model 1 is arranged on upper connecting base 2-2 and lower connecting base 2-12 by fastener 3, by the first work(
Rate module 1 is sealingly mounted on the mounting surface 2-11 of heat sink body 2.
As shown in 1,2 and 4, base 2-8 bottoms of the present invention are provided with lower connecting base 2-12 corresponding with respective cooling chamber, top
Plate 2-3 tops are provided with upper connecting base 2-2 corresponding with respective cooling chamber, and pinboard 5 is provided with least one window, and pinboard 5 exists
The both sides of window are respectively equipped with switching connecting seat 5-1, seal groove 2-9 before the mounting surface 2-11 of heat sink body 2 is provided with first, or
The back side on pinboard 5 is provided with rear seal groove, and the first sealing ring 8 is arranged in the first seal groove 2-8, and pinboard 5 passes through fastening
Part 3 is arranged on upper connecting base 2-2 and lower connecting base 2-12.As shown in Fig. 1,2, the pinboard 5 of invention is provided with 2~3 windows
Mouthful, pinboard 5 is located at seal groove before window is additionally provided with second, before the second sealing ring 9 is arranged on second in seal groove, the second power
The cover plate 7 of module 6 or/and second is arranged on switching connecting seat 5-1 by fastener 3, convenient that pinboard 5 is sealingly mounted at into peace
On the 2-11 of dress face, while also the second power model 6 or/and the second cover plate 7 are sealingly mounted on pinboard 5, pass through pinboard 5
Different power models can be installed.As shown in Figure 1, pinboard 5 of the invention is provided with two windows, two the second power models
6 are sealingly mounted on pinboard 5；Or as shown in Figure 2, two windows on the pinboard 5 one are with installing the second power model
6, the window without installing the second power model 6 then seals the second cover plate 7 of installation, of the invention by the first power model 1 second
Power model 6 and the different multiclass power model of more sizes are installed concentratedly on heat sink body 2 and radiated, and are installed
Mode is flexible, can meet the installation of the power model of multi items, is also postorder installation power module leaving space.
Claims (7)
- A kind of 1. cooling mechanism of common type of power module, it is characterised in that：Including a heat sink body (2), the radiating master Body (2) includes base (2-8), top plate (2-3) and is fixed between base (2-8) and top plate (2-3) and positioned at the envelope at middle part Plate (2-4) forms a cooling space, and heat sink body (2) is through hole in prismatic and prismatic middle parts more than three sides, At least two dividing plates (2-7) are fixed between base (2-8), top plate (2-3) and shrouding (2-4), and cooling space is separated into two Independent cooling chamber more than individual, heat sink body (2) are provided with 3~8 mounting surfaces (2-11), base (2-8) bottom provided with it is each The lower pipe connection (2-10) communicated from cooling chamber, top plate (2-3) top are provided with the upper pipe joint (2- communicated with respective cooling chamber 1), the front portion of each cooling chamber has the mounting surface (2-11) of heat sink body (2), the first power model (1) or/and pinboard (5) It is sealingly mounted on each self-corresponding mounting surface (2-11), the second power model (6) is sealingly mounted on pinboard (5).
- 2. the cooling mechanism of common type of power module according to claim 1, it is characterised in that：The heat sink body (2) On the other mounting surfaces (2-11) for being fitted without the first power model (1) or/and pinboard (5), first is also sealed and installed with Cover plate (4).
- 3. the cooling mechanism of common type of power module according to claim 1, it is characterised in that：The two of each cooling chamber It is staggered on dividing plate (2-7) provided with more than three around flowing plate (2-6), cooling chamber is separated by the flow channel for liquids to form bending.
- 4. the cooling mechanism of common type of power module according to claim 1, it is characterised in that：Described base (2-8) Bottom is provided with lower connecting base (2-12) corresponding with respective cooling chamber, and top plate (2-3) top is provided with corresponding with respective cooling chamber Upper connecting base (2-2), the mounting surface (2-11) of heat sink body (2) are provided with preceding seal groove, or the back side of the first power model (1) Provided with rear seal groove, the first sealing ring (8) is arranged in preceding seal groove (2-9) or rear seal groove, and the first power model (1) passes through Fastener (3) is arranged on upper connecting base (2-2) and lower connecting base (2-12).
- 5. the cooling mechanism of common type of power module according to claim 1, it is characterised in that：Described base (2-8) Bottom is provided with lower connecting base (2-12) corresponding with respective cooling chamber, and top plate (2-3) top is provided with corresponding with respective cooling chamber Upper connecting base (2-2), described pinboard (5) are provided with least one window, and pinboard (5) is respectively equipped with the both sides of window to be turned Joint chair (5-1) in succession, the mounting surface (2-11) of heat sink body (2) are provided with the back side on preceding seal groove (2-9) or pinboard (5) Provided with rear seal groove, the first sealing ring (8) is arranged in preceding seal groove (2-9), and pinboard (5) is arranged on by fastener (3) On upper connecting base (2-2) and lower connecting base (2-12).
- 6. the cooling mechanism of common type of power module according to claim 4, it is characterised in that：Described pinboard (5) Seal groove before being additionally provided with second at window, before the second sealing ring (9) is arranged on second in seal groove, the second power model (6) or/and the second cover plate (7) is arranged on switching connecting seat (5-1) by fastener (3).
- 7. the cooling mechanism of common type of power module according to claim 1, it is characterised in that：The heat sink body (2) Each lower pipe connection (2-10) or each upper pipe joint (2-1) be connected respectively by pipeline with each self-corresponding magnetic valve.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310667286.4A CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
| PCT/CN2014/074264 WO2015085682A1 (en) | 2013-12-10 | 2014-03-28 | Heat dissipation mechanism for general power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310667286.4A CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104701278A CN104701278A (en) | 2015-06-10 |
| CN104701278B true CN104701278B (en) | 2017-12-05 |
Family
ID=53348243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310667286.4A Active CN104701278B (en) | 2013-12-10 | 2013-12-10 | The cooling mechanism of common type of power module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104701278B (en) |
| WO (1) | WO2015085682A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994717A (en) * | 2015-08-08 | 2015-10-21 | 衢州昀睿工业设计有限公司 | Heat radiation device of power switch tube |
| CN106229862A (en) * | 2016-08-12 | 2016-12-14 | 南京亚派科技股份有限公司 | The installation method of power model heat dissipation wind channel in a kind of outdoor rack |
| CN107787160B (en) * | 2016-08-30 | 2020-01-03 | 中车株洲电力机车研究所有限公司 | Water-cooling heat dissipation structure of motor controller |
| DE102019202902A1 (en) * | 2019-03-04 | 2020-09-10 | Abb Schweiz Ag | Direct cooling of a converter using an embossed plate |
| FR3113440B1 (en) * | 2020-08-14 | 2022-12-30 | Valeo Siemens eAutomotive France | ELECTRICAL DEVICE WITH WATER BOX COOLING AND ELECTRICAL SYSTEM COMPRISING SUCH DEVICE |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101363600A (en) * | 2007-08-10 | 2009-02-11 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201773834U (en) * | 2010-08-05 | 2011-03-23 | 中山大洋电机制造有限公司 | Cooling mechanism of integrated power module |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN203607388U (en) * | 2013-12-10 | 2014-05-21 | 江苏宏微科技股份有限公司 | Heat radiation mechanism of power modules |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007294891A (en) * | 2006-03-30 | 2007-11-08 | Dowa Metaltech Kk | Heat sink |
| KR101367021B1 (en) * | 2012-05-23 | 2014-02-24 | 삼성전기주식회사 | Heat dissipation system for power module |
| CN203104252U (en) * | 2013-01-23 | 2013-07-31 | 深圳市汇川技术股份有限公司 | Novel heat radiation structure |
-
2013
- 2013-12-10 CN CN201310667286.4A patent/CN104701278B/en active Active
-
2014
- 2014-03-28 WO PCT/CN2014/074264 patent/WO2015085682A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101363600A (en) * | 2007-08-10 | 2009-02-11 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201773834U (en) * | 2010-08-05 | 2011-03-23 | 中山大洋电机制造有限公司 | Cooling mechanism of integrated power module |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN203607388U (en) * | 2013-12-10 | 2014-05-21 | 江苏宏微科技股份有限公司 | Heat radiation mechanism of power modules |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015085682A1 (en) | 2015-06-18 |
| CN104701278A (en) | 2015-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104701278B (en) | The cooling mechanism of common type of power module | |
| WO2019227531A1 (en) | Pipeless liquid-cooled heat dissipation system | |
| CN109936963B (en) | Heat radiation structure of charging pile | |
| CN204461167U (en) | A kind of high-power planar heater liquid-cooling heat radiator | |
| CN107256075A (en) | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink | |
| CN203607388U (en) | Heat radiation mechanism of power modules | |
| CN207555317U (en) | A kind of liquid-circulating heat radiation type LED light of high heat dispersion | |
| CN206533667U (en) | Integrated radiator | |
| CN209594131U (en) | A kind of wearable device | |
| CN201601573U (en) | Voltage regulator of double surface radiators | |
| CN106852096A (en) | A kind of water-cooling heat radiating device | |
| CN201866735U (en) | LED (light emitting diode) liquid-cooled radiating structure | |
| CN210136679U (en) | LED display screen using semiconductor refrigerating sheet for heat dissipation | |
| CN110648988B (en) | Liquid cooling heat radiator capable of giving consideration to both CPU and memory | |
| CN206629375U (en) | A kind of water-cooling heat radiating device | |
| CN210377232U (en) | Computer all-in-one machine with water cooling function | |
| CN107247493A (en) | A kind of heat spreader structures for MINI PC products | |
| CN207733155U (en) | A kind of big plane module radiator of disturbed flow type | |
| CN202309489U (en) | Novel liquid immersion type radiator | |
| CN207247969U (en) | A kind of twoport cooled plate | |
| CN205830234U (en) | A kind of combined liquid cooling and radiation device of medium-and-large-sized high frequency switch power | |
| CN210075881U (en) | Control box heat abstractor | |
| CN213272259U (en) | LED lamp heat radiation structure and LED lamp | |
| CN108462291A (en) | A kind of electric machine stand | |
| CN205124221U (en) | Earth ceremony liquid cooling ware |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |