CN104700991B - The manufacture method of inductance element and inductance element - Google Patents
The manufacture method of inductance element and inductance element Download PDFInfo
- Publication number
- CN104700991B CN104700991B CN201410719919.6A CN201410719919A CN104700991B CN 104700991 B CN104700991 B CN 104700991B CN 201410719919 A CN201410719919 A CN 201410719919A CN 104700991 B CN104700991 B CN 104700991B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- terminal
- electrode layer
- surface electrode
- core body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 41
- 229910000679 solder Inorganic materials 0.000 claims abstract description 36
- 238000009434 installation Methods 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000037237 body shape Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 34
- 239000010949 copper Substances 0.000 description 31
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 230000032683 aging Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052681 coesite Inorganic materials 0.000 description 7
- 229910052906 cristobalite Inorganic materials 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 229910052682 stishovite Inorganic materials 0.000 description 7
- 229910052905 tridymite Inorganic materials 0.000 description 7
- 238000009736 wetting Methods 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920003270 Cymel® Polymers 0.000 description 1
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The present invention provides a kind of inductance element for including Ag close to configuration surface electrode layer on installation base plate, can also prevent inductance element and its manufacture method that inductance element is electrically short-circuited to each other.Inductance element possesses：Press-powder core body, be embedded to press-powder core body inside coil and by welding the portion of terminal that is electrically connected with coil, wherein, portion of terminal has Cu base materials and the surface electrode layer formed on the surface of Cu base materials, surface electrode layer is formed by Ag or Ag alloy, portion of terminal has the solder-joint parts with being soldered to the weld part of coil and being engaged relative to installation base plate by solder, and the thickness that surface electrode layer is formed as the side of Thickness ratio solder-joint parts one of the side of weld part one is thicker.
Description
Technical field
The present invention relates to the inductance element and its manufacture method that coil is embedded to inside magnetic core.
Background technology
Patent document 1 discloses the invention related to coil-embedded dust core body.The coil-embedded dust core body has pressure
Powder core body, the coil for covering press-powder core body and the portion of terminal electrically connected with coil.Press-powder core body by Fe base amorphous alloys magnetic
Property powder and resin glue are formed.Coil and portion of terminal are formed by Cu (copper) base material.For the solder with external circuit,
The surface treatment based on plating is implemented to portion of terminal.
The press-powder core body formed by the Magnaglo and resin glue of Fe base amorphous alloys in order to improve magnetic characteristic and
It is preferred that be heat-treated after forming, thus be used in the metal needs of the surface treatment of portion of terminal will will not in above-mentioned heat treatment
Cause rotten.Moreover, in the coil-embedded dust core body described in patent document 1, being used as the Cu base materials for forming portion of terminal
Surface treatment, the surface electricity formed on the surface of Ni basalis by plating formation by Ag (silver) or Ag-Pd (silver-palladium)
Pole layer.
【Patent document 1】TOHKEMY 2011-258737 publications
But, coil-embedded dust core body as described in Patent Document 1 is such, if being formed on the surface of portion of terminal with Ag
For the surface electrode layer of main body, then in the case that core body is mounted close to each other on installation base plate, or with other ministrys of electronics industry
In the case of the close installation of part, when having carried out energization to coil and portion of terminal, the Ag included in surface electrode layer is because of battery
Effect and it is exposed, due to exposed Ag, there is a possibility that short-circuit between adjacent portion of terminal.
The content of the invention
Thus it is an object of the present invention to form the surface electrode layer comprising Ag in portion of terminal in the case of, even if
The portion of terminal and other portion of terminal etc. can also be suppressed to Ag exposed inductance element and its manufacture method close to configuration.
In order to solve above-mentioned problem, inductance element of the invention possesses press-powder core body, is embedded to the inside of press-powder core body
Coil and the portion of terminal electrically connected by welding with coil, the inductance element is characterised by, portion of terminal have Cu base materials and
The surface electrode layer formed on the surface of Cu base materials, surface electrode layer is formed by Ag or Ag alloy, and portion of terminal, which has, to be soldered
To coil weld part and be mounted opposite the solder-joint parts that substrate is engaged by solder, surface electrode layer is formed as the side of weld part one
The side of Thickness ratio solder-joint parts one thickness it is thick.
The present invention on the surface of portion of terminal by forming the surface electrode layer for including Ag, so that surface electrode layer will not be because of warm
Processing etc. and it is apt to deteriorate.Moreover, by suppressing the thickness of the surface electrode layer comprising Ag in solder-joint parts, so as to
The control Ag exposed because of galvanic action amount, it is thus close with other inductance elements or other electronic units on installation base plate
During installation, easily prevent that short circuit occurs due to exposed Ag.On the other hand, because the weld part of portion of terminal is increased comprising Ag
Surface electrode layer thickness, therefore, it is possible to ensure the weld strength of portion of terminal and coil.
In the inductance element of the present invention, preferably portion of terminal has the part for being embedded to press-powder core body and exposed from press-powder core body
Part, welding position is formed in the inside of press-powder core body, the surface electrode layer of the part exposed from press-powder core body of portion of terminal
For the thickness of the surface electrode layer of Thickness ratio weld part.
Because solder distribution is wide in the part exposed from press-powder core body, therefore in the presence of due to galvanic action, Ag is exposed
Possibility.Therefore, the thickness on the surface by making portion of terminal in the part exposed from press-powder core body is thinning, so as to suppress
Exposed Ag amount.
In the inductance element of the present invention, the thickness of the surface electrode layer at preferred weld portion is more than 2 μm and less than 8 μm,
The thickness of surface electrode layer at solder-joint parts is more than 0.2 μm and less than 1.3 μm.
By the way that the thickness of the surface electrode layer at weld part is set into more than 2 μm and less than 8 μm, so as to ensure and line
The weld strength of circle.In addition, by setting the thickness of the surface electrode layer at solder-joint parts as more than 0.2 μm and less than 1.3 μm,
So as to ensure solder wetting.
In the inductance element of the present invention, preferred weld portion is resistance weld.
In the manufacture method of the inductance element of the present invention, inductance element possesses press-powder core body, is embedded to press-powder core body
Internal coil and the portion of terminal electrically connected with coil, portion of terminal is with the weld part for being soldered to coil and relative to installation base
The solder-joint parts that plate is engaged by solder, the manufacture method of the inductance element is characterised by, including：By the Cu base materials of portion of terminal
Be formed as defined shape, on the surface of portion of terminal with the thick layer side of the side of Thickness ratio solder-joint parts one of the side of weld part one
The process that formula is formed surface electrode layer by Ag or Ag alloy；By the way that coil is welded into weld part and electric connecting terminal sub-portion and line
The process of circle；With the process for making press-powder core body shape and bury the above-mentioned coil for being connected to portion of terminal in press-powder core body.
Also, also include the process for implementing heat treatment to press-powder core body.
According to the manufacture method, in the surface electrode layer comprising Ag, by suppressing the thickness of solder-joint parts, so as to
Enough control the Ag exposed because of galvanic action amount.
In the manufacture method of the inductance element of the present invention, preferably in portion of terminal, basalis is formed on the surface of Cu base materials,
Surface electrode layer is formed by plating process on the surface of the basalis.
In the manufacture method of the inductance element of the present invention, preferably fetched by electric resistance welding and coil and portion of terminal are welded
Connect.
(invention effect)
By the present invention, by forming the surface electrode layer for including Ag on the surface of portion of terminal, so as to prevent heat from drawing
Going bad for the surface electrode layer risen, can make the wettability of the surface solder of portion of terminal be in good state all the time.Moreover, i.e.
Make in the case that the installation interval between other inductance elements or other electronic units narrows, can also suppress because of battery effect
Ag's is exposed Deng caused by, and portion of terminal can be made to maintain high weld strength with coil.
Brief description of the drawings
Fig. 1 is the solid for carrying out fractional transmission to the overall structure of the inductance element of embodiments of the present invention to represent
Figure.
Inductance element shown in Fig. 1 is installed to the partial elevational view of the state on installation base plate for expression by Fig. 2.
Fig. 3 amplifies longitudinal section for Fig. 2 region A part.
Fig. 4 is the stereogram for representing the terminal electrode plate in the embodiment shown in Fig. 1.
The fixture that Fig. 5 is formed for expression in the terminal electrode plate shown in Fig. 4 employed in the process of surface electrode layer
The stereogram of structure.
Fig. 6 is the top view for the manufacturing process for representing the inductance element shown in Fig. 1.
Embodiment
Hereinafter, come to carry out the inductance element of embodiments of the present invention and the manufacture method of inductance element referring to the drawings
Describe in detail.
First, 1~Fig. 3 of reference picture, the structure to the inductance element of present embodiment is illustrated.
Fig. 1 carries out the stereogram that fragmentary perspective is represented for the overall structure of the inductance element 1 to present embodiment.Fig. 1
In, represented with the posture of the lower surface (mounting surface) of inductance element 1 upward.Fig. 2 is first by the inductance shown in Fig. 1 for expression
Part 1 is installed on the partial elevational view of the state on installation base plate 10.Fig. 3 amplifies longitudinal section for Fig. 2 region A part.
Inductance element 1 shown in Fig. 1 is configured to possess：Press-powder core body 3, it is used as the coil being embedded to inside press-powder core body 3
Hollow coil 2 and by welding a pair of end sub-portion 4 for being electrically connected with hollow coil 2.
Hollow coil 2 is that the wire that will be covered by dielectric film winds coil formed by curl.Hollow coil 2 is constituted
For extraction end 2b, the 2b drawn with wound portion 2a and from wound portion 2a.The number of turn of hollow coil 2 can be according to required inductance
And suitably set.
Press-powder core body 3 is cured into for the powder of such as Fe base amorphous alloys by binding material (resin glue)
The part of shape.As Fe base amorphous alloys, the Fe and Ni, Sn, Cr, P, C, B, Si (its as principal component e.g. with the addition of
In, Ni, Sn, Cr, B, Si addition are arbitrary) and the non-retentive alloy of composition.Can be by this Fe base amorphous alloys example
Such as it is fabricated to by atomization powdered or banding (ribbon shapes) is fabricated to by liquid quenching method.
The structural formula preferably constituted of Fe base amorphous alloys (Fe base amorphous alloys) can be by Fe100-a-b-c-x-y-z- tNiaSnbCrcPxCyBzSitRepresent, wherein 0at%≤a≤10at%, 0at%≤b≤3at%, 0at%≤c≤6at%,
3.0at%≤x≤10.8at%, 2.2at%≤y≤9.8at%, 0at%≤z≤4.2at%, 0at%≤t≤3.9at%.
As binding material, epoxy resin, silicone resin, silicone rubber, phenolic resin, urea resin, three can be enumerated
The liquids such as cymel, PVA (polyvinyl alcohol), acrylic resin or powdered resin or rubber, waterglass
(Na2O-SiO2), oxide glass powder (Na2O-B2O3-SiO2、PbO-B2O3-SiO2、PbO-BaO-SiO2、Na2O-B2O3-
ZnO、CaO-BaO-SiO2、Al2O3-B2O3-SiO2、B2O3-SiO2), the glassy mass that is generated by sol-gal process is (with SiO2、
Al2O3、ZrO2、TiO2Deng the material as principal component) etc..
In addition, as lubricant, can also add zinc stearate, aluminum stearate etc..The mixing ratio of binding material is 5 mass %
Below, the addition of lubricant is the mass % degree of 0.1 mass %~1.
As shown in figure 1, in press-powder core body 3, being formed in the mounting surface 3a relative to installation base plate for storing terminal
The housing recess 30 of the part in portion 4.Housing recess 30 is formed at mounting surface 3a both sides, side 3b towards press-powder core body 3,
3c is liberated and formed.Bent from a part for side 3b, 3c of press-powder core body 3 portion of terminal 4 protruded towards mounting surface 3a, and
It is received to the inside of housing recess 30.
Portion of terminal 4 is formed by laminal Cu base materials.Portion of terminal 4 is configured to the inside for being embedded in press-powder core body 3
And with extraction end 2b, 2b of hollow coil 2 connection end 40 electrically connected and it is exposed to the outside of press-powder core body 3 and from upper
Side 3b, the 3c for stating press-powder core body 3 are cross over the 1st bending section 42a and the 2nd bending section 42b that mounting surface 3a is bent to form successively.
It is the weld part welded with hollow coil 2 to connect end 40.1st bending section 42a and the 2nd bending section 42b is relative to installation base
The solder-joint parts that plate 10 is engaged by solder.Solder-joint parts are the part exposed from the press-powder core body 3 in portion of terminal 4, meaning
The surface in the outside at least towards press-powder core body 3.
The connection end 40 of portion of terminal 4 is engaged with the extraction end 2b of hollow coil 2 by resistance welding.
As shown in Fig. 2 inductance element 1 is installed on installation base plate 10.
The conductive pattern turned on external circuit is formed on the surface of installation base plate 10, passes through one of the conductive pattern
Point, form a pair of welding disks 11 for installing inductance element 1.
As shown in Fig. 2 in inductance element 1, mounting surface 3a reveals towards the side of installation base plate 10 from press-powder core body 3 to outside
It is engaged between the 1st bending section 42a and the 2nd bending section 42b and the welding disk 11 of installation base plate 10 that go out in solder layer 12.
In solder process, after the solder for applying paste by printing process in welding disk 11, with the 2nd bending section
41a installs inductance element 1 with the facing mode of welding disk 11, and solder is melted by heating process.As shown in Figures 2 and 3 that
Sample, the 2nd bending section 42b and installation base plate 10 welding disk 11 is opposite, and the 1st bending section 42a is exposed to the side of inductance element 1
3b, 3c, therefore protect hood-like solder layer 12 to adhere to while being fixed on welding disk 11 in the 2nd bending as solder-joint parts
Adhere to fixed enough to width on both portion 42b and the 1st bending section 42a surface.
As shown in figure 3, being formed on the surface of portion of terminal 4 for improving the surface electrode layer with the wettability of solder layer 12
17.That is, basalis 16 is formed on the surface for constituting the Cu base materials 15 of portion of terminal 4, surface electrode is formed on the surface of basalis 16
Layer 17.
Basalis 16 is formed by Ni.Surface electrode layer 17 is formed by Ag or Ag alloy.As Ag alloy, for example, use
Ag-Pd.Basalis 16 and surface electrode layer 17 are respectively formed at surface and the back of the body of Cu base materials 15 by other plating process
On the two faces of face.The plating carried out at this can be any one in electrolytic coating, electroless plating.
The thickness for forming the Cu base materials 15 of portion of terminal 4 is 200 μm of degree.In addition, the Cu of Cu base materials 15 material is without spy
Do not limit, but in order to avoid hollow coil 2 caused by copper loss efficiency reduction and it is preferred that be applicable oxygen-free copper.
The thickness of basalis 16 is preferably 1~5 μm of degree.Basalis 16 makes surface electrode layer 17 appropriate when carrying out plating
Ground is separated out, in addition for suppressing diffusion from Cu base materials 15 etc. as much as possible.
Surface electrode layer 17 is formed by plating process, is formed as connecting the Thickness ratio the 1st of end 40 (weld part) one side
The thickness of bending section 42a and the sides of the 2nd bending section 42b (solder-joint parts) one are thicker.In other words, from the press-powder core of portion of terminal 4
The Thickness ratio of the surface electrode layer 17 for the part that body 3 exposes is located at the layer of the surface electrode layer of the weld part inside press-powder core body 3
Thickness.
For example, the thickness of the surface electrode layer 17 at connection end 40 is more than 2 μm and less than 8 μm, the 1st bending section 42a
And the thickness of the 2nd surface electrode layer 17 at the 42b of bending section is more than 0.2 μm and less than 1.3 μm.Here, it is preferred that connection end
The thickness of surface electrode layer 17 at portion 40 is same degree, the 1st bending section 42a and the 2nd bending section compared with prior art
The thickness of surface electrode layer 17 at 42b is thinner compared with prior art.According to the structure, can suppress the 1st bending section 42a with
And the 2nd Ag in the 42b of bending section galvanic action.It is exposed thereby, it is possible to the Ag that suppresses surface electrode layer 17, it can prevent in peace
Fill the short circuit between the portion of terminal or welding disk of other inductance elements 1 or other electronic units on substrate 10 and close to configuration.
Prevented in surface electrode layer 17 by the case that Ag is formed, being such as adapted to using the discoloration of organic chelate film-type
Agent carries out the surface treatment of surface electrode layer 17.
Next, 4~Fig. 6 of reference picture, the manufacture method to the inductance element of present embodiment is illustrated.
Fig. 4 is the stereogram for representing terminal electrode plate 45.Fig. 5 plating in the terminal electrode plate 45 shown in Fig. 4 for expression
The stereogram of the structure of the fixture 50 formed employed in the process of surface electrode layer.Fig. 6 is the manufacture work for representing inductance element 1
The top view of sequence.
Laminal terminal electrode plate 45 shown in Fig. 4 is to be separated into the so-called ring-shaped material before each portion of terminal 4.Terminal
Battery lead plate 45 is the bridge portion 46 by extending at width D1 two ends along long side direction D2, and multigroup portion of terminal 4 is along side
The structure being concatenated successively to D2.In the terminal electrode plate 45, by plating in advance on surface and the two face shapes of the back side
Into Ni basalis 16.
When by plating process formation surface electrode layer 17, the fixture 50 shown in Fig. 5 is used.Terminal electrode plate 45 is in figure
It is inserted into and is kept towards long side direction L in fixture 50 shown in 5.By carrying out plating in this condition, so that
The two faces of the surface and the back side of terminal electrode plate 45 form surface electrode layer 17.
Fixture 50 is made up of the material such as PVC (polyvinyl chloride) that can suitably cover plating liquid, as shown in figure 5, internally
Form the holding hole portion 51 for keeping terminal electrode plate 45.Hole portion 51 is kept to be arranged along the long side direction L of fixture 50
And insertion fixture 50.Fixture 50 with the shape in the section of long side direction L-orthogonal on all long side direction L identical, retaining hole
The width W in portion 51 central portion 52 turns at the higher position of maintaining part 53,53 than its both sides in short transverse H
Wider opening.The position of central portion 52 and width correspond to the terminal taken out in the process after from terminal electrode plate 45
The scope of the inside of press-powder core body 3 is embedded in portion 4.In addition, the width of central portion 52 be at least included in after process in
With the scope of 2 connection ends 40 for drawing end 2b welding.
The central portion 52 and the height of maintaining part 53 of fixture 50 are set to, and the table of portion of terminal 4 is formed in plating process
The thickness (plated thickness) of face electrode layer 17 is in connection end 40 (weld part) one side than the 1st bending section 42a and the 2nd bending section
The sides of 42b (solder-joint parts) one are thick.
Terminal electrode plate 45 is formed as, by used the plating of fixture 50, in a plating process,
The thickness of surface electrode layer 17 is respectively provided according to height on H directions of central portion 52 and maintaining part 53, end 40 is connected
The surface electrode layer of one side is formed must be thicker than the surface electrode layer of the 1st bending section 42a and the 2nd bending section 42b mono- side.Fig. 4 and
In Fig. 6 (a), in terminal electrode plate 45, the region for setting thicker by the plating thickness of surface electrode layer 17 is illustrated with Tm.
After the plating of fixture 50 has been used, such as shown in Fig. 6 (b), terminal electrode plate 45 is separated into paired
Portion of terminal 4.In the cut off operation, in the way of remaining above-mentioned zone Tm in portion of terminal 4, cut off and remove terminal electrode plate
45 central portion.
Next, in Fig. 6 (c) process, by electric resistance welding fetch engagement hollow coil 2 extraction end 2b, 2b and
The connection end 40 of portion of terminal 4.Connect end 40 as in the present embodiment, Ag surface electrode layer 17 is being included to being formed with
Connection end 40 and the hollow coil 2 formed by Cu extraction end 2b be resistance welded in the case of, its bond strength
Trend with the thickness dependent on the surface electrode layer comprising Ag.In the present embodiment, due to the surface electrode comprising Ag
The thickness of layer 17 is thicker, therefore, it is possible to which the bond strength of resistance welding is maintained into higher.
Next, in Fig. 6 (d) process, in the position of hollow coil 2, to above-mentioned Fe base amorphous alloys
The press-powder core body 3 of powder and binding material carries out press molding, and hollow coil 2 is embedded in press-powder core body 3.Now, connect
End 40 is embedded to the inside of press-powder core body 3, and the 1st bending section 42a and the 2nd bending section 42b are exposed to outer from press-powder core body 3
Portion.
Next, implementing the heat treatment needed for removal stress deformation to press-powder core body 3.In the present embodiment, by adopting
Vitrification point (Tg) can be reduced with the Fe base amorphous alloys of above-mentioned ratio of components, thus phase can be reduced compared with prior art
For the optimum treatment temperature of press-powder core body 3.Here, so-called " optimum treatment temperature " is relative to Fe base amorphous alloys
Stress deformation can effectively be relaxed and core body loss minimal heat treatment temperature can be reduced to.For example, in N2Gas, Ar
Under the inert gas environments such as gas, it will heat up speed and be set to 40 DEG C/min, if reaching defined heat treatment temperature, keep the heat
Treatment temperature 1 hour, and above-mentioned heat treatment temperatures of core body loss W when minimum is regarded as into optimum treatment temperature.
Next, after having cut off portion of terminal 4,4 from bridge portion 46 in the state of Fig. 6 (d), bending as shown in Figure 1
Portion of terminal 4,4, forming surface turns into solder-joint parts, i.e. the 1st bending section 42a and the 2nd bending section 42b on solder composition surface.
Hereafter, as shown in Figure 2 and Figure 3, by reflow process by the 1st bending section 42a of portion of terminal 4 and the 2nd bending section
Solder engagement is carried out between the welding disk 11 of 42b and installation base plate 10.The heating-up temperature during engagement of Pb free solders for 245~
260 DEG C of degree.
Portion of terminal 4 turns into across the basalis 16 being made up of Ni forms the conjunction by Ag or Ag on the surface of Cu base materials 15
The stepped construction for the surface electrode layer 17 that gold is constituted.Thus, even if implementing the heat treatment of 350 DEG C~400 DEG C degree, it can also suppress
Rotten situation occurs for surface electrode layer 17.Here, Cu diffusion can be produced to a certain extent, but by by Ag's or Ag
Alloy formation surface electrode layer 17, occurs to go bad, it is thus possible to compared with prior art so as to suppress surface electrode layer 17
More effectively improve the solderability of portion of terminal 4.
Thus, as shown in Figure 2 and Figure 3, when solder engages inductance element 1 on installation base plate 10, by Ag or Ag alloy structure
Into the solder wetting of portion of terminal 4 that exposes in most surface of surface electrode layer 17 it is good, can be in portion of terminal 4 and installation base plate
It is properly formed between 10 welding disk 11 and protects hood-like solder layer 12, appropriate and stable solder engagement can be carried out.
And then, according to the structure, the 1st bending section 42a and the Ag in the 2nd bending section 42b galvanic action can be suppressed,
It is exposed thus, it is possible to the Ag that suppresses surface electrode layer 17, can easily prevent inductance element 1 adjacent on installation base plate 10 or
Short circuit is produced between other electronic units.
As described above, in surface electrode layer 17 by the case that Ag is formed, being used as discoloration countermeasure, it is preferred to use discoloration is anti-
Only agent carries out the surface treatment of surface electrode layer 17.Or, by forming surface electrode layer 17 by Ag-Pd, so as to suppress
Discoloration.
In addition, the amorphous alloy used in the shaping of press-powder core body 3 is not limited to the material of above-mentioned composition.This
Outside, in this case, it is also preferred that using optimum treatment temperature for the Fe base amorphous alloys of 350 DEG C~400 DEG C degree.
Embodiment
(solder wetting evaluation)
According to JIS standard C0099 and JISC60068-2-54, the solder wetting of portion of terminal is evaluated.
In the evaluation, the sample changed for the thickness of the surface electrode layer to being formed at portion of terminal compares solder moistening
Property.The table for the result that table 1 is evaluated for expression solder wetting.
(1) evaluation method
Evaluation method：Drastically heat temperature raising method
Solder：Thousand live in metal M705 (Sn96.5%, Ag3%, Cu0.5%)
Measurement temperature：245℃
Impregnating depth：0.2mm
Dip time：5s (second)
Impregnating speed：10mm/s
Accelerated ageing conditions：In 120 DEG C of temperature, relative humidity 85% lower 8 hour
(2) sample
Base material：Cu (profile 8.68mm × 3.2mm, thickness 0.2mm)
Basalis：Ni (1.1~1.3 μm of thickness)
Sample number：Each 10
The Rotating fields of embodiment comparative example：
(embodiment 1) Cu base materials/basalis/surface electrode layer：Ag (1.0~1.3 μm of thickness), without accelerated ageing
(embodiment 2) Cu base materials/basalis/surface electrode layer：Ag (0.2~0.3 μm of thickness), without accelerated ageing
(embodiment 3) Cu base materials/basalis/surface electrode layer：Ag (1.0~1.3 μm of thickness), there is accelerated ageing
(embodiment 4) Cu base materials/basalis/surface electrode layer：Ag (0.2~0.3 μm of thickness), there is accelerated ageing
(comparative example 1) Cu base materials/basalis/surface electrode layer：Ag (2.3~2.6 μm of thickness), without accelerated ageing
(comparative example 2) Cu base materials/basalis/surface electrode layer：Ag (2.3~2.6 μm of thickness), there is accelerated ageing
The basalis and surface electrode layer of above structure are sequentially formed on base material by plating, zero crossing is measured
Time (second) (table 1).
(3) evaluation result
【Table 1】
It can be seen from the comparison of the comparison of the embodiment 1,2 of table 1 and comparative example 1 or embodiment 3,4 and comparative example 2, i.e.,
Make surface electrode layer it is thinning will not also see in zero crossing time it is artificial poor.Therefore, it is known that even if surface electrode layer is thinning, solder
Also had no problem in wettability.
In addition, being compared by the embodiment 3 to table 1,4, embodiment 1,2 and comparative example 1, even if being added
Fast aging, it is artificial poor also not can be appreciated that in zero crossing time.It is therefore contemplated that moistening the solder of the thinning sample of surface electrode layer
Property also has no problem after it have passed through long-time.Thus, from the viewpoint of solder wetting, it is known that preferred solder junction surface
Surface electrode layer thickness be more than 0.2 μm and less than 1.3 μm.
(weld strength evaluation)
The table for the result that table 2 is evaluated for expression weld strength.
(1) evaluation method：It is to be carried out using pull test device (AGS-50NJ (SHIMADZU company systems)).
(2) sample
Coil：The width dimensions for making the wire of banding are that 0.87mm, thickness are that 0.21mm, the number of turn are 7.5 circles
Coil, irradiates laser to eliminate covering.
Portion of terminal：The Ni conducts of 1~3 μm of thickness are formed on Cu base materials (profile 4.09mm × 3.2mm, thickness 0.2mm)
Basalis.
The welding condition of coil and portion of terminal：Voltage 1.15/1.6V, air pressure：0.4MPa
The Rotating fields of portion of terminal：
(comparative example 1) Cu base materials/basalis/surface electrode layer：Ag (1~3 μm of thickness)
(embodiment 1) Cu base materials/basalis/surface electrode layer：Ag (2~4 μm of thickness)
(embodiment 2) Cu base materials/basalis/surface electrode layer：Ag (5~8 μm of thickness)
Weld strength (unit N) (table is measured using the inductance element of above structure, and using above-mentioned pull test device
2)。
(3) evaluation result
【Table 2】
Table 2
It can be seen from table 2, comparative example 1 is judged as in terms of practicality simultaneously due to having deviation in terms of weld strength
It is insufficient.In contrast, in embodiment 1,2, weld strength is always more than 10N, and because the deviation of measured value is smaller,
Therefore enough weld strengths have been obtained.Thus, from the viewpoint of weld strength, it is known that the layer of the surface electrode layer of weld part
Thickness is more than 2 μm and 8 μm the following is preferred.
By above-described embodiment, in the case of all more than 2 μm of the thickness of surface electrode layer and less than 8 μm, due to
The Ag's of surface electrode layer is exposed caused by Ag galvanic action, with installation base plate close to configuration other inductance elements or
The possibility that short circuit is produced between the portion of terminal or welding disk of other electronic units becomes big.On the other hand, it is known that by making solder
The thickness of surface electrode layer at junction surface is set as more than 0.2 μm and less than 1.3 μm, makes surface electrode layer at weld part
Thickness thickness is set as more than 2 μm and less than 8 μm, so as to expect the strong weld strength of maintenance and can prevent and other inductance member
The situation of short circuit is produced between part or other electronic units.
It is illustrated for the present invention with reference to above-mentioned embodiment, but the present invention is not limited to above-mentioned embodiment,
It can be improved or be changed in the range of the purpose of improvement or the thought of the present invention.
Industrial applicability
Even if as described above, the inductance element of the present invention has used Ag or Ag conjunction with the surface electrode layer in portion of terminal
The structure of gold on installation base plate, can also be prevented inductance element to be electrically short-circuited to each other, therefore be to have very much in this close to configuration
.
【Symbol description】
1 inductance element
2 hollow coils (coil)
3 press-powder core bodys
4 portion of terminal
10 installation base plates
12 solder layers
15 Cu base materials
16 basalises
17 surface electrode layers
40 connections end (weld part)
The bending sections (solder-joint parts) of 42a the 1st
The bending sections (solder-joint parts) of 42b the 1st
50 fixtures
Claims (7)
1. a kind of inductance element, possess press-powder core body, be embedded to above-mentioned press-powder core body inside coil and by welding with it is upper
The portion of terminal of coil electrical connection is stated, the inductance element is characterised by,
Above-mentioned portion of terminal has the surface electrode layer of Cu base materials and the coating surface formation in above-mentioned Cu base materials, above-mentioned surface electrode
Layer is formed by Ag or Ag alloy,
Above-mentioned portion of terminal has the weld part for being soldered to above-mentioned coil and connect relative to installation base plate by the solder that solder is engaged
Conjunction portion,
The thickness that above-mentioned surface electrode layer is formed as the above-mentioned side of solder-joint parts one of Thickness ratio of the above-mentioned side of weld part one is thicker,
The thickness of above-mentioned surface electrode layer at above-mentioned weld part is upper at more than 2 μm and less than 8 μm, above-mentioned solder-joint parts
The thickness for stating surface electrode layer is more than 0.2 μm and less than 1.3 μm.
2. inductance element according to claim 1, it is characterised in that
Above-mentioned portion of terminal possesses the part for being embedded to above-mentioned press-powder core body and the part exposed from above-mentioned press-powder core body, above-mentioned weldering
Socket part is located at the inside of above-mentioned press-powder core body, the above-mentioned surface electrode layer shape of the part exposed from press-powder core body of above-mentioned portion of terminal
The thickness of surface electrode layer as the above-mentioned weld part of Thickness ratio is thinner.
3. inductance element according to claim 1 or 2, it is characterised in that
Above-mentioned weld part is resistance weld.
4. a kind of manufacture method of inductance element, the inductance element possesses press-powder core body, is embedded to the interior of above-mentioned press-powder core body
The coil in portion and the portion of terminal electrically connected with above-mentioned coil, above-mentioned portion of terminal have the weld part and phase for being soldered to above-mentioned coil
The solder-joint parts engaged for installation base plate by solder, the manufacture method of the inductance element is characterised by, including：
The Cu base materials of above-mentioned portion of terminal are formed as into defined shape, on the surface of above-mentioned portion of terminal with the above-mentioned side's of weld part one
The thicker mode of the thickness of the above-mentioned side of solder-joint parts one of Thickness ratio is formed the work of surface electrode layer by Ag or Ag alloy plating
Sequence；
The process for electrically connecting above-mentioned portion of terminal and above-mentioned coil by the way that above-mentioned coil is welded into above-mentioned weld part；With
The process for making above-mentioned press-powder core body shape and bury the above-mentioned coil for being connected to above-mentioned portion of terminal in above-mentioned press-powder core body,
The thickness of above-mentioned surface electrode layer at above-mentioned weld part is formed as more than 2 μm and less than 8 μm, above-mentioned solder is engaged
The thickness of above-mentioned surface electrode layer at portion is formed as more than 0.2 μm and less than 1.3 μm.
5. the manufacture method of inductance element according to claim 4, it is characterised in that also include：
Implement the process of heat treatment to above-mentioned press-powder core body after above-mentioned press-powder core body is shaped.
6. the manufacture method of the inductance element according to claim 4 or 5, it is characterised in that
In above-mentioned portion of terminal, basalis is formed on the surface of above-mentioned Cu base materials, plating process is passed through on the surface of the basalis
Form surface electrode layer.
7. the manufacture method of the inductance element according to claim 4 or 5, it is characterised in that
Fetched by electric resistance welding and above-mentioned coil and above-mentioned portion of terminal are welded.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013253957A JP6192522B2 (en) | 2013-12-09 | 2013-12-09 | Inductance element and method of manufacturing inductance element |
| JP2013-253957 | 2013-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104700991A CN104700991A (en) | 2015-06-10 |
| CN104700991B true CN104700991B (en) | 2017-08-15 |
Family
ID=53348016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410719919.6A Active CN104700991B (en) | 2013-12-09 | 2014-12-01 | The manufacture method of inductance element and inductance element |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6192522B2 (en) |
| KR (2) | KR101659666B1 (en) |
| CN (1) | CN104700991B (en) |
| TW (1) | TWI591664B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6506658B2 (en) * | 2015-08-18 | 2019-04-24 | アルプスアルパイン株式会社 | Dust core, electronic / electrical component comprising the dust core, and electronic / electrical device on which the electronic / electrical component is mounted |
| CN109478457B (en) * | 2016-07-14 | 2020-11-13 | 阿尔卑斯阿尔派株式会社 | Composite smoothing inductor and smoothing circuit |
| CN107799270B (en) * | 2016-09-01 | 2021-08-17 | 胜美达集团株式会社 | Plate material for terminal of coil component and method for manufacturing electronic component |
| TWI624845B (en) * | 2016-11-08 | 2018-05-21 | Alps Electric Co Ltd | Inductive element and manufacturing method thereof |
| JP6822129B2 (en) * | 2016-12-21 | 2021-01-27 | 株式会社村田製作所 | Surface mount inductor |
| CN110462764B (en) * | 2017-03-24 | 2023-09-12 | 博迈立铖株式会社 | Powder magnetic core with terminal and method for manufacturing the same |
| WO2019065841A1 (en) * | 2017-09-29 | 2019-04-04 | ミネベアミツミ株式会社 | Strain gauge |
| KR102064068B1 (en) | 2018-04-25 | 2020-01-08 | 삼성전기주식회사 | Coil electronic component |
| JP7132745B2 (en) * | 2018-05-08 | 2022-09-07 | 株式会社村田製作所 | surface mount inductor |
| JP7187831B2 (en) * | 2018-06-13 | 2022-12-13 | Tdk株式会社 | coil parts |
| JP7268611B2 (en) * | 2020-01-15 | 2023-05-08 | 株式会社村田製作所 | inductor components |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003133887A (en) * | 2001-10-30 | 2003-05-09 | Kyocera Corp | Crystal oscillator |
| JP2006032558A (en) * | 2004-07-14 | 2006-02-02 | Tdk Corp | Manufacturing method of coil component |
| CN102290208A (en) * | 2010-05-17 | 2011-12-21 | 阿尔卑斯绿色器件株式会社 | Coil-embedded dust magnetic core and its manufacturing method |
| CN102364631A (en) * | 2010-06-09 | 2012-02-29 | 阿尔卑斯绿色器件株式会社 | Coil enclosed dustcore and device with same, and method for manufacturing coil enclosed dustcore and method for manufacturing device |
| CN103280298A (en) * | 2013-05-29 | 2013-09-04 | 深圳顺络电子股份有限公司 | Inductance coil and laser-cutting manufacturing method of inductance coil |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59166407U (en) * | 1983-04-22 | 1984-11-08 | 日本電気ホームエレクトロニクス株式会社 | Electrode structure |
| JPH04277607A (en) * | 1991-03-06 | 1992-10-02 | Murata Mfg Co Ltd | Electronic part |
| JP2004207355A (en) * | 2002-12-24 | 2004-07-22 | Murata Mfg Co Ltd | Surface-mounting electronic component and method of manufacturing same |
| JP4528058B2 (en) * | 2004-08-20 | 2010-08-18 | アルプス電気株式会社 | Coiled powder magnetic core |
| JP5084408B2 (en) * | 2007-09-05 | 2012-11-28 | 太陽誘電株式会社 | Wire wound electronic components |
| JP5084459B2 (en) * | 2007-11-15 | 2012-11-28 | 太陽誘電株式会社 | Inductor and manufacturing method thereof |
| JP5897247B2 (en) * | 2009-10-22 | 2016-03-30 | Tdk株式会社 | Electronic component and method for manufacturing electronic component |
-
2013
- 2013-12-09 JP JP2013253957A patent/JP6192522B2/en active Active
-
2014
- 2014-10-27 TW TW103137071A patent/TWI591664B/en active
- 2014-11-21 KR KR1020140163169A patent/KR101659666B1/en active IP Right Grant
- 2014-12-01 CN CN201410719919.6A patent/CN104700991B/en active Active
-
2016
- 2016-02-11 KR KR1020160015893A patent/KR101711325B1/en active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003133887A (en) * | 2001-10-30 | 2003-05-09 | Kyocera Corp | Crystal oscillator |
| JP2006032558A (en) * | 2004-07-14 | 2006-02-02 | Tdk Corp | Manufacturing method of coil component |
| CN102290208A (en) * | 2010-05-17 | 2011-12-21 | 阿尔卑斯绿色器件株式会社 | Coil-embedded dust magnetic core and its manufacturing method |
| CN102364631A (en) * | 2010-06-09 | 2012-02-29 | 阿尔卑斯绿色器件株式会社 | Coil enclosed dustcore and device with same, and method for manufacturing coil enclosed dustcore and method for manufacturing device |
| CN103280298A (en) * | 2013-05-29 | 2013-09-04 | 深圳顺络电子股份有限公司 | Inductance coil and laser-cutting manufacturing method of inductance coil |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015115341A (en) | 2015-06-22 |
| JP6192522B2 (en) | 2017-09-06 |
| TWI591664B (en) | 2017-07-11 |
| TW201523657A (en) | 2015-06-16 |
| CN104700991A (en) | 2015-06-10 |
| KR101659666B1 (en) | 2016-09-26 |
| KR101711325B1 (en) | 2017-02-28 |
| KR20160022844A (en) | 2016-03-02 |
| KR20150067021A (en) | 2015-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104700991B (en) | The manufacture method of inductance element and inductance element | |
| TWI438793B (en) | Coil parts | |
| JP5553978B2 (en) | Manufacturing method of electronic parts | |
| US10366819B2 (en) | Coil component and method of manufacturing the same | |
| US20160240306A1 (en) | Coil component | |
| US9508519B2 (en) | Fuse and manufacturing method thereof | |
| KR101563092B1 (en) | Inductance element | |
| TWI442424B (en) | And a method of manufacturing the same, the coil is sealed to the core portion and the apparatus for sealing the core portion of the powder and the method of manufacturing the same, | |
| US10381152B2 (en) | Coil component and coil-component-equipped mounting substrate | |
| CN112530697B (en) | Ceramic electronic component | |
| US20150235758A1 (en) | Coil component and terminal component used therein | |
| JP6387697B2 (en) | Magnetic core and coil device | |
| CN105702432B (en) | Electronic component and board having the same | |
| JP2013120919A (en) | Coil enclosed dust core and device having the same, manufacturing method of coil enclosed dust core, and manufacturing method of device | |
| US20140152411A1 (en) | Inductor and manufacturing method thereof | |
| JP6456729B2 (en) | Inductor element and manufacturing method thereof | |
| JP2019050411A (en) | Magnetic material core and coil device | |
| KR20100048249A (en) | Power inductor using embedded coils and the manufacturing method thereof | |
| JP6468412B2 (en) | Magnetic core and coil device | |
| JP5880583B2 (en) | Temperature sensor and manufacturing method | |
| JP2007266175A (en) | Porcelain structure, and surface mounting inductor | |
| JP6723690B2 (en) | Coated lead type electronic component and manufacturing method thereof | |
| JPH03161915A (en) | Lc composite component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161208 Address after: Tokyo, Japan, Japan Applicant after: Alps Electric Co., Ltd. Address before: Tokyo, Japan Applicant before: ALPS Green Devices Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: Alpine Alpine Company Address before: Tokyo, Japan, Japan Patentee before: Alps Electric Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |