CN104699289A - Panel structure - Google Patents
Panel structure Download PDFInfo
- Publication number
- CN104699289A CN104699289A CN201410052206.9A CN201410052206A CN104699289A CN 104699289 A CN104699289 A CN 104699289A CN 201410052206 A CN201410052206 A CN 201410052206A CN 104699289 A CN104699289 A CN 104699289A
- Authority
- CN
- China
- Prior art keywords
- decorative layer
- insulation course
- layer
- area
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 106
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims description 142
- 238000010276 construction Methods 0.000 claims description 69
- 230000003287 optical effect Effects 0.000 claims description 25
- 239000004568 cement Substances 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000005034 decoration Methods 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 277
- 238000000034 method Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention provides a panel structure, which comprises a substrate, a decorative layer, an insulating layer and at least one conductive element. The decoration layer is arranged on the substrate, the area where the decoration layer is located is a first area, the area outside the decoration layer is a second area, and the material of the decoration layer comprises a photoresist material. The insulating layer is arranged on the side surface of the decorative layer close to the second area and partially extends to the second area. The included angle between the cross-sectional profile of the insulating layer far away from the front end of the decorative layer and the substrate is smaller than the included angle formed between the cross-sectional profile of the decorative layer near the bottom end of the second area and the substrate. Each conductive element extends continuously from the second region to the first region along the insulating layer.
Description
Technical field
The invention relates to a kind of panel construction, and relate to a kind of panel construction with decorative layer especially.
Background technology
Along with the progress of science and technology, the electronic component of the tabular such as contact panel and display panel has been widely used on multiple electronic installation, such as, be smart mobile phone (smart phone), satellite navigation system (GPSnavigator system), panel computer (tablet PC), personal digital assistant (PDA) and notebook computer (laptop PC) etc.
For contact panel, generally speaking, contact panel is divided into the Touch Zone being positioned at central authorities and the non-touch-control district being positioned at surrounding, in order to cover the cabling in non-touch-control district, usually on substrate, can form a thicker decorative layer, with shield lights with ink.For the ink that optical density value is lower, as white ink or colored ink etc., usually need multiple-level stack, certain screening effect can be reached, comparatively loaded down with trivial details in process.In addition, the height that ink heap poststack can be assigned to compared with central portion usually in marginal portion, the similar ox horn of shape that this edge tilts.After multilayer ink is stacking, the profile of ox horn can be caused more to become obvious and stacks as high is higher, thus cause follow-up when will form the cabling extended toward non-touch-control district from Touch Zone, because the side surface of decorative layer is too steep, cabling may break.
Summary of the invention
The invention provides a kind of panel construction, the process of its decorative layer is comparatively simple, and can reduce the probability of cabling broken string.
A kind of panel construction of the present invention, comprises substrate, decorative layer, insulation course and at least one conducting element.Decorative layer is configured on substrate, and decorative layer region is first area and region beyond decorative layer is second area, and the material of decorative layer comprises photoresist.Insulation course is at least configured at decorative layer on the decorative layer side surface of second area and extends to second area partly.Insulation course is less than away from the angle formed between the section profile of the front end of decorative layer and substrate the angle that decorative layer forms between the section profile and substrate of the bottom near second area.Each conducting element extends to first area from second area continuously along insulation course.
In one embodiment of this invention, above-mentioned decorative layer comprises the first photoresist layer and the second photoresist layer, and the second photoresist layer is configured on the first photoresist layer, and the color of the first photoresist layer and the second photoresist layer is different.
In one embodiment of this invention, also comprise cushion, between the first photoresist layer and the second photoresist layer.
In one embodiment of this invention, above-mentioned cushion extends to second area along the first photoresist layer side surface of the first photoresist layer, and the second photoresist layer extends along cushion toward the direction of second area, to make the decorative layer side surface that the surface of the closer second area of the second photoresist layer is decorative layer.
In one embodiment of this invention, also comprise fill-in light resistance layer, wherein insulation course extends to second area from the decorative layer end face away from substrate of decorative layer through the decorative layer side surface of decorative layer, fill-in light resistance layer is configured at position on the insulation course of end face, and the color of decorative layer and fill-in light resistance layer is different.
In one embodiment of this invention, also comprise cushion, between fill-in light resistance layer and insulation course.
In one embodiment of this invention, also comprise cushion, between decorative layer and insulation course.
In one embodiment of this invention, above-mentioned insulation course is photoresist layer, and the color of photoresist layer is different from decorative layer.
In one embodiment of this invention, the thickness of the first above-mentioned photoresist layer is 10 microns to 20 microns.
In one embodiment of this invention, above-mentioned insulation course extends 30 microns to 150 microns by decorative layer side surface to the direction away from decorative layer.
In one embodiment of this invention, the angle between the side surface of the first above-mentioned photoresist layer and substrate is 30 degree to 90 degree.
In one embodiment of this invention, above-mentioned insulation course is less than 75 degree away from the angle formed between the section profile of the front end of decorative layer and substrate.
In one embodiment of this invention, the insulation course on decorative layer side surface, the closer to substrate, insulation course is larger at the thickness of parallel substrate bearing of trend.
In one embodiment of this invention, also comprise insulating bottom layer, be configured between substrate and decorative layer and between substrate and conducting element.
In one embodiment of this invention, also comprise optical match layer, be covered in decorative layer, insulation course and each conducting element.
In one embodiment of this invention, also comprise protective seam, be covered in decorative layer and insulation course, and the material of protective seam is identical with the material of insulation course.
In one embodiment of this invention, the thickness of above-mentioned insulation course is 0.5 micron to 3 microns.
In one embodiment of this invention, above-mentioned conducting element comprises the first electrode unit, the second electrode unit and electrically completely cuts off the isolated unit of the first electrode unit and the second electrode unit, and isolated unit is identical in fact with the thickness of insulation course.
In one embodiment of this invention, also comprise plastic cement rete and optical cement, plastic cement rete is attached at by optical cement the one side that substrate has insulation course, and plastic cement rete and optical cement overlapping with the insulation course at second area.
In one embodiment of this invention, also comprise display and optical cement, display is attached at by optical cement the one side that substrate has insulation course, and optical cement is overlapping with the insulation course at second area.
Based on above-mentioned, panel construction of the present invention utilizes photoresist layer as decorative layer, compared to during in the past with printing ink to manufacture decorative layer, needs multiple-level stack, use photoresist layer directly just can mold the photoresistance of certain height with a gold-tinted process as decorative layer, comparatively simple in process.In addition, in order to avoid decorative layer side surface makes conducting element not easily extend to first area from second area too suddenly, panel construction of the present invention configures insulation course on decorative layer, insulation course extends to second area along decorative layer side surface, the angle of decorative layer between the section profile and substrate of the bottom near second area is less than away from the angle between the section profile of the front end of decorative layer and substrate in the second area by insulation course, and the gradient of insulation course side surface is delayed compared with the gradient of decorative layer side surface, can be configured on decorative layer along milder insulation course to make conducting element, effectively avoid conducting element that the problem of broken string occurs.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section of a kind of panel construction of the first embodiment of the present invention;
Fig. 2 is the diagrammatic cross-section of a kind of panel construction of the second embodiment of the present invention;
Fig. 3 A is the partial cutaway schematic of a kind of panel construction of the third embodiment of the present invention;
Fig. 3 B to Fig. 3 D is the partial cutaway schematic of a kind of panel construction of the 4th to the 6th embodiment of the present invention;
Fig. 3 E is the section of insulation course away from the front end of decorative layer and the micrograph of substrate of the panel construction of Fig. 3 A;
Fig. 4 is the partial cutaway schematic of a kind of panel construction of the seventh embodiment of the present invention;
Fig. 5 is the partial cutaway schematic of a kind of panel construction of the eighth embodiment of the present invention;
Fig. 6 is the partial cutaway schematic of a kind of panel construction of the ninth embodiment of the present invention.
Description of reference numerals:
A1: first area;
A2: second area;
100,200,300,400,500,600: panel construction;
110,210,310,410,510,610: substrate;
120,220,320,420,520,620: decorative layer;
120a, 220a, 320a, 420a, 620a: decorative layer side surface;
122,222: the first photoresist layers;
122a: the first photoresist layer side surface;
124,224: the second photoresist layers;
124a, 224a: the second photoresist layer side surface;
124b: the second photoresist layer end face;
130,230,530,630: cushion;
130a, 630a: buffer layer side surface;
140,240,340,440,540,640: insulation course;
140a, 240a, 340a, 640a: insulation course side surface;
150,250: conducting element;
152: the first electrode units;
154: the second electrode units;
156: linkage unit;
160: insulating bottom layer;
170: pattern;
180: optical match layer;
190: protective seam;
192: isolated unit;
194: connection pad;
196: external circuit;
198: periphery cabling;
320b, 420b, 620b: decorative layer end face;
495,595: fill-in light resistance layer.
Embodiment
Fig. 1 is the diagrammatic cross-section of a kind of panel construction of the first embodiment of the present invention.Refer to Fig. 1, the panel construction 100 of the present embodiment comprises substrate 110, decorative layer 120, cushion 130, insulation course 140 and at least one conducting element 150.In the present embodiment, panel construction 100 is touch panel structure provided, but the kind of panel construction 100 is not as restriction.The substrate 110 of the present embodiment is transparency carrier, such as, be glass substrate.In other embodiments, substrate 110 also can be overlay, is one strengthening substrate, has high mechanical properties, can protect its lower element.
Decorative layer 120 is configured on substrate 110, and decorative layer 120 region is first area A1 and region beyond decorative layer 120 is second area A2.In the present embodiment, first area A1 is non-touch-control district, and second area A2 is Touch Zone, but the classification of first area A1 and second area A2 is not as restriction.
In the present embodiment, decorative layer 120 comprises the first photoresist layer 122 and the second photoresist layer 124, and the second photoresist layer 124 is configured on the first photoresist layer 122.The panel construction 100 of the present embodiment utilizes the first photoresist layer 122 and the second photoresist layer 124 as decorative layer 120, and process twice gold-tinted process can just mold the photoresistance of certain height.
The color of the first photoresist layer 122 and the second photoresist layer 124 is different, in the present embodiment, the color of the first photoresist layer 122 is white, and the color of the second photoresist layer 124 is black, but the color visible product of the first photoresist layer 122 and the second photoresist layer 124 designs and different, not as restriction, such as the second photoresist layer 124 also can be identical with the color of the first photoresist layer 122.The thickness range of the first photoresist layer 122 can between 1.2 microns to 30 microns.In a preferred embodiment, the thickness of the first photoresist layer 122 is 10 microns to 20 microns.In the present embodiment, the thickness of the first photoresist layer 122 is 15 microns, to make the first photoresist layer 122 of white, there is enough optical density (optical density, be called for short OD) value, and when allowing the below of user's substrate 110 from Fig. 1 look toward top, the decorative layer 120 that color is more saturated can be seen.
Decorative layer 120 has a decorative layer side surface 120a of close second area A2.In a preferred embodiment, the angle between decorative layer side surface 120a and substrate 110 is in the scope of 20 degree to 125 degree.In the present embodiment, the angle between decorative layer side surface 120a and substrate 110 is in the scope of 30 degree to 90 degree.In detail, decorative layer 120 due to the present embodiment is made up of the first photoresist layer 122 and the second photoresist layer 124, and the first photoresist layer 122 and the second photoresist layer 124 have one first photoresist layer side surface 122a near second area A2 and one second photoresist layer side surface 124a respectively.In the present embodiment, decorative layer side surface 120a is formed jointly by the first photoresist layer side surface 122a and the second photoresist layer side surface 124a.First photoresist layer side surface 122a and the second photoresist layer side surface 124a can be in the scope of 30 degree to 90 degree with the angle of substrate 110 bearing of trend respectively.
Cushion 130 between the first photoresist layer 122 and the second photoresist layer 124, and extends to second area A2 along the first photoresist layer side surface 122a of the first photoresist layer 122.The function of cushion 130 mainly avoids the problem of the second photoresist layer 124 bleeding to the first photoresist layer 122.Specifically, because the first photoresist layer 122 is white photoresistance, its density of texture is relatively low or constituent particle is relatively large, in pyroprocessing, the black particles of the second photoresist layer 124 may be diffused in the space of the first photoresist layer 122, cause the first photoresist layer 122 variable color, such as, be turn yellow or become ash, and make the quality of colour of decorative layer 120 bad.In addition, cushion 130 can also intercept the first photoresist layer 122, and avoids the first photoresist layer 122 generating gasification and phenomenon of crumble (outgassing) when pyroprocessing.In the present embodiment, the material of cushion 130 comprises silicon dioxide, but not as restriction.
Protruded by substrate 110 because decorative layer 120 has certain height, successfully first area A1 can be extended to from second area A2 when processing in order to make conducting element 150, in the present embodiment, be at least configured at decorative layer 120 on the decorative layer side surface 120a of second area A2 by insulation course 140 and extend to second area A2 partly.Thus, conducting element 150 is configured at probability insulation course 140 contributing to reduce conducting element 150 and break.
Specifically, the second photoresist layer 124 has the second photoresist layer end face 124b away from the first photoresist layer 122, cushion 130 have position in the A1 of first area and near second area A2 one buffer layer side surface 130a.As shown in Figure 1, insulation course 140 extends to second area A2 by the second photoresist layer end face 124b along the second photoresist layer side surface 124a and buffer layer side surface 130a.Angle between the section profile that insulation course 140 has in the front end away from decorative layer 120 and substrate 110 is less than the angle between section profile and substrate 110 that the first photoresist layer 122 has in the bottom near second area A2.That is, insulation course 140, compared to decorative layer 120, is supplied to the front end gradient that conducting element 150 is milder, and conducting element 150 can first be distributed continuously on insulation course 140 more easily.In addition, as shown in Figure 1, from cross-section structure, during with the direction being parallel to substrate 110 to measure width, insulation course 140 on decorative layer side surface 120a, segment thickness the closer to substrate 110 larger (insulation course 140 namely on decorative layer side surface 120a, time transversal with the surface level of differing heights, the cross-sectional width the closer to the part of substrate 110 is larger).In other words, compared to decorative layer side surface 120a, insulation course side surface 140a on decorative layer side surface 120a provides more gentle incline, to configure along milder insulation course 140 to make conducting element 150 and be covered to above decorative layer 120, and extend to first area A1 continuously by second area A2, to reduce the problem that conducting element 150 ruptures.
It is worth mentioning that, in panel construction 100 illustrated in fig. 1, in order to clearly represent the configuration relation between each layer, deliberately have adjusted thickness and the size of each layer.In practice, the thickness of each layer and scale visual design requirement and determine, do not limited with ratio shown on Fig. 1.
In addition, in the present embodiment, insulation course 140 is organic material, but in other embodiments, insulation course 140 also can be inorganic material.When making the insulation course 140 of the present embodiment, can use resin material, be coated on decorative layer 120 with the thickness of 0.5 ~ 3 micron, wherein resin material forms insulation course 140 after solidification and patterning.Insulation course 140 can be adopt light sensitive material to be made, and therefore the solidification of insulation course 140 and the method for patterning can be micro-shadow process.Insulation course 140 in second area A2 to extensible 30 microns to 150 microns of the direction away from the first photoresist layer 122.It is more that insulation course 140 extends to the direction away from the first photoresist layer 122 in second area A2, then can have less angle between the section profile that has in the front end away from decorative layer 120 of insulation course 140 and substrate 110, continuously extend to first area A1 from second area A2 along insulation course 140 in order to conducting element 150.In the present embodiment, conducting element 150 is transparency electrode, such as indium tin oxide, but the kind of conducting element 150 is not limited thereto.With other embodiment, conducting element 150 also can be the component that metal, alloy or multilayer conductive material laminate are formed.
It is worth mentioning that, because the not decorated layer 120 of second area A2 covers, when insulation course 140 extends more toward second area A2, insulation course 140 is more easily seen by user or is discovered.Therefore, the panel construction 100 of the present embodiment can attach the plastic cement such as blow-out disc or conductive shielding layer rete further by optical cement, display of even can arranging in pairs or groups in the one side being provided with insulation course 140, and is fitted by the optical cement of whole and display.Due to the one-piece construction out of the ordinary such as this type of blow-out disc, conductive shielding layer and optical cement with at the overlapping and refractive index close of its refractive index and insulation course 140 of the insulation course 140 of second area A2, the probability that the insulation course 140 that significantly can be reduced in second area A2 after this class A of geometric unitA of arranging in pairs or groups is aware.In other words, the length that such design can make insulation course 140 extend toward second area A2 is larger, such as be greater than 70 microns, thus make insulation course side surface 140a can provide more gentle incline, and, the angle formed between the section profile that insulation course 140 is had in the front end away from decorative layer 120 and substrate is less, and is conducive to conducting element and arranges.Another is carried, and the present invention is not limited to plastic cement rete, in another embodiment, also can be other hard substrates, such as glass.
In the present embodiment, first area A1 can be hollow, and first area A1 surrounds second area A2 haply completely, and insulation course 140 is also, and hollow is to cover decorative layer 120 comprehensively.But in other embodiments, insulation course 140 also can not cover decorative layer 120 all sidedly, insulation course 140 is only configured on the decorative layer 120 of conducting element 150 distribution.That is, insulation course 140 can be arranged continuously along the juncture area of first area A1 and second area A2, or insulation course 140 juncture area that is only arranged on first area A1 and second area A2 is overlapped in the part of conducting element 150.
In addition, refer again to Fig. 1, in the present embodiment, panel construction 100 also comprises insulating bottom layer 160, pattern 170, optical match layer 180, protective seam 190.Insulating bottom layer 160 is configured between substrate 110 and decorative layer 120 and between substrate 110 and conducting element 150, can be formed on substrate 110 by auxiliary conductive element 150.The material of insulating bottom layer 160 comprises silicon dioxide, but the material of insulating bottom layer 160 is not as restriction.Pattern 170 is such as product brand or symbol (icon), and between substrate 110 and decorative layer 120, the configuration of pattern 170 can allow user see from substrate 110 toward the direction of decorative layer 120 to be such as the certain patterns of the colors such as mirror-like silver.Certainly, insulating bottom layer 160 and pattern 170 can optionally be arranged, and can omit in actual product design.Optical match layer 180 is covered in decorative layer 120, insulation course 140 and conducting element 150; in order to improve pattern significant degree; the material of optical match layer 180 is such as silicon dioxide, nitrogen silicon compound or the two composite film etc., and can simultaneously as the protective seam of conducting element 150.Protective seam 190 covers decorative layer 120, insulation course 140 and is positioned at the optical match layer 180 of first area A1, and in the present embodiment, the material of protective seam 190 comprises resin, and that is, the material of protective seam 190 is identical with the material of insulation course 140.But the material of the material of protective seam 190 and insulation course 140 is not limited to this.
In addition, in the present embodiment, panel construction 100 is the touch panel structure provided of dual electric layer.Specifically, as shown in Figure 1, conducting element 150 comprises at least one first electrode unit 152, at least one second electrode unit 154 and at least one linkage unit 156.Linkage unit 156 is positioned on the cushion 130 of second area A2; the linkage unit 156 of isolated unit 192 cover part; first electrode unit 152 is connected to the part that the not isolated unit 192 of linkage unit 156 covers; and the isolated unit 192 of cover part further, to protect the exposed parts of linkage unit 156.Therefore, the first adjacent electrode unit 152 can connect bunchiness by linkage unit 156 and be electrically connected.In the present embodiment, the first electrode unit 152 connects bunchiness by linkage unit 156 along first direction, and the second electrode unit 154 then can be designed as the electrode structure extended along second direction, and wherein first direction is crossing with second direction.Therefore, namely Fig. 1 indicates the cross-section structure of one-tenth string structure that the first electrode unit 152 forms and the second electrode unit 154 intersection.
With the present embodiment, the second electrode unit 154 with the configuration of the serial connection direction of vertical first electrode unit 152, and covers on isolated unit 192.That is, be connected to the isolated unit 192 between linkage unit 156 and the second electrode unit 154 that the first electrode unit 152 connects to separate.Thus, the linkage unit 156 that the first electrode unit 152 is connected with it is electrically insulated from the second electrode unit 154.In addition, in the present embodiment, the material of isolated unit 192 can be identical with the material of insulation course 140.Thus, when making panel construction 100, insulation course 140 and isolated unit 192 can be formed simultaneously, and shorten making step and time.Because insulation course 140 and isolated unit 192 are formed simultaneously, therefore, the thickness of insulation course 140 and isolated unit 192 should be approximately identical.Certainly, the material of isolated unit 192 also can be different from the material of insulation course 140.
In addition, in the A1 of first area, can be provided with connection pad 194, it is positioned on decorative layer 120, connects with for external circuit 196.So, conducting element 150 extends to first area A1 continuously from second area A2, the first electrode unit 152 of periphery cabling 198 connect conduction element 150 and connection pad 194, to be electrically connected by connection pad 194 and external circuit 196.The material of connection pad 194 also can with the first electrode unit 152 and the second electrode unit 154 identical or different.Certainly, Fig. 1 just illustrates wherein a kind of touch panel structure provided, and in other embodiments, the first electrode unit 152 and linkage unit 156 can utilize identical conductive film layer to make and form a continuous print electrode unit.Now, the first electrode unit 152 and the second electrode unit 154 can separate by direct isolated unit 192 in both staggered places.Or in another embodiment, conducting element 150 also can be made up of the single conductive layer without bridge structure, and now, panel construction 100 can be the contact panel of single-layer electrodes layer.In other words, the structural design of conducting element 150 in second area A2 is not limited with the bilayer conductive layer represented by Fig. 1.
Fig. 2 is the diagrammatic cross-section of a kind of panel construction of the second embodiment of the present invention.Refer to Fig. 2, the panel construction 200 of Fig. 2 is with the Main Differences of the panel construction 100 of Fig. 1, and in fig. 2, the second photoresist layer 224 extends along cushion 230.The decorative layer 220 of the present embodiment is also be made up of the first photoresist layer 222 and the second photoresist layer 224, and the second photoresist layer 224 some relative to the first photoresist layer 222 closer to second area A2.Thus, the second photoresist layer side surface 224a that decorative layer side surface 220a can be considered as the closer second area A2 of the second photoresist layer 224 formed.
Similarly be configured on decorative layer side surface 220a by insulation course 240 in the panel construction 200 of the present embodiment and also extend to this second area A2 partly.That is, the second photoresist layer 224 is all accompanied between insulation course 240 and the first photoresist layer 222.Angle between the section profile (can be considered as insulation course side surface 240a) that insulation course 240 has away from the front end of decorative layer 220 and substrate 210 is less than the angle between section profile (can be considered as decorative layer side surface 220a) and substrate 210 that decorative layer 220 has in the bottom near second area A2.In the present embodiment, angle between the section profile that insulation course 240 has away from the front end of decorative layer 220 and substrate 210 is less than 90 degree, and insulation course side surface 240a provides more gentle incline compared to decorative layer side surface 220a, to reduce the probability that conducting element 250 occurs when being extended to first area A1 by second area A2 to break.In other embodiments, the angle between the section profile that has away from the front end of decorative layer 220 of insulation course 240 and substrate 210 is less than 75 degree.
The wherein two kind insulation course of Fig. 1 and Fig. 2 only in display panel structure is configured at the configuration relation of decorative layer side surface, and the configuration relation between insulation course and decorative layer also can have other design.In order to can more highlight insulation course and decorative layer be configured on substrate relative position.Below graphic only illustrates the substrate of local, insulation course, decorative layer and part discrepant with tool in above-described embodiment, and omits the part identical with Fig. 1 and Fig. 2.
Fig. 3 A is the partial cutaway schematic of a kind of panel construction of the third embodiment of the present invention.In the present embodiment, decorative layer 320 is formed by photoresist.Compared to during in the past with printing ink to manufacture decorative layer, need multiple-level stack, use photoresist to be made as decorative layer 320 directly just can mold certain height photoresistance with a gold-tinted process, comparatively simple in process.Insulation course 340 is covered in the decorative layer end face 320b of part and the decorative layer side surface 320a of part, and exposes the interface portion of decorative layer end face 320b and decorative layer side surface 320a.Also extend to this second area A2 partly because insulation course 340 is configured on decorative layer side surface 320a, insulation course side surface 340a provides more gentle incline compared to decorative layer side surface 320a.
Certainly, Fig. 3 A only represents the configuration relation wherein between a kind of insulation course 340 and decorative layer 320.Fig. 3 B to Fig. 3 D is the partial cutaway schematic of a kind of panel construction of the 4th to the 6th embodiment of the present invention.Insulation course 340 also can cover whole decorative layer end face 320b and decorative layer side surface 320a as shown in Figure 3 B.Or insulation course 340 also can cover whole decorative layer end face 320b and exposed portion decorative layer side surface 320a as shown in Figure 3 C.Or insulation course 340 also can exposed portion decorative layer end face 320b cover whole decorative layer side surface 320a as shown in Figure 3 D.Configuration relation between insulation course 340 and decorative layer 320 is not made with above-mentioned being limited, as long as the angle formed between the section profile that insulation course 340 has in the front end away from decorative layer 320 and substrate 310 is less than the angle formed between section profile and substrate 310 that decorative layer 320 has in the bottom near second area A2, and compared to decorative layer side surface 320a, insulation course side surface 340a can provide comparatively gentle incline.
Fig. 3 E is the section of insulation course away from the front end of decorative layer and the micrograph of substrate of the panel construction of Fig. 3 A.Can clearly be seen by Fig. 3 E, the angle formed between the section profile that insulation course 340 has in the front end away from decorative layer 320 and substrate 310 is less than the angle formed between section profile and substrate 310 that decorative layer 320 has in the bottom near second area A2.In addition, the angle theta between the section profile that has in the front end away from decorative layer 320 of insulation course 340 and substrate 310 is less than 90 degree.More particularly, angle theta is the angle of insulation course 340 between the near-tangential and the bearing of trend of substrate 310 of the section profile foremost away from decorative layer 320.As shown in Figure 3 B, the angle theta of insulation course 340 between the near-tangential and the bearing of trend of substrate 310 of the section profile foremost away from decorative layer 320 is 71.8 degree.In addition, in the present embodiment, the length W that insulation course 340 extends to the direction away from decorative layer 320 in second area A2 is 34.65 microns, and at first area A1 and the thickness H(of insulation course 340 of second area A2 intersection i.e. the height of the bearing of trend of vertical substrate 310) be 10.01 microns.
Fig. 4 is the partial cutaway schematic of a kind of panel construction of the seventh embodiment of the present invention.Refer to Fig. 4, in the present embodiment, decorative layer 420 is formed by photoresist.Insulation course 440 extends to second area A2 from the decorative layer end face 420b away from substrate 410 of decorative layer 420 through the decorative layer side surface 420a of decorative layer 420.
The panel construction 400 of Fig. 4 is with the Main Differences of the panel construction 300 of Fig. 3 A, and the panel construction 400 of Fig. 4 also comprises fill-in light resistance layer 495.Fill-in light resistance layer 495 is configured at position on the insulation course 440 of decorative layer end face 420b.Decorative layer 420 is different with the color of fill-in light resistance layer 495.In the present embodiment, the color of decorative layer 420 is white, and the color of fill-in light resistance layer 495 is black, but decorative layer 420 and the color visible product of fill-in light resistance layer 495 design and different, not as restriction.In the present embodiment, insulation course 440 is except providing the function of comparatively gentle incline, because insulation course 440 is configured between decorative layer 420 and fill-in light resistance layer 495, under insulation course 440 also can avoid pyroprocessing, decorative layer 420 variable color and gasification and the problem crumbled.
Fig. 5 is the partial cutaway schematic of a kind of panel construction of the eighth embodiment of the present invention.Refer to Fig. 5, the panel construction of Fig. 5 500 is with the Main Differences of the panel construction 400 of Fig. 4, and the panel construction 500 of Fig. 5 also comprises cushion 530, and it to be configured on substrate 510 and between fill-in light resistance layer 595 and insulation course 540.That is, in the present embodiment, panel construction 500 is by the duplex configuration of cushion 530 with insulation course 540, under pyroprocessing, can also stop that the impregnation of fill-in light resistance layer 595 enters decorative layer 520, to avoid the problem of variable color, and more effectively avoid the problem that decorative layer 520 crumbles in pyroprocessing gasified.
Fig. 6 is the partial cutaway schematic of a kind of panel construction of the ninth embodiment of the present invention.Refer to Fig. 6, in the panel construction 600 of Fig. 6, decorative layer 620 is photoresist formation, and insulation course 640 is different from the color of the photoresist of decorative layer 620 for color, insulation course 640 intactly covers whole decorative layer end face 620b and decorative layer side surface 620a.Further, the panel construction 600 of Fig. 6 also comprises cushion 630, between decorative layer 620 and insulation course 640.In detail, cushion 630 extends toward second area A2 from decorative layer end face 620b through decorative layer side surface 620a, and insulation course 640 extends toward second area A2 downwards along the cushion 630 be positioned on decorative layer end face 620b through buffer layer side surface 630a.
In the present embodiment, second area A2 is extended to along cushion 630 by insulation course 640, angle between the section profile that insulation course 640 has away from the front end of decorative layer 620 and substrate 610 is less than the angle between section profile and substrate 610 that decorative layer 620 has in the bottom near second area A2, and insulation course side surface 640a provides more gentle incline compared to decorative layer side surface 620a.
In sum, panel construction of the present invention utilizes photoresist layer as decorative layer, compared to during in the past with printing ink to manufacture decorative layer, needs multiple-level stack, use photoresist layer directly just can mold the photoresistance of certain height with a gold-tinted process as decorative layer, comparatively simple in process.In addition, in order to avoid decorative layer side surface makes conducting element not easily extend to first area from second area too suddenly, panel construction of the present invention configures insulation course on decorative layer, insulation course extends to second area along decorative layer side surface, angle between the section profile had away from the front end of decorative layer in the second area by insulation course and substrate is less than the angle between section profile and substrate that decorative layer has in the bottom near second area, and the gradient of insulation course side surface is delayed compared with the gradient of decorative layer side surface, can be configured on decorative layer along milder insulation course to make conducting element, effectively avoid conducting element that the problem of broken string occurs.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (20)
1. a panel construction, is characterized in that, comprising:
Substrate;
Decorative layer, is configured on this substrate, and this decorative layer region is first area and region beyond this decorative layer is second area, and wherein the material of this decorative layer comprises photoresist;
Insulation course, at least being configured at this decorative layer on the decorative layer side surface of this second area extends to this second area partly, and wherein this insulation course is less than away from the angle formed between the section profile of the front end of this decorative layer and this substrate the angle that this decorative layer forms between the section profile and this substrate of the bottom near this second area; And
At least one conducting element, respectively this conducting element extends to this first area from this second area continuously along this insulation course.
2. panel construction according to claim 1, is characterized in that, this decorative layer comprises the first photoresist layer and the second photoresist layer, and this second photoresist layer is configured on this first photoresist layer, and the color of this first photoresist layer and this second photoresist layer is different.
3. panel construction according to claim 2, is characterized in that, also comprises cushion, between this first photoresist layer and this second photoresist layer.
4. panel construction according to claim 3, it is characterized in that, this cushion extends to this second area along the first photoresist layer side surface of this first photoresist layer, and this second photoresist layer extends along this cushion toward the direction of this second area, be this decorative layer side surface of this decorative layer to make the surface of this second photoresist layer this second area closer.
5. panel construction according to claim 1, it is characterized in that, also comprise fill-in light resistance layer, wherein this insulation course extends to this second area from the decorative layer end face away from this substrate of this decorative layer through the decorative layer side surface of this decorative layer, this fill-in light resistance layer is configured at position on this insulation course of this decorative layer end face, and the color of this decorative layer and this fill-in light resistance layer is different.
6. panel construction according to claim 5, is characterized in that, also comprises cushion, between this fill-in light resistance layer and this insulation course.
7. panel construction according to claim 1, is characterized in that, also comprises cushion, between this decorative layer and this insulation course.
8. panel construction according to claim 7, is characterized in that, this insulation course is a photoresist layer, and the color of this photoresist layer is different from this decorative layer.
9. panel construction according to claim 2, is characterized in that, the thickness of this first photoresist layer is 10 microns to 20 microns.
10. panel construction according to claim 2, is characterized in that, the angle between the side surface of this first photoresist layer and this substrate is 30 degree to 90 degree.
11. panel constructions according to claim 1, is characterized in that, this insulation course extends 30 microns to 150 microns by this decorative layer side surface to the direction away from this decorative layer.
12. panel constructions according to claim 1, is characterized in that, this insulation course is less than 75 degree away from the angle formed between the section profile of the front end of this decorative layer and this substrate.
13. panel constructions according to claim 1, is characterized in that, this insulation course on this decorative layer side surface, and the closer to this substrate, this insulation course is larger at the thickness of this substrate bearing of trend parallel.
14. panel constructions according to claim 1, is characterized in that, also comprise insulating bottom layer, are configured between this substrate and this decorative layer and between this substrate and this conducting element.
15. panel constructions according to claim 1, is characterized in that, also comprise optical match layer, are covered in this decorative layer, this insulation course and each this conducting element.
16. panel constructions according to claim 1, is characterized in that, also comprise protective seam, be covered in this decorative layer and this insulation course, and the material of this protective seam are identical with the material of this insulation course.
17. panel constructions according to claim 1, is characterized in that, the thickness of this insulation course is 0.5 micron to 3 microns.
18. panel constructions according to claim 1, it is characterized in that, this conducting element comprises the first electrode unit, the second electrode unit and electrically completely cuts off the isolated unit of this first electrode unit and this second electrode unit, and this isolated unit is identical in fact with the thickness of this insulation course.
19. panel constructions according to claim 1, it is characterized in that, also comprise plastic cement rete and optical cement, this plastic cement rete is attached at by this optical cement the one side that this substrate has this insulation course, and this plastic cement rete and this optical cement overlapping with this insulation course at this second area.
20. panel constructions according to claim 1, is characterized in that, also comprise display and optical cement, and this display is attached at by this optical cement the one side that this substrate has this insulation course, and this optical cement is overlapping with this insulation course at this second area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102144901 | 2013-12-06 | ||
| TW102144901A TW201523359A (en) | 2013-12-06 | 2013-12-06 | Panel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104699289A true CN104699289A (en) | 2015-06-10 |
Family
ID=53346494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410052206.9A Pending CN104699289A (en) | 2013-12-06 | 2014-02-14 | Panel structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104699289A (en) |
| TW (1) | TW201523359A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898886A (en) * | 2015-06-19 | 2015-09-09 | 京东方科技集团股份有限公司 | Substrate, preparation method thereof and touch display screen |
| CN109428011A (en) * | 2017-09-05 | 2019-03-05 | 创王光电股份有限公司 | A kind of light-emitting component and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202267939U (en) * | 2011-10-14 | 2012-06-06 | 联胜（中国）科技有限公司 | Touch device and touch display device |
| KR20130017898A (en) * | 2011-08-12 | 2013-02-20 | 엘지이노텍 주식회사 | Touch window |
| CN103376939A (en) * | 2012-04-11 | 2013-10-30 | 联胜（中国）科技有限公司 | Touch panel, touch display panel and manufacture method of touch panel |
| CN103389823A (en) * | 2012-05-08 | 2013-11-13 | 宏达国际电子股份有限公司 | Touch display device |
-
2013
- 2013-12-06 TW TW102144901A patent/TW201523359A/en unknown
-
2014
- 2014-02-14 CN CN201410052206.9A patent/CN104699289A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130017898A (en) * | 2011-08-12 | 2013-02-20 | 엘지이노텍 주식회사 | Touch window |
| CN202267939U (en) * | 2011-10-14 | 2012-06-06 | 联胜（中国）科技有限公司 | Touch device and touch display device |
| CN103376939A (en) * | 2012-04-11 | 2013-10-30 | 联胜（中国）科技有限公司 | Touch panel, touch display panel and manufacture method of touch panel |
| CN103389823A (en) * | 2012-05-08 | 2013-11-13 | 宏达国际电子股份有限公司 | Touch display device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898886A (en) * | 2015-06-19 | 2015-09-09 | 京东方科技集团股份有限公司 | Substrate, preparation method thereof and touch display screen |
| US10133379B2 (en) | 2015-06-19 | 2018-11-20 | Boe Technology Group Co., Ltd. | Substrate, touch display panel having the same, and method thereof |
| CN109428011A (en) * | 2017-09-05 | 2019-03-05 | 创王光电股份有限公司 | A kind of light-emitting component and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201523359A (en) | 2015-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203773509U (en) | Touch control panel | |
| CN103186273B (en) | Contactor control device and manufacture method thereof | |
| US9417722B2 (en) | Touch panel and fabrication method thereof | |
| US9977544B2 (en) | Touch device and method for fabricating thereof | |
| TWI471774B (en) | Touch-sensitive device and touch-sensitive display device | |
| US9215796B2 (en) | Touch panel | |
| US9740315B2 (en) | Touch panel and method of manufacturing the same | |
| CN103513812B (en) | Touch control display device | |
| CN103076907B (en) | Contactor control device and manufacture method thereof | |
| TWI488084B (en) | Touch panel | |
| US20130241857A1 (en) | Touch panel and touch display panel and method of making the same | |
| CN104808824A (en) | Touch board | |
| US8947399B2 (en) | Dual-substrate capacitive touch panel | |
| US9391609B2 (en) | Touch device and fabrication method thereof | |
| CN204155210U (en) | Covering plate and touch device | |
| TWI480783B (en) | Touch devices and method for manufacturing the same | |
| CN203706182U (en) | Touch control panel | |
| CN103677388A (en) | Touch control panel | |
| CN104699289A (en) | Panel structure | |
| CN204203916U (en) | Cover sheet and contact panel | |
| TWM461835U (en) | Touch panel | |
| CN203759670U (en) | Touchpad | |
| TWM484740U (en) | Panel structure | |
| CN104317437A (en) | Protecting cover plate and touch panel | |
| CN104461106A (en) | Touch panel and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150610 |
|
| WD01 | Invention patent application deemed withdrawn after publication |