CN104694911A - Method for chemically plating Ni-P alloy on SiC particle surface - Google Patents
Method for chemically plating Ni-P alloy on SiC particle surface Download PDFInfo
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- CN104694911A CN104694911A CN201510118257.1A CN201510118257A CN104694911A CN 104694911 A CN104694911 A CN 104694911A CN 201510118257 A CN201510118257 A CN 201510118257A CN 104694911 A CN104694911 A CN 104694911A
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- 238000007747 plating Methods 0.000 title claims abstract description 98
- 239000002245 particle Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229910018104 Ni-P Inorganic materials 0.000 title claims abstract description 25
- 229910018536 Ni—P Inorganic materials 0.000 title claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 24
- 239000000956 alloy Substances 0.000 title claims abstract description 24
- 239000000126 substance Substances 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000001914 filtration Methods 0.000 claims abstract description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 21
- 229910001096 P alloy Inorganic materials 0.000 claims description 19
- 230000004913 activation Effects 0.000 claims description 13
- 238000001994 activation Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 150000002815 nickel Chemical class 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 7
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 7
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 7
- 229940093930 potassium iodate Drugs 0.000 claims description 7
- 235000006666 potassium iodate Nutrition 0.000 claims description 7
- 239000001230 potassium iodate Substances 0.000 claims description 7
- 239000001632 sodium acetate Substances 0.000 claims description 7
- 229960004249 sodium acetate Drugs 0.000 claims description 7
- 235000017281 sodium acetate Nutrition 0.000 claims description 7
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 7
- 239000001488 sodium phosphate Substances 0.000 claims description 7
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 7
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 238000001556 precipitation Methods 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005275 alloying Methods 0.000 claims description 2
- 230000007420 reactivation Effects 0.000 claims description 2
- 239000002131 composite material Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 3
- 230000001376 precipitating effect Effects 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 42
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 41
- 239000000243 solution Substances 0.000 description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000008204 material by function Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
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- Chemically Coating (AREA)
Abstract
The invention discloses a method for chemically plating Ni-P alloy on SiC particle surface. The method for chemically plating the Ni-P alloy on the SiC particle surface includes that directly adding weighted SiC particles to chemical plating Ni-P alloy solution, using a glass rod plated with the alloy to induce and activate the chemical plating solution in thermostatic water bath, or adding a metal plate plated with the alloy to induce and activate till appearing a writhing phenomenon, ending plating, and obtaining the SiC particles plated with Ni-P alloy element layers through precipitating, filtering, drying and the like. The particles can be used as particle reinforcement to prepare metal-base composite material, and meanwhile, the particles are basic raw material for preparing engineering material and function material.
Description
Technical field
The present invention relates to nanoparticle surface processing technology field, especially relate to a kind of method of SiC particle surface chemical plating Mi-P alloy.
Background technology
At present, SiC particle is widely used as reinforced particulate to prepare metal-base composites, is also the basic raw material of preparation engineering material, functional materials simultaneously.Domestic and international many scholars are in the applied research being actively devoted to SiC particle.Find in practical application: prepare reinforced composite if directly added in metallic matrix by naked SiC particle, boundary moisture performance can be caused poor because of the essential distinction between the covalent linkage of SiC particle and the metallic bond of metallic matrix, and when SiC particle contacts with metallic matrix, significant solid state reaction can be there is in interface more than 800 DEG C, SiC particle is caused to be degraded, the product that some have complex construction is generated in interface, change the microstructure of metallic matrix, thus disadvantageous effect is caused to the bonding state at interface and the mechanical property of material, thus greatly reduce its over-all properties.
If form ceramic-metal composite granule at SiC particle surface compound Ni or other metal, then can improve the interface wet ability between pottery and matrix and chemical compatibility.Composite granule is joined in metallic matrix top layer and prepare composite surface material, metallic element and coating can suppress or delay the reaction of particle and matrix, form at particle periphery the tissue that some support particle simultaneously, thus obtain the excellent metal-base composites of wear resisting property.Therefore, in order to play the performance of SiC particle better, generally need to modify to improve its performance to its surface, this is also a large hot research problem in the fields such as domestic and international Materials science, interface and Surface Science.
Realize the compound of SiC particle and Ni or other metal mainly through electroless plating in currently available technology.Electroless plating method utilizes metal salt solution to make reducing metal ions become metal under the effect of reductive agent, the surface of plating piece obtains the settled layer of metal, the method has that technique is simple, with low cost, coating evenly, with the advantage such as matrix is combined, there is very consequence in the process for treating surface of particle.Such as, publication number is that the application for a patent for invention of CN103451634A discloses " a kind of chemical nickel plating method of micrometer silicon carbide silicon powder surface ", the method is the minimum reduction dosage that only can react in the amount of the reductive agent starting to add, then undertaken low discharge, continual adding reductive agent by dropper, the reductibility of reductive agent in plating solution is made to keep constant, thus reach the object controlling speed of response, effectively overcome the problem that nickel plating micrometer silicon carbide silica flour is unstable and nickel plating micrometer silicon carbide silicon powder surface is exposed.Publication number is that the application for a patent for invention of CN102277564A discloses " a kind of aluminum silicon carbide composite material Electroless nickel-phosphor plating process ", this technique comprises: workpiece surface pre-treatment, oil removing, alligatoring, activation, plating, thermal treatment, its chemical plating fluid is made up of nickel salt, reductive agent, complexing agent, stablizer, brightening agent and deionized water, and gained coating is bright, smooth, even, fine and close.Electroless plating disclosed in technique scheme modifies SiC particle technique all will implement a series of pre-treatments such as oxidation, hydrophilic, sensitization and activation to SiC particle, and process is numerous and diverse, and medicine used is extremely expensive, limits the application of this method in actual production.
Summary of the invention
For solving the problems of the technologies described above, the invention discloses a kind of the SiC particle and the activating treatment process thereof that are coated with Ni-P alloy through electroless plating activation treatment rear surface.
The technical scheme that the application adopts is:
A method for SiC particle surface chemical plating Mi-P alloy, comprising:
(1) plating solution is configured: prepare plating solution needed for chemical plating Mi-P alloy in proportion;
(2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C ~ 90 DEG C;
(3) add SiC particle and stir: load weighted SiC particle is directly added in above-mentioned plating solution, implementing to bring out activation treatment, bring out in reactivation process and need not stir;
(4) plating is seethed to plating solution: plating time is 3 ~ 5 hours, and adjust ph is 4.6 ~ 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears;
(5) through precipitation, filtration, drying, the SiC particle being coated with Ni-P alloy is obtained.
Further, described in step (1), the formula of plating solution is: single nickel salt 20-40g/L, inferior sodium phosphate 10-30g/L, citric acid 10-30g/L, sodium-acetate 5-25g/L, Potassium Iodate 0.01-0.05mg/L, Sodium dodecylbenzene sulfonate 0.01-0.05mg/L.
Further, described in step (1), the formula of plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L.
Further, in step (3), employing has been coated with the glass stick of Ni-P alloy or has adopted the iron plate being coated with Ni-P alloy to implement to bring out activation.
Further, the ammoniacal liquor of 1: 5 is adopted to regulate bath pH value in step (4).
Beneficial effect of the present invention:
SiC particle surface compound Ni-P alliage effect after activation is good, avoids the complex process of carrying out add SiC particle in plating process before, only need with glass stick or the iron plate activation plating solution being coated with Ni-P alloy, and technique is simple.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that activated treat surface is coated with the SiC particle of Ni-P alloy;
Fig. 2 is the method flow diagram of a kind of SiC particle surface chemical plating Mi-P alloy of the present invention.
Embodiment
Composition graphs 1 describes the SiC particle adopting the method for the invention this surface of preparing to be coated with Ni-P alloy in detail, and this SiC particle is made up of SiC particle-matrix and the Ni-P alloying element layer that is compounded in matrix surface.This particle can be used as reinforced particulate to prepare metal-base composites, and this particle is also the basic raw material of preparation engineering material, functional materials simultaneously.
The embodiment of SiC particle surface chemical plating Mi-P alloy is described in detail below in conjunction with accompanying drawing.
Embodiment 1
A kind of method of SiC particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is: single nickel salt 20g/L, inferior sodium phosphate 10g/L, citric acid 10g/L, sodium-acetate 5g/L, Potassium Iodate 0.01mg/L, Sodium dodecylbenzene sulfonate 0.01mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C; (3) add SiC particle and stir: load weighted SiC particle is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 3 hours, and adopts the ammoniacal liquor of 1: 5 to regulate bath pH value, and adjust ph is 4.6, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the SiC particle being coated with Ni-P alloy is obtained.
Embodiment 2
A kind of method of SiC particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 85 DEG C; (3) add SiC particle and stir: load weighted SiC particle is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 4 hours, and adopts the ammoniacal liquor of 1: 5 to regulate bath pH value, and adjust ph is 4.8, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the SiC particle being coated with Ni-P alloy is obtained.
Embodiment 3
A kind of method of SiC particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is single nickel salt 40g/L, inferior sodium phosphate 30g/L, citric acid 30g/L, sodium-acetate 25g/L, Potassium Iodate 0.05mg/L, Sodium dodecylbenzene sulfonate 0.05mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 90 DEG C; (3) add SiC particle and stir: load weighted SiC particle is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 5 hours, and adopts the ammoniacal liquor of 1: 5 to regulate bath pH value, and adjust ph is 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the SiC particle being coated with Ni-P alloy is obtained.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (6)
1. a method for SiC particle surface chemical plating Mi-P alloy, comprising:
(1) plating solution is configured: prepare plating solution needed for chemical plating Mi-P alloy in proportion;
(2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C ~ 90 DEG C;
(3) add SiC particle and bring out activation: load weighted SiC particle is directly added in above-mentioned plating solution, implementing to bring out activation treatment simultaneously, bring out in reactivation process and need not stir;
(4) plating is seethed to plating solution: plating time is 3 ~ 5 hours, and adjust ph is 4.6 ~ 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears;
(5) through precipitation, filtration, drying, the SiC particle being coated with Ni-P alloy is obtained.
2. the method for a kind of SiC particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 20-40g/L, inferior sodium phosphate 10-30g/L, citric acid 10-30g/L, sodium-acetate 5-25g/L, Potassium Iodate 0.01-0.05mg/L, Sodium dodecylbenzene sulfonate 0.01-0.05mg/L.
3. the method for a kind of SiC particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L.
4. the method for a kind of SiC particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: in step (3), employing has been coated with the glass stick of Ni-P alloy or has adopted the iron plate being coated with Ni-P alloy to implement to bring out activation.
5. the method for a kind of SiC particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: adopt the ammoniacal liquor of 1: 5 to regulate bath pH value in step (4).
6. the method for a kind of SiC particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: the SiC particle of the surface chemical plating Ni-P alloy particle that the method prepares is made up of SiC matrix and the Ni-P alloying element layer that is compounded in matrix surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510118257.1A CN104694911B (en) | 2015-03-18 | 2015-03-18 | A kind of method of SiC particle surfaces Electroless Plating Ni P alloys |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510118257.1A CN104694911B (en) | 2015-03-18 | 2015-03-18 | A kind of method of SiC particle surfaces Electroless Plating Ni P alloys |
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| Publication Number | Publication Date |
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| CN104694911A true CN104694911A (en) | 2015-06-10 |
| CN104694911B CN104694911B (en) | 2018-03-27 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105944743A (en) * | 2016-05-17 | 2016-09-21 | 天津大学 | Preparation method of Ni-P nano-particles having eggshell structure and applied to catalytic hydrogen production |
| CN111500104A (en) * | 2020-04-24 | 2020-08-07 | 南京同诚节能环保装备研究院有限公司 | Preparation method of nickel-coated graphene silicon carbide |
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2015
- 2015-03-18 CN CN201510118257.1A patent/CN104694911B/en not_active Expired - Fee Related
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Cited By (2)
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| CN105944743A (en) * | 2016-05-17 | 2016-09-21 | 天津大学 | Preparation method of Ni-P nano-particles having eggshell structure and applied to catalytic hydrogen production |
| CN111500104A (en) * | 2020-04-24 | 2020-08-07 | 南京同诚节能环保装备研究院有限公司 | Preparation method of nickel-coated graphene silicon carbide |
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| CN104694911B (en) | 2018-03-27 |
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