CN104681308A - Method for preparing aperture controllable three-dimensional microelectrode of super capacitor - Google Patents

Method for preparing aperture controllable three-dimensional microelectrode of super capacitor Download PDF

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Publication number
CN104681308A
CN104681308A CN201510122007.5A CN201510122007A CN104681308A CN 104681308 A CN104681308 A CN 104681308A CN 201510122007 A CN201510122007 A CN 201510122007A CN 104681308 A CN104681308 A CN 104681308A
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photoresist
dimensional
temperature
electrode
fecl
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CN201510122007.5A
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李刚
赵清华
李朋伟
张文栋
胡杰
淡富奎
桑胜波
段倩倩
菅傲群
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Taiyuan University of Technology
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Taiyuan University of Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H01G11/86Processes for the manufacture of hybrid or EDL capacitors, or components thereof specially adapted for electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22Electrodes
    • H01G11/26Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13Energy storage using capacitors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

The invention relates to the technical field of a micro electro mechanical system, in particular to a method for preparing an aperture controllable three-dimensional microelectrode of a super capacitor. The method comprises the following steps: firstly, doping FeCl3 solid particles of which the diameter is in the range of 2 to 50nm into SU-8 photoresist; then spin-coating the doped SU-8 photoresist on a silicon chip and obtaining a three-dimensional array structure with a vertical side wall and a high depth-to-width ratio by a photolithographic process; placing the structure into a high-temperature carbonization furnace to carry out carbonization to obtain a mesoporous carbon electrode. According to the method, from the angle of the design process, the specific surface area of the three-dimensional electrode is increased in a manner of doping FeCl3 into the SU-8 photoresist; FeCl3 is easy to directly sublimate at a high temperature and can be volatilized in the carbonizing process; mesoporous carbon most of which has the aperture range of 2 to 50nm is formed; the number of blind holes is reduced, and the utilization rate of the surface area of the porous carbon is greatly improved, so that the area of the electrode of the super capacitor is enlarged, and specific capacitance and specific power of the capacitor are improved.

Description

The ultracapacitor three-dimensional micro-electrode preparation method that a kind of aperture is controlled
Technical field
The present invention relates to micro-electromechanical system field, be specially the ultracapacitor three-dimensional micro-electrode preparation method that a kind of aperture is controlled.
Background technology
MEMS (Micro Electro Mechanical Systems, i.e. microelectromechanical systems) be a kind of industrial technology that microelectric technique and mechanical engineering are fused together, it has, and cost is low, volume is little, automatic control strong, high reliability, is one of most important technological innovation in recent years.Ultracapacitor is a kind of novel energy storage device, MEMS supercapacitor also shows while possessing conventional Super capacitor advantage that stored energy is large, volume microminiaturization, have extended cycle life, can the repeatedly feature such as cycle charge-discharge and batch production, reduce device volume and design cost, improve the reliability and stability of device layout system, therefore MEMS supercapacitor is subject to showing great attention to of domestic and international researcher.
Ultracapacitor, according to the difference of energy storage mechnism, can be divided into double electric layer capacitor and fake capacitance capacitor, and the electrode material that wherein double electric layer capacitor uses mostly is porous carbon materials, such as active carbon, carbon aerogels, carbon nano-tube.The amount of capacity of double electric layer capacitor is relevant with the hole of electrode material.Usually, porosity is higher, and the specific area of electrode material is larger, and electric double layer capacitance is also larger.Simultaneously pore size can affect the utilance in hole, causes the movement rate of electrolyte ion to reduce or electrolyte ion cannot in access aperture due to the too small meeting in aperture, and aperture too conference makes space waste in hole.Therefore, how effectively to improve porosity, control pore size thus improve the Main way that the capacity of double electric layer capacitor becomes electrochemical capacitance research.
Summary of the invention
The present invention, in order to solve the little problem of double electric layer capacitor capacity, provides the ultracapacitor three-dimensional micro-electrode preparation method that a kind of aperture is controlled.
The present invention adopts following technical scheme to realize: the ultracapacitor three-dimensional micro-electrode preparation method that a kind of aperture is controlled, comprises the steps:
(1) choose silicon chip as substrate, will clean at the bottom of silicon wafer-based and dry;
(2) be the FeCl of 2-50nm by diameter 3evenly be incorporated in SU-8 photoresist, FeCl when mixing 3be 1:5 ~ 1:20 with the mass ratio of SU-8 photoresist;
(3) at the bottom of the silicon wafer-based after cleaning, drying, even spin coating is mixed with FeCl 3sU-8 photoresist;
(4) doped with FeCl 3to place figure be the mask plate of regular hexagon hole shape on SU-8 photoresist surface;
(5) SU-8 photoresist is exposed, developed, obtain three-dimensional regular hexahedron columnar arrays structure;
(6) the three-dimensional regular hexahedron columnar arrays structure obtained is put in retort carry out high temperature carbonization and obtain mesoporous carbon electrode.
The present invention proposes the controlled ultracapacitor three-dimensional micro-electrode preparation method in a kind of aperture.The FeCl that the method utilizes high temperature easily to distil 3the pore size of the effective control electrode material of particle, chooses the FeCl that diameter is 2-50nm in experiment 3as alloy, and with the quality of 1:5 ~ 1:20 than scope and the mixing of SU-8 photoresist, while guaranteeing electrode material porosity, effectively improve the specific area of electrode material, thus improve the ratio capacitance of double electric layer capacitor.Present invention incorporates SU-8 glue and FeCl 3superperformance, compared to common electrode material, the empty number that is situated between improves greatly, decreases the quantity of blind hole, significantly improves the surface area utilance of electrode material, finally reaches the object improving ratio capacitance and specific energy.
The ultracapacitor three-dimensional micro-electrode preparation method that above-mentioned a kind of aperture is controlled, in carbonization process, temperature, the rate of heat addition and cooldown rate arrange as follows: first, and temperature is elevated to 450 DEG C from room temperature by used time 130min, stablizes 60min; Temperature is risen to 700 DEG C by used time 100min again, and heating rate is 2.5 DEG C/minute, stablizes 90min; Need 80min to be warming up to 900 DEG C afterwards again, heating rate is 2.5 DEG C/minute, continues to stablize 60min; Final used time 40min is warming up to 1000 DEG C, and heating rate is 2.5 DEG C/minute, continual and steady 60min, progressively completes the charing completely of array structure; Naturally cool 360min and be down to room temperature.Carbonization temperature is multi-level ladder propradation, and one is to fully carbonize at a certain temperature, is conducive to the eliminating of specific product at this temperature, increases the mesoporous quality and quantity of electrode; Two is slow down heating rate can reduce the different problem causing electrode to come off from silicon base of the coefficient of expansion with cooldown rate, utilizes and increases the specific area that mesoporous quality and quantity increases electrode.
Present invention achieves the control to porous carbon aperture, improve porous surface and amass utilance.Thus reach the object increasing specific capacity of double-layer capacitor and specific power.Processing technology in the present invention is simple to operation.Size is little, and quality is light, can be integrated, is widely used in the Power supply of micro mechanical system.
Accompanying drawing explanation
Fig. 1 is electrode structure vertical view.
Fig. 2 is carbonization temperature time plot.
Embodiment
(1) choose 2 cun of silicon chips as substrate, and clean at the bottom of silicon wafer-based with wipe oil, oxide-film and metal ion in dimethylbenzene, acetone, alcohol, sulfuric acid/hydrogen peroxide, ammoniacal liquor/hydrogen peroxide, hydrochloric acid/hydrogen peroxide solution successively, then dry;
(2) be the FeCl of 2-50nm by diameter 3be incorporated in SU-8 photoresist, FeCl when mixing 3be 1:5 ~ 1:20 with the mass ratio of SU-8 photoresist, use magnetic stirrer to stir and make it mix;
(3) at the bottom of the silicon wafer-based after cleaning, drying by twice lacquering technique spin coating thickness be 500 μm doped with FeCl 3sU-8 photoresist, before whirl coating, first will be heated to 45 DEG C at the bottom of silicon wafer-based, then carry out first time whirl coating, first time whirl coating complete after first to photoresist carry out certain hour front baking solidification, carry out second time whirl coating afterwards;
(4) by the close contact post-exposure of photoresist surface with mask plate, the time for exposure is 120s, then puts into baking oven by the bottom of silicon wafer-based, is warming up to 60 DEG C, keeps 1min, is warming up to 90 DEG C, keeps 30min, takes out after naturally cooling to room temperature; Then photoresist is placed on photoresist developing 60min under ultrasonic environment, obtains column hexahedron structure;
(5) three-dimensional regular hexahedron columnar arrays structure is put in retort, carry out in the environment of 95% nitrogen/5% hydrogen during charing, in carbonization process, temperature, the rate of heat addition and cooldown rate arrange as follows: first, and temperature is elevated to 450 DEG C from room temperature by used time 130min, stablizes 60min; Temperature is risen to 700 DEG C by used time 100min again, and heating rate is 2.5 DEG C/minute, stablizes 90min; Need 80min to be warming up to 900 DEG C afterwards again, heating rate is 2.5 DEG C/minute, continues to stablize 60min; Final used time 40min is warming up to 1000 DEG C, and heating rate is 2.5 DEG C/minute, continual and steady 60min, progressively completes the charing completely of array structure; Naturally cool 360min and be down to room temperature, final charing obtains mesoporous carbon electrode.

Claims (2)

1. the ultracapacitor three-dimensional micro-electrode preparation method that aperture is controlled, is characterized in that comprising the steps:
(1) choose silicon chip as substrate, will clean at the bottom of silicon wafer-based and dry;
(2) be the FeCl of 2-50nm by diameter 3evenly be incorporated in SU-8 photoresist, FeCl when mixing 3be 1:5 ~ 1:20 with the mass ratio of SU-8 photoresist;
(3) at the bottom of the silicon wafer-based after cleaning, drying, even spin coating is doped with FeCl 3sU-8 photoresist;
(4) doped with FeCl 3to place figure be the mask plate of regular hexagon hole shape on SU-8 photoresist surface;
(5) SU-8 photoresist is exposed, developed, obtain three-dimensional regular hexahedron columnar arrays structure;
(6) the three-dimensional regular hexahedron columnar arrays structure obtained is put in retort carry out high temperature carbonization and obtain mesoporous carbon electrode.
2. the ultracapacitor three-dimensional micro-electrode preparation method that a kind of aperture according to claim 1 is controlled, it is characterized in that temperature in carbonization process, the rate of heat addition and cooldown rate are arranged as follows: first, temperature is elevated to 450 DEG C from room temperature by used time 130min, stablizes 60min; Temperature is risen to 700 DEG C by used time 100min again, and heating rate is 2.5 DEG C/minute, stablizes 90min; Need 80min to be warming up to 900 DEG C afterwards again, heating rate is 2.5 DEG C/minute, continues to stablize 60min; Final used time 40min is warming up to 1000 DEG C, and heating rate is 2.5 DEG C/minute, continual and steady 60min, progressively completes the charing completely of array structure; Naturally cool 360min and be down to room temperature.
CN201510122007.5A 2015-03-20 2015-03-20 Method for preparing aperture controllable three-dimensional microelectrode of super capacitor Pending CN104681308A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105675682A (en) * 2015-12-28 2016-06-15 中国人民大学 Size-controllable nanowire microelectrode, preparation method and application thereof
CN108807007A (en) * 2018-08-08 2018-11-13 武汉理工大学 The manufacture craft of three-dimensional manometer threadiness hole carbon material and high voltage micro super capacitor

Citations (5)

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CN1702887A (en) * 2005-05-20 2005-11-30 清华大学 Process for preparing carbon electrode array with high surface area and high gap filling capacity
US20080176138A1 (en) * 2007-01-19 2008-07-24 Park Benjamin Y Carbon electrodes for electrochemical applications
CN101388291A (en) * 2008-10-31 2009-03-18 中国科学院上海硅酸盐研究所 Boron containing porous carbon electrode material and preparation thereof
CN101421866A (en) * 2004-02-11 2009-04-29 加州大学评议会 High aspect ratio C-MEMS architecture
CN103588165A (en) * 2013-11-27 2014-02-19 华中科技大学 Three dimensional trans-scale charcoal electrode array structure and manufacture method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101421866A (en) * 2004-02-11 2009-04-29 加州大学评议会 High aspect ratio C-MEMS architecture
CN1702887A (en) * 2005-05-20 2005-11-30 清华大学 Process for preparing carbon electrode array with high surface area and high gap filling capacity
US20080176138A1 (en) * 2007-01-19 2008-07-24 Park Benjamin Y Carbon electrodes for electrochemical applications
CN101388291A (en) * 2008-10-31 2009-03-18 中国科学院上海硅酸盐研究所 Boron containing porous carbon electrode material and preparation thereof
CN103588165A (en) * 2013-11-27 2014-02-19 华中科技大学 Three dimensional trans-scale charcoal electrode array structure and manufacture method

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105675682A (en) * 2015-12-28 2016-06-15 中国人民大学 Size-controllable nanowire microelectrode, preparation method and application thereof
CN105675682B (en) * 2015-12-28 2019-03-26 中国人民大学 A kind of nano wire microelectrode and the preparation method and application thereof that size is controllable
CN108807007A (en) * 2018-08-08 2018-11-13 武汉理工大学 The manufacture craft of three-dimensional manometer threadiness hole carbon material and high voltage micro super capacitor
CN108807007B (en) * 2018-08-08 2019-10-25 武汉理工大学 The manufacture craft of three-dimensional manometer threadiness hole carbon material and high voltage micro super capacitor

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Application publication date: 20150603