CN104668888A - Integrated tube shell manufacturing method - Google Patents
Integrated tube shell manufacturing method Download PDFInfo
- Publication number
- CN104668888A CN104668888A CN201310607036.1A CN201310607036A CN104668888A CN 104668888 A CN104668888 A CN 104668888A CN 201310607036 A CN201310607036 A CN 201310607036A CN 104668888 A CN104668888 A CN 104668888A
- Authority
- CN
- China
- Prior art keywords
- copper billet
- copper
- extrusion die
- extruding
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 16
- 238000001125 extrusion Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009851 ferrous metallurgy Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Extrusion Of Metal (AREA)
Abstract
The invention discloses an integrated tube shell manufacturing method, and relates to a manufacturing process of an electric semiconductor tube shell cathode. The manufacturing method comprises the following steps: (1) a copper bar is cut to copper blocks; (2) the copper blocks are put in an extruder for extruding; and (3) extruded workpiece blanks are machined by an NC lathe to remove scales and to improve the size precision.
Description
Technical field
The present invention relates to a kind of preparation method of power semiconductor tube.It is high that the power semiconductor tube of this explained hereafter has production efficiency, and air-tightness is high, the advantage that structural strength is high.
Background technology
Power Electronic Technique is modern efficient power-saving technology, is the important interface between information industry and conventional industries, and being vulnerabilities scan and by the bridge controlled between forceful electric power, is the basic technology supporting multinomial high technology development in field widely.Wherein high-power electric-power semiconductor device is the core unsteady flow parts of generating, distribution, transmission of electricity, electricity consumption, energy storage, can carry out accurately controlling efficiently and conversion to electric current, voltage, power, frequency, for power distribution, electric energy conversion, controlling electric energy, play the effect of energy-conserving and environment-protective, be widely used in the fields such as Ferrous Metallurgy, electric power (generating, distribution, transmission of electricity), machinery production, track traffic, environmental protection, oil, chemical industry, automobile making, boats and ships making, mine, military project.
The basis of Development of Power Electronic Technology is the appearance of high-quality high-power electric-power semiconductor device, and the development of the latter will propose higher requirement to high-power electric semiconductor shell again.Current power semiconductor tube negative electrode all adopts copper body and flange copper sheet to form through high-temperature soldering, there is the problem that stress of sealing is larger, and when long-time load operation, the air-tightness of shell device can decline, thus causes the premature failure of semiconductor devices.Meanwhile, flange and copper body are also difficult to when welding ensure the consistent of concentricity, cannot meet the requirement of high-end customer.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of power semiconductor tube, the method for the copper body of abandoning tradition and flange high temp welding, adopts integrated molding technology, not disposablely by welding produces shell part.The method greatly can improve the service life of power semiconductor tube, thus meets the needs of high-quality high-power electric-power semiconductor device.
For achieving the above object, technical solution of the present invention is:
(1) copper rod is become contour copper billet by sawing machine sawing;
(2) contour copper billet is annealed in reducing atmosphere;
(3) make the extrusion die of extruder, extrusion die has the draft angle of 5 degree;
(4) 600 tons of extruders extrude copper billet by extrusion die, form the blank of copper body and flange one;
(5) by extruding after copper billet blank through NC lathe process become needed for size.
After adopting such scheme, because shell negative electrode directly becomes the shape of final products, whole shell negative electrode all adopts commaterial, ensure that the structural strength of product, too increase the compactness of shell negative electrode simultaneously, improve the mechanical strength of shell, owing to being commaterial, eliminate the impact of solder on sealing strength, thus drastically increase the air-tightness of product, meanwhile, the product later stage is by NC lathe process gained, therefore, also ensure that the concentricity of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the structural representation of traditional handicraft.
Fig. 3 process chart of the present invention.
Detailed description of the invention
The preparation method of a kind of power semiconductor tube of the present invention, is characterized in that: its technique comprises: blanking-extruding-NC lathe process.A, described blanking be by the copper rod of relevant specification by cutting machine, become the fritter copper billet of measured length.B, described extruding refer to that the copper billet after by cutting is placed in the extrusion die of extruder, by applying pressure to reach the plastic deformation of copper billet on copper billet, form the blank of copper body and flange one.The draft angle of extrusion die is 5 degree.C, described NC lathe process, be while removal extruding surface of the work hardened layer, improve the dimensional accuracy of workpiece further.
Claims (5)
1. integrated shell manufacture method, is characterized in that:
By the copper rod of relevant specification by cutting machine, become the fritter copper billet of measured length; Be placed in the extrusion die of extruder by the fritter copper billet after cutting, by applying pressure to reach the plastic deformation of copper billet on copper billet, the draft angle of extrusion die is 5 degree; By the workpiece after extruding by NC lathe process, while removing extruding surface of the work hardened layer, improve the dimensional accuracy of workpiece further.
2. integrated shell manufacture method as claimed in claim 1, is characterized in that: copper rod, by cutting machine, becomes the fritter copper billet of measured length.
3. integrated shell manufacture method as claimed in claim 1, is characterized in that: be placed in the extrusion die of extruder, by applying pressure to reach the plastic deformation of copper billet on copper billet by the fritter copper billet after cutting.
4. integrated shell manufacture method as claimed in claim 1, is characterized in that: the draft angle of extrusion die is 5 degree.
5. the preparation method of a kind of power semiconductor tube as claimed in claim 1, is characterized in that: the workpiece after extruding, need use NC lathe process, removes the oxide skin on surface and the accurate size of final formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310607036.1A CN104668888A (en) | 2013-11-27 | 2013-11-27 | Integrated tube shell manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310607036.1A CN104668888A (en) | 2013-11-27 | 2013-11-27 | Integrated tube shell manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104668888A true CN104668888A (en) | 2015-06-03 |
Family
ID=53304751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310607036.1A Pending CN104668888A (en) | 2013-11-27 | 2013-11-27 | Integrated tube shell manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104668888A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2071096U (en) * | 1990-04-04 | 1991-02-13 | 太原机械学院 | Medium and small t shape tube mould |
| US6091134A (en) * | 1997-08-22 | 2000-07-18 | Enomoto Co., Ltd. | Semiconductor lead frame and method for manufacturing the same |
| CN1334598A (en) * | 2000-07-21 | 2002-02-06 | 中村制作所株式会社 | Method for forming electronic element sealing device |
| CN1604826A (en) * | 2001-12-19 | 2005-04-06 | 昭和电工株式会社 | Extrusion tool, method for manufacturing shaped article with fins, and heat sink |
| JP2006005025A (en) * | 2004-06-15 | 2006-01-05 | Sharp Corp | Method of manufacturing semiconductor wafer with lid and method of manufacturing semiconductor apparatus |
| CN102350614A (en) * | 2011-08-16 | 2012-02-15 | 山东中佳新材料有限公司 | Machining method for seamless copper pipe |
| CN102554561A (en) * | 2011-02-01 | 2012-07-11 | 郑维舟 | Method for manufacturing power semiconductor tube |
| CN102581060A (en) * | 2012-02-20 | 2012-07-18 | 绍兴市力博电气有限公司 | Method for processing copper tube having circular inside and quadrate outside |
-
2013
- 2013-11-27 CN CN201310607036.1A patent/CN104668888A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2071096U (en) * | 1990-04-04 | 1991-02-13 | 太原机械学院 | Medium and small t shape tube mould |
| US6091134A (en) * | 1997-08-22 | 2000-07-18 | Enomoto Co., Ltd. | Semiconductor lead frame and method for manufacturing the same |
| CN1334598A (en) * | 2000-07-21 | 2002-02-06 | 中村制作所株式会社 | Method for forming electronic element sealing device |
| CN1604826A (en) * | 2001-12-19 | 2005-04-06 | 昭和电工株式会社 | Extrusion tool, method for manufacturing shaped article with fins, and heat sink |
| JP2006005025A (en) * | 2004-06-15 | 2006-01-05 | Sharp Corp | Method of manufacturing semiconductor wafer with lid and method of manufacturing semiconductor apparatus |
| CN102554561A (en) * | 2011-02-01 | 2012-07-11 | 郑维舟 | Method for manufacturing power semiconductor tube |
| CN102350614A (en) * | 2011-08-16 | 2012-02-15 | 山东中佳新材料有限公司 | Machining method for seamless copper pipe |
| CN102581060A (en) * | 2012-02-20 | 2012-07-18 | 绍兴市力博电气有限公司 | Method for processing copper tube having circular inside and quadrate outside |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100391728C (en) | Standing mold pressing die for bars in hard alloy, and manufacturing method | |
| CN103056179B (en) | Warm extrusion forming method for straight toothed spur gear | |
| CN103934638B (en) | A kind of accurate external splines pipe manufacturing process | |
| CN104589002A (en) | Manufacturing technology of hollow outer gear of electric forklift driving flange | |
| CN101693312B (en) | Method for processing steel mold cavity | |
| CN205032633U (en) | Double -end rivet cold -heading device that caves in | |
| CN105081188A (en) | Cold heading device for electronic parking adjusting nuts and processing method of cold heading device | |
| CN203862710U (en) | Forged ring processing device | |
| CN205032636U (en) | Panel welded nut cold -heading device | |
| CN101804550A (en) | Method for high-precision manufacturing of large-size complex-cross-section mold for extruding train body profile | |
| CN101829697A (en) | One-die double-top extrusion forming technology for automotive axle housing tube or engineering mechanical supporting axle | |
| CN205032617U (en) | Cold -heading device of riveting nut is turned over to four corners flange orientation | |
| CN205032637U (en) | Outer flower tooth flange nut cold -heading device | |
| CN104668888A (en) | Integrated tube shell manufacturing method | |
| CN103658213A (en) | Novel extrusion method for efficiently machining straight spur gear | |
| CN106378632A (en) | Precise forming mechanism of oil pump oil mouth plunger sleeve | |
| CN102554561B (en) | Method for manufacturing power semiconductor tube | |
| CN205032635U (en) | Electron parking adjusting nut cold -heading device | |
| CN104439997A (en) | Method for quickly manufacturing metal mold | |
| CN101695778B (en) | Method for producing electrical discharge copper matrix tool electrode for steel cavity mould | |
| CN107553068A (en) | A kind of processing method of back-off electrode for the processing of LSR moulds | |
| CN204247897U (en) | Two-sided butt-joint point adapter sleeve cold upsetting die of car | |
| CN102909303B (en) | A kind of screw mold one two rushes cover and processing technology thereof | |
| CN106238569A (en) | A kind of vehicle cantilever support plate processing technique | |
| CN207982026U (en) | Cold upsetting die of car component for manufacturing car spare tire fixing bolt |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150603 |