CN104658943B - Material processing method and device when a kind of semiconductor equipment is abnormal - Google Patents
Material processing method and device when a kind of semiconductor equipment is abnormal Download PDFInfo
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- CN104658943B CN104658943B CN201310577369.4A CN201310577369A CN104658943B CN 104658943 B CN104658943 B CN 104658943B CN 201310577369 A CN201310577369 A CN 201310577369A CN 104658943 B CN104658943 B CN 104658943B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract
An embodiment of the present invention provides material processing method during a kind of semiconductor equipment exception and device, the semiconductor equipment to include technical module and transport module, the described method includes：For current task creation state variable；The state variable includes unactivated state and state of activation, and the unactivated state is used to indicate that technical module or transport module are normal condition, and the state of activation is used to indicate that technical module or transport module are abnormality；When monitoring that technical module that current task is related to or transport module are abnormal, the state variable is changed to state of activation from initial unactivated state, and recalculate the transmission path of material；The transmission path includes source position and target location；The material is transferred to by the target location from the source position using the transmission path；If the material transferring success, unactivated state is changed to by the state variable from state of activation.The present invention reduces the complexity of operation, and saves transmission time.
Description
Technical field
The present invention relates to the control technology field of semiconductor equipment, more particularly to a kind of thing of semiconductor equipment when abnormal
Expect material handling apparatus when processing method and a kind of abnormal semiconductor equipment.
Background technology
In art production process, semiconductor equipment ensures all materials by the technique transfer process pre-established
Material predetermined position be can be sent in an orderly manner according to the flow and technique productions processing, and the material that will be machined carried out
The position specified is sent to be stored.
When semiconductor equipment is abnormal, such as the component progress process task when semiconductor equipment, it is unsatisfactory for interlocking condition
And when causing the technique to stop, or semiconductor equipment component by manual termination when, generally require in semiconductor equipment manually
Existing material pass to the position of material storing.
, it is necessary to which distributing position according to material in semiconductor equipment, one by one passes material during manual operation
To the position of material storing, need to observe translational speed and the position of semiconductor equipment materials inside while manual operation,
To adjust the amplitude of manual operation.
Above-mentioned manual operation complex procedures, reduce efficiency of transmission, and be easy to cause maloperation；In operation,
Since manual operation accuracy is low, is easily collided between material and equipment in operating process, cause the damage of material and equipment.
The content of the invention
The technical problem to be solved is that material processing side when a kind of semiconductor equipment of offer is abnormal for the embodiment of the present invention
Method, to realize the automatic business processing when semiconductor equipment is abnormal.
Present invention also offers a kind of material handling apparatus of semiconductor equipment when abnormal, to ensure the reality of the above method
Existing and application.
To solve the above-mentioned problems, the material processing side the embodiment of the invention discloses a kind of semiconductor equipment when abnormal
Method, the semiconductor equipment include technical module and transport module, the described method includes：
For current task creation state variable；The state variable includes unactivated state and state of activation, described non-
State of activation is used to indicate that technical module or transport module are normal condition, and the state of activation is used to indicate technical module or biography
Defeated module is abnormality；
When monitoring that technical module that current task is related to or transport module are abnormal, by the state variable from first
The unactivated state of beginning is changed to state of activation, and recalculates the transmission path of material；The transmission path includes source position
And target location；
The material is transferred to by the target location from the source position using the transmission path；
If the material transferring success, unactivated state is changed to by the state variable from state of activation.
Preferably, the transport module includes loading chamber, atmospheric robot, transfer chamber and/or vacuum mechanical-arm
Arm, the technical module include processing chamber.
Preferably, the target location includes loading chamber, and the transmission path includes the first transmission path, the second transmission
Path, the 3rd transmission path and/or the 4th transmission path；
It is described recalculate material transmission path the step of include：
When having material on the atmospheric robot, the atmospheric robot is set as source position, and recalculate
First transmission path；First transmission path is transmitted directly to the dress for the material from the atmospheric robot
Carry the transmission path of chamber；
And/or
When having material in the transfer chamber room, the transfer chamber is set as source position, and recalculate described second
Transmission path；Second transmission path is transferred to the atmospheric robot for the material from the transfer chamber, then
It is transferred to the transmission path of the loading chamber；
And/or
When having material in the vacuum robot, the vacuum robot is set as source position, and recalculate
3rd transmission path；3rd transmission path is transferred to the transfer chamber for the material from the vacuum robot
Room, then the atmospheric robot is transferred to, it is finally delivered to the transmission path of the loading chamber；
And/or
When having material in the processing chamber, the processing chamber is set as source position, and recalculates the 4th transmission
Path；4th transmission path is transferred to the vacuum robot for the material from the processing chamber, then passes
It is defeated to arrive the transfer chamber, then the atmospheric robot is transferred to, it is finally delivered to the transmission path of the loading chamber.
Preferably, the described the step of material is transferred to target location from source position using the transmission path, wraps
Include：
Using the corresponding transmission instruction of transmission path generation；
The transmission instruction is sent to the transport module；The transport module is used to instruct institute using the transmission
Material transferring is stated to the target location.
Preferably, when the transmission path is first transmission path, the transmission instruction of generation includes the first transmission
Instruction；Transmission of the first transmission instruction for the atmospheric robot directly by the material transferring to the loading chamber
Instruction；
When the transmission path is second transmission path, the transmission instruction of generation includes the second transmission instruction；Institute
State the second transmission instruction and the material is taken out from the transfer chamber, again by the material transferring for the atmospheric robot
To the transmission instruction of the loading chamber；
When the transmission path is three transmission path, the transmission instruction of generation includes the 3rd transmission instruction；Institute
It is the vacuum robot by the material transferring to the transfer chamber, the atmospheric robot to state the 3rd transmission instruction
The material is taken out from the transfer chamber, again instructs the transmission of the material transferring to the loading chamber；
When the transmission path is four transmission path, the transmission instruction of generation includes the 4th transmission instruction；Institute
State the 4th transmission instruction and the material is taken out from the processing chamber, again by the material transferring for the vacuum robot
To the transfer chamber, the atmospheric robot takes out the material from the transfer chamber, is transferred to the loading again
The transmission instruction of the transmission path of chamber.
The embodiment of the invention also discloses a kind of material handling apparatus of semiconductor equipment when abnormal, the semiconductor equipment
Including technical module and transport module, described device includes：
State variable creation module, for for current task creation state variable；The state variable includes inactive
State and state of activation, the unactivated state is used to indicating technical module or transport module is normal condition, the activation shape
State is used to indicate that technical module or transport module are abnormality；
State of activation changes module, for monitoring that technical module that current task is related to or transport module be abnormal
When, the state variable is changed to state of activation from initial unactivated state；
Transmission path computing module, for recalculating the transmission path of material；The transmission path include source position and
Target location；
Transport module, for the material to be transferred to the target position from the source position using the transmission path
Put；
Unactivated state changes module, if for material transferring success, by the state variable from state of activation
It is changed to unactivated state.
Preferably, the transport module includes loading chamber, atmospheric robot, transfer chamber and/or vacuum mechanical-arm
Arm, the technical module include processing chamber.
Preferably, the target location includes loading chamber, and the transmission path includes the first transmission path, the second transmission
Path, the 3rd transmission path and/or the 4th transmission path；
The transmission path computing module includes：
First transmission path calculating sub module, for when having material on the atmospheric robot, setting the air
Mechanical arm is source position, and recalculates first transmission path；First transmission path is the material from described
Atmospheric robot is transmitted directly to the transmission path of the loading chamber；
And/or
Second transmission path calculating sub module, during for having material in the transfer chamber room, sets the transfer chamber
For source position, and recalculate second transmission path；Second transmission path is the material from the transfer chamber
In be transferred to the atmospheric robot, then be transferred to it is described loading chamber transmission path；
And/or
3rd transmission path calculating sub module, for when having material in the vacuum robot, setting the vacuum
Mechanical arm is source position, and recalculates the 3rd transmission path；3rd transmission path is the material from described
Vacuum robot is transferred to the transfer chamber, then is transferred to the atmospheric robot, is finally delivered to the loading chamaer
The transmission path of room；
And/or
4th transmission path calculating sub module, during for having material in the processing chamber, sets the processing chamber
For source position, and recalculate the 4th transmission path；4th transmission path passes for the material from the processing chamber
It is defeated to arrive the vacuum robot, the transfer chamber is then transmitted to, then the atmospheric robot is transferred to, finally transmit
To the transmission path of the loading chamber.
Preferably, the transport module includes：
Transmission instruction generation submodule, for using the corresponding transmission instruction of transmission path generation；
Transmission instruction sending submodule, for sending the transmission instruction to the transport module；The transport module
For being instructed using the transmission by the material transferring to the target location.
Preferably, when the transmission path is first transmission path, the transmission instruction of generation includes the first transmission
Instruction；Transmission of the first transmission instruction for the atmospheric robot directly by the material transferring to the loading chamber
Instruction；
When the transmission path is second transmission path, the transmission instruction of generation includes the second transmission instruction；Institute
State the second transmission instruction and the material is taken out from the transfer chamber, again by the material transferring for the atmospheric robot
To the transmission instruction of the loading chamber；
When the transmission path is three transmission path, the transmission instruction of generation includes the 3rd transmission instruction；Institute
It is the vacuum robot by the material transferring to the transfer chamber, the atmospheric robot to state the 3rd transmission instruction
The material is taken out from the transfer chamber, again instructs the transmission of the material transferring to the loading chamber；
When the transmission path is four transmission path, the transmission instruction of generation includes the 4th transmission instruction；Institute
State the 4th transmission instruction and the material is taken out from the processing chamber, again by the material transferring for the vacuum robot
To the transfer chamber, the atmospheric robot takes out the material from the transfer chamber, is transferred to the loading again
The transmission instruction of the transmission path of chamber.
Compared with background technology, the present invention includes advantages below：
The present invention passes target location back by recalculating the transmission path of material, realizes oneself in exception
Dynamic processing, reduces manually-operated complexity, and saves transmission time, reduces the possibility of maloperation, then reduces by grasping by mistake
Semiconductor equipment damage caused by work and material damage.
Brief description of the drawings
Fig. 1 is the step flow chart of material processing method embodiment when a kind of semiconductor equipment of the present invention is abnormal；
Fig. 2 is a kind of structure diagram of APCVD equipment of the present invention；
Fig. 3 is a kind of materiel machining path flow diagram in the APCVD equipment shown in Fig. 2；
Fig. 4 is a kind of flow chart of preferable material processing example of the present invention；
The structure diagram of material handling apparatus embodiment when a kind of semiconductor equipment of Fig. 5 present invention is abnormal.
Embodiment
To enable the above-mentioned purpose of the embodiment of the present invention, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings and
Embodiment is described in further detail the embodiment of the present invention.
With reference to Fig. 1, the step of showing material processing method embodiment when a kind of semiconductor equipment of the present invention is abnormal
Flow chart, the semiconductor equipment include technical module and transport module, and the method specifically may include steps of：
Step 101, for current task creation state variable；
The state variable includes unactivated state and state of activation, the unactivated state be used to indicating technical module or
Transport module is normal condition, and the state of activation is used to indicate that technical module or transport module are abnormality；
The operation of semiconductor equipment can generally be related to two modules, technical module（PMC）And transport module（TMC）.PMC is
The module of process is carried out for control material, and TMC is then the module for control material transmission.
In one preferred embodiment of the invention, the transport module includes loading chamber, atmospheric robot, transfer
Chamber and/or vacuum robot, the technical module include processing chamber.
In practical applications, the main body of many semiconductor equipments, which can all have, loads chamber, atmospheric robot, transfer chamber
Room, vacuum robot and/or processing chamber, such as APCVD（Atmospheric Pressure Chemical Vapor
Deposition, normal pressure chemical vapor phase deposition）Equipment, PVD（Physical Vapor Deposition, physical vapour deposition (PVD)）
Equipment, etching apparatus etc..
Certainly, the PMC and TMC of different semiconductor equipments and not merely comprising above-mentioned loading chamber, atmospheric mechanical hand
Arm, transfer chamber, vacuum robot and processing chamber, can also include different valves, conveyer belt, gas pipeline etc.,
Contrast of the embodiment of the present invention is not described in detail one by one.
To make those skilled in the art more fully understand the present invention, APCVD equipment presented below illustrates this as example
Process is realized in the application of invention.
Reference Fig. 2, shows a kind of structure diagram of APCVD equipment of the present invention.As shown in Fig. 2, the APCVD bags
Include：
Two LoadPort：Load chamber（LP）, for the container of loaded material, comprising multiple grooves, each groove can hold
Receive a sheet material, inside there are 25 Slot（The position of a placement material in the container of material can be placed）, wherein the thing stored
Material includes 5 cun, 6 cun and 8 cun three kinds of forms；
One LoadLock：Transfer chamber（LL）, for the container that can be sealed, thing is transmitted between air and vacuum parts
Material plays cushioning effect, can place 1 sheet material；
One ExternalValve：A valve between LoadPort and LoadLock, only when this valve is opened
Qi Shi, material could transmit between LoadPort and LoadLock；
One Transfor Cambe：Vacuum chamber（TC）, for forming vacuum environment, vacuum end single arm robot place
Chamber, its periphery is equipped with multiple processing chambers；
One InternalValve：A valve between LoadLock and TC, only when this valve opening,
Material could transmit between LoadLock and TC chambers；
One ProcessModule：Processing chamber（PM）, for carrying out corresponding technological operation, for various sizes of
Material, the material number stored in pallet are also inconsistent.8 cun can at most put 5, and 6 cun can at most put 8, and 5 cun at most may be used
The position for being used to store material to put 10, in pallet is known as " Pocket "；
One GateValve：Valve between TC and processing chamber, only when this valve opening, material ability
Transmitted between TC and PM；
One atmosphere end single arm robot（Robot）, for the biography piece between LoadPort and LoadLock
One vacuum end single arm robot（Robot）, passed for the material between LoadLock and TC, and TC and PM
It is defeated.
Task Job is that path of the material according to setting in semiconductor equipment is transmitted, and is referred in transmitting procedure
Complete a process of technique in fixed position.Job can include following four step：Load, material is put into from external environment
Into semiconductor equipment；Transmission, another position is transmitted to by material from some position in semiconductor equipment；Technique, material
Process is carried out in processing chamber；Unload, material is put into external environment from semiconductor equipment.
Before performing Job, first have to define Job, including：
1st, which Job load chamber from（LoadPort, LP）It is loaded into board；
2nd, corresponding each position in predefined loading chamber（slot）The machining path of placed material.
With reference to Fig. 3, a kind of materiel machining path flow diagram in the APCVD equipment shown in Fig. 2 is shown.As shown in figure 3,
The machining path of material can be：
1st, atmosphere end single arm robot（Robot）Material in LoadPort is placed into calibrator（Aligner）Colonel
It is accurate；
2nd, ExternalValve is opened；
3rd, material is moved in LoadLock by atmosphere end single arm robot from calibrator；
4th, LoadLock completes air pressure conversion；
5th, InternalValve is opened；
6th, vacuum end single arm robot takes piece from LoadLock；
7th, GateValve is opened；
8th, material is placed into PM by vacuum end single arm robot；
9th, material is processed in PM；
10th, after completion of processing, GateValve is opened；
11st, vacuum end single arm robot takes out material from PM；
12nd, InternalValve is opened；
13rd, material is placed into LoadLock by vacuum end single arm robot；
14th, LoadLock completes air pressure conversion；
15th, ExternalValve is opened；
16th, atmosphere end single arm robot moves to material in LoadPort from LoadLock.
Since then, material completes time processing.
Step 102, when monitoring that technical module that current task is related to or transport module are abnormal, by the state
Variable is changed to state of activation from initial unactivated state；
When task starts, state variable is initially unactivated state, such as 0 value, the technique that instruction current task is related to
Module or transport module are working properly.When monitoring that technical module that current task is related to or transport module are abnormal, example
Such as, detect that LL has dished out notready in the buffer（It is unripe）Information, then state variable is changed to state of activation,
Such as 1 value, the technical module that is related to of instruction current task or transport module work occur abnormal.
It should be noted that not all unusual condition can be automatically processed by semiconductor equipment, such as caching
In detect that PM dishes out overtime alarm, then needs artificial treatment.For this reason, the embodiment of the present invention can be with a preset independent configuration
File, can be xml（(Extensible Markup Language, extensible markup language）File, is placed on program code
Together, which can store the corresponding processing method of various exceptions, specifically include artificial treatment and automatically process.
Then in a preferred embodiment of the invention, the preferred embodiment of step 102 can be：
When monitoring that technical module that current task is related to or transport module are abnormal, in preset configuration file
Search the corresponding processing method of the exception；If automatically processing, then by the state variable from initial unactivated state more
It is changed to state of activation；
It should be noted that if being to automatically process, then state variable can not be changed to state of activation, but the police that dishes out
Report, reminds user's semiconductor equipment the exception for needing artificial treatment occur, and user can then perform in control terminal and safeguard behaviour manually
Make.
Step 103, the transmission path of material is recalculated；The transmission path includes source position and target location；
When state variable is state of activation, it is necessary to recalculate abnormal lower material transferring to the transmission road of designated position
Footpath, current location are source position, and target location then needs the position reached for transmission material（That is designated position）.
In one preferred embodiment of the invention, the target location includes loading chamber, and the transmission path includes
First transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path, the step 103 can specifically wrap
Include following sub-step：
Sub-step S11, when having material on the atmospheric robot, sets the atmospheric robot as source position,
And recalculate first transmission path；First transmission path directly passes for the material from the atmospheric robot
The defeated transmission path to the loading chamber；
In practical applications, atmospheric robot（Robot1）There can be slot variables to indicate whether with material, for example,
When the slot values for detecting atmospheric robot in the buffer are 1, indicate that it, with material, can set atmospheric mechanical hand at this time
Arm is source position（srcRobot1）, target location is loading chamber（destLP）, then the first transmission path for srcRobot1 →
destLP。
It should be noted that load chamber can have it is multiple, specifically set which load chamber can as target location
With depending on the Job of the material, i.e., material enters from which device chamber, then is transmitted back to which device chamber.Certainly, set
Which loads chamber can also be set as target location according to actual conditions.For example, which device chamber is idle,
It is target location then to set it.In another example it is target location that can set the loading chamber that user specifies, the present invention is not added with this
With limitation.At this time, the first transmission path is srcRobot1（1）→ destLPA, wherein, the value in bracket is slot values, and LPA is
The A loading chamber.
And/or
Sub-step S12, when having material in the transfer chamber room, sets the transfer chamber as source position, and count again
Calculate second transmission path；Second transmission path is transferred to the atmospheric engine for the material from the transfer chamber
Tool arm, then it is transferred to the transmission path of the loading chamber；
Similarly, transfer chamber（LL）There can also be slot variables to indicate whether with material, for example, detecting in the buffer
When slot values to transfer chamber are 1, indicate that it, with material, can set transfer chamber as source position at this time（srcLL）, mesh
Mark is set to loading chamaer room（destLPA）, then the second transmission path is srcLL（1）→Robot1（0）→ destLPA, wherein,
Value in bracket is slot values.
And/or
Sub-step S13, when having material in the vacuum robot, sets the vacuum robot as source position,
And recalculate the 3rd transmission path；3rd transmission path is transferred to for the material from the vacuum robot
The transfer chamber, then the atmospheric robot is transferred to, it is finally delivered to the transmission path of the loading chamber；
Similarly, vacuum robot（Robot2）There can also be slot variables to indicate whether with material, for example, slow
When the slot values that vacuum robot is detected in depositing are 1, indicate it with material, can set at this time vacuum robot as
Source position（srcRobot2）, target location is loading chamber（destLPA）, then the 3rd transmission path is srcRobot2（1）→
LL（0）→Robot1（1）→ destLPA, wherein, the value in bracket is slot values.
And/or
Sub-step S14, when having material in the processing chamber, sets the processing chamber as source position, and count again
Calculate the 4th transmission path；4th transmission path is transferred to the vacuum mechanical-arm for the material from the processing chamber
Arm, is then transmitted to the transfer chamber, then is transferred to the atmospheric robot, is finally delivered to the biography of the loading chamber
Defeated path.
Similarly, processing chamber（PM）There can also be slot variables to indicate whether with material, for example, detecting in the buffer
When slot values to processing chamber are 1, indicate that it, with material, can set processing chamber as source position at this time（srcPM）, mesh
Mark is set to loading chamaer room（destLPA）, then the 4th transmission path is srcPM → Robot2 → LL → Robot1 → destLPA.
It should be noted that processing chamber can have multiple, which processing chamber is specifically set as source position needs
Depending on actual conditions carry out.When material is located at X processing chamber, setting PMX is source position, then the 4th transmission path
For srcPMX（1）→Robot2（0）→LL（0）→Robot1（0）→ destLPA, wherein, the value in bracket is slot values.When
When multiple processing chambers all have material, its pass back load chamber order can be according to its Job depending on, i.e., it is slower to enter technique
The material of chamber is preferably taken away.
In one preferred embodiment of the invention, step 103 can also specifically include following sub-step：
Sub-step S21, judges whether there is material on the atmospheric robot, if so, then performing sub-step S11；
Sub-step S22, judges whether there is material in the transfer chamber room, if so, then performing sub-step S12；
Sub-step S23, judges whether there is material in the vacuum robot, if so, then performing sub-step S13；
Sub-step S24, judges whether there is material in the processing chamber, if so, then performing sub-step S14.
In the concrete realization, it can in the buffer detect and whether have according to the sequence detection of Robot1, LL, Robot2, PM
There is material, and corresponding transmission path is sequentially recalculated according to this, ensure that the material nearer from loading chamber is preferentially taken away, can
All materials all to be passed back to loading chamber, and prevent material collides from causing unnecessary loss.
Then transmission path is srcPMX（slot）→Robot2（slot）→LL（slot）→Robot1（slot）→
destLPA。
Step 104, the material is transferred to by the target location from the source position using the transmission path；
By material transferring to after loading chamber, user can take material away from chamber is loaded, and be further processed.
In one preferred embodiment of the invention, the step 104 can specifically include following sub-step：
Sub-step S31, is instructed using the corresponding transmission of transmission path generation；
TMC directly can not parse transmission path and be instructed, it is necessary to which transmission path is decomposed into the transmission that TMC can perform.And
In practical applications, different transmission path can be corresponding with different transmission instructions.
In one preferred embodiment of the invention, the sub-step S31 can further include following sub-step：
Sub-step S311, when the transmission path is first transmission path, the transmission instruction of generation includes first
Transmission instruction；The first transmission instruction is the atmospheric robot directly by the material transferring to the loading chamber
Transmission instruction；
In the concrete realization, for different semiconductor equipments, the concrete meaning of the first transmission instruction can be different.
Different valves is may include turn on, uses calibrator etc..
Sub-step S312, when the transmission path is second transmission path, the transmission instruction of generation includes second
Transmission instruction；The second transmission instruction takes out the material for the atmospheric robot from the transfer chamber, again will
Transmission instruction of the material transferring to the loading chamber；
In the concrete realization, for different semiconductor equipments, the concrete meaning of the second transmission instruction can be different.
For example, in the APCVD equipment shown in Fig. 2, ExternalValve is opened in the second specific instruction of transmission instruction, then atmospheric engine
Tool arm takes out material, again by material transferring to the loading chamber from the transfer chamber.
Sub-step S313, when the transmission path is three transmission path, the transmission instruction of generation includes the 3rd
Transmission instruction；3rd transmission is instructed the material transferring as the vacuum robot to the transfer chamber, described
Atmospheric robot takes out the material, the again transmission by the material transferring to the loading chamber from the transfer chamber
Instruction；
In the concrete realization, for different semiconductor equipments, the concrete meaning of the 3rd transmission instruction can be different.
For example, in the APCVD equipment shown in Fig. 2, InternalValve, vacuum mechanical-arm are opened in the 3rd specific instruction of transmission instruction
Material transferring to transfer chamber after transfer chamber completes air pressure conversion, is opened ExternalValve, then atmospheric mechanical by arm
Arm takes out material, again by material transferring to the loading chamber from the transfer chamber.
Sub-step S314, when the transmission path is four transmission path, the transmission instruction of generation includes the 4th
Transmission instruction；The 4th transmission instruction takes out the material for the vacuum robot from the processing chamber, again will
The material transferring takes out the material from the transfer chamber, passes again to the transfer chamber, the atmospheric robot
The transmission instruction of the defeated transmission path to the loading chamber.
In the concrete realization, for different semiconductor equipments, the concrete meaning of the 4th transmission instruction can be different.
For example, in the APCVD equipment shown in Fig. 2, GateValve is opened in the 4th specific instruction of transmission instruction, vacuum robot from
Take out the material in processing chamber, open InternalValve, vacuum robot by material transferring to transfer chamber, in
After turning chamber completion air pressure conversion, ExternalValve is opened, then atmospheric robot extract from the transfer chamber
Expect, again by material transferring to the loading chamber.
Sub-step S32, the transmission instruction is sent to the transport module；The transport module is used to use the biography
It is defeated to instruct the material transferring to the target location.
After transport module receives executable transmission instruction, transmission instruction is performed, passes material back loading chamber.
In the concrete realization, the first transmission path is srcRobot1（1）→destLPA.Receiving the first transmission instruction
Afterwards, by the material transferring in Robot1 to LPA, while the slot values of Robot1 are changed to 0.
Second transmission path is srcLL（1）→Robot1（0）→ destLPA, will after the second transmission instruction is received
The material of LL passes to Robot1, and the slot of LL is changed to 0, the slot of Robot1 is changed to 1；The material of Robot1 is passed to
After LPA, the slot of Robot1 is changed to 0.
3rd transmission path is srcRobot2（1）→LL（0）→Robot1（0）→ destLPA, is receiving the 3rd biography
After defeated instruction, by the material transferring of Robot2 to LL, while the slot values of Robot2 are changed to 0, the slot of LL is changed to 1；Will
When the material transferring of LL is to Robot1, the slot values of LL are changed to 0, the slot of Robot1 is changed to 1；The material of Robot1 is passed
To after LPA, the slot of Robot1 is changed to 0.
4th transmission path is srcPMX（1）→Robot2（0）→LL（0）→Robot1（0）→ destLPA, is receiving
To after the 4th transmission instruction, after the material transferring of PMX to Robot2, the slot of PMX is changed to 0, the slot of Robot2 is changed
For 1；By the material transferring of Robot2 to LL, while the slot values of Robot2 are changed to 0, the slot of LL is changed to 1；By the thing of LL
When material is transferred to Robot1, the slot values of LL are changed to 0, the slot of Robot1 is changed to 1；The material of Robot1 is passed into LPA
Afterwards, the slot of Robot1 is changed to 0.
Step 105, if material transferring success, inactive shape is changed to by the state variable from state of activation
State.
In the concrete realization, it can be determined that load chamber, atmospheric robot, transfer chamber, vacuum robot and work
Whether the slot values of skill chamber are 0, if so, then judge material transferring success, by state variable from state of activation be changed to it is non-swash
State living.
Reference Fig. 4, shows a kind of flow chart of preferable material processing example of the embodiment of the present invention.Scheme as indicated at 4,
When TMC/PMC occurs abnormal, if it is to automatically process to judge, state variable is changed to state of activation, preferentially by Robot1
Material pass LP back, then pass the material of LL back LP, then pass the material of Robot2 back LP, finally pass the material of PM back
LP, after material all passes LP back, unactivated state is changed to by state variable.
The present invention passes target location back by recalculating the transmission path of material, realizes oneself in exception
Dynamic processing, reduces manually-operated complexity, and saves transmission time, reduces the possibility of maloperation, then reduces by grasping by mistake
Semiconductor equipment damage caused by work and material damage.
For embodiment of the method, in order to be briefly described, therefore it is all expressed as to a series of combination of actions, but this area
Technical staff should know, the embodiment of the present invention and from the limitation of described sequence of movement, because implementing according to the present invention
Example, some steps can use other orders or be carried out at the same time.Secondly, those skilled in the art should also know, specification
Described in embodiment belong to preferred embodiment, necessary to the involved action not necessarily embodiment of the present invention.
With reference to Fig. 5, material handling apparatus embodiment when a kind of semiconductor equipment of the embodiment of the present invention is abnormal is shown
Structure diagram, the semiconductor equipment includes technical module and transport module, and described device can include with lower module：
State variable creation module 501, for for current task creation state variable；The state variable includes non-sharp
Living state and state of activation, the unactivated state is used to indicating technical module or transport module is normal condition, the activation
State is used to indicate that technical module or transport module are abnormality；
State of activation changes module 502, in the technical module or transport module generation for monitoring that current task is related to
When abnormal, the state variable is changed to state of activation from initial unactivated state；
Transmission path computing module 503, for recalculating the transmission path of material；The transmission path includes source position
And target location；
Transport module 504, for the material to be transferred to the target from the source position using the transmission path
Position；
Unactivated state change module 505, if for the material transferring success, by the state variable from activation shape
State is changed to unactivated state.
In one preferred embodiment of the invention, the transport module includes loading chamber, atmospheric robot, transfer
Chamber and/or vacuum robot, the technical module include processing chamber.
In one preferred embodiment of the invention, the target location includes loading chamber, and the transmission path includes
First transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path；
The transmission path computing module includes following submodule：
First transmission path calculating sub module, for when having material on the atmospheric robot, setting the air
Mechanical arm is source position, and recalculates first transmission path；First transmission path is the material from described
Atmospheric robot is transmitted directly to the transmission path of the loading chamber；
And/or
Second transmission path calculating sub module, during for having material in the transfer chamber room, sets the transfer chamber
For source position, and recalculate second transmission path；Second transmission path is the material from the transfer chamber
In be transferred to the atmospheric robot, then be transferred to it is described loading chamber transmission path；
And/or
3rd transmission path calculating sub module, for when having material in the vacuum robot, setting the vacuum
Mechanical arm is source position, and recalculates the 3rd transmission path；3rd transmission path is the material from described
Vacuum robot is transferred to the transfer chamber, then is transferred to the atmospheric robot, is finally delivered to the loading chamaer
The transmission path of room；
And/or
4th transmission path calculating sub module, during for having material in the processing chamber, sets the processing chamber
For source position, and recalculate the 4th transmission path；4th transmission path passes for the material from the processing chamber
It is defeated to arrive the vacuum robot, the transfer chamber is then transmitted to, then the atmospheric robot is transferred to, finally transmit
To the transmission path of the loading chamber.
In one preferred embodiment of the invention, the transport module includes following submodule：
Transmission instruction generation submodule, for using the corresponding transmission instruction of transmission path generation；
Transmission instruction sending submodule, for sending the transmission instruction to the transport module；The transport module
For being instructed using the transmission by the material transferring to the target location.
In one preferred embodiment of the invention, when the transmission path is first transmission path, generation
Transmission instruction includes the first transmission instruction；The first transmission instruction is the atmospheric robot directly by the material transferring
To the transmission instruction of the loading chamber；
When the transmission path is second transmission path, the transmission instruction of generation includes the second transmission instruction；Institute
State the second transmission instruction and the material is taken out from the transfer chamber, again by the material transferring for the atmospheric robot
To the transmission instruction of the loading chamber；
When the transmission path is three transmission path, the transmission instruction of generation includes the 3rd transmission instruction；Institute
It is the vacuum robot by the material transferring to the transfer chamber, the atmospheric robot to state the 3rd transmission instruction
The material is taken out from the transfer chamber, again instructs the transmission of the material transferring to the loading chamber；
When the transmission path is four transmission path, the transmission instruction of generation includes the 4th transmission instruction；Institute
State the 4th transmission instruction and the material is taken out from the processing chamber, again by the material transferring for the vacuum robot
To the transfer chamber, the atmospheric robot takes out the material from the transfer chamber, is transferred to the loading again
The transmission instruction of the transmission path of chamber.
For device embodiment, since it is substantially similar to embodiment of the method, so description is fairly simple, it is related
Part illustrates referring to the part of embodiment of the method.
Each embodiment in this specification is described by the way of progressive, what each embodiment stressed be with
The difference of other embodiment, between each embodiment identical similar part mutually referring to.
Although having been described for the preferred embodiment of the embodiment of the present invention, those skilled in the art once know base
This creative concept, then can make these embodiments other change and modification.So appended claims are intended to be construed to
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or order.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article including a series of elements or mobile equipment are not only wrapped
Those key elements are included, but also including other elements that are not explicitly listed, or further include as this process, method, article
Or the key element that movement equipment is intrinsic.In the absence of more restrictions, wanted by what sentence "including a ..." limited
Element, it is not excluded that also there are other identical element in the process including the key element, method, article or mobile equipment.
Material processing method when a kind of semiconductor equipment provided above the embodiment of the present invention is abnormal and a kind of half
Material handling apparatus when conductor device is abnormal, is described in detail, and specific case used herein implements the present invention
The principle and embodiment of example are set forth, and the explanation of above example is only intended to the side that help understands the embodiment of the present invention
Method and its core concept；Meanwhile for those of ordinary skill in the art, according to the thought of the embodiment of the present invention, specific real
There will be changes in mode and application range are applied, in conclusion this specification content should not be construed as implementing the present invention
The limitation of example.
Claims (10)
- Material processing method when 1. a kind of semiconductor equipment is abnormal, it is characterised in that the semiconductor equipment includes technique mould Block and transport module, the described method includes：For current task creation state variable；The state variable includes unactivated state and state of activation, described inactive State is used to indicate that technical module or transport module are normal condition, and the state of activation is used to indicate technical module or transmission mould Block is abnormality；When monitoring that technical module that current task is related to or transport module are abnormal, by the state variable from initial Unactivated state is changed to state of activation, and recalculates the transmission path of material；The transmission path includes source position and mesh Cursor position；The material is transferred to by the target location from the source position using the transmission path；If the material transferring success, unactivated state is changed to by the state variable from state of activation.
- Material processing method when 2. semiconductor equipment according to claim 1 is abnormal, it is characterised in that the transmission mould Block, which includes loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, the technical module, includes process cavity Room.
- Material processing method when 3. semiconductor equipment according to claim 2 is abnormal, it is characterised in that the target position Put including loading chamber, the transmission path includes the first transmission path, the second transmission path, the 3rd transmission path and/or the Four transmission paths；It is described recalculate material transmission path the step of include：When having material on the atmospheric robot, the atmospheric robot is set as source position, and is recalculated described First transmission path；First transmission path is transmitted directly to the loading chamaer for the material from the atmospheric robot The transmission path of room；And/orWhen having material in the transfer chamber room, the transfer chamber is set as source position, and recalculates second transmission Path；Second transmission path is transferred to the atmospheric robot for the material from the transfer chamber, then transmits To the transmission path of the loading chamber；And/orWhen having material in the vacuum robot, the vacuum robot is set as source position, and is recalculated described 3rd transmission path；3rd transmission path is transferred to the transfer chamber for the material from the vacuum robot, The atmospheric robot is transferred to again, is finally delivered to the transmission path of the loading chamber；And/orWhen having material in the processing chamber, the processing chamber is set as source position, and recalculate the 4th transmission path； 4th transmission path is transferred to the vacuum robot for the material from the processing chamber, is then transmitted to institute Transfer chamber is stated, then is transferred to the atmospheric robot, is finally delivered to the transmission path of the loading chamber.
- Material processing method when 4. the semiconductor equipment according to claim 1 or 3 is abnormal, it is characterised in that described to adopt The step of material is transferred to target location from source position with the transmission path includes：Using the corresponding transmission instruction of transmission path generation；The transmission instruction is sent to the transport module；The transport module is used to instruct the thing using the transmission Material is transferred to the target location.
- Material processing method when 5. semiconductor equipment according to claim 4 is abnormal, it is characterised in thatWhen the transmission path is the first transmission path, the transmission instruction of generation includes the first transmission instruction；Described first passes Defeated instruction directly instructs the material transferring to the transmission for loading chamber for atmospheric robot；When the transmission path is the second transmission path, the transmission instruction of generation includes the second transmission instruction；Described second passes Defeated instruction takes out the material, again by the material transferring to the loading chamaer for the atmospheric robot from transfer chamber The transmission instruction of room；When the transmission path is three transmission path, the transmission instruction of generation includes the 3rd transmission instruction；Described 3rd passes Defeated instruction is vacuum robot by the material transferring to the transfer chamber, and the atmospheric robot is from the transfer chamber The material is taken out in room, again instructs the transmission of the material transferring to the loading chamber；When the transmission path is four transmission path, the transmission instruction of generation includes the 4th transmission instruction；Described 4th passes Defeated instruction takes out the material, again by the material transferring in described for the vacuum robot from the processing chamber Turn chamber, the atmospheric robot takes out the material from the transfer chamber, is transferred to the biography of the loading chamber again The transmission instruction in defeated path.
- Material handling apparatus when 6. a kind of semiconductor equipment is abnormal, it is characterised in that the semiconductor equipment includes technique mould Block and transport module, described device include：State variable creation module, for for current task creation state variable；The state variable includes unactivated state And state of activation, the unactivated state are used to indicate that technical module or transport module are normal condition, the state of activation is used In instruction technical module or transport module be abnormality；State of activation changes module, for when monitoring that technical module that current task is related to or transport module are abnormal, The state variable is changed to state of activation from initial unactivated state；Transmission path computing module, for recalculating the transmission path of material；The transmission path includes source position and target Position；Transport module, for the material to be transferred to the target location from the source position using the transmission path；Unactivated state changes module, if for material transferring success, the state variable is changed from state of activation For unactivated state.
- Material handling apparatus when 7. semiconductor equipment according to claim 6 is abnormal, it is characterised in that the transmission mould Block, which includes loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, the technical module, includes process cavity Room.
- Material handling apparatus when 8. semiconductor equipment according to claim 7 is abnormal, it is characterised in that the target position Put including loading chamber, the transmission path includes the first transmission path, the second transmission path, the 3rd transmission path and/or the Four transmission paths；The transmission path computing module includes：First transmission path calculating sub module, for when having material on the atmospheric robot, setting the atmospheric mechanical Arm is source position, and recalculates first transmission path；First transmission path is the material from the air Mechanical arm is transmitted directly to the transmission path of the loading chamber；And/orSecond transmission path calculating sub module, during for having material in the transfer chamber room, sets the transfer chamber as source Position, and recalculate second transmission path；Second transmission path passes for the material from the transfer chamber It is defeated to arrive the atmospheric robot, then it is transferred to the transmission path of the loading chamber；And/or3rd transmission path calculating sub module, for when having material in the vacuum robot, setting the vacuum machine Arm is source position, and recalculates the 3rd transmission path；3rd transmission path is the material from the vacuum Mechanical arm is transferred to the transfer chamber, then is transferred to the atmospheric robot, is finally delivered to the loading chamber Transmission path；And/or4th transmission path calculating sub module, during for having material in the processing chamber, sets the processing chamber as source Position, and recalculate the 4th transmission path；4th transmission path is transferred to for the material from the processing chamber The vacuum robot, is then transmitted to the transfer chamber, then is transferred to the atmospheric robot, is finally delivered to institute State the transmission path for loading chamber.
- Material handling apparatus when 9. the semiconductor equipment according to claim 6 or 8 is abnormal, it is characterised in that the biography Defeated module includes：Transmission instruction generation submodule, for using the corresponding transmission instruction of transmission path generation；Transmission instruction sending submodule, for sending the transmission instruction to the transport module；The transport module is used for Instructed using the transmission by the material transferring to the target location.
- Material handling apparatus when 10. semiconductor equipment according to claim 9 is abnormal, it is characterised in thatWhen the transmission path is the first transmission path, the transmission instruction of generation includes the first transmission instruction；Described first passes Defeated instruction directly instructs the material transferring to the transmission for loading chamber for atmospheric robot；When the transmission path is the second transmission path, the transmission instruction of generation includes the second transmission instruction；Described second passes Defeated instruction takes out the material, again by the material transferring to the loading chamaer for the atmospheric robot from transfer chamber The transmission instruction of room；When the transmission path is three transmission path, the transmission instruction of generation includes the 3rd transmission instruction；Described 3rd passes Defeated instruction is vacuum robot by the material transferring to the transfer chamber, and the atmospheric robot is from the transfer chamber The material is taken out in room, again instructs the transmission of the material transferring to the loading chamber；When the transmission path is four transmission path, the transmission instruction of generation includes the 4th transmission instruction；Described 4th passes Defeated instruction takes out the material, again by the material transferring in described for the vacuum robot from the processing chamber Turn chamber, the atmospheric robot takes out the material from the transfer chamber, is transferred to the biography of the loading chamber again The transmission instruction in defeated path.
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| CN107346750A (en) * | 2016-05-04 | 2017-11-14 | 北京北方华创微电子装备有限公司 | A kind of semiconductor technology processing method and processing device |
| CN105810618B (en) * | 2016-05-31 | 2018-08-10 | 北京七星华创电子股份有限公司 | Improve the system and method for wafer transfer efficiency |
| CN110938807B (en) * | 2019-11-26 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Control method and system for returning wafer of PVD sputtering equipment to disc according to specified path |
| CN113651059A (en) * | 2021-07-28 | 2021-11-16 | 北京旷视机器人技术有限公司 | Abnormity processing method and device, material conveying system and robot |
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| KR20110121806A (en) * | 2010-05-03 | 2011-11-09 | 세메스 주식회사 | Method for operating wafers processing apparatus |
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