CN104637650A - Multi-layer type inductor - Google Patents
Multi-layer type inductor Download PDFInfo
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- CN104637650A CN104637650A CN201410101315.5A CN201410101315A CN104637650A CN 104637650 A CN104637650 A CN 104637650A CN 201410101315 A CN201410101315 A CN 201410101315A CN 104637650 A CN104637650 A CN 104637650A
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- 239000000919 ceramic Substances 0.000 claims abstract description 67
- 230000037361 pathway Effects 0.000 claims description 30
- 230000007261 regionalization Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2866—Combination of wires and sheets
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a multi-layer type inductor comprising a ceramic main body, which is provided with a plurality of ceramic layers disposed on the ceramic main body in an overlapped manner; a plurality of conductive patterns, which are respectively disposed on the plurality of ceramic layers, and are mainly used to form an annular shape provided with gaps; a plurality of path electrodes, which can be formed on the conductive patterns along one direction at certain intervals, and can be used to connect the conductive patterns in the vertical direction together to form the coil; a first outer electrode and a second outer electrode, which are respectively formed on the two end surfaces of the ceramic main body, and are connected with the two end parts of the coil.
Description
This application claims the rights and interests of the 10-2013-0138396 korean patent application submitted in Korean Intellectual Property Office on November 14th, 2013, the disclosure of this korean patent application is contained in this by reference.
Technical field
The disclosure relates to a kind of multi-layered type inductor.
Background technology
Inductor is important passive component that is a kind of and resistor forming circuit together with capacitor, and it may be used for removing noise or can use in the assembly etc. forming LC resonant circuit.
Specifically, because display screen becomes large according to the improvement of the such as performance of the mancarried device such as smart mobile phone, individual panel computer (PC), so the speed of auxiliary power unit (APU) increases, and the amount of power used increases because of the use of double-core or four cores.Therefore, the inductor used in direct current (DC) to DC transducer is needed to have high allowable current value.
In order to increase the allowable current value of inductor, importantly may improve the DC bias characteristic of material to suppress the reduction of L value, and the heat generation amount reducing inductor rises to suppress temperature.
Here, because the efficiency of reduction to DC to DC transducer of the DC resistance of inductor has a great impact and for preventing temperature from rising, so the resistance reducing the coil in inductor may be extremely important.
Meanwhile, the type of inductor can be divided into convoluted inductor, film-type inductor and multi-layered type inductor etc. according to the structure of inductor.
In them, by reel around ferrite core coil or on ferrite core printed coil, and on its two ends, form electrode to manufacture convoluted inductor or film-type inductor.
In addition, by printed conductive patterns on multiple that are formed by magnetic material, dielectric material etc., then in a thickness direction stacking multiple manufacture multi-layered type inductor.
Multi-layered type inductor can have the size less than the size of convoluted inductor and the thickness thinner than the thickness of convoluted inductor, and also can be conducive to DC resistance.Therefore, multi-layered type inductor can mainly be used in needs to be miniaturized and needs the power circuit of high electric current etc.
Because multi-layered type inductor needs the size with reduction, there is the characteristic equal with the characteristic of large-sized multi-layered type inductor simultaneously, so the such as maximum L value of limitations affect to multi-layered type inductor, some characteristics of DC resistance and DC bias characteristic etc. in space in multi-layered type inductor.
Summary of the invention
One side of the present disclosure can provide a kind of multi-layered type inductor, and this multi-layered type inductor can have excellent characteristic have little size simultaneously by improving the shape of conductive pattern.
According to one side of the present disclosure, multi-layered type inductor can comprise: ceramic main body, has the multiple ceramic layers be stacked in ceramic main body; Multiple conductive pattern, is respectively formed on multiple ceramic layer, and is formed with the annular shape substantially with gap; Multiple pathway electrode, a direction on conductive pattern formation institute edge is formed at predetermined intervals, and is connected to each other by the conductive pattern that in the vertical direction is arranged, thus form coil; The first external electrode and the second external electrode, two end surfaces being respectively formed at ceramic main body are connected to two ends of coil.
According to another aspect of the present disclosure, multi-layered type inductor can comprise: ceramic main body, has the multiple ceramic layers be stacked in ceramic main body; Multiple conductive pattern, is respectively formed on multiple ceramic layer, and is formed with the annular of 90% or larger; Multiple pathway electrode, the direction forming conductive pattern institute edge is formed at predetermined intervals, and is connected to each other by the conductive pattern that in the vertical direction is arranged, thus forms coil; The first external electrode and the second external electrode, be respectively formed on two end surfaces of ceramic main body, and be connected to two ends of coil.
Pathway electrode can only be formed in the part adjacent with a side surface of ceramic main body of conductive pattern.
Pathway electrode can be formed at predetermined intervals reeling on contrary direction, direction with conductive pattern.
The total number of turns of coil can be at least one in 3.5,4.5 and 5.5.
Conductive pattern can comprise the first connection pattern and be connected pattern with second, and first connects pattern is connected pattern respectively by two end surfaces exposures of ceramic main body and is connected to the first external electrode and the second external electrode with second.
Multi-layered type inductor also can comprise be stacked on ceramic main body respectively upper surface and lower surface on upper caldding layer and lower caldding layer.
Accompanying drawing explanation
By the detailed description of carrying out below in conjunction with accompanying drawing, above and other aspect of the present disclosure, other advantages of characteristic sum will be more clearly understood, in the accompanying drawings:
Fig. 1 is the perspective view of the outside of the multi-layered type inductor schematically shown according to exemplary embodiment of the present disclosure;
Fig. 2 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to exemplary embodiment of the present disclosure;
Fig. 3 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to another exemplary embodiment of the present disclosure;
Fig. 4 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to another exemplary embodiment of the present disclosure;
Fig. 5 is used to the schematic diagram of the correlation described between coil and inductance.
Embodiment
Exemplary embodiment of the present disclosure is described in detail now with reference to accompanying drawing.
But the disclosure can illustrate with much different forms, should not be interpreted as being limited to specific embodiment set forth herein.On the contrary, provide these embodiments to make the disclosure to be thoroughly with complete, these embodiments will convey to those skilled in the art fully the scope of the present disclosure.
In the accompanying drawings, for clarity, the shape and size of element can be exaggerated, and will identical reference number be used all the time to represent same or analogous element.
In order to clearly describe embodiment of the present disclosure, will define hexahedral direction, L, W and the T shown in Fig. 1 refers to hexahedral length direction, Width and thickness direction respectively.Here, thickness direction can be used to have the concept identical with laminated ceramic layer direction.
In addition, in an exemplary embodiment of the disclosure, in order to the convenience explained, in the longitudinal direction its that two end surfaces of ceramic main body refer to ceramic main body is formed with the surface of the first external electrode and the second external electrode, what two side surfaces of ceramic main body referred to ceramic main body intersects with the surface vertical with two end surfaces with two end surfaces, and the upper surface of ceramic main body and lower surface refer to the surface in the thickness direction thereof of ceramic main body.
Fig. 1 is the perspective view of the outside of the multi-layered type inductor schematically shown according to exemplary embodiment of the present disclosure; Fig. 2 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to exemplary embodiment of the present disclosure.
See figures.1.and.2, can comprise ceramic main body 110, coil and the first external electrode 131 and the second external electrode 132 according to the multi-layered type inductor 100 of exemplary embodiment of the present disclosure, coil comprises multiple conductive pattern 211 to 216 and multiple pathway electrode 221 to 225.
Here, in order to protect the multiple conductive patterns 211 to 216 wherein printed, ceramic main body 110 can have be respectively formed at ceramic main body 110 upper surface and lower surface on upper caldding layer 111 and lower caldding layer 112.
Upper caldding layer 111 and lower caldding layer 112 are formed by stacking single ceramic layer or multiple ceramic layer, and each ceramic layer is formed by potsherd in a thickness direction respectively.
Ceramic main body 110, by stacking multiple ceramic layers 113 formed by potsherd in a thickness direction, then sinters multiple ceramic layer 113 and is formed.The shape and size of ceramic main body 110 and the quantity of stacking ceramic layer 113 are not limited to the example illustrated in fig. 1 and 2.
Conductive pattern 211 to 216 is formed by the conductive paste comprising conducting metal with predetermined thickness printing on each ceramic layer 113.
Such as, conductive pattern 211 to 216 can be formed by the material comprising silver (Ag) or copper (Cu) or its alloy.But the disclosure is not limited thereto.
Conductive pattern 211 to 216 can have the shape being similar to annular shape substantially.That is, each conductive pattern 211 to 216 can be formed with the annular shape substantially with a gap.
Here, the core in coil can be formed by metallicl magnetic material or Ferrite Material.But the disclosure is not limited thereto.
In addition, when from another viewpoint, except a part for annular, conductive pattern 211 to 216 can be formed in the Zone Full of annular substantially.In this case, conductive pattern 211 to 216 can be formed with the annular of 90% or larger.
The number of turn of the coil realized by single conductive pattern stacking on single ceramic sheet is less than 1, and in an exemplary embodiment of the disclosure, the quantity of stacking conductive pattern can have the value corresponding with the number of turn+0.5 of coil.When stacking mutually and the sum it being formed with the ceramic layer 113 of conductive pattern 211 to 216 increases in multi-layered type inductor 100 time, difference between the quantity of stacking conductive pattern and the number of turn of coil may accumulate, thus existence makes the quantity of stacking conductive pattern have the limiting value of the quantity of the stack layer of the value corresponding with the number of turn+1.5 of coil.When coil is formed by the conductive pattern of the annular being less than 90%, the limiting value of the quantity of stack layer can be less than above-mentioned value.
In addition, can consider that the electrical characteristics of the such as inductance value of the design based on multi-layered type inductor 100 etc. differently determine it is formed with the total quantity of the stacking ceramic layer 113 of conductive pattern 211 to 216.
In an exemplary embodiment of the disclosure, because the total number of turns of coil is 5.5, conductive pattern 211 to 216 can be stacked as six layers.The total number of turns of the coil corresponding to 5.5 can be the such as acceptable maximum number of turn in 2012 size inductors.When ceramic main body has the size of the increase of such as 3216 sizes, the rectangle length of ceramic layer can increase.Therefore, can further stacking each on be formed with two ceramic layers 113 of in conductive pattern 211 to 216, make the maximum number of turn of coil can be 7.5.
In addition, even in the multi-layered type inductor with same size, the maximum number of turn of the coil in multi-layered type inductor can be made different by regulating the accurate degree of technique of line width or conductive pattern.
In addition, at least two conductive patterns can be respectively and have first of the leading part exposed by two end surfaces of ceramic main body 110 and connect pattern 211 and be connected pattern 212 with second.
Leading part contacts respectively and is electrically connected to and is formed in the first external electrode 131 on two end surfaces of ceramic main body 110 and the second external electrode 132.
In addition, although exemplary embodiment of the present disclosure shows the first connection pattern be connected with second the situation that pattern is separately positioned on the top and bottom of ceramic main body, the disclosure is not limited thereto.
The conductive pattern 211 to 216 that in the vertical direction is arranged can be connected to each other to form coil by pathway electrode 221 to 225.
Pathway electrode 221 to 225 shown in Fig. 2 can with the end portion of conductive pattern 211 to 216 at predetermined spaced intervals.Its reason is guarantee to prevent the bottom line of defective workmanship.
Pathway electrode 221 to 225 by forming through hole (not shown) in each ceramic layer 113, and is formed with the conductive paste filling vias with excellent conductance.
In addition, conductive paste can be formed by least one in silver (Ag), silver-palladium (Ag-Pd), nickel (Ni) and copper (Cu) or its alloy.But the disclosure is not limited thereto.
The first external electrode 131 and the second external electrode 132 can be respectively formed on two end surfaces of ceramic main body 110, and can contact respectively and be electrically connected to the two ends of coil, that is, first connects pattern 211 is connected the outside exposure of pattern 212 leading part with second.
The first external electrode 131 and the second external electrode 132 can be formed by the conducting metal with excellent conductance.
Such as, the first external electrode 131 and the second external electrode 132 can be formed by the material of at least one comprised in silver (Ag) and copper (Cu) or its alloy.But the disclosure is not limited thereto.
In addition, if necessary, then can form nickel (Ni) coating (not shown) on the outer surface of the first external electrode 131 and the second external electrode 132, then, tin (Sn) coating (not shown) can be formed thereon.
According to exemplary embodiment of the present disclosure, the conductive pattern 211 to 216 that in the vertical direction is arranged is connected to each other by pathway electrode 221 to 225, to form the single spiral helicine coil integrally connected.In this case, the total number of turns of coil can be 5.5.
In addition, in an exemplary embodiment of the disclosure, pathway electrode 221 to 225 can only be formed in a part adjacent with a side surface of ceramic main body 110 for conductive pattern 211 to 216 respectively.
In addition, in an exemplary embodiment of the disclosure, pathway electrode 221 to 225 can be formed at predetermined intervals along with each conductive pattern 211 to 216 contrary direction, direction that reels.
Usually, the inductance of inductor can be determined by both materials and structures of inductor.
The characteristic of the materials and structures of the determination inductance of inductor is described with reference to Fig. 5 and formula below 1.Inductance can to square being directly proportional of the number of turn of the permeability of material and coil, and the area that can shorten along with the path of the magnetic flux of inductor and pass along with magnetic flux increases and increases.
[formula 1]
Here, N represents the number of turn of coil, and A represents the cross-sectional area of core, and l represents the length of coil, μ
rrepresent the relative permeability of internal material, μ
0represent permeability under vacuo.
Multi-layered type inductor according to prior art is mainly divided into: use and manufacture potsherd, the scheme of printed conductive patterns and stacking potsherd and the multi-layered type inductor that manufactures on potsherd; Use and form the scheme of conductive pattern and ceramic main body and the multi-layered type inductor that manufactures with mode of printing.
But, because conductive pattern is connected to each other by pathway electrode after printed conductive patterns on potsherd, and in fact not coiled electrical conductor, so a circle coil may not be fully formed in above-mentioned fabrication scheme in an only potsherd.Therefore, the quantity of stacking conductive pattern can be increased to larger than the number of turn of coil.
Such as, in order to form the coil with 3 circles, when the shape of conductive pattern is corresponding with 1/2 annular, the quantity of stacking conductive pattern can be six, when the shape of conductive pattern is corresponding with 3/4 annular, the quantity of stacking conductive pattern can be five.
As the method for the quantity for reducing stacking conductive pattern, can propose with the annular of 95% or larger to form the method for conductive pattern.In this case, the distortion by conductive pattern realizes single turn to reduce the quantity of stacking conductive pattern on single ceramic sheet.Such as, in order to form the coil with 3 circles, can stacking four conductive patterns.
Therefore, when realizing the identical number of turn, when conductive pattern with 95% or larger annular formed, the quantity of stacking conductive pattern can be minimum, when the shape of conductive pattern is corresponding with 3/4 annular, the quantity of stacking conductive pattern can be median, and when the shape of conductive pattern is corresponding with 1/2 annular, the quantity of stacking conductive pattern can be maximum.Along with the quantity of stacking conductive pattern increases, " l " in formula 1 can increase, and the area that the magnetic flux in the space on electrode passes can reduce, thus inductance can reduce.
But when coil has with the pattern of the annular formation of 95% or larger, coil structurally can have the part that wherein coil flux amount area is reduced, and the reduction of such relative area can reduce along with the size of chip and increase.Therefore, have conductive pattern with 95% or larger the coil of structure that formed of annular may can not be used frequently.
Because according to the multi-layered type inductor of exemplary embodiment while the stacking number of plies is fewer than the stacking number of plies of the multi-layered type inductor according to prior art, the number of turn of identical coil can be realized, so the inductance of increase can be had according to the multi-layered type inductor of exemplary embodiment while size reduces.
Such as, when suppose in the prior art in order to formed the loop construction of expectation and stacking 5 conductive patterns time, even when only reducing a slice in 5 conductive patterns, the quantity of conductive pattern decreases 20%, and it is the numerical value that can have 10% or larger impact on inductance.
On the basis that the quantity of stacking conductive pattern is identical, compared with there is the coil of the conductive pattern formed with the annular of 95% or larger, larger according to the internal area of the coil of exemplary embodiment of the present disclosure, thus the inductance that increases can be realized.
When increasing inductance while the coil turn that maintenance is identical, Q value proportionally can increase with inductance, and this can be conducive to the inductor in high frequency etc. needing high q-factor.In addition, because the number of turn of coil can reduce, so Rdc also can reduce because inductance increases under specific circumstances.
Such as, even if when the line width by widening conductive pattern reduces the area of passage of magnetic flux or extends path by the thickness increasing electrode, exemplary embodiment of the present disclosure in view of stacking conductive pattern quantity and can be favourable, thus compared with the structure of the electrode according to prior art, high q-factor and Rdc can be carried while maintenance L value.
In addition, at the printing width of conductive pattern little or as important in resolution time mackle brush (double printing), when each conductive pattern with 95% or larger annular formed time, may be short-circuited continually because of the diffusion between adjacent conductive pattern.But according to exemplary embodiment of the present disclosure, electrode area facing with each other is little, thus can reduce circuit defect.
Meanwhile, according to prior art, the quantity of the screen (screen) of use increases along with the quantity increase of stacking conductive pattern.But, according to exemplary embodiment of the present disclosure, because when Screen-printed conductive pattern, some conductive pattern in the vertical directions are mutually symmetrical, such as, so the quantity of screen reduces when printed conductive patterns, when coil has 5.5 circle, the quantity of screen can reduce to 3, thus boosts productivity.
Fig. 3 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to another exemplary embodiment of the present disclosure.Fig. 4 shows the decomposition diagram of the conductive pattern of multi-layered type inductor and the structure of pathway electrode be wherein provided with according to another exemplary embodiment of the present disclosure.
With reference to Fig. 3, the coil of multi-layered type inductor can comprise four conductive patterns 2110 to 2140 and three pathway electrodes 2210 to 2230.Here, pathway electrode 2210 to 2230 can vertically be arranged, and with wider gap-forming compared with the multi-layered type inductor shown in Fig. 2.Here, the total number of turns of coil can be 3.5.
Because other assemblies are identical with other assemblies of the multi-layered type inductor according to foregoing example embodiment of the present disclosure, so the description in order to avoid repeating, detailed description will be omitted.
With reference to Fig. 4, the coil of multi-layered type inductor can comprise five conductive patterns 2310 to 2350 and four pathway electrodes 2410 to 2440.Here, pathway electrode 2410 to 2440 can vertically be arranged, pathway electrode 2410 to 2440 with shown in Fig. 2 and the situation comprising the multi-layered type inductor of the coil with 5.5 circles compared with can with wider gap-forming, and with shown in Fig. 3 and the situation comprising the multi-layered type inductor of the coil with 3.5 circles compared with can with narrower gap-forming.Here, the total number of turns of coil can be 4.5.
Because other assemblies are identical with other assemblies of the multi-layered type inductor according to foregoing example embodiment of the present disclosure, so the description in order to avoid repeating, detailed description will be omitted.
As mentioned above, according to exemplary embodiment of the present disclosure, pathway electrode is formed on a direction on institute edge at conductive pattern and is formed at predetermined intervals, to increase the number of turn of coil while the quantity reducing stacking conductive pattern, thus can boost productivity.In addition, reduce the height of coil, thus inductance and Q value can be improved, and can Rdc be reduced.
Although below illustrate and describe exemplary embodiment, being apparent that to those skilled in the art, when not departing from the spirit and scope of the present disclosure be defined by the claims, amendment and modification can being made.
Claims (16)
1. a multi-layered type inductor, described multi-layered type inductor comprises:
Ceramic main body, has the multiple ceramic layers be stacked in ceramic main body;
Multiple conductive pattern, is separately positioned on described multiple ceramic layer, and is formed with the annular shape substantially with gap;
Multiple pathway electrode, a direction on conductive pattern formation institute edge is arranged at predetermined intervals, and is connected to each other by the conductive pattern that in the vertical direction is arranged, thus form coil; And
The first external electrode and the second external electrode, two end surfaces being separately positioned on ceramic main body are connected to two ends of coil.
2. multi-layered type inductor according to claim 1, wherein, pathway electrode is only formed in the part adjacent with a side surface of ceramic main body of conductive pattern.
3. multi-layered type inductor according to claim 1, wherein, pathway electrode is formed at predetermined intervals reeling on contrary direction, direction with conductive pattern.
4. multi-layered type inductor according to claim 1, wherein, the total number of turns of coil is 3.5.
5. multi-layered type inductor according to claim 1, wherein, the total number of turns of coil is 4.5.
6. multi-layered type inductor according to claim 1, wherein, the total number of turns of coil is 5.5.
7. multi-layered type inductor according to claim 1, wherein, conductive pattern comprises the first connection pattern and is connected pattern with second, and first connects pattern is connected pattern respectively by two end surfaces exposures of ceramic main body and is connected to the first external electrode and the second external electrode with second.
8. multi-layered type inductor according to claim 1, described multi-layered type inductor also comprises: upper caldding layer and lower caldding layer, on the upper surface being stacked on ceramic main body respectively and lower surface.
9. a multi-layered type inductor, described multi-layered type inductor comprises:
Ceramic main body, has the multiple ceramic layers be stacked in ceramic main body;
Multiple conductive pattern, is separately positioned on described multiple ceramic layer, and is formed with the annular of 90% or larger;
Multiple pathway electrode, the direction forming conductive pattern institute edge is arranged at predetermined intervals, and is connected to each other by the conductive pattern that in the vertical direction is arranged, thus forms coil; And
The first external electrode and the second external electrode, be separately positioned on two end surfaces of ceramic main body, and be connected to two ends of coil.
10. multi-layered type inductor according to claim 9, wherein, pathway electrode is only formed in the part adjacent with a side surface of ceramic main body of conductive pattern.
11. multi-layered type inductors according to claim 9, wherein, pathway electrode is arranged at predetermined intervals reeling on contrary direction, direction with conductive pattern.
12. multi-layered type inductors according to claim 9, wherein, the total number of turns of coil is 3.5.
13. multi-layered type inductors according to claim 9, wherein, the total number of turns of coil is 4.5.
14. multi-layered type inductors according to claim 9, wherein, the total number of turns of coil is 5.5.
15. multi-layered type inductors according to claim 9, wherein, conductive pattern comprises the first connection pattern and is connected pattern with second, and first connects pattern is connected pattern respectively by two end surfaces exposures of ceramic main body and is connected to the first external electrode and the second external electrode with second.
16. multi-layered type inductors according to claim 9, described multi-layered type inductor also comprises: upper caldding layer and lower caldding layer, on the upper surface being stacked on ceramic main body respectively and lower surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0138396 | 2013-11-14 | ||
| KR1020130138396A KR101532148B1 (en) | 2013-11-14 | 2013-11-14 | Laminated Inductor |
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| Publication Number | Publication Date |
|---|---|
| CN104637650A true CN104637650A (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410101315.5A Pending CN104637650A (en) | 2013-11-14 | 2014-03-18 | Multi-layer type inductor |
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| KR (1) | KR101532148B1 (en) |
| CN (1) | CN104637650A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994305A (en) * | 2019-03-27 | 2019-07-09 | 武汉合康亿盛电气连接***有限公司 | A kind of stacked inductor |
| CN112038041A (en) * | 2019-06-03 | 2020-12-04 | 株式会社村田制作所 | Laminated coil component |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102551243B1 (en) | 2016-07-07 | 2023-07-03 | 삼성전기주식회사 | Coil component |
| US10580559B2 (en) | 2016-07-07 | 2020-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
| KR102438500B1 (en) * | 2021-04-30 | 2022-08-31 | 삼화콘덴서공업 주식회사 | Muti-layer chip component for high current |
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| JP2005191191A (en) * | 2003-12-25 | 2005-07-14 | Tdk Corp | Laminated chip inductor |
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| WO2010092861A1 (en) * | 2009-02-13 | 2010-08-19 | 株式会社村田製作所 | Electronic component |
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| CN102272867A (en) * | 2009-01-08 | 2011-12-07 | 株式会社村田制作所 | Electronic component |
| KR20120047631A (en) * | 2010-11-04 | 2012-05-14 | 삼성전기주식회사 | A multilayer type inductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100513347B1 (en) * | 2004-03-04 | 2005-09-07 | 삼성전기주식회사 | Chip inductor |
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| EP1075000A1 (en) * | 1999-07-30 | 2001-02-07 | Murata Manufacturing Co., Ltd. | Monolithic inductor |
| JP2005191191A (en) * | 2003-12-25 | 2005-07-14 | Tdk Corp | Laminated chip inductor |
| TWI248091B (en) * | 2004-01-23 | 2006-01-21 | Murata Manufacturing Co | Chip inductor and manufacturing method therefor |
| CN102067253A (en) * | 2008-08-07 | 2011-05-18 | 株式会社村田制作所 | Multilayer inductor |
| CN102272867A (en) * | 2009-01-08 | 2011-12-07 | 株式会社村田制作所 | Electronic component |
| WO2010092861A1 (en) * | 2009-02-13 | 2010-08-19 | 株式会社村田製作所 | Electronic component |
| KR20120047631A (en) * | 2010-11-04 | 2012-05-14 | 삼성전기주식회사 | A multilayer type inductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109994305A (en) * | 2019-03-27 | 2019-07-09 | 武汉合康亿盛电气连接***有限公司 | A kind of stacked inductor |
| CN112038041A (en) * | 2019-06-03 | 2020-12-04 | 株式会社村田制作所 | Laminated coil component |
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| Publication number | Publication date |
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| KR20150055871A (en) | 2015-05-22 |
| KR101532148B1 (en) | 2015-06-26 |
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