CN104619121B - Accompany plating plate - Google Patents
Accompany plating plate Download PDFInfo
- Publication number
- CN104619121B CN104619121B CN201410856797.5A CN201410856797A CN104619121B CN 104619121 B CN104619121 B CN 104619121B CN 201410856797 A CN201410856797 A CN 201410856797A CN 104619121 B CN104619121 B CN 104619121B
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- CN
- China
- Prior art keywords
- plating plate
- substrate
- conductive layer
- accompany
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
One kind accompanying plating plate, including substrate, and the substrate has first surface, the second surface opposite with first surface, and connects the side of the first surface and the second surface, and resistance coating is formed on the side.It is above-mentioned accompany plating plate be conducive to reuse and coated metal recycling be easy.
Description
Technical field
The present invention relates to one kind accompanying plating plate.
Background technology
Vertical continuous electroplating technology generally uses in printed circuit board electroplating work procedure, and a feature of the electroplating technology is
It needs segmentation to beat electric current, accompany consistent with production plate of taking measurements greatly must be used to plate plate in this way and fill the plating cylinder body of target phase
It is full, the normal of production plate could be carried out and play electric current plating.Currently, most manufacturers directly use copper-clad plate as plating plate is accompanied, it is electroplated
When in the surface coating metal for accompanying plating plate, when accompany plating plate using to a certain extent after i.e. discarded or removing surface plating metal after
It is continuing with.When accompanying plating plate to reuse, it is necessary to etch the metal for removing surface plating through chemical medicinal liquid, not environmentally；More
By importantly, to plating metal recycling it is very inconvenient.
Invention content
Based on this, it is necessary to provide one kind and be relatively easy to accompany plating plate conducive to recycling, environmental protection and metal recovery.
One kind accompanies plating plate, including substrate, the substrate to have first surface, the second surface opposite with first surface, and
The side of the first surface and the second surface is connected, resistance coating is formed on the side.
In one embodiment, the material of the substrate is plastics or metal, the first surface and the second surface
It has been respectively formed on conductive layer.
In one embodiment, the material of the conductive layer is conductive metal or conducting resinl.
In one embodiment, it is copper, iron, aluminium, zinc, nickel or filling gold that the material of the conductive layer, which is the conductive metal,
Belong to particle resin type conducting resinl.
In one embodiment, the thickness of the conductive layer is 100nm-1mm.
In one embodiment, the material of the resistance coating is polytetrafluoroethylene (PTFE), polypropylene, polyvinyl chloride or polyethylene.
In one embodiment, the thickness of the resistance coating is 0.2mm~1.5mm.
In one embodiment, the width of the resistance coating is 5mm~20mm.
In one embodiment, the material of the substrate is epoxy resin, phenolic resin, polyimide resin or polytetrafluoro
Ethylene.
In one embodiment, the edge of the resistance coating cladding first surface and second surface.
It is this to accompany plating plate, resistance coating is formed in the side of substrate, thus during plating, in first surface and second
The metal layer that surface is formed can form clearly line of demarcation in the intersection of first surface and second surface and resistance coating, repeatedly accompany
After plating, when the thickness for the metal layer that surface is formed is thicker, the edge of metal layer is clamped using auxiliary tool such as pliers
By metal layer from the sur-face peeling of substrate, without using liquid medicine, the more metal of environmental protection and recycling can be recycled directly.
Description of the drawings
Fig. 1 is the vertical view for accompanying plating plate of an embodiment；
The sectional view for accompanying plating plate that Fig. 2 is Fig. 1.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Please refer to Fig. 1 and Fig. 2, an embodiment accompanies plating plate 100, including substrate 10.
The generally plate of substrate 10, concrete shape depend on the shape of electroplate in production process, can be rectangle, three
Angular or irregular shape plank is illustrated by taking rectangular plate-like as an example in the present embodiment.
Substrate 10 has first surface 12, the second surface 14 opposite with first surface 12 and side 16.
In present embodiment, substrate 10 is rectangular plate-like, and therefore, first surface 12 and second surface 14 are rectangle, and phase
It is mutually parallel.Side 16 connects first surface 12 and second surface 14.In present embodiment, substrate 10 is rectangular plate-like, therefore side
Face 16 is sequentially connected end to end in turn by four faces and forms round.
The material of substrate 10 is plastics or metal.Preferably, the material of substrate 10 is plastics.It is furthermore preferred that substrate 10
Material is epoxy resin, phenolic resin or polyimide resin.The thickness of substrate 10 is 0.5mm~4mm.
First surface 12 and second surface 16 have been respectively formed on conductive layer 20.The material of conductive layer 20 is conductive metal or leads
Electric glue.Conductive metal is copper, iron, aluminium, zinc or nickel.Conducting resinl is the resin type conducting resinl for filling metallic.Metallic is
At least one of silver, nickel and copper.The thickness of conductive layer 20 is 100nm-1mm.
The surface of side 16 forms resistance coating 30.Resistance coating 30 is round.Coating 30 is hindered to be used to prevent at it in plating
Surface forms coating.Preferably, the width of resistance coating 30 is more than the thickness of substrate 10, hinders the side of 30 coated with conductive layer 20 of coating
Edge.Herein, in the size on the direction of first surface and second surface, i.e., the width of resistance coating 30 refers to resistance coating
For the distance between first surface 12 and second surface 14.
Preferably, the material of resistance coating 30 is polytetrafluoroethylene (PTFE), polypropylene, polyvinyl chloride or polyethylene.Hinder coating 30
Thickness is 0.2mm~1.5mm.The width for hindering coating 30 is 5mm~20mm.
It is this to accompany plating plate, conductive layer 20 is formed on two surfaces of substrate, it is whether conductive from the material but regardless of substrate
Two-sided conductive effect can be reached.Resistance coating 30 is formed in the side of substrate 10 16, thus during plating, in conductive layer 20
Surface formed metal layer conductive layer 20 with resistance coating 30 intersection have clearly line of demarcation, after repeatedly accompanying plating, when
When the thickness for the metal layer that 20 surface of conductive layer is formed is thicker, the edge of metal layer is clamped using auxiliary tool such as pliers
By metal layer from the sur-face peeling of conductive layer 20, without using liquid medicine, more environmentally friendly and plated simple metal can directly recycle profit
With.
It is appreciated that conductive layer 20 can be omitted, substrate is made of conductive metal such as steel at this time.
Below in conjunction with specific embodiment to accompanying plating plate to be described in detail.
Embodiment 1
Accompany the structure of plating plate as shown in Figure 2.It is epoxy resin, two surfaces up and down of substrate to accompany the material of the substrate of plating plate
I.e. first surface and second surface are formed with conductive layer, and the material of conductive layer is conducting resinl, and the thickness of conducting resinl is 0.1mm.Base
The side of plate is formed with resistance coating, and the material for hindering coating is polytetrafluoroethylene (PTFE), and the width for hindering coating is 8mm, thickness 1.5mm.
After repeatedly accompanying plating, the thickness of coating on conductive layer begins to exceed resistance thickness of coating, and the weight of plating plate is accompanied to reach
Constant weight, you can clamp coating side with pliers, recycling is easily removed with physical external force, and accompany plating plate through simple process
It can reuse again afterwards.
Embodiment 2
Accompany the structure of plating plate as shown in Figure 2.It is epoxy resin, two surfaces up and down of substrate to accompany the material of the substrate of plating plate
I.e. first surface and second surface are formed with conductive layer, and the material of conductive layer is copper, and the thickness of conductive layer is 10 μm.The side of substrate
Face is formed with resistance coating, and the material for hindering coating is polytetrafluoroethylene (PTFE), and the width for hindering coating is 8mm, thickness 1.0mm.
After repeatedly accompanying plating, the thickness of coating on conductive layer begins to exceed resistance thickness of coating, and the weight of plating plate is accompanied to reach
Constant weight, you can clamp coating side with pliers, recycling is easily removed with physical external force, and accompany plating plate through simple process
It can reuse again afterwards.
Embodiment 3
Accompany the structure of plating plate as shown in Figure 1.It is the sheet metal of 1mm thickness, the side shape of substrate to accompany the material of the substrate of plating plate
At there is resistance coating, the material for hindering coating is polytetrafluoroethylene (PTFE), and the width for hindering coating is 8mm, thickness 1.0mm.
After repeatedly accompanying plating, the thickness of coating on conductive layer begins to exceed resistance thickness of coating, and the weight of plating plate is accompanied to reach
Constant weight, you can clamp coating side with pliers, recycling is easily removed with physical external force, and accompany plating plate through simple process
It can reuse again afterwards.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. one kind accompanying plating plate, which is characterized in that including substrate, the substrate has first surface, opposite with first surface the
Two surfaces, and the side of the first surface and the second surface is connected, it is formed with resistance coating on the side；
The material of the substrate is plastics or metal, and the first surface and the second surface have been respectively formed on conductive layer；
The thickness of the resistance coating is 0.2mm~1.5mm.
2. according to claim 1 accompany plating plate, which is characterized in that the material of the conductive layer is conductive metal or conduction
Glue.
3. according to claim 1 accompany plating plate, which is characterized in that the material of the conductive layer be copper, iron, aluminium, zinc, nickel or
Fill metallic resin type conducting resinl.
4. according to claim 1 accompany plating plate, which is characterized in that the thickness of the conductive layer is 100nm~1mm.
5. according to claim 1 accompany plating plate, which is characterized in that the material of the resistance coating is polytetrafluoroethylene (PTFE), poly- third
Alkene, polyvinyl chloride or polyethylene.
6. according to claim 1 accompany plating plate, which is characterized in that the width of the resistance coating is 5mm~20mm.
7. according to claim 1 accompany plating plate, which is characterized in that the material of the substrate be epoxy resin, phenolic resin,
Polyimide resin or polytetrafluoroethylene (PTFE).
8. according to claim 1 accompany plating plate, which is characterized in that the resistance coating cladding first surface and second surface
Edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410856797.5A CN104619121B (en) | 2014-12-31 | 2014-12-31 | Accompany plating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410856797.5A CN104619121B (en) | 2014-12-31 | 2014-12-31 | Accompany plating plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104619121A CN104619121A (en) | 2015-05-13 |
| CN104619121B true CN104619121B (en) | 2018-10-19 |
Family
ID=53153322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410856797.5A Active CN104619121B (en) | 2014-12-31 | 2014-12-31 | Accompany plating plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104619121B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018152686A1 (en) * | 2017-02-22 | 2018-08-30 | 华为技术有限公司 | Method for forming plated hole, method for manufacturing circuit board, and circuit board |
| CN106968007B (en) * | 2017-04-07 | 2018-10-02 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN106968008B (en) * | 2017-04-07 | 2018-09-28 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN107278042B (en) * | 2017-08-07 | 2023-09-12 | 大连崇达电路有限公司 | Accompanying plating board of circuit board VCP |
| CN110146045A (en) * | 2019-04-16 | 2019-08-20 | 珠海中京电子电路有限公司 | A kind of electroplating evenness detection method |
| CN110602891B (en) * | 2019-08-22 | 2021-01-15 | 江门崇达电路技术有限公司 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN110602893B (en) * | 2019-09-24 | 2021-01-15 | 珠海崇达电路技术有限公司 | Pattern electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN113737254B (en) * | 2021-08-03 | 2024-01-23 | 昆山沪利微电有限公司 | Device and method for recycling Dummy board in electroplating VCP production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62296596A (en) * | 1986-06-17 | 1987-12-23 | 松下電器産業株式会社 | Method of selective plating of printed wiring circuit board |
| CN101928969A (en) * | 2009-06-19 | 2010-12-29 | 桦玮电子科技(苏州)有限公司 | Offset-free electroplating method and electroplating block piece used in same |
| CN202989319U (en) * | 2012-08-27 | 2013-06-12 | 珠海市祥芝电子有限公司 | Electroplating drag cylinder plate |
-
2014
- 2014-12-31 CN CN201410856797.5A patent/CN104619121B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62296596A (en) * | 1986-06-17 | 1987-12-23 | 松下電器産業株式会社 | Method of selective plating of printed wiring circuit board |
| CN101928969A (en) * | 2009-06-19 | 2010-12-29 | 桦玮电子科技(苏州)有限公司 | Offset-free electroplating method and electroplating block piece used in same |
| CN202989319U (en) * | 2012-08-27 | 2013-06-12 | 珠海市祥芝电子有限公司 | Electroplating drag cylinder plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104619121A (en) | 2015-05-13 |
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