CN104617014B - Highly-efficient processing device for diode component - Google Patents
Highly-efficient processing device for diode component Download PDFInfo
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- CN104617014B CN104617014B CN201410802411.2A CN201410802411A CN104617014B CN 104617014 B CN104617014 B CN 104617014B CN 201410802411 A CN201410802411 A CN 201410802411A CN 104617014 B CN104617014 B CN 104617014B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Slot Machines And Peripheral Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Rectifiers (AREA)
- Electrodes Of Semiconductors (AREA)
- Combined Means For Separation Of Solids (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention discloses a kind of highly-efficient processing device for diode component, including strip substrate, several comb material teeth and several orientation teeth, several described comb material tooth positions are in the middle part of strip substrate and inline along its length, several described orientation tooth positions are in strip substrate a side and inline along its length, to form a long groove between several comb material teeth and several orientation teeth, there are comb material inter-tooth slots between adjacent comb material tooth, there are comb material inter-tooth slots between adjacent orientation tooth, the comb expects inter-tooth slots, the gap of comb material inter-tooth slots is more than the first bronze medal lead, the diameter of second bronze medal lead；The comb material tooth and orientation tooth position in strip substrate homonymy and are oppositely arranged, and the both ends of the strip substrate along its length are respectively arranged with left and right handle, and the upper end of the comb material tooth has a hook portion for stretching into long groove.The present invention, which can comb from graphite boat the diode being welded, to be got up and rotates 180 degree material and will not fall down, is reduced turnover tool to reach, is improved man efficiency and yield.
Description
Technical field
The present invention relates to the production of rectifying device, more particularly to a kind of highly-efficient processing devices for diode component.
Background technology
The prior art is combed material onto aluminum strip by combing material strip in diode manufacture, then again by the material on aluminum strip
It is transferred on the stock shelf of molding die.The problem of such mode is brought is to increase turnover tool, increase cost of labor, increase
A procedure is added to cause the risk of damage to product.
Invention content
It is an object of the present invention to provide a kind of channel schottky semiconductor devices, which changes
The reliability of device has been apt to it, potential line density will reduce at the top of groove, and make device forward voltage drop and device loss equal
Reduced, and when device reversely turns off, further reduced the electric leakage of device.
In order to achieve the above objectives, the technical solution adopted by the present invention is：A kind of highly-efficient processing for diode component fills
It sets, the axialmode diode includes diode chip for backlight unit, the first bronze medal lead, the second bronze medal lead, one end of the first bronze medal lead
The N pole-faces of the diode chip for backlight unit are connected to by scolding tin, the other end of the first bronze medal lead is defeated as the axialmode diode
Enter end；One end of the second bronze medal lead is connected to the P pole-faces of the diode chip for backlight unit by scolding tin, the second bronze medal lead it is another
End is used as the axialmode diode input terminal, the diode chip for backlight unit, first bronze medal lead the second bronze medal lead and diode chip for backlight unit
One end of contact is coated by epoxy body；
The turnover device includes that strip substrate, several comb material teeth and several orientation teeth, several described combs expect tooth
It is in the middle part of strip substrate and inline along its length, several described orientation tooth positions in strip substrate a side and
It is inline along its length, it is adjacent to form a long groove between several comb material teeth and several orientation teeth
There are comb material inter-tooth slots between comb material tooth, there is orientation inter-tooth slots, the comb material inter-tooth slots, orientation between cog between adjacent orientation tooth
The gap of slot is more than the diameter of the first bronze medal lead, the second bronze medal lead；
Comb material tooth and orientation tooth position in strip substrate homonymy and be oppositely arranged, and the strip substrate is along its length
Both ends are respectively arranged with left and right handle, and the upper end of the comb material tooth has a hook portion for stretching into long groove.
Further improved technical solution is as follows in above-mentioned technical proposal：
1. preferably, the left and right handle is located at strip substrate both sides with comb material tooth, orientation tooth.
2. preferably, the angle of the left and right handle and strip substrate is 20 ° ~ 40 °.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
The present invention is used for the highly-efficient processing device of diode component, can comb the diode being welded from graphite boat
Get up and rotate 180 degree material to will not fall down, to achieve the purpose that direct feeding, it is possible to reduce turnover tool improves manually
Efficiency, the process for reducing diode turnover, improve product yield.
Description of the drawings
Attached drawing 1 is existing axialmode diode structure schematic diagram；
Attached drawing 2 is the highly-efficient processing apparatus structure schematic diagram that the present invention is used for diode component；
Attached drawing 3 is the side structure schematic view of attached drawing 2；
Attached drawing 4 is the highly-efficient processing device use state diagram that the present invention is used for diode component.
In the figures above：1, diode chip for backlight unit；2, the first bronze medal lead；3, the second bronze medal lead；4, scolding tin；5, epoxy body；6、
Strip substrate；7, comb material tooth；71, comb material inter-tooth slots；8, tooth is oriented；81, comb material inter-tooth slots；9, long groove；10, hook portion；11, left
Handle；12, right handles.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and embodiments：
Embodiment 1：A kind of highly-efficient processing device for diode component, the axialmode diode includes diode core
One end of piece 1, the first bronze medal lead 2, the second bronze medal lead 3, the first bronze medal lead 2 is connected to the diode core by scolding tin 4
The N pole-faces of piece 1, the other end of the first bronze medal lead 2 is as the axialmode diode input terminal；The one of the second bronze medal lead 3
End is connected to the P pole-faces of the diode chip for backlight unit 1 by scolding tin 4, and the other end of the second bronze medal lead 3 is as two pole of the axialmode
Pipe input terminal, one end that the diode chip for backlight unit 1,2 second bronze medal lead 3 of the first bronze medal lead are contacted with diode chip for backlight unit is by epoxy body
5 claddings；
The turnover device includes strip substrate 6, several comb material teeth 7 and several orientation teeth 8, several described comb material
Tooth 7 is located at the middle part of strip substrate 6 and inline along its length, several described orientation teeth 8 are located at strip substrate 6 one
Side and inline along its length, to form a long ditch between several comb material teeth 7 and several orientation teeth 8
Slot 9 has comb material inter-tooth slots 71 between adjacent comb material tooth 7, between adjacent orientation tooth 8 there are orientation inter-tooth slots 81, the comb to expect
Inter-tooth slots 71, the gap for orienting inter-tooth slots 81 are more than the diameter of the first bronze medal lead 2, the second bronze medal lead 3；
The comb material tooth 7 and orientation tooth 8 are located at 6 homonymy of strip substrate and are oppositely arranged, and the strip substrate 6 is along length side
To both ends be respectively arranged with left and right handle 11,12, the upper end of the comb material tooth 7 has a hook portion 10 for stretching into long groove 9.
Above-mentioned left and right handle 11,12 and the angle of strip substrate 6 are 25 °.
Embodiment 2：A kind of highly-efficient processing device for diode component, the axialmode diode includes diode core
One end of piece 1, the first bronze medal lead 2, the second bronze medal lead 3, the first bronze medal lead 2 is connected to the diode core by scolding tin 4
The N pole-faces of piece 1, the other end of the first bronze medal lead 2 is as the axialmode diode input terminal；The one of the second bronze medal lead 3
End is connected to the P pole-faces of the diode chip for backlight unit 1 by scolding tin 4, and the other end of the second bronze medal lead 3 is as two pole of the axialmode
Pipe input terminal, one end that the diode chip for backlight unit 1,2 second bronze medal lead 3 of the first bronze medal lead are contacted with diode chip for backlight unit is by epoxy body
5 claddings；
The turnover device includes strip substrate 6, several comb material teeth 7 and several orientation teeth 8, several described comb material
Tooth 7 is located at the middle part of strip substrate 6 and inline along its length, several described orientation teeth 8 are located at strip substrate 6 one
Side and inline along its length, to form a long ditch between several comb material teeth 7 and several orientation teeth 8
Slot 9 has comb material inter-tooth slots 71 between adjacent comb material tooth 7, between adjacent orientation tooth 8 there are orientation inter-tooth slots 81, the comb to expect
Inter-tooth slots 71, the gap for orienting inter-tooth slots 81 are more than the diameter of the first bronze medal lead 2, the second bronze medal lead 3；
The comb material tooth 7 and orientation tooth 8 are located at 6 homonymy of strip substrate and are oppositely arranged, and the strip substrate 6 is along length side
To both ends be respectively arranged with left and right handle 11,12, the upper end of the comb material tooth 7 has a hook portion 10 for stretching into long groove 9.
Above-mentioned left and right handle 11,12 is located at 6 both sides of strip substrate with comb material tooth 7, orientation tooth 8.
Above-mentioned left and right handle 11,12 and the angle of strip substrate 6 are 30 °.
The above-mentioned highly-efficient processing device course of work for diode component is as follows：Comb material inter-tooth slots 71 are for fixing two poles
Pipe, long groove 9 are used to avoid die portions among diode, and 10 purpose of hook portion is can be with after turnover device rotation 180 degree
Diode is supported, diode is made not fall out, left and right handle 11,12 is convenient for manual operations.
It, can be by the diode being welded from graphite boat when using above-mentioned highly-efficient processing device for diode component
Upper comb, which gets up and rotates 180 degree material, will not fall down, to achieve the purpose that direct feeding.Week can be reduced by reaching the purpose
Change a job tool, improve man efficiency, reduce aluminum strip turnover process, improve product yield.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (1)
1. a kind of highly-efficient processing device for diode component, it is characterised in that：The diode component includes diode core
Piece（1）, the first bronze medal lead（2）, the second bronze medal lead（3）, the first bronze medal lead（2）One end pass through scolding tin（4）It is connected to institute
State diode chip for backlight unit（1）N pole-faces, the first bronze medal lead（2）The other end as the diode component input terminal；Described second
Copper lead（3）One end pass through scolding tin（4）It is connected to the diode chip for backlight unit（1）P pole-faces, the second bronze medal lead（3）It is another
End is used as the diode component input terminal, the diode chip for backlight unit（1）, the first bronze medal lead（2）With diode chip for backlight unit（1）Contact
One end, the second bronze medal lead（3）With diode chip for backlight unit（1）One end of contact is by epoxy body（5）Cladding；
The highly-efficient processing device includes strip substrate（6）, several comb material teeth（7）With several orientation teeth（8）, several institute
State comb material tooth（7）Positioned at strip substrate（6）Middle part and inline along its length, several described orientation teeth（8）Position
In strip substrate（6）A side and inline along its length, in several comb material teeth（7）With several orientations
Tooth（8）Between formed a long groove（9）, adjacent comb material tooth（7）Between have comb material inter-tooth slots（71）, adjacent orientation tooth（8）It
Between have orientation inter-tooth slots（81）, the comb material inter-tooth slots（71）, orientation inter-tooth slots（81）Gap draw more than first bronze medal
Line（2）, the second bronze medal lead（3）Diameter；
The comb expects tooth（7）With orientation tooth（8）Positioned at strip substrate（6）It homonymy and is oppositely arranged, the strip substrate（6）Along long
The both ends in degree direction are respectively arranged with left and right handle（11、12）, the comb material tooth（7）Upper end have and one stretch into long groove（9）
Hook portion（10）.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947526.4A CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201810255654.7A CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947151.1A CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201710947527.9A CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255573.7A CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
| CN201410802411.2A CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802411.2A CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
Related Child Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947151.1A Division CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201710947526.4A Division CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201710947527.9A Division CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255654.7A Division CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201810255573.7A Division CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104617014A CN104617014A (en) | 2015-05-13 |
| CN104617014B true CN104617014B (en) | 2018-09-07 |
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Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810255573.7A Active CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
| CN201710947527.9A Active CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201410802411.2A Active CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810255573.7A Active CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
| CN201710947527.9A Active CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
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| CN (6) | CN108461428B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128808B (en) * | 2019-12-30 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | Turnover tool for axial diode packaging process |
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| US4997792A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method for separation of diode array chips during fabrication thereof |
| CN201466010U (en) * | 2009-06-19 | 2010-05-12 | 常州新区佳讯电子器材有限公司 | Full-automatic diode gilling machine |
| CN102108479A (en) * | 2010-11-19 | 2011-06-29 | 程远山 | Method for tinning pins of plastics-sealed diodes and tinning device thereof |
| CN203266649U (en) * | 2013-04-10 | 2013-11-06 | 常州信息职业技术学院 | Mechanical arm device for carrying diodes integrally |
| CN203277327U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Material-combing strip for diode production |
| CN204632728U (en) * | 2014-12-22 | 2015-09-09 | 苏州固锝电子股份有限公司 | For the highly-efficient processing device of diode component |
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| JP4360595B2 (en) * | 2002-10-18 | 2009-11-11 | ペルノックス株式会社 | Photoelectric conversion device |
| US8183581B2 (en) * | 2008-05-13 | 2012-05-22 | Siemens Aktiengesellschsft | LED arrangement |
| KR101065724B1 (en) * | 2009-10-07 | 2011-09-19 | 주식회사 프로텍 | Bond head module for manufacturing led |
| CN201754503U (en) * | 2010-03-03 | 2011-03-02 | 苏州固锝电子股份有限公司 | Transient voltage suppressor |
| KR101141577B1 (en) * | 2010-07-07 | 2012-06-08 | (주)세미머티리얼즈 | Apparatus and method for plasma texturing of solar cell |
| CN102593283A (en) * | 2012-03-01 | 2012-07-18 | 溧阳通亿能源科技有限公司 | High light-efficiency LED (light-emitting diode) packaging preparation method |
| CN102646618A (en) * | 2012-04-12 | 2012-08-22 | 苏州固锝电子股份有限公司 | Dissecting process for diode device |
| CN202549817U (en) * | 2012-04-20 | 2012-11-21 | 常州信息职业技术学院 | Elastic hand grasping device for carrying diodes |
| CN103918066B (en) * | 2012-11-05 | 2016-08-24 | 日本精工株式会社 | Semiconductor module |
| CN203631492U (en) * | 2013-11-29 | 2014-06-04 | 如皋市大昌电子有限公司 | Axial diode SKY and GPP product rotating plate tooling |
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2014
- 2014-12-22 CN CN201810255573.7A patent/CN108461428B/en active Active
- 2014-12-22 CN CN201710947527.9A patent/CN107958863B/en active Active
- 2014-12-22 CN CN201810255654.7A patent/CN108630589B/en active Active
- 2014-12-22 CN CN201710947526.4A patent/CN107978547B/en active Active
- 2014-12-22 CN CN201410802411.2A patent/CN104617014B/en active Active
- 2014-12-22 CN CN201710947151.1A patent/CN107978546B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4997792A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method for separation of diode array chips during fabrication thereof |
| CN201466010U (en) * | 2009-06-19 | 2010-05-12 | 常州新区佳讯电子器材有限公司 | Full-automatic diode gilling machine |
| CN102108479A (en) * | 2010-11-19 | 2011-06-29 | 程远山 | Method for tinning pins of plastics-sealed diodes and tinning device thereof |
| CN203266649U (en) * | 2013-04-10 | 2013-11-06 | 常州信息职业技术学院 | Mechanical arm device for carrying diodes integrally |
| CN203277327U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Material-combing strip for diode production |
| CN204632728U (en) * | 2014-12-22 | 2015-09-09 | 苏州固锝电子股份有限公司 | For the highly-efficient processing device of diode component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107958863A (en) | 2018-04-24 |
| CN107978547A (en) | 2018-05-01 |
| CN108461428A (en) | 2018-08-28 |
| CN108630589B (en) | 2020-12-08 |
| CN107978546A (en) | 2018-05-01 |
| CN107958863B (en) | 2021-05-18 |
| CN107978546B (en) | 2020-08-07 |
| CN104617014A (en) | 2015-05-13 |
| CN108461428B (en) | 2020-12-08 |
| CN108630589A (en) | 2018-10-09 |
| CN107978547B (en) | 2020-03-24 |
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