CN104616996A - Manufacturing method of chip card substrate - Google Patents
Manufacturing method of chip card substrate Download PDFInfo
- Publication number
- CN104616996A CN104616996A CN201310543030.2A CN201310543030A CN104616996A CN 104616996 A CN104616996 A CN 104616996A CN 201310543030 A CN201310543030 A CN 201310543030A CN 104616996 A CN104616996 A CN 104616996A
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- CN
- China
- Prior art keywords
- copper foil
- glass fibre
- adhesive layer
- basal plate
- fibre basal
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Abstract
The invention provides a manufacturing method of a chip card substrate. The manufacturing method comprises a double-face adhesive pressing step, a punching step, a copper foil pressing step, an image transfer step, an electroplating step and a surface package step, wherein an adhesive layer is formed on the upper and lower surfaces of a glass fiber substrate respectively in the double-face adhesive pressing step; the structure after image transfer is electroplated in the electroplating step, so an electroplating layer is formed on the surface of a metal layer pattern formed by the copper foil; a package material is formed on the lower surface of the glass fiber substrate in the surface package step, so the package material and a hot melt film are combined with the glass fiber substrate through the adhesive layer; thus the adhesion of the glass fiber substrate and the package material as well as the hot melt film is improved, subsequent chip package is avoided, or falling after long-term use is avoided so as to improve the service cycle and the reliability of the integral chip card substrate.
Description
Technical field
The present invention relates to a kind of manufacture method of chip card substrate, especially all form adhesive layer the two-sided of glass fibre basal plate, to promote overall life cycle and reliability.
Background technology
Consulting Fig. 1, is the flow chart of the manufacture method of prior art chip card substrate.As shown in Figure 1, the manufacture method S100 of prior art chip card substrate comprises polish-brush step S10, moulding step S15, punching step S30, pressure Copper Foil step S40, image transfer step S50, plating step S60, and surface encapsulation step S70.Above step illustrates coordinating the progressively generalized section of Fig. 2 A to Fig. 2 K.As shown in Figure 2 A, polish-brush step S10 be with polish-brush mode make glass fibre basal plate 10 upper surface and lower surface at least one of them, form rough surface 15.As shown in Figure 2 B, moulding step S15 forms an adhesive layer 20 at the upper surface of glass fibre basal plate 10.
As shown in Figure 2 C, punching step S30 is formed to run through at least one through hole 25 of this glass fibre basal plate 10 and this adhesive layer 20, with as via, or registration holes.As shown in Figure 2 D, pressure Copper Foil step S40 presses an attached Copper Foil 30 on the upper surface of glass fibre basal plate 10, and suitably toasts, and this Copper Foil 30 is combined as a whole with this glass fibre basal plate 10 through this adhesive layer 20.
Shown in Fig. 2 E to Fig. 2 H, image transfer step S50 be included in this Copper Foil 30 formed photoresist layer 35, with expose and develop make this photoresist layer 35 formed photoresistance pattern 37, etching not cover by photoresistance pattern 37 Copper Foil 30 part, make Copper Foil 30 form metal layer pattern 39, and divest photoresistance pattern 37.As shown in figure 2i, plating step S60 electroplates completing the structure after image transfer, and makes the surface of this metal layer pattern 39, all forms an electrodeposited coating 40.
As shown in Fig. 2 J and Fig. 2 K, surface encapsulation step S70 is a lower surface encapsulated moulding material (MoldingCompound) 50 and a hot melt film (Hot Melt Film) 55 being formed in order glass fibre basal plate 10, and this hot melt film 55 is around this encapsulated moulding material 50, and complete chip card substrate.Chip card substrate and chip join also attach to after on paper card, can use as chip financial products such as existing credits card.
The bottleneck that prior art faces mainly is, due to before the credit card that completes, still have the step such as pressing, connection, in prior art often in those steps, or after user uses a period of time, there is the phenomenon that hot melt film 55 and this encapsulated moulding material 50 come off, and overall reliability is reduced, therefore, need a kind of problem that can solve prior art, and promote the method for reliability.
Summary of the invention
Main purpose of the present invention is the manufacture method providing a kind of chip card substrate, and the method comprises two-sided moulding step, punching step, pressure Copper Foil step, image transfer step, plating step, and surface encapsulation step.Two-sided moulding step is the upper and lower surface at glass fibre basal plate, each formation one adhesive layer.Punching step forms at least one through hole of running through this glass fibre basal plate and described adhesive layer with as via, or registration holes.Pressure Copper Foil step presses attached Copper Foil on the upper surface of glass fibre basal plate, and suitably toast, and this Copper Foil is combined as a whole through this adhesive layer and this glass fibre basal plate.
Image transfer step utilizes and forms photoresistance, exposure, development and etching, makes Copper Foil form metal layer pattern.Plating step is electroplated completing the structure after image transfer, and make the surface of this metal layer pattern, all forms an electrodeposited coating, and this electrodeposited coating comprises one of them of gold, silver, nickel, cobalt, palladium and alloy thereof.Surface encapsulation step is lower surface encapsulated moulding material and hot melt film being formed in glass fibre basal plate, this encapsulated moulding material and this hot melt film are combined as a whole through adhesive layer and this glass fibre basal plate, and this hot melt film is around this encapsulated moulding material, and complete chip card substrate of the present invention.All adhesive layer is formed by the upper and lower surface of glass fibre basal plate, and the tackness of glass fibre basal plate and encapsulated moulding material and hot melt film can be improved, avoid at follow-up chip package, or come off after Long-Time Service, thus improve life cycle and the reliability of overall chip card substrate.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of prior art chip card substrate;
Fig. 2 A to Fig. 2 K is the progressively generalized section of the manufacture method of prior art chip card substrate;
Fig. 3 is the flow chart of the manufacture method of chip card substrate of the present invention; And
Fig. 4 A to Fig. 4 K is the progressively generalized section of the manufacture method of chip card substrate of the present invention.
Wherein, description of reference numerals is as follows:
10 glass fibre basal plates
15 rough surfaces
20 adhesive layer
25 through holes
30 Copper Foils
35 photoresist layers
37 photoresistance patterns
39 metal pattern layer
40 electrodeposited coatings
50 encapsulated moulding materials
55 hot melt films
The manufacture method of S1 chip card
S10 polish-brush step
S15 moulding step
The two-sided moulding step of S20
S25 maturation stage
S30 punching step
S40 presses Copper Foil step
The surface flattening step of S45
S50 image transfer step
S60 plating step
S70 surface encapsulation step
The manufacture method of S100 chip card
Embodiment
Below coordinate graphic and element numbers to do more detailed description to embodiments of the present invention, can implement according to this with reference to specification word to make those skilled in the art.
Consulting Fig. 3, is the flow chart of the manufacture method of chip card substrate of the present invention.As shown in Figure 3, the manufacture method S1 of chip card substrate of the present invention comprises two-sided moulding step S20, punching step S30, pressure Copper Foil step S40, image transfer step S50, plating step S60, and surface encapsulation step S70.Above step illustrates coordinating the progressively generalized section of Fig. 4 A to Fig. 4 K.As shown in Figure 4 A, two-sided moulding step S20 is the upper and lower surface at glass fibre basal plate 10, and each formation one adhesive layer 20, the thickness of this glass fibre basal plate 10 is 90 ~ 130 μm, and the thickness of this adhesive layer 20 is 5 ~ 20 μm.As shown in Figure 4 B, punching step S30 is formed to run through at least one through hole 25 of this glass fibre basal plate 10 and described adhesive layer 20, with as via, or registration holes.Further, between two-sided moulding step S20, punching step S30, comprise a maturation stage S25 further, this maturation stage S25 is with mode of heating at least one times, makes adhesive layer 20 slaking, and mobility declines.
As shown in Figure 4 C, pressure Copper Foil step S40 presses an attached Copper Foil 30 on the upper surface of glass fibre basal plate 10, and suitably toast, this Copper Foil 30 is combined as a whole with this glass fibre basal plate 10 through this adhesive layer 20, and the thickness of this Copper Foil 30 is 35 ~ 60 μm.Shown in Fig. 4 F to Fig. 4 H, image transfer step S50 is with image transfer method, Copper Foil 30 is formed as metal pattern layer 39, be included in detail this Copper Foil 30 formed photoresist layer 35, with expose and develop make this photoresist layer 35 formed photoresistance pattern 37, etching not cover by photoresistance pattern 37 Copper Foil 30 part, make Copper Foil 30 form metal layer pattern 39, and divest photoresistance pattern 37.Further, simultaneously with reference to figure 3 and Fig. 4 D before or after image transfer step S50, also comprise a surface flattening step S45, this surface flattening step S45 is in the mode of chemical microetch, makes the surface being exposed to through hole 25 of Copper Foil 30 become smooth.
As shown in fig. 41, plating step S60 electroplates completing the structure after image transfer, and make the surface of this metal layer pattern 39, all form an electrodeposited coating 40 to promote effect anti-oxidant, against corrosion, this electrodeposited coating 40 comprises one of them of gold, silver, nickel, cobalt, palladium and alloy thereof.As shown in Fig. 4 J and Fig. 4 K, surface encapsulation step S70 is a lower surface encapsulated moulding material 50 and a hot melt film 55 being formed in order glass fibre basal plate 10, and suitably toast, this encapsulated moulding material 50 is combined as a whole through adhesive layer 20 and this glass fibre basal plate 10 with this hot melt film 55, and this hot melt film 55 is around this encapsulated moulding material 50, and complete chip card substrate of the present invention, wherein encapsulated moulding material 50 can be a resin or an illumination curing glue, chip card substrate and chip join also attach to after on paper card, can use as chip financial products such as existing credits card.
Technical characteristics of the present invention is, utilize and all form adhesive layer 20 in the upper and lower surface of glass fibre basal plate, and the tackness of glass fibre basal plate and this encapsulated moulding material 50 and this hot melt film 55 can be improved, avoid at follow-up chip package, or come off after Long-Time Service, thus improve life cycle and the reliability of overall chip card substrate.
As described above is only to explain preferred embodiment of the present invention; not attempt does any pro forma restriction to the present invention according to this; therefore, all have any modification for the present invention or the change done under identical invention spirit, all must be included in the category that the invention is intended to protect.
Claims (7)
1. a manufacture method for chip card substrate, is characterized in that, comprises:
One two-sided moulding step, at a upper surface and a lower surface of a glass fibre basal plate, each formation one adhesive layer;
One punching step, forms at least one through hole running through this glass fibre basal plate and described adhesive layer;
One pressure Copper Foil step, this upper surface of this glass fibre basal plate presses an attached Copper Foil, and baking makes this Copper Foil be combined with this glass fibre basal plate through this adhesive layer;
One image transfer step, by an image transfer mode, makes this Copper Foil be formed as a metal layer pattern;
One plating step, electroplates the structure after completing this image transfer step, and makes the surface of this metal layer pattern form an electrodeposited coating; And
One surface encapsulation step, one encapsulated moulding material and hot melt film are formed in order this lower surface of this glass fibre basal plate, and baking makes this encapsulated moulding material be combined with this glass fibre basal plate through adhesive layer with this hot melt film, and this hot melt film is around this encapsulated moulding material
Wherein this electrodeposited coating comprises one of them of gold, silver, nickel, cobalt, palladium and alloy thereof.
2. the method for claim 1, is characterized in that, the thickness of this glass fibre basal plate is 90 ~ 130 μm, and the thickness of described adhesive layer is 5 ~ 20 μm.
3. the method for claim 1, it is characterized in that, between this two-sided moulding step and this punching step, comprise a maturation stage further, this maturation stage utilizes mode heat aging at least one times, make this adhesive layer slaking, and the mobility of this adhesive layer is reduced.
4. the method for claim 1, it is characterized in that, this image transfer mode be included in this Copper Foil formed a photoresist layer, with expose and develop make this photoresist layer formed a photoresistance pattern, etching not the Copper Foil part that covers by this photoresistance pattern, make Copper Foil form metal layer pattern, and divest this photoresistance pattern.
5. the method for claim 1, is characterized in that, comprises a surface flattening step, utilizes the mode of a chemical microetch, makes the surface being exposed to this through hole of this Copper Foil become smooth.
6. method as claimed in claim 4, is characterized in that, this surface coarsening step makes the upper surface of this Copper Foil form rough surface further.
7. the method for claim 1, is characterized in that, this encapsulated moulding material is a resin or an illumination curing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310543030.2A CN104616996A (en) | 2013-11-05 | 2013-11-05 | Manufacturing method of chip card substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310543030.2A CN104616996A (en) | 2013-11-05 | 2013-11-05 | Manufacturing method of chip card substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104616996A true CN104616996A (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310543030.2A Pending CN104616996A (en) | 2013-11-05 | 2013-11-05 | Manufacturing method of chip card substrate |
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| CN (1) | CN104616996A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349599A (en) * | 2020-11-10 | 2021-02-09 | 南方电网科学研究院有限责任公司 | Manufacturing method of chip substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060131067A1 (en) * | 2004-12-20 | 2006-06-22 | Hyung-Jik Byun | PCB, manufacturing method thereof and semiconductor package implementing the same |
| CN101887869A (en) * | 2009-05-13 | 2010-11-17 | 日月光半导体制造股份有限公司 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| WO2013032277A2 (en) * | 2011-09-02 | 2013-03-07 | Lg Innotek Co., Ltd. | Method of manufacturing substrate for chip packages and method of manufacturing chip package |
-
2013
- 2013-11-05 CN CN201310543030.2A patent/CN104616996A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060131067A1 (en) * | 2004-12-20 | 2006-06-22 | Hyung-Jik Byun | PCB, manufacturing method thereof and semiconductor package implementing the same |
| CN101887869A (en) * | 2009-05-13 | 2010-11-17 | 日月光半导体制造股份有限公司 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| WO2013032277A2 (en) * | 2011-09-02 | 2013-03-07 | Lg Innotek Co., Ltd. | Method of manufacturing substrate for chip packages and method of manufacturing chip package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349599A (en) * | 2020-11-10 | 2021-02-09 | 南方电网科学研究院有限责任公司 | Manufacturing method of chip substrate |
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Application publication date: 20150513 |