A kind of high adhesion force conductive silver paste
Technical field
A kind of the invention belongs to conductive silver paste field, more particularly to high adhesion force conductive silver paste.
Background technology
Slug type conductive silver slurry needs to sinter film forming, sintering temperature>500 DEG C, glass dust or oxide are used as bonding phase.
Silver powder is according to particle size classification, average grain diameter<0.1 μm (100nm) is nano-silver powder;0.1μm<Dav (average grain diameter)<10.0 μm it is
Micro silver powder;Dav (average grain diameter)>10.0 μm is raw Ag powder.The preparation method of powder has a lot, for silver, once can adopt
Physical (plasma, atomization), chemical method (silver nitrate thermal decomposition method, liquid-phase reduction).As silver is noble metal, easily it is reduced
And elemental stage is returned to, therefore liquid phase reduction is the topmost method for preparing silver powder at present.Will silver salt (silver nitrate etc.)
Soluble in water, add chemical reducing agent (such as hydrazine hydrate etc.), deposit silver powder, through washing, dry and obtain silver-colored reduced powder, put down
Between 0.1-10.0 μm, the selection of reducing agent, the control of reaction condition, the use of interfacial agent can be prepared particle diameter
Micro silver powder (particle shape, degree of scatter, average grain diameter and particle diameter distribution, specific surface area, the pine dress of different physicochemical characteristics
Density, tap density, grain size, crystallinity etc.), (ball milling etc.) is machined to reduced powder can be obtained Bright Silver Powder
(polished silver powder), flake silver powder (silver flake).
Content of the invention
It is an object of the invention to provide a kind of high adhesion force conductive silver paste.
The present invention is adopted the following technical scheme that to achieve these goals:
A kind of high adhesion force conductive silver paste, it is characterised in which is obtained by the raw material of following weight parts:Silver powder 55-
70th, dimethyl silicone polymer 0.8-1.0, amyl acetate 2-3, acetylacetone,2,4-pentanedione silver 2-5, C5 Petropols 2-4, polyester resin 5-
15th, dimethyl azelate 1-2, tetraethyl orthosilicate 0.3-0.6, isopropanol 18-22, modified glass powder 15-30, isophorone 10-
12nd, butyl stearate 0.8-1.2;
Modified glass powder is obtained by the raw material of following weight parts:Waste glass powder 10-15, Na2O 6-10,K2O 10-12、
Co2O310-12、SnO 2-4、Na3AlF64-8、TiO24-8, sodium aluminate 1-2, Tissuemat E 2-4, chlorinated paraffin 1-2, alkyl
Benzene sulfonic acid sodium salt 2-4, sodium metasilicate 3-5, turkey red oil 0.1-0.2, sodium hydrogensulfite 1-2, lecithin 1-2, deionized water
100-150;
The preparation method of described modified glass powder is:
(1) sodium aluminate, Tissuemat E, chlorinated paraffin and deionized water are added in reactor, 300-400 rev/min is stirred
Mix uniform, add sodium alkyl benzene sulfonate, sodium metasilicate, turkey red oil, sodium hydrogensulfite, lecithin, be warming up to 130-150
DEG C, stir under 200-500rpm, obtain modification liquid;
(2) waste glass powder and remaining raw material mix sintering, and sintering temperature is 1200-1400 DEG C, and the time is that 0.5-2 is little
When, obtain glass melt, quenching, ball milling, drying, sieve to obtain 10-15 μm of glass dust;
(3) by glass dust and modification liquid, mixing, at 50-60 DEG C, 3-5 hours are stirred, stand 7-8 hours, suction filtration is dried,
Obtain final product.
A kind of described high adhesion force conductive silver paste, it is characterised in that:Preparation method is comprised the following steps:
(1), dimethyl silicone polymer, C5 Petropols, polyester resin, dimethyl azelate, tetraethyl orthosilicate, isopropyl
Alcohol, isophorone, butyl stearate stir 30-50min under 40-50 DEG C, 45-60 rev/min, obtain organic carrier standby;
(2), modified glass powder is added in organic carrier, stirring is mixed, adds remaining raw material, mix 2-3 hours,
Obtain slurry;
(3), slurry ball milling, is ground to slurry fineness less than 10 μm, obtains final product after adjusting viscosity.
Beneficial effects of the present invention:
The addition of each additive is so that silver powder, powdered graphite in conductive silver paste can be divided after adding well
Dissipate, improve adding for the electric conductivity of conductive silver paste, C5 Petropols etc. and the present invention can be caused good with the adhesive force of substrate.
Specific embodiment
A kind of high adhesion force conductive silver paste, its are obtained by the raw material of following weight (kg):
Silver powder 60, dimethyl silicone polymer 0.8, amyl acetate 2, acetylacetone,2,4-pentanedione silver 2, C5 Petropols 4, polyester resin
8th, dimethyl azelate 1, tetraethyl orthosilicate 0.3, isopropanol 22, modified glass powder 20, isophorone 12, butyl stearate 0.8;
Modified glass powder is obtained by the raw material of following weight (kg):Waste glass powder 15, Na2O 10,K2O 12、Co2O310、
SnO 2-4、Na3AlF68、TiO26th, sodium aluminate 1, Tissuemat E 4, chlorinated paraffin 2, sodium alkyl benzene sulfonate 4, sodium metasilicate 3,
Turkey red oil 0.1, sodium hydrogensulfite 1, lecithin 2, deionized water 150;
The preparation method of described modified glass powder is:
(1) sodium aluminate, Tissuemat E, chlorinated paraffin and deionized water are added in reactor, 400 revs/min of stirrings are
Even, add sodium alkyl benzene sulfonate, sodium metasilicate, turkey red oil, sodium hydrogensulfite, lecithin, be warming up to 150 DEG C,
Stir under 500rpm, obtain modification liquid;
(2) waste glass powder and remaining raw material mix sintering, and sintering temperature is 1300 DEG C, and the time is 0.5 hour, obtains glass
Glass molten mass, quenching, ball milling, drying, sieve to obtain 10-15 μm of glass dust;
(3) by glass dust and modification liquid, mixing, stir 5 hours at 60 DEG C, stand 7 hours, suction filtration is dried, and is obtained final product.
A kind of described high adhesion force conductive silver paste, preparation method are comprised the following steps:
(1), dimethyl silicone polymer, C5 Petropols, polyester resin, dimethyl azelate, tetraethyl orthosilicate, isopropyl
Alcohol, isophorone, butyl stearate stir 50min under 50 DEG C, 60 revs/min, obtain organic carrier standby;
(2), modified glass powder is added in organic carrier, stirring is mixed, adds remaining raw material, mixed 3 hours, obtain
Arrive slurry;
(3), slurry ball milling, is ground to slurry fineness less than 10 μm, obtains final product after adjusting viscosity.
Silver paste is printed on 125mm × 125mm Si substrates using screen process press, then in 180 DEG C of dryings, then
880 DEG C carry out quick fired electrodes lead, and the contact conductor surface silvery white that makes after high temperature sintering, smooth zero defect are peeled off strong
14.6 N/cm are spent, soldering is functional, sheet resistance < 10Siements/sq, the solar cell photoelectric transformation efficiency of preparation is
22.3%, tensile test result is adhesive force>15.2N/mm2.