CN104607256A - Plasma auxiliary thermo-compression bonding micro-fluidic chip and preparation method thereof - Google Patents
Plasma auxiliary thermo-compression bonding micro-fluidic chip and preparation method thereof Download PDFInfo
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- CN104607256A CN104607256A CN201410853042.XA CN201410853042A CN104607256A CN 104607256 A CN104607256 A CN 104607256A CN 201410853042 A CN201410853042 A CN 201410853042A CN 104607256 A CN104607256 A CN 104607256A
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Abstract
The invention relates to a plasma auxiliary thermo-compression bonding micro-fluidic chip and a preparation method thereof. The preparation method comprises the following steps: respectively performing plasma treatment on a substrate and a cover plate, so as to form a first activated layer on the surface of the substrate, and form a second activated layer on the surface of the cover plate; performing thermo-compression bonding on the substrate and the cover plate through the first activated layer and the second activated layer, thereby obtaining the micro-fluidic chip. By adopting the preparation method provided by the invention, the bonding process parameters, namely, the bonding temperature and the bonding time can be reduced, the production efficiency and the pass percent of thermal bonding can be remarkably improved, the bonding intensity is 3-5 times of that of direct thermal bonding, and the deformation of a micro structure is remarkably reduced when being compared with that of direct thermal bonding.
Description
Technical field
The present invention relates to bioscience micro-total analysis system (Micro Total Analysis System, μ-TAS) technical field, particularly relate to a kind of plasma-assisted heat pressure bonding micro-fluidic chip and preparation method thereof.
Background technology
Micro-fluidic chip refers to, by micro-processing technology and other processing method, a biological or chemical laboratory micro is only had several square centimeters of large thin slices to one piece.The chemistry built on one chip or biology laboratory can by sample preparation, the reaction involved by chemistry and biological field, be separated, detection, cell chulture, sorting, the basic operation unit such as cracking carry out integrated.Finally, above-mentioned operating unit can be integrated on the chip of a piece very little, forms network, run through whole system with controlled fluid by microchannel, in order to realize the various functions of conventional chemical or biology laboratory.
In the facture of microchip of current thermoplastic polymer, most popular bonding method is that direct hot key is legal, its main technique puts into heating chamber after being coordinated with cover plate by substrate, then utilize heater substrate and cover plate to heat, meanwhile certain pressure is applied to it.When material is heated near vitrification point Tg and pressure reaches the bonding pressure of setting, enter the heat-insulation pressure keeping stage.In this process, owing to being subject to higher temperature and external pressure effect, device surface fits tightly, and intermolecular force constantly strengthens.After heat-insulation pressure keeping a period of time, start substrate and cover plate cooling, when temperature is reduced to below the Tg of material, the pressure on unloading chip, final substrate and cover plate can realize bonding under surface molecular intermolecular forces.
The legal characteristic not changing micro-structure surface of direct hot key, does not introduce other material yet, so micro-structure surface uniformity.But, the deflection of bond strength and micro-structural is the contradiction being difficult to take into account in this process, because the high power of the spacing of intermolecular force and contact interface is inversely proportional to, therefore only under higher temperature and pressure, two interfaces can produce stronger interaction force between polymer molecule, and obtain the bonding of high strength.But temperature, hypertonia then easily cause microchannel deflection excessive, also can cause substrate bulk deformation and bonding residual stress excessive.The time of device power-up preheating and bonding is all long in addition, and after thermocompression bonding, the organic matter on micro-fluidic chip can be attached on heat block or pad, not easy cleaning.
Summary of the invention
The object of the invention is, by plasma treatment thermoplasticity micro-fluidic chip, the condition of thermocompression bonding can be reduced, and can bond strength be improved, significantly reduce microchannel deflection, thus assist the large-scale production of thermocompression bonding.
First aspect, the invention provides the preparation method of a kind of plasma-assisted heat pressure bonding micro-fluidic chip, described method comprises: carry out plasma treatment respectively to substrate and cover plate, make the surface of described substrate form the first active layer, and the surface of described cover plate forms the second active layer; Utilize described first active layer and described second active layer to carry out thermocompression bonding to described substrate and described cover plate, obtain described micro-fluidic chip.
Preferably, the material of described substrate and cover plate is thermoplastic polymer.
Preferably, the gas of described plasma treatment is O
2or the O of volume ratio 1:1
2/ N
2mist, power is 50W-100W, and the processing time is 1 minute-3 minutes, and gas flow rate is 100sccm-400sccm.
Preferably, the temperature of described thermocompression bonding is 80 DEG C-100 DEG C, and pressure is 1Mpa-5Mpa, and the time is 5 minutes-15 minutes.
Preferably, describedly utilize described first active layer and described second active layer to carry out thermocompression bonding to described substrate and described cover plate to be specially:
Described substrate and described cover plate are put into hot-press equipment, and described first active layer is aimed at described second active layer;
Utilize described hot-press equipment, described first active layer and described second active layer are fit together, and apply pressure under preset temperature, thus realize the thermocompression bonding of described substrate and described cover plate.
Preferably, described substrate comprises groove; After described thermocompression bonding, between described substrate and described cover plate, form microchannel by described groove.
Second aspect, micro-fluidic chip prepared by the preparation method that the invention provides a kind of plasma-assisted heat pressure bonding micro-fluidic chip as described in above-mentioned first aspect.
The invention provides a kind of plasma-assisted heat pressure bonding micro-fluidic chip and preparation method thereof, in pretreatment link before micro-fluidic chip bonding, utilize plasma modification technology to carry out plasma treatment to micro-fluidic chip surface in plasma machine cavity, enter in hot press after improving chip surface activity and realize bonding.Method provided by the invention reduces bonding temperature and time in bonding technology parameter, significantly improves the production efficiency of thermal bonding, and bond strength is 3-5 times of direct thermal bonding, and the deflection of micro-structural significantly reduces than direct thermal bonding.
Accompanying drawing explanation
Preparation method's flow chart of the plasma-assisted heat pressure bonding micro-fluidic chip that Fig. 1 provides for the embodiment of the present invention one;
Preparation method's schematic diagram of the plasma-assisted heat pressure bonding micro-fluidic chip that Fig. 2 provides for the embodiment of the present invention one;
Preparation method's schematic diagram of the plasma-assisted heat pressure bonding micro-fluidic chip that Fig. 3 provides for the embodiment of the present invention one;
Preparation method's schematic diagram of the plasma-assisted heat pressure bonding micro-fluidic chip that Fig. 4 provides for the embodiment of the present invention one;
The micro-fluidic chip profile that Fig. 5 provides for the embodiment of the present invention four.
Detailed description of the invention
Below by drawings and Examples, technical scheme of the present invention is described in further detail.Should be understood to these embodiments be only used for specifically describing more in detail, but be not intended to limit the scope of the invention.
Embodiment one
Preparation method's flow chart of the plasma-assisted heat pressure bonding micro-fluidic chip that Fig. 1 provides for the embodiment of the present invention one, as shown in Figure 1, described method comprises:
S110, carries out plasma treatment respectively to substrate and cover plate, make the surface of described substrate form the first active layer, and the surface of described cover plate forms the second active layer.
Concrete, substrate and cover plate bonding face are put into plasma processor upward, make the surface of described substrate form the first active layer, and the surface of described cover plate forms the second active layer, as shown in Figure 2.
Concrete, the material of described substrate and cover plate is thermoplastic polymer.Such as, polymethyl methacrylate (polymethylmethacrylate, PMMA), Merlon (Polycarbonate, PC), cyclic olefin polymer (Cyclo-olefin polymer, COP) etc.
Concrete, the gas of described plasma treatment is O
2or the O of volume ratio 1:1
2/ N
2mist, power is 50W-100W, and the processing time is 1 minute-3 minutes, and gas flow rate is 100sccm-400sccm.
S120, utilizes described first active layer and described second active layer to carry out thermocompression bonding to described substrate and described cover plate, obtains described micro-fluidic chip.
Concrete, described substrate and described cover plate are put into hot-press equipment, and described first active layer is aimed at described second active layer, as shown in Figure 3; Utilize described hot-press equipment, described first active layer and described second active layer are fit together, and apply pressure under preset temperature, thus realize the thermocompression bonding of described substrate and described cover plate, obtain described micro-fluidic chip, as shown in Figure 4.
Concrete, the temperature of described thermocompression bonding is 80 DEG C-100 DEG C, and pressure is 1Mpa-5Mpa, and the time is 5 minutes-15 minutes.
Concrete, described substrate comprises groove; After described thermocompression bonding, between described substrate and described cover plate, form microchannel by described groove.
The preparation method of the plasma-assisted heat pressure bonding micro-fluidic chip that the present embodiment provides, in pretreatment link before micro-fluidic chip bonding, utilize plasma modification technology to carry out plasma treatment to micro-fluidic chip surface in plasma machine cavity, enter in hot press after improving chip surface activity and realize bonding.The method that the present embodiment provides reduces bonding temperature and time in bonding technology parameter, significantly improves the production efficiency of thermal bonding, and bond strength is 3-5 times of direct thermal bonding, and the deflection of micro-structural significantly reduces than direct thermal bonding.
The technical scheme provided for a better understanding of the present invention, the following detailed process preparing micro-fluidic chip with multiple instantiation preparation method that application the above embodiment of the present invention provides respectively, and performance.
Embodiment two
A preparation method for PC plasma-assisted heat pressure bonding micro-fluidic chip, step is as follows:
1, PC substrate and cover plate specification are 37.5*25*0.6mm, and plasma treatment gas is chosen as the O of volume ratio 1:1
2/ N
2mist, puts into plasma processor upward by the substrate of PC chip and cover plate bonding face.
2, arranging plasma treatment power is 50W, plasma treatment time 2 minutes, and gas flow rate is that 200sccm passes in processor, carries out surface activation process to the substrate of chip and cover plate.
3, to after chip plasma treatment, the substrate of chip and cover plate are aimed at and fits together up and down, put into thermocompression bonding machine, hot compression parameters temperature 100 DEG C is set, pressure 3Mpa, time 10min.
4, take out sample after to test, obtain groove width rate of change below 3% by the test of 3D microscope, after destroying chip, obtain gash depth rate of change below 10% by step instrument test.
Embodiment three
A preparation method for PMMA plasma-assisted heat pressure bonding micro-fluidic chip, step is as follows:
1, PMMA substrate and cover plate specification are 45*37*0.6mm, and plasma gas is chosen as O
2, the substrate of PMMA chip and cover plate bonding face are put into plasma processor upward.
2, arranging plasma treatment power is 100W, plasma treatment time 1 minute, and gas flow rate is that 300sccm passes in processor, carries out surface activation process to PMMA chip substrate and cover plate.
3, after chip plasma treatment, the substrate of chip and cover plate are aimed at and fits together up and down, put into thermocompression bonding machine, hot compression parameters temperature 80 DEG C is set, pressure 1Mpa, time 5min.
4, after take out sample and test, obtaining groove width rate of change below 2% by the test of 3D microscope, after destroying chip, obtaining gash depth rate of change below 10% by step instrument test.
Above embodiment be premised on technical solution of the present invention under, the detailed enforcement material component provided and concrete preparation process, but protection scope of the present invention is not limited to above-described embodiment.
Embodiment four
The micro-fluidic chip that the present embodiment provides presses the preparation method of bonding micro-fluidic chip to be prepared from by the plasma-assisted heat in embodiment one, the micro-fluidic chip profile that Fig. 5 provides for the embodiment of the present invention four, as shown in Figure 5, described micro-fluidic chip comprises: cover plate 1, substrate 2.
Cover plate 1 and substrate 2 are after plasma treatment, and surface forms active layer, is bonded together in hot-press equipment after treatment, form micro-fluidic chip.Substrate 2 is provided with groove, between substrate 2 and cover plate 1, forms microchannel by groove 3.
It should be noted that, although present invention has been description to a certain degree, significantly, under the condition not departing from the spirit and scope of the present invention, can carry out the suitable change of each condition.Can be understood as and the invention is not restricted to described embodiment, and be attributed to the scope of claim, it comprises the equivalent replacement of described each factor.
Above-described detailed description of the invention; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only the specific embodiment of the present invention; the protection domain be not intended to limit the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a preparation method for plasma-assisted heat pressure bonding micro-fluidic chip, it is characterized in that, described preparation method comprises:
Respectively plasma treatment is carried out to substrate and cover plate, make the surface of described substrate form the first active layer, and the surface of described cover plate forms the second active layer;
Utilize described first active layer and described second active layer to carry out thermocompression bonding to described substrate and described cover plate, obtain described micro-fluidic chip.
2. preparation method according to claim 1, is characterized in that, the material of described substrate and cover plate is thermoplastic polymer.
3. preparation method according to claim 1, is characterized in that, the gas of described plasma treatment is O
2or the O of volume ratio 1:1
2/ N
2mist, power is 50W-100W, and the processing time is 1 minute-3 minutes, and gas flow rate is 100sccm-400sccm.
4. preparation method according to claim 1, is characterized in that, the temperature of described thermocompression bonding is 80 DEG C-100 DEG C, and pressure is 1Mpa-5Mpa, and the time is 5 minutes-15 minutes.
5. preparation method according to claim 1, is characterized in that, describedly utilizes described first active layer and described second active layer to carry out thermocompression bonding to described substrate and described cover plate to be specially:
Described substrate and described cover plate are put into hot-press equipment, and described first active layer is aimed at described second active layer;
Utilize described hot-press equipment, described first active layer and described second active layer are fit together, and apply pressure under preset temperature, thus realize the thermocompression bonding of described substrate and described cover plate.
6. preparation method according to claim 1, is characterized in that, described substrate comprises groove;
After described thermocompression bonding, between described substrate and described cover plate, form microchannel by described groove.
7. micro-fluidic chip prepared by the preparation method as described in a claim as arbitrary in the claims 1-6.
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772120A (en) * | 2016-03-07 | 2016-07-20 | 北京同方生物芯片技术有限公司 | Batched bonding packaging method for polymeric biochips and positioning device |
| CN106391151A (en) * | 2016-08-31 | 2017-02-15 | 清华大学 | Manufacturing method of multilayer microfluidic chip suitable for batch production |
| CN106475158A (en) * | 2016-10-17 | 2017-03-08 | 首都师范大学 | Micro-fluidic chip for transmission-type terahertz time-domain spectroscopy system and manufacture method |
| CN106783645A (en) * | 2016-11-29 | 2017-05-31 | 东莞市广信知识产权服务有限公司 | A kind of method of diamond and GaN wafer Direct Bondings |
| CN107785287A (en) * | 2016-08-31 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | Bonding apparatus and method |
| CN108080045A (en) * | 2017-12-27 | 2018-05-29 | 北京百奥芯科技有限公司 | A kind of hydrophilically modified method of fluid channel inside micro-fluidic chip |
| CN108162368A (en) * | 2017-12-27 | 2018-06-15 | 北京百奥芯科技有限公司 | A kind of thermal bonding method of control plastic chip and the chip obtained |
| CN108562736A (en) * | 2018-01-03 | 2018-09-21 | 兰州大学 | Immunoassay device based on microwell array chip and Intelligent mobile equipment and method |
| CN109926112A (en) * | 2019-04-10 | 2019-06-25 | 中南大学 | The layered manufacturing method of three-dimensional microstructures polymeric micro-fluidic chip |
| CN110293687A (en) * | 2019-06-05 | 2019-10-01 | 大连理工大学 | A kind of more menifold plate bonding methods of polyetherimide |
| CN112569881A (en) * | 2020-07-24 | 2021-03-30 | 苏州恒瑞宏远医疗科技有限公司 | Reaction device and processing method thereof |
| CN115283030A (en) * | 2022-08-03 | 2022-11-04 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | Bonding method of polymer microfluidic chip and polymer microfluidic chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484021A (en) * | 2003-05-15 | 2004-03-24 | 厦门大学 | Low vacunm bonding method of polydimethylsiloxane chip |
| US20100175999A1 (en) * | 2007-01-16 | 2010-07-15 | David Barlow | Microfluidic device |
| CN102701145A (en) * | 2012-05-04 | 2012-10-03 | 南京大学 | Method for irreversible bonding of high-quality polydimethylsiloxane (PDMS)-polyolefine plastics |
| CN102910578A (en) * | 2012-11-07 | 2013-02-06 | 中国科学院上海微***与信息技术研究所 | Method for bonding silicon-based chip and PDMS (Polydimethylsiloxane) chip by adopting hybrid plasma |
| CN103394382A (en) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | Microfluidic chip with optical filtering characteristics |
-
2014
- 2014-12-31 CN CN201410853042.XA patent/CN104607256A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484021A (en) * | 2003-05-15 | 2004-03-24 | 厦门大学 | Low vacunm bonding method of polydimethylsiloxane chip |
| US20100175999A1 (en) * | 2007-01-16 | 2010-07-15 | David Barlow | Microfluidic device |
| CN102701145A (en) * | 2012-05-04 | 2012-10-03 | 南京大学 | Method for irreversible bonding of high-quality polydimethylsiloxane (PDMS)-polyolefine plastics |
| CN102910578A (en) * | 2012-11-07 | 2013-02-06 | 中国科学院上海微***与信息技术研究所 | Method for bonding silicon-based chip and PDMS (Polydimethylsiloxane) chip by adopting hybrid plasma |
| CN103394382A (en) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | Microfluidic chip with optical filtering characteristics |
Non-Patent Citations (2)
| Title |
|---|
| 曾戎等编著: "《生物医用仿生高分子材料》", 31 October 2010 * |
| 朱学林等: "一种PMMA表面改性的热压键合方法研究", 《微细加工技术》 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772120A (en) * | 2016-03-07 | 2016-07-20 | 北京同方生物芯片技术有限公司 | Batched bonding packaging method for polymeric biochips and positioning device |
| CN106391151B (en) * | 2016-08-31 | 2018-11-09 | 清华大学 | It is suitable for the multilayer micro-fluid chip production method of mass production |
| CN106391151A (en) * | 2016-08-31 | 2017-02-15 | 清华大学 | Manufacturing method of multilayer microfluidic chip suitable for batch production |
| CN107785287A (en) * | 2016-08-31 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | Bonding apparatus and method |
| CN106475158A (en) * | 2016-10-17 | 2017-03-08 | 首都师范大学 | Micro-fluidic chip for transmission-type terahertz time-domain spectroscopy system and manufacture method |
| CN106475158B (en) * | 2016-10-17 | 2019-06-04 | 首都师范大学 | Micro-fluidic chip and manufacturing method for transmission-type terahertz time-domain spectroscopy system |
| CN106783645A (en) * | 2016-11-29 | 2017-05-31 | 东莞市广信知识产权服务有限公司 | A kind of method of diamond and GaN wafer Direct Bondings |
| CN108162368A (en) * | 2017-12-27 | 2018-06-15 | 北京百奥芯科技有限公司 | A kind of thermal bonding method of control plastic chip and the chip obtained |
| CN108080045A (en) * | 2017-12-27 | 2018-05-29 | 北京百奥芯科技有限公司 | A kind of hydrophilically modified method of fluid channel inside micro-fluidic chip |
| CN108562736A (en) * | 2018-01-03 | 2018-09-21 | 兰州大学 | Immunoassay device based on microwell array chip and Intelligent mobile equipment and method |
| CN109926112A (en) * | 2019-04-10 | 2019-06-25 | 中南大学 | The layered manufacturing method of three-dimensional microstructures polymeric micro-fluidic chip |
| CN110293687A (en) * | 2019-06-05 | 2019-10-01 | 大连理工大学 | A kind of more menifold plate bonding methods of polyetherimide |
| CN112569881A (en) * | 2020-07-24 | 2021-03-30 | 苏州恒瑞宏远医疗科技有限公司 | Reaction device and processing method thereof |
| CN115283030A (en) * | 2022-08-03 | 2022-11-04 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | Bonding method of polymer microfluidic chip and polymer microfluidic chip |
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