CN104602171A - Integrated silicon condenser microphone - Google Patents
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- CN104602171A CN104602171A CN201310526291.3A CN201310526291A CN104602171A CN 104602171 A CN104602171 A CN 104602171A CN 201310526291 A CN201310526291 A CN 201310526291A CN 104602171 A CN104602171 A CN 104602171A
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Abstract
The invention discloses an integrated silicon condenser microphone. The integrated silicon condenser microphone comprises a shell, which is provided with at least one sound inlet hole, a substrate, which is provided with a hole, two or four MEMS (Micro-Elecro-Mechanical System) sensing elements, which are in seamless physical connection, an integrated circuit and sound cavities, wherein the sound cavities are formed by the two or four MEMS sensing elements and the substrate together, specifically, the sound cavities of the two or four MEMS sensing elements are symmetrically communicated through holes in the substrate, and through the symmetrical sound cavities, which are shared and arranged in the shell and are formed by the same sound inlet path relative to the position of each MEMS sensing element, the sound wave is input until a sound transmission path for an electric signal, which is converted by the sound wave through each MEMS sensing element, is fully symmetrical for each MEMS sensing element in the silicon microphone, wherein a sound inlet path is a path formed from the sound inlet hole in the shell to the sound cavities to a vibrating diaphragm of each MEMS sensing element; the integrated circuit is used for buffering/amplifying and outputting the electric signal, which is converted by sending the sound wave to each MEMS sensing element through the sound transmission path.
Description
Technical field
The present invention relates to microphone field, in particular to a kind of integrated silicon capacitor microphone.
Background technology
Micro electronmechanical (MEMS, Micro-Electro-Mechanical System) microphone or claim silicon microphone, because its volume is little, is suitable for the advantages such as surface mount and is widely used in the sound collection of tablet electronic device, such as: mobile phone, MP3, recording pen and monitoring equipment etc.For meeting the growing material and cultural needs of the people, the index such as volume, cost, signal to noise ratio of silicon microphone is also constantly optimizing raising.In relevant optimisation technique scheme, is no lack of the mode of attempting by together being used by multiple silicon microphone MEMS senser, to improve the signal to noise ratio index under existing fabrication process condition.
Traditional silicon micro-microphone is single MEMS senser, generally comprises the vibration section that vibrating diaphragm is formed and the support portion be connected with substrate, hollows out and form sound chamber below the core of the corresponding vibrating diaphragm in support portion.In order to make the voice signal that obtains during multiple MEMS senser collaborative work close so that data fusion, generally can ensure that the sound chamber of each MEMS senser is interconnected by air.
In order to many MEMS senser multiplex requirements of accommodate silicon micro-microphone, prior art proposes the substrate making many perforates or the mode distinguishing chamber, front and back in a package by arranging plate ensures that the sound chamber of each MEMS senser is interconnected by air.US Patent No. 7933428, US20080037768 are by the substrate of many perforates, and below substrate, corresponding each MEMS senser makes a perforate, and the sound chamber of each MEMS senser is interconnected by the space outside perforate.This encapsulation scheme is due to the randomness of sound source position in actual service condition, strength retrogression in sound wave transmittance process and phase shift are also different, more seriously, this to the decay of acoustic signals intensity and the delay of phase place along with frequency change is also different, and the distribution of collapsing field is also along with the change of sound source position changes.Like this, the acoustic signals intensity that each MEMS senser receives and phase place all incomplete same, and to change along with the variation of sound source position.Correspondingly, facing the signal synthesis of each MEMS senser to when making data fusion together, facing the inconsistent situation of each signal and must give up a part of information.
For reducing the inconsistent data fusion loss brought of each MEMS senser signal, US Patent No. 8170244, US20100092020, US20120207334, Chinese patent CN102187685A all propose scheme microphone cavity being divided into ante-chamber, back cavity by substrate, and the sound chamber of each MEMS senser is all connected with ante-chamber, then by ante-chamber to housing openings.So just shield the sound source position when silicon capacitor microphone normally uses and change the impact brought.Although the acoustic signals intensity that each MEMS senser receives and phase place incomplete same, but due to decay signal strength signal intensity and phase delay do not change with the change of sound source position in use procedure, make the means by circuit compensation in data fusion become possibility.But the encapsulation scheme that such chamber, front and back is separated increases to some extent on gauge, limits the scope of application of corresponding microphone products; For making the signal of each MEMS senser carry out data fusion with greater efficiency, more need to do extra effort on circuit compensation.A kind of operatic tunes of full symmetric of double integrated circuit in US Patent No. 20120039499 two MEMS senser conceptual design, but this scheme is only applicable to double integrated circuit, its lead design is comparatively complicated, parasitic parameter is restive, in addition, similar with aforementioned schemes, the encapsulation scheme that chamber, this front and back is separated increases to some extent on gauge, limits the scope of application of corresponding microphone products.
For the situation that multiple MEMS senser is multiplexing, US Patent No. 7933428, US20080037768 have selected the MEMS senser scheme of separation, US Patent No. 8170244, US20100092020, US20120207334, Chinese patent CN102187685A be separative MEMS senser scheme both, also has the MEMS senser scheme of seamless physical connection.For the MEMS senser scheme be separated, because sound wave is for the transaudient path non complete symmetry of each MEMS senser, inherently there is the problem that each road signal is inconsistent, if each MEMS senser is separated, just likely on one piece of wafer, get non-conterminous MEMS senser so in process of production, thus cause not mating of each MEMS senser, increasing the inconsistent of each road signal, also increasing in follow-up data fusion to improve the burden that data fusion efficiency compensates.For US Patent No. 8170244, US20100092020, US20120207334, the MEMS senser scheme of the seamless physical connection of Chinese patent CN102187685A, the scheme of its weak point and US Patent No. 8477983 is similar, comparatively large thus except the problem of restriction application scenario for the gauge of each MEMS senser asymmetry problem and encapsulation scheme except there is the transaudient path of sound wave, its MEMS senser is directly connected and connects the mode to integrated circuit (IC) chip, the inconsistent result that cannot compensate of each road signal because its encapsulation scheme brings will be caused.In addition, in follow-up encapsulation process, the packaging cost of many MEMS senser of separation is apparently higher than many MEMS senser of single MEMS senser and seamless physical connection.Rigidity as being representative with US Patent No. 20070278601 encapsulates, and the process procedure and the material that just there is many MEMS senser that extra reply is separated prepare link; And in many MEMS sensitive structure flexible package mode of US Patent No. 20100155863 separation that is representative, cost is especially far above the single MEMS sensitive structure flexible package mode being representative with Korean Patent KR100737728B1.So just make existing many MEMS senser multiplex technique be faced with and will bear the higher MEMS package cost be separated from each other as compensated, and MEMS senser is directly connected and the mode connected to integrated circuit (IC) chip cannot compensate the dilemma of not mating the data fusion efficiency reduction that bring of front end by chip position and transaudient path.
In prior art, for many MEMS senser walk abreast use the operatic tunes each MEMS senser relative to transaudient path and failed call is symmetrical, sound wave may be there is so in actual use and be input to the inconsistent and inconsistency of signal in each signal path by sound source position variable effect, or fixing inconsistency faces higher encapsulation and cost of compensation in corresponding compensation work, or inconsistency is difficult to the situation of compensation.In the present invention, by the symmetry that will deliberately maintain transaudient path and acoustic signal in encapsulation scheme and convert to electrical signal, ensure that the consistency of signal in each MEMS senser signal path, thus can ensure that each road signal can carry out data fusion with higher efficiency without the need to compensation tache, also respective needle has been evaded in current techique thus to the encapsulation of many MEMS senser, the extra cost compensated, maintain the compatibility of relatively single MEMS senser microphone system versatility technology and range of application, also provide the flexible topology's wire laying mode under guarantee high efficiency data fusion prerequisite simultaneously.
Summary of the invention
The invention provides a kind of integrated silicon capacitor microphone, in order to improve the efficiency of mutual data fusion between each MEMS sensitive structure of integrated silicon capacitor microphone, improve its performance further.
For achieving the above object, the invention provides a kind of integrated silicon capacitor microphone, comprising: the shell with at least 1 sound inlet, there is the substrate of 1 perforate, the MEMS senser of the mutual coupling of 2 or 4 seamless physical connections, integrated circuit and the operatic tunes, wherein:
The operatic tunes is made up of jointly 2 or 4 MEMS sensers and substrate, be connected symmetrically specifically by the sound chamber of the perforate on substrate by 2 or 4 MEMS sensers, and by shared arrangement on shell, relatively each MEMS senser position same enter sound path formed the symmetrical operatic tunes, sound wave is inputted until changed into the full symmetric of transaudient path for MEMS senser each in silicon microphone of the signal of telecommunication by each MEMS senser, and wherein entering sound path is the path formed to the vibrating diaphragm of each MEMS senser from the sound inlet shell, the operatic tunes;
Integrated circuit is used for being sent to sound wave the signal of telecommunication that each MEMS senser is converted into through transaudient path and cushions/amplify and export.
Preferably, the material of substrate is silicon, devitrified glass or pottery, and substrate engages with each MEMS senser, and the shape of the perforate on substrate and position are relative to the Central Symmetry of 2 or 4 MEMS sensers.
Preferably, on the cap that the sound inlet on shell is arranged on shell and/or base plate.
Preferably, 2 or 4 MEMS sensers are respectively change direction, the variable capacitor that sensitivity is all identical.
Preferably, 2 or 4 MEMS sensers parallel with one another.
Preferably, the sheet of integrated circuit is several to be determined according to lead-in wire and parasitic parameter, mutually electrical connection or be connected to integrated circuit by wire bonding again after being connected by wire bonding between each MEMS senser, or realize each MEMS senser and being connected between integrated circuit respectively by the mode of wire bonding.
Preferably, the end face of substrate and shell or bottom surface are connected.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the microphone structure vertical section schematic diagram of sound inlet at outer casing upper cover of one embodiment of the invention;
Fig. 2 is the microphone structure vertical section schematic diagram of sound inlet at shell bottom plate of one embodiment of the invention;
Fig. 3 is the vertical view of the MEMS senser of 2 seamless physical connections of one embodiment of the invention and the layout of integrated circuit on substrate of 1 piece of cooperation, 1 MEMS senser;
Fig. 4 is the vertical view of the MEMS senser of 2 seamless physical connections of one embodiment of the invention and the layout of integrated circuit on substrate of 1 piece of cooperation, 2 MEMS sensers;
Fig. 5 is the vertical view that the MEMS senser of 2 seamless physical connections of one embodiment of the invention and 3 pieces coordinate the layout of integrated circuit on substrate of 2 MEMS sensers altogether;
Fig. 6 is the vertical view of the MEMS senser of 4 seamless physical connections of one embodiment of the invention and the layout of integrated circuit on substrate of 1 piece of cooperation, 1 MEMS senser;
Fig. 7 is the vertical view that the MEMS senser of 4 seamless physical connections of one embodiment of the invention and 5 pieces coordinate the layout of integrated circuit on substrate of 4 MEMS sensers altogether;
Fig. 8 is the vertical view of the MEMS senser of 4 seamless physical connections of one embodiment of the invention and the layout of integrated circuit on substrate of 1 piece of cooperation, 4 MEMS sensers;
Fig. 9 is the vertical view that the MEMS senser of 4 seamless physical connections of one embodiment of the invention and 3 pieces coordinate the layout of integrated circuit on substrate of 4 MEMS sensers altogether;
Figure 10 is the vertical view that the MEMS senser of 4 seamless physical connections of one embodiment of the invention and 3 pieces coordinate the layout of integrated circuit on substrate of 2 MEMS sensers altogether;
Figure 11 is the analog or digital processing of circuit scheme schematic diagram coordinating actual 2 MEMS sensers with the input of 1 MEMS senser do of one embodiment of the invention;
Figure 12 is the analog or digital processing of circuit scheme schematic diagram coordinating actual 2 MEMS sensers with the input of 2 MEMS sensers dos of one embodiment of the invention;
Figure 13 is the analog or digital processing of circuit scheme schematic diagram coordinating actual 4 MEMS sensers with the input of 1 MEMS senser do of one embodiment of the invention;
Figure 14 is the analog or digital processing of circuit scheme schematic diagram coordinating actual 4 MEMS sensers with the input of 4 MEMS sensers dos of one embodiment of the invention;
Figure 15 is the analog or digital processing of circuit scheme schematic diagram coordinating actual 4 MEMS sensers with the input of 2 MEMS sensers dos of one embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not paying the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 is the microphone structure vertical section schematic diagram of sound inlet at outer casing upper cover of one embodiment of the invention; Fig. 2 is the microphone structure vertical section schematic diagram of sound inlet at shell bottom plate of one embodiment of the invention; As shown in the figure, integrated silicon capacitor microphone comprises: the shell with 1 sound inlet 101, has the MEMS senser 301 of the substrate 202,2 of 1 perforate 201 or the mutual coupling of 4 seamless physical connections, integrated circuit 401 and the operatic tunes, wherein:
The operatic tunes is made up of jointly 2 or 4 MEMS sensers 301 and substrate 202, be connected symmetrically specifically by the sound chamber of the perforate 201 on substrate 202 by 2 or 4 MEMS sensers 301, and by shared arrangement on shell, what relatively each MEMS senser 301 position was same the enter symmetrical operatic tunes that sound path formed, sound wave is inputted until changed into the full symmetric of transaudient path for MEMS senser 301 each in silicon microphone of the signal of telecommunication by each MEMS senser 301, wherein entering sound path is from the sound inlet 101 shell, the path that the operatic tunes is formed to the vibrating diaphragm of each MEMS senser 301, this is in order to by the relative position of each minor structure of MEMS senser 301, the control of package position, makes microphone enter line encapsulation scheme and itself possesses symmetry, thus ensures the symmetry of acoustic signals in microphone internal delivery process.
Integrated circuit 401 cushions/amplifies for signal of telecommunication sound wave being sent to each MEMS senser 301 through transaudient path and being converted into and export.
Fig. 1 and Fig. 2 gives the microphone structure vertical section schematic diagram of sound inlet 101 respectively on shell 102 upper cover and shell bottom plate 103.Perforate 201 wherein on substrate 202 connects with the sound chamber 302 of MEMS senser 301 and forms the total large operatic tunes of each MEMS senser and relative each MEMS senser symmetry, and acoustic wavefield is distributed to equably on the vibrating diaphragm of each MEMS senser 301 in this large operatic tunes.In fact, the sound inlet on shell can be present in any case surface of scheme needs and get suitable number, shape, only need ensure that the sound source in any direction inputs from sound inlet, and the relatively each MEMS senser of acoustic signals be delivered on substrate after perforate is symmetrical.Doing one is like this change the sound inlet that the brings transaudient path change to the operatic tunes to be abandoned sound source position by the design of sound inlet, two is to be inputted equably from the orientation of relatively each MEMS senser symmetry of the operatic tunes by the acoustic signals of input sound inlet, thus ensures the symmetry in transaudient path.Even if with other other existing encapsulation schemes compatible with arrange means be combined by dust-proof, the acoustic aperture of resist for the purpose of welded and installed process foul and high temperature, also need guarantee this point.
It is emphasized that, from be divided into by microphone cavity chamber, front and back different to ensure symmetric way in US Patent No. 8170244, US20100092020, US20120207334, Chinese patent CN102187685A, the present invention is by being restricted to 2 or 4 and seamless link and mutually mating by MEMS senser number, be aided with other conventional encapsulation means, realize transaudient path completely same, thus maintain with traditional single MEMS senser suitable on gauge, wider range of application can be had than thicker chamber, front and back encapsulation scheme.Above-described embodiment uses parallel for the MEMS senser of 2 or 4 couplings, ensure the input of each sound wave until the transaudient path of being changed into the signal of telecommunication by MEMS senser is for the full symmetric of each MEMS senser in silicon capacitor microphone simultaneously, improve the performance index such as the sensitivity of microphone, signal to noise ratio; In addition, also by the means of matching structure, transaudient path and acoustic resistance, the strength retrogression that acoustic signals is propagated on MEMS senser is consistent with phase delay, and the capacitance change signal that the MEMS senser of coupling makes acoustic signals transform into is also consistent, thus improve the efficiency of mutual data fusion between each MEMS senser of integrated silicon capacitor microphone, improve the performance of microphone further.
Wherein, the material of substrate 202 can be silicon, devitrified glass or pottery, substrate 202 is installed with surface with MEMS senser 301, bonding or any other any those of ordinary skill in the art it is conceivable that mode connect, the shape of the perforate 201 on substrate 202 and position are relative to the Central Symmetry of MEMS senser 301.This is to make perforate 201 connect with the sound chamber 302 of MEMS senser 301 and form the total large operatic tunes of each MEMS senser and relative each MEMS senser is symmetrical, making acoustic wavefield be distributed to equably on the vibrating diaphragm of each MEMS senser 301 in this large operatic tunes.
Wherein, above-mentioned 2 or 4 MEMS sensers 301 mate and about the Central Symmetry of chipset, these 2 or 4 MEMS sensers 301 are that base holds, change direction, the variable capacitor that sensitivity is all identical, and it is parallel with one another to connect needs according to circuit, makes subsequent treatment they can be regarded as same.This is to make acoustic signals be delivered to symmetrically after on MEMS senser 301, being converted into the signal of telecommunication symmetrically, ensures like this to regard as same encapsulation scheme at subsequent treatment Zhong Jiangge road signal, does data fusion useful to each road signal.Even if will compensate signal for the needs of the signal optimizings such as echo cancellor, as long as also regard as same in rear class by the signal of each MEMS senser path, carry out advantageously software compensation.
Wherein, the sheet number of integrated circuit 401 can need to arrange 1 or more according to lead-in wire and parasitic parameter, mutually electrical connection or be connected to integrated circuit by wire bonding again after being connected by wire bonding between each MEMS senser 301, or realize each MEMS senser and being connected between integrated circuit respectively by the mode of wire bonding, such as can according to actual cabling and parasitic parameter, package layout etc. need to be split as multiple integrated circuit (IC) chip such as the direct integrated circuit 402 be connected with MEMS senser 301 and the integrated circuit 403 be not directly connected with senser 301.Wherein connection scheme can be selected according to overall package scheme and production efficiency, but transaudient way symmetric has precedence over electrical lead wire symmetry in encapsulation scheme, this is because transaudient path is positioned at prime, its non-linear offset influence is delivered to rear class and can be exaggerated and be difficult to compensate, and prior art for the imbalance on late-class circuit compensatory device and compensate validity also more than with the compensation be better than for the imbalance of prime transaudient path.
Wherein said integrated circuit can be the dedicated buffering/amplification-output circuit of coupling these 2 or 4 MEMS senser Integrated Solutions, also can be the match circuit of general silicon capacitor microphone list MEMS senser.This is done to obtain superior performance by application-specific integrated circuit (ASIC); Or when cost, package lead dimensional form, technical conditions etc. do not catch up with, by being directly connected in parallel respectively having identical transaudient path each MEMS senser same again the match circuit accessed again by single MEMS senser, although corresponding cabling is limited relative to the former with parasitic parameter prioritization scheme, also the parallel performance raising using MEMS senser can be obtained by higher data fusion efficiencies.
Fig. 3 ~ Figure 10 gives the flexible package layout wiring configuration for 2 or 4 MEMS sensers and multiple integrated antenna package form, and the perforate 201 wherein on substrate 202 connects with the sound chamber 302 of MEMS senser 301 and forms the geometric center symmetry of the large operatic tunes relative MEMS senser group 301 that each MEMS senser has.Heavy line in figure connects expression and carries out electric signal transmission by wire bonding; MEMS senser 301 uses identical figured pad, can control according to parasitic parameter and the selection flexibly of wiring needs, MEMS senser 301 arranges line by MEMS processing technology and realizes electric signal transmission, or MEMS processing break but at wire bonding time to be connected by going between and to realize electric signal transmission; To express possibility the double-wire signal transmission existed in the fine line that some heavy lines are other.Chip in Fig. 3 ~ 10 and pad layout mode are only a kind of example; and it is nonrestrictive; those skilled in the art is understood, and can carry out many amendments, change or equivalence, but they all will fall within the scope of protection of the present invention within the spirit and scope of claim restriction to it.
The circuit theory that Figure 11 ~ Figure 15 gives for 2 or 4 the supporting integrated circuits of MEMS senser is illustrated.The integrated circuit principle of Figure 11 and Figure 13 is close, corresponding using method is also applicable to the supporting integrated circuit of single MEMS senser, in other words, the present invention allows to use the circuit theory of similar Figure 11 and Figure 13 to realize in the present invention the supporting of the integrated circuit of 2 or 4 MEMS sensers and general corresponding list MEMS senser.The integrated circuit principle of Figure 12 and Figure 15 is close, and in other words, the present invention allows to use the circuit theory of similar Figure 15 to realize in the present invention the supporting of integrated circuit in 4 MEMS sensers and Figure 13.Under the principle framework of Figure 11 ~ 15, can need to do fractionation that is integrated or partial function module to integrated circuit according to parasitic parameter control and placement-and-routing, its example includes but not limited to single IC chip and the multiple ic chip solution of Fig. 3 ~ Figure 10.In the present invention, with 2 or the supporting integrated circuit of 4 MEMS sensers, both allowed to be analog circuit, also allowing is digital circuit, and also allowing is the situation of a part of analog circuit part digital circuit.
Wherein in order to ensure that comparatively small package size is to widen microphone applicable situation, substrate 202 can also be connected with the end face of shell 102 or base plate 103.
In addition, on the basis ensureing transaudient way symmetric, the integrated silicon capacitor microphone in above-described embodiment can also other existing encapsulation schemes compatible and the acoustic aperture plan of establishment for the purpose of dust-proof, opposing welded and installed process foul and high temperature.This is the convenience in order to be connected with more existing current techique schemes to ensure microphone production implementation process.
In sum, the above embodiment of the present invention achieves following beneficial effect:
(1) integrated silicon capacitor microphone makes MEMS senser be combined with the encapsulating structure such as substrate, shell, constitutes the operatic tunes of transaudient path for each MEMS senser full symmetric.Overall package owing to dividing chamber, front and back as picture patent CN102187685A, thus maintains with traditional single MEMS senser suitable on gauge, can have wider range of application.
(2) due to provide in the embodiment of the present invention each MEMS senser on chip be connected electric connecting mode, have when circuit design more fully space according to principle scheme, encapsulation and parasitic parameter etc. because of usually selection gage system to optimize distribution.
(3) owing to the invention provides the path, transaudient chamber of full symmetric and being only applicable to 2 or 4 MEMS sensers, need not consider to compensate based on the transaudient path of the difference of MEMS senser and the sensor characteristics of itself are inconsistent when circuit design, thus have larger design space.If the microphone that the present invention proposes needs to compensate in follow-up use, only need to do same compensate by software mode to this 2 road or 4 road signals in rear end, this just maintains the larger compensation degree of freedom on the basis greatly reducing corresponding packaging cost.In addition, Data-Fusion theory is pointed out, along with increasing of MEMS senser, its fusion efficiencies also reduces along with the inconsistent of each chip, and the inconsistency in each MEMS senser and path, transaudient chamber thereof but affects the limitation with packaged type by MEMS technology, increases along with increased number, therefore, although for ensureing symmetry, the present invention is only suitable for 2 or 4 MEMS sensers and walks abreast the occasion of use, can cover wider range of application also.
One of ordinary skill in the art will appreciate that: accompanying drawing is the schematic diagram of an embodiment, the module in accompanying drawing or flow process might not be that enforcement the present invention is necessary.
One of ordinary skill in the art will appreciate that: the module in the device in embodiment can describe according to embodiment and be distributed in the device of embodiment, also can carry out respective change and be arranged in the one or more devices being different from the present embodiment.The module of above-described embodiment can merge into a module, also can split into multiple submodule further.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in previous embodiment, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of embodiment of the present invention technical scheme.
Claims (7)
1. an integrated silicon capacitor microphone, is characterized in that, comprising: the shell with at least 1 sound inlet, has the substrate of 1 perforate, the MEMS senser of the mutual coupling of 2 or 4 seamless physical connections, integrated circuit and the operatic tunes, wherein:
The described operatic tunes is made up of jointly described 2 or 4 MEMS sensers and described substrate, be connected symmetrically specifically by the sound chamber of the perforate on described substrate by described 2 or 4 MEMS sensers, and by shared arrangement on the housing, what relatively each described MEMS senser position was same the enter symmetrical operatic tunes that sound path formed, sound wave is inputted until changed into the full symmetric of transaudient path for described MEMS senser each in silicon microphone of the signal of telecommunication by each described MEMS senser, wherein said enter sound path be from the sound inlet described shell, the path that the described operatic tunes is formed to the vibrating diaphragm of each described MEMS senser,
Described integrated circuit is used for being sent to sound wave the signal of telecommunication that each described MEMS senser is converted into through described transaudient path and cushions/amplify and export.
2. integrated silicon capacitor microphone according to claim 1, it is characterized in that, the material of described substrate is silicon, devitrified glass or pottery, described substrate engages with each described MEMS senser, and the shape of the perforate on described substrate and position are relative to the Central Symmetry of described 2 or 4 MEMS sensers.
3. integrated silicon capacitor microphone according to claim 1, is characterized in that, on the cap that the sound inlet on described shell is arranged on described shell and/or base plate.
4. integrated silicon capacitor microphone according to claim 1, is characterized in that, described 2 or 4 MEMS sensers are respectively change direction, the variable capacitor that sensitivity is all identical.
5. integrated silicon capacitor microphone according to claim 4, is characterized in that, described 2 or 4 MEMS sensers parallel with one another.
6. integrated silicon capacitor microphone according to claim 1, it is characterized in that, the sheet of described integrated circuit is several to be determined according to lead-in wire and parasitic parameter, mutually electrical connection or be connected to described integrated circuit by wire bonding again after being connected by wire bonding between each described MEMS senser, or realize each described MEMS senser and being connected between described integrated circuit respectively by the mode of wire bonding.
7. integrated silicon capacitor microphone according to claim 1, is characterized in that, end face or the bottom surface of described substrate and described shell are connected.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104936116A (en) * | 2015-06-01 | 2015-09-23 | 北京卓锐微技术有限公司 | Integrated differential silicon capacitor microphone |
| CN105072551A (en) * | 2015-08-20 | 2015-11-18 | 歌尔声学股份有限公司 | Micro-electromechanical system (MEMS) microphone and MEMS acoustical sensor chip |
| CN113132876A (en) * | 2021-03-01 | 2021-07-16 | 歌尔微电子股份有限公司 | Micro-electromechanical microphone and electronic equipment |
| WO2022012043A1 (en) * | 2020-07-17 | 2022-01-20 | 通用微(深圳)科技有限公司 | Audio capturing device, audio processing device, method, device, and storage medium |
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| CN203537561U (en) * | 2013-10-30 | 2014-04-09 | 北京卓锐微技术有限公司 | Integrated silicon capacitor microphone |
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| CN104936116B (en) * | 2015-06-01 | 2018-12-04 | 山东共达电声股份有限公司 | A kind of integrated difference silicon capacitor microphone |
| CN105072551A (en) * | 2015-08-20 | 2015-11-18 | 歌尔声学股份有限公司 | Micro-electromechanical system (MEMS) microphone and MEMS acoustical sensor chip |
| WO2022012043A1 (en) * | 2020-07-17 | 2022-01-20 | 通用微(深圳)科技有限公司 | Audio capturing device, audio processing device, method, device, and storage medium |
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