CN104600183B - The preparation method of LED white light-emitting diodes - Google Patents
The preparation method of LED white light-emitting diodes Download PDFInfo
- Publication number
- CN104600183B CN104600183B CN201410818665.3A CN201410818665A CN104600183B CN 104600183 B CN104600183 B CN 104600183B CN 201410818665 A CN201410818665 A CN 201410818665A CN 104600183 B CN104600183 B CN 104600183B
- Authority
- CN
- China
- Prior art keywords
- paster
- dao
- emitting diodes
- white light
- blue led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000000843 powder Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- 229920006335 epoxy glue Polymers 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- 235000015895 biscuits Nutrition 0.000 claims abstract description 12
- 238000007493 shaping process Methods 0.000 claims abstract description 7
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 244000247747 Coptis groenlandica Species 0.000 claims 1
- 241001062009 Indigofera Species 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000007639 printing Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- 241000218202 Coptis Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of preparation method of LED white light-emitting diodes, the LED white light-emitting diodes includes first, two leads, blue LED die and the epoxy glue layer containing yellow fluorescent powder, first, two leads have first for being mutually integrated respectively, two paster Ji Dao and first, two pins, blue LED die is mounted on the first paster Ji Dao and is electrically connected with the first paster Ji Dao, the surface of blue LED die is electrically connected with the second paster Ji Dao, the first paster Ji Dao, second paster Ji Dao and blue LED die are covered by the epoxy glue layer containing yellow fluorescent powder；And its：The step of LED white light-emitting diodes preparation methods is：The solid epoxy biscuit of step a, preparation containing fluorescent material；Step b, die bond；Step c, bonding；Step d, injection moulding and solidification；Step e, shaping；So as to be prepared into LED white light-emitting diodes.Preparation method of the invention is reasonable, and production efficiency is high, and input cost is low.
Description
Technical field
The present invention relates to a kind of preparation method of LED white light-emitting diodes, belong to technical field of semiconductor encapsulation.
Background technology
At present, there are EMC/PPA plastic materials on the lead frame of existing white light-emitting diodes and in the case of bowl shape, and
Transparent adhesive tape containing fluorescent material is to press screw rod spot printing mode or syringe spot printing mode to be injected in case by air, so that
The periphery of luminescence chip is formed in the lens jacket of hemisphere shape, and luminescence chip is by the case reflecting light in bowl shape
's.The equipment of investment required for the packaged type of above-mentioned air pressure screw rod spot printing mode and the expense of mould are all high；And pin
Cylinder spot printing mode exist fluorescent material do not mix uniformly with epoxy resin, fluorescent material can precipitate in the epoxy reduce light emission rate,
And the poured with epoxy resin amount unstable problem of how many not first-class many product quality that can cause to produce, and due to two kinds
The production technology of mode is easily limited by single variety so that the method for packing of which is difficult to be transformed to volume production pattern, production
Efficiency is also low.
The content of the invention
The purpose of the present invention is：There is provided a kind of not only preparation method rationally, and the low LED white lights two of Productive statistics expense
The preparation method of pole pipe, the method can be transformed to volume production pattern, can rapid, high volume manufacture, to overcome prior art not
Foot.
In order to achieve the above object, the technical scheme is that：A kind of preparation method of LED white light-emitting diodes, it is described
LED white light-emitting diodes includes the first lead, the second lead, blue LED die and the epoxy glue layer containing yellow fluorescent powder, institute
Stating the first lead has the first paster Ji Dao and the first pin being mutually integrated, and the second lead has the second paster being mutually integrated
Ji Dao and second pin, the blue LED die are mounted on the first paster Ji Dao and are electrically connected with the first paster Ji Dao, blue
The surface of color LED chip is electrically connected with the second paster Ji Dao, the first paster Ji Dao, the second paster Ji Dao and blue led
Chip is covered by the epoxy glue layer containing yellow fluorescent powder；And its：The step of LED white light-emitting diodes preparation methods
It is：
The solid epoxy biscuit of step a, preparation containing fluorescent material；Mixed with water white transparency epoxy resin by yellow fluorescent powder
Close the mixed material for constituting carries out uniform stirring at normal temperatures, surveys its viscosity and reaches 3000 ~ 4000mPas, is then placed in baking oven
Taken out after drying, after material cooling to be mixed so that mixed material is in cake formula solid-like, standby；The temperature control of the baking oven
In the range of 150 ~ 170 DEG C, the time control of drying is in the range of 1.5 ~ 2.5 hours；
Step b, die bond；The die bond is the paster Ji Dao that blue LED die is mounted on lead frame by bonding agent
On, it is subsequently placed in baking oven after drying and takes out, the temperature control of the baking oven in the range of 145 ~ 155 DEG C, control by the time of drying
System is in the range of 1.5 ~ 2.5 hours；
Step c, bonding；The bonding is that the workpiece obtained through step b is placed in bonding equipment, with gold thread by blueness
The pin welding corresponding with lead frame respectively of the positive and negative electrode of LED chip, rear taking-up workpiece to be welded；
Step d, injection moulding and solidification；The workpiece obtained through step c is placed in the lower mould of mould, and is covered
The mold of synthesis type mould, hot briquetting mould simultaneously makes its temperature maintain in the range of 175 ± 5 DEG C；Step a is produced again
Solid epoxy biscuit containing fluorescent material is placed in the injecting hole of mould after softening, will by the pressure of 3 ~ 8Mpa
It is injected into mould, and is solidified 2 ~ 3 minutes；It is the baking oven in the range of 145 ~ 155 DEG C to then take out workpiece and be put into temperature
Interior baking, makes the solid epoxy internal stress containing fluorescent material fill part and discharges, so as in the periphery of the paster Ji Dao of lead frame
The epoxy glue layer containing yellow fluorescent powder is formd with blue LED die periphery；
Step e, shaping；The shaping is that the workpiece that will be obtained through step d is removed by stamping mold or cutting mode
The clout of lead frame, so as to be prepared into LED white light-emitting diodes.
In the above-mentioned technical solutions, the yellow fluorescent powder of the solid epoxy biscuit containing fluorescent material used in step a
It is 5 ~ 8 with the percentage by weight of water white transparency epoxy resin:95~92.
In the above-mentioned technical solutions, the also pretreatment including lead frame in step b；The pretreatment is in lead frame elder generation
Nickel coating, then copper plate, last silver coating, wherein, the thickness control of nickel dam exists>In the range of 0.1um, the thickness control of layers of copper exists
In the range of 0.2 ~ 0.3um, the thickness control of silver layer exists>In the range of 2.5um.
In the above-mentioned technical solutions, the blue LED die in step b is mounted on the attachment on the paster Ji Dao of lead frame
Mode has two kinds, and a kind of mode is that on same surface, blue LED die is by exhausted for the positive and negative electrode of the blue LED die
Edge sticker is on the paster Ji Dao of lead frame；Another way is that the positive and negative electrode of the blue LED die is located at respectively
On its two sides, the back side of blue LED die is mounted on the paster Ji Dao of lead frame by elargol.
In the above-mentioned technical solutions, the asphalt mixtures modified by epoxy resin containing yellow fluorescent powder that the periphery of blue LED die described in step d is formed
The thickness control of fat glue-line is in the range of 0.4 ~ 1mm.
The good effect that has of the present invention is：Due to taking above-mentioned preparation method, obtained LED white light-emitting diodes
Epoxy glue layer containing yellow fluorescent powder is prepared into containing glimmering after being mixed with water white transparency epoxy resin by yellow fluorescent powder in advance
The solid epoxy biscuit of light powder, then the solid epoxy biscuit containing fluorescent material is placed on the injecting hole of mould
In after softening, injection moulding in mould is injected into by pressure, then formed by baking-curing, instead of prior art
Middle utilization air pressure screw rod spot printing mode or syringe spot printing mode are injected in the case in bowl shape, so, containing yellow fluorescence
The epoxy glue layer of powder is well mixed, and is not in not only the phenomenon of yellow fluorescent powder precipitation, and reflecting rate is high so that most
Finished product quality is guaranteed.Not only method is simple, reasonable for the present invention, and the expense of Productive statistics is low.The method can
Be transformed to volume production pattern, can rapid, high volume manufacture, realize the purpose of the present invention.
Brief description of the drawings
Fig. 1 is the structural representation of LED white light-emitting diodes of the present invention；
Fig. 2 is the structural representation of mould of the present invention, wherein, 5 is mold, and 6 is lower mould, and 7 is injection bar.
Specific embodiment
Below with the embodiment for being given, the present invention is further illustrated, but is not limited to this.
As shown in Figure 1, 2, a kind of preparation method of LED white light-emitting diodes, the LED white light-emitting diodes includes the first lead
1st, the second lead 2, blue LED die 3 and the epoxy glue layer containing yellow fluorescent powder 4, first lead 1 is with each other one
First paster base island 1-1 of body and the first pin 1-2, the second lead 2 has the second paster base island 2-1 and second being mutually integrated
Pin 2-2, the blue LED die 3 is mounted on the first paster base island 1-1 and is electrically connected with the first paster base island 1-1, blue
The surface of color LED chip 3 is electrically connected with the second paster base island 2-1, the first paster base island 1-1, the second paster base island 2-1
It is covered by the epoxy glue layer 4 containing yellow fluorescent powder with blue LED die 3；And its：It is prepared by the LED white light-emitting diodes
The step of method is：
The solid epoxy biscuit of step a, preparation containing fluorescent material；Mixed with water white transparency epoxy resin by yellow fluorescent powder
Close the mixed material for constituting carries out uniform stirring at normal temperatures, surveys its viscosity and reaches 3000 ~ 4000mPas, is then placed in baking oven
Taken out after drying, after material cooling to be mixed so that mixed material is in cake formula solid-like, standby；The temperature control of the baking oven
In the range of 150 ~ 170 DEG C, the time control of drying is in the range of 1.5 ~ 2.5 hours；
Step b, die bond；The die bond is the paster Ji Dao that blue LED die is mounted on lead frame by bonding agent
On, it is subsequently placed in baking oven after drying and takes out, the temperature control of the baking oven in the range of 145 ~ 155 DEG C, control by the time of drying
System is in the range of 1.5 ~ 2.5 hours；
Step c, bonding；The bonding is that the workpiece obtained through step b is placed in bonding equipment, with gold thread by blueness
The pin welding corresponding with lead frame respectively of the positive and negative electrode of LED chip, rear taking-up workpiece to be welded；
Step d, injection moulding and solidification；The workpiece obtained through step c is placed in the lower mould of mould, and is covered
The mold of synthesis type mould, hot briquetting mould simultaneously makes its temperature maintain in the range of 175 ± 5 DEG C；Step a is produced again
Solid epoxy biscuit containing fluorescent material is placed in the injecting hole of mould after softening, will by the pressure of 3 ~ 8Mpa
It is injected into mould, and is solidified 2 ~ 3 minutes；It is the baking oven in the range of 145 ~ 155 DEG C to then take out workpiece and be put into temperature
Interior baking, makes the solid epoxy internal stress containing fluorescent material fill part and discharges, so as in the periphery of the paster Ji Dao of lead frame
The epoxy glue layer containing yellow fluorescent powder is formd with blue LED die periphery, and contains the epoxide-resin glue of yellow fluorescent powder
Layer can also play optically focused, hence it is evident that the luminous intensity of enhancing LED white light-emitting diodes；
Step e, shaping；The shaping is that the workpiece that will be obtained through step d is removed by stamping mold or cutting mode
The clout of lead frame, so as to be prepared into LED white light-emitting diodes.
The yellow fluorescent powder of the solid epoxy biscuit containing fluorescent material used and water white transparency ring in step a of the present invention
The percentage by weight of oxygen tree fat is 5 ~ 8:95~92.Wherein, yellow fluorescent powder is preferentially from the production of ntematix companies, and model
It is the fluorescent material of YAG-04.
The also pretreatment including lead frame in step b；It is described to pre-process in lead frame elder generation nickel coating, then copper plate,
Last silver coating, wherein, the thickness control of nickel dam exists>In the range of 0.1um, the thickness control of layers of copper is in 0.2 ~ 0.3um scopes
Interior, the thickness control of silver layer exists>In the range of 2.5um.
The mounting method that blue LED die in step b is mounted on the paster Ji Dao of lead frame has two kinds, Yi Zhongfang
Formula is that on same surface, blue LED die is mounted on lead frame to the positive and negative electrode of the blue LED die by insulating cement
Paster Ji Dao on；Another way is that the positive and negative electrode of the blue LED die is located on its two sides respectively, blue led core
The back side of piece is mounted on the paster Ji Dao of lead frame by elargol.
The thickness control of the epoxy glue layer containing yellow fluorescent powder that the periphery of blue LED die described in step d is formed
In the range of 0.4 ~ 1.0mm.
Lab scale effect of the present invention shows, using method for packing of the invention, not only simply, rationally, and Productive statistics into
This is low, and production efficiency is high, and can be mass-produced manufacture.
Claims (5)
1. a kind of preparation method of LED white light-emitting diodes, the LED white light-emitting diodes includes the first lead（1）, the second lead
（2）, blue LED die（3）With the epoxy glue layer containing yellow fluorescent powder（4）, first lead（1）With being mutually integrated
The first paster Ji Dao（1-1）With the first pin（1-2）, the second lead（2）With the second paster Ji Dao being mutually integrated（2-1）
And second pin（2-2）, the blue LED die（3）It is mounted on the first paster Ji Dao（1-1）It is upper and with the first paster Ji Dao
（1-1）It is electrically connected with, blue LED die（3）Surface and the second paster Ji Dao（2-1）It is electrically connected with, the first paster base
Island（1-1）, the second paster Ji Dao（2-1）And blue LED die（3）It is covered by the epoxy glue layer containing yellow fluorescent powder
（4）It is interior；It is characterized in that：The step of LED white light-emitting diodes preparation methods is：
The solid epoxy biscuit of step a, preparation containing fluorescent material；By yellow fluorescent powder and water white transparency epoxy resin mixing structure
Into mixed material carry out uniform stirring at normal temperatures, survey its viscosity and reach 3000 ~ 4000mPas, be then placed in drying in baking oven
After take out, after material to be mixed cooling so that mixed material is in cake formula solid-like, standby；The temperature control of the baking oven is 150
In the range of ~ 170 DEG C, the time control of drying is in the range of 1.5 ~ 2.5 hours；
Step b, die bond；The die bond is that blue LED die is mounted on the paster Ji Dao of lead frame by bonding agent, so
After be placed in baking oven after drying take out, in the range of 145 ~ 155 DEG C, the time control of drying exists the temperature control of the baking oven
In the range of 1.5 ~ 2.5 hours；
Step c, bonding；The bonding is that the workpiece obtained through step b is placed in bonding equipment, with gold thread by blue led core
The pin welding corresponding with lead frame respectively of the positive and negative electrode of piece, rear taking-up workpiece to be welded；
Step d, injection moulding and solidification；The workpiece obtained through step c is placed in the lower mould of mould, and is covered into
The mold of pattern tool, hot briquetting mould simultaneously makes its temperature maintain in the range of 175 ± 5 DEG C；Again by step a produce containing glimmering
The solid epoxy biscuit of light powder is placed in the injecting hole of mould after softening, and is noted by the pressure of 3 ~ 8Mpa
Enter in mould, and solidify 2 ~ 3 minutes；Then take out workpiece and be put into temperature to be dried in the baking oven in the range of 145 ~ 155 DEG C
It is roasting, the solid epoxy internal stress containing fluorescent material is fully discharged, so as in the periphery of the paster Ji Dao of lead frame and indigo plant
Color LED chip periphery forms the epoxy glue layer containing yellow fluorescent powder；
Step e, shaping；The shaping is that the workpiece that will be obtained through step d removes lead by stamping mold or cutting mode
The clout of framework, so as to be prepared into LED white light-emitting diodes.
2. the preparation method of LED white light-emitting diodes according to claim 1, it is characterised in that：It is used containing glimmering in step a
The yellow fluorescent powder of the solid epoxy biscuit of light powder and the percentage by weight of water white transparency epoxy resin are 5 ~ 8:95~92.
3. the preparation method of LED white light-emitting diodes according to claim 1, it is characterised in that：Also include lead in step b
The pretreatment of framework；It is described to pre-process in lead frame elder generation nickel coating, then copper plate, last silver coating, wherein, the thickness of nickel dam
Control exists>In the range of 0.1um, in the range of 0.2 ~ 0.3um, the thickness control of silver layer exists the thickness control of layers of copper>2.5um models
In enclosing.
4. the preparation method of LED white light-emitting diodes according to claim 1, it is characterised in that：Blue led in step b
Mounting method of the chip attachment on the paster Ji Dao of lead frame has two kinds, and a kind of mode is, the blue LED die
On same surface, blue LED die is mounted on the paster Ji Dao of lead frame positive and negative electrode by insulating cement；Another kind side
Formula is that the positive and negative electrode of the blue LED die is located on its two sides respectively, and the back side of blue LED die is mounted on by elargol
On the paster Ji Dao of lead frame.
5. the preparation method of LED white light-emitting diodes according to claim 1, it is characterised in that：It is blue described in step d
The thickness control of the epoxy glue layer containing yellow fluorescent powder that LED chip periphery is formed is in the range of 0.4 ~ 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410818665.3A CN104600183B (en) | 2014-12-25 | 2014-12-25 | The preparation method of LED white light-emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410818665.3A CN104600183B (en) | 2014-12-25 | 2014-12-25 | The preparation method of LED white light-emitting diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104600183A CN104600183A (en) | 2015-05-06 |
| CN104600183B true CN104600183B (en) | 2017-06-13 |
Family
ID=53125821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410818665.3A Active CN104600183B (en) | 2014-12-25 | 2014-12-25 | The preparation method of LED white light-emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104600183B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416392A (en) * | 2019-07-30 | 2019-11-05 | 深圳市永裕光电有限公司 | A kind of 360 ° of light emitting diodes of encapsulation |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1909254A (en) * | 2005-08-03 | 2007-02-07 | 刘士龙 | Producing method for base plate type white light diode and its constitution |
| CN101123284A (en) * | 2006-08-09 | 2008-02-13 | 刘胜 | Encapsulation method for high-brightness white light LED |
| CN101521257A (en) * | 2009-04-20 | 2009-09-02 | 南京工业大学 | White-light LED package structure with prefabricated fluorescent powder film |
| CN102136542A (en) * | 2010-01-22 | 2011-07-27 | 中外合资江苏稳润光电有限公司 | White light-emitting diode (LED) manufacturing method |
| CN103022326A (en) * | 2012-12-26 | 2013-04-03 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
-
2014
- 2014-12-25 CN CN201410818665.3A patent/CN104600183B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1909254A (en) * | 2005-08-03 | 2007-02-07 | 刘士龙 | Producing method for base plate type white light diode and its constitution |
| CN101123284A (en) * | 2006-08-09 | 2008-02-13 | 刘胜 | Encapsulation method for high-brightness white light LED |
| CN101521257A (en) * | 2009-04-20 | 2009-09-02 | 南京工业大学 | White-light LED package structure with prefabricated fluorescent powder film |
| CN102136542A (en) * | 2010-01-22 | 2011-07-27 | 中外合资江苏稳润光电有限公司 | White light-emitting diode (LED) manufacturing method |
| CN103022326A (en) * | 2012-12-26 | 2013-04-03 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104600183A (en) | 2015-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106876534B (en) | A kind of packaging method of flip-chip grade LED light source | |
| CN101582475B (en) | Method for coating phosphor powder layer on LED chip and manufacture of LED device | |
| CN101533886B (en) | A luminous module encapsulation method | |
| CN101789483A (en) | Coating method of light-emitting diode fluorescent powder | |
| CN101599521A (en) | A kind of encapsulating structure of great power LED | |
| CN101521257B (en) | White-light LED package structure with prefabricated fluorescent powder film and preparation method | |
| CN100596343C (en) | Method for coating fluorescent powder for high-power white light-emitting diode | |
| CN103165797A (en) | Preformed phosphor thin film for white light-emitting diode (LED) thin film packaging and preparation method for thin film | |
| CN102931328B (en) | A kind of preparation method of LED packaging body | |
| CN102856478A (en) | Power type light-emitting diode, light-emitting diode bracket and preparation method thereof | |
| CN103367616B (en) | A kind of LED module and its manufacturing process of COB encapsulation | |
| CN103022326B (en) | Intensive packaging method of LEDs | |
| CN202888243U (en) | Power-type light emitting diode and light emitting diode support | |
| CN104600183B (en) | The preparation method of LED white light-emitting diodes | |
| CN101436628B (en) | Technological process for coating fluorescent powder of high-power chip | |
| CN103367612A (en) | LED (Light Emitting Diode) packaging structure and process | |
| CN106876543A (en) | A kind of QFN surface mounts RGB LED packages and its manufacture method | |
| CN106058027A (en) | LED light source with lens and manufacturing method of LED light source | |
| CN203491298U (en) | Led packaging structure | |
| CN101694861A (en) | Encapsulation method preventing LED fluorescent powder from precipitation | |
| CN201893379U (en) | LED (light-emitting diode) packaging structure | |
| CN102610600B (en) | High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module | |
| CN209045604U (en) | A kind of novel instruction type LED light sources encapsulating structure | |
| CN202736977U (en) | COB packaged LED module | |
| CN104576877A (en) | Manufacturing method of packaging element of light emitting diode and packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Applicant after: Changzhou Galaxy century microelectronics Limited by Share Ltd Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Applicant before: Zhangzhou Yinheshiji Micro-Electronic Co., Ltd. |
|
| COR | Change of bibliographic data | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |