CN104597978B - Electronic device and its circuit module - Google Patents
Electronic device and its circuit module Download PDFInfo
- Publication number
- CN104597978B CN104597978B CN201510032275.8A CN201510032275A CN104597978B CN 104597978 B CN104597978 B CN 104597978B CN 201510032275 A CN201510032275 A CN 201510032275A CN 104597978 B CN104597978 B CN 104597978B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit
- substrate
- circuit module
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention is about a kind of electronic device and its circuit module, circuit module supplies to be electrically connected with circuit board device, circuit board device includes power output end portion, circuit module includes substrate, booster circuit and piasmatron, substrate has an at least perforation, and substrate with circuit board device with the direction of thickness side opposite direction for being engaged；Booster circuit is set to substrate comprising the electronic component of an at least conducting wire and plural number and conducting wire electric connection, conducting wire includes that the power input end that can be electrically connected with power output end portion and two power output ends, electronic component are arranged in perforation；The opposite end of piasmatron has the electrode being electrically connected with power output end.Electronic device includes circuit module, and the circuit board device being electrically connected with circuit module, circuit board device are engaged with the substrate of circuit module with the direction of thickness side opposite direction.It when the present invention is inserted in motherboard, is not easy to take up space, more electronic devices can be made to be inserted on motherboard.
Description
Technical field
The present invention is about a kind of electronic device and its circuit module.
Background technology
The circuit module of general electronic device includes a circuit board, plural electronic component and a Port, several electronics
Element is directly welded in circuit board, and Port and circuit board are electrically connected and can be connected to computer motherboard, and such one
Come, when circuit module is connected on motherboard, you can the power supply road module for transmitting motherboard uses.TaiWan, China patent
Circuit module disclosed by M456042 belongs to such.
It is set in circuit board however, the electronic component of such circuit module is directly viscous, wherein some electronic components unavoidably
Thickness is larger, when it is set on substrate, it will cause circuit module blocked up；In addition to this, between the slot of each motherboard
Gauge must meet the limitation of its thickness from the electronic device for having specific standard, therefore plugging, if in addition by circuit module
When covering other shells, then circuit module being plugged in motherboard, it will extremely take up space, cause part slot idle.Cause
This, it is necessary to electronic device and its circuit module a kind of novel and with progressive are provided, to solve the above problems.
Invention content
The main purpose of the present invention is to provide a kind of electronic device and its circuit module, the substrate of the circuit module has
An at least perforation, at least an electronic component are arranged in the perforation, thus, you can reduce integral thickness, and it is made to plug
It when motherboard, is less susceptible to take up space, and makes more electronic devices that can be inserted in motherboard.
To reach above-mentioned purpose, the present invention uses following technical scheme：
A kind of circuit module, the circuit module supply to be electrically connected with a circuit board device, which includes
One power output end portion, the circuit module include a substrate, a booster circuit and a piasmatron；The substrate has at least consistent
Hole, the substrate with the circuit board device with the direction of thickness side opposite direction for being engaged；The booster circuit is set to the substrate, and should
Booster circuit includes an at least conducting wire and the electronic component that plural number is electrically connected with an at least conducting wire, this at least one
Conducting wire includes the power input end and two power output ends that a confession is electrically connected with the power output end portion, and at least one should
Electronic component is arranged in the perforation；The opposite end of the piasmatron has two electrodes being electrically connected with two power output end.
Further,
Each electrode includes one being located inside the piasmatron and being hollow electrode cap cylinder, and two electrode cap cylinders are in coaxially setting
It sets.
The power input end supplies and memory body, display card, network card or printing equipped with the power output end portion
Circuit board is electrically connected.
The plural number electronic component includes plural passive device and an at least transformer, electrical between the plural number passive device
The low pressure booster circuit of the electric connection power input end is connected and composed, which constitutes one and be electrically connected
High voltage step-up circuit between the low pressure booster circuit and two power output end.
The plural number electronic component further includes a processing unit, which includes an electric connection power input
The frequency changer circuit of end and the low pressure booster circuit.
To reach above-mentioned purpose, it the present invention also provides a kind of electronic device, including a foregoing circuit module, also wraps
A circuit board device being electrically connected with the circuit module is included, the substrate of the circuit board device and the circuit module is with thickness
The direction of side opposite direction engages.
Further,
The circuit board device further includes the electrical insert row of a confession and the electrical grafting of electrical slot of computer motherboard, should
Electrical insert row is set to side of the circuit board device relative to the circuit module.
An at least bridgeware is also associated between the circuit board device and the substrate of circuit module, each bridgeware is crossed over
The thickness side that the circuit board device is engaged with the substrate of circuit module, the both ends of each bridgeware are respectively and fixedly connected in described
The substrate of circuit board device and circuit module.
Electronic device further includes two cooling fins, which covers respectively in the opposite sides of the electronic device.
Electronic device further includes an at least shells, and the shells is parallel with a wherein cooling fin in the side of the electronic device
Ground is halved together.
The advantage of the invention is that：
There is the circuit module of the present invention an at least perforation, at least an electronic component to be arranged in the perforation, can reduce entirety
Thickness, and when it being made to be inserted in motherboard, be less susceptible to take up space, and can make more electronic devices that can be inserted in motherboard
On.
Description of the drawings
Fig. 1 is a preferred embodiment of the present invention electronic device stereogram.
Fig. 2 is a preferred embodiment of the present invention electronic device exploded view.
Fig. 3 is a preferred embodiment of the present invention circuit module and circuit board device constitutional diagram.
Fig. 4 is a preferred embodiment of the present invention circuit module structural relation block diagram.
Fig. 5 is a preferred embodiment of the present invention electronic device partial enlarged view.
Specific implementation mode
The possible embodiment of the present invention is only illustrated with embodiment below, is not so to limit the model of the invention to be protected
Farmland is stated in advance.
It please refers to Fig.1 to 4, shows that the preferred embodiment of the present invention, circuit module 1 of the invention supply and a circuit base
Panel assembly 40 be electrically connected, the circuit board device 40 include a power output end portion 200, circuit module 1 include a substrate 10,
One booster circuit 20 and a piasmatron 30.Furtherly, the low-tension supply that booster circuit 20 can input circuit board device turns
It is changed to High Level AC Voltage or high-voltage pulse type direct current, to supply the use of piasmatron 30, and so that piasmatron 30 is generated plural item and dodges
Electric shape light.
Substrate 10 has an at least perforation 100, and electronic component is worn wherein；Substrate 10 for circuit board device 40 with
The direction of thickness side opposite direction engages.In the present embodiment, substrate 10 has plural perforation 100, is worn for each electronic component
In each perforation 100；It will be appreciated that also can only have a perforation and there is plural electronic component to wear wherein；Also or, substrate only has
There is a perforation, and the electronic component that one relatively takes up space is plugged wherein.
Booster circuit 20 is set to substrate 10, and booster circuit 20 includes that an at least conducting wire and plural number and at least one are conductive
The electronic component 202 that circuit is electrically connected, at least a conducting wire include an electricity for being electrically connected with power output end portion 200
Source input end 201 and two power output ends 23, at least an electronic component 202 are arranged in perforation 100.More particularly, conductive
Circuit is embedded in substrate 10, and in the present embodiment, substrate 10 constitutes a printed circuit board with conducting wire；Certain conducting wire also may be used
It is set on substrate otherwise.Furtherly, the low-voltage DC that booster circuit 20 can will be inputted by power input end 201
High Level AC Voltage is converted to, and is used via two power output ends 23 supply piasmatron 30；It will be appreciated that booster circuit 20 is also
Low-voltage DC can be converted to high-voltage pulse type direct current.In the present embodiment, power input end 201 for it is defeated equipped with power supply
The memory body (circuit board device 40) for going out end 200 is electrically connected, and can make memory body (circuit board device 40) and circuit mould
Group 1 less takes up space after engaging；Certain power input end also for display card, network card equipped with power output end portion
Or printed circuit board is electrically connected.
More particularly, plural electronic component 202 includes plural passive device 210 and an at least transformer 220, plural quilt
It is electrically connected between dynamic element 210 and constitutes a low pressure booster circuit 21 for being electrically connected power input end 201, it can be by circuit base
The direct current that panel assembly 40 provides is converted to alternating current or pulse DC electricity.An at least transformer 220 constitutes one and is electrically connected
Low-tension supply can be converted to high-voltage electricity by the high voltage step-up circuit 22 between low pressure booster circuit 21 and two power output ends 23
Source, to supply the use of piasmatron 30.
In more detail, plural electronic component 202 further includes a processing unit 24, which electrically connects including one
The frequency changer circuit 240 for connecing power input end 201 and low pressure booster circuit 21 can have first by frequency changer circuit 240 by one
The power supply of frequency is converted to a power supply with second frequency, furtherly, by the switching of frequency, piasmatron 30 can be made to generate
The light of different disturbance effects.
The opposite end of piasmatron 30 has the electrode 31 that two and two power output ends 23 are electrically connected.In more detail,
Inert gas with low pressure in piasmatron 30, and it is coated with fluorescent material in the inner wall of piasmatron 30, it, can when passing to high-voltage electricity
So that inert gas is dissociated and generates fulgurans light.More particularly, each electrode 31 include one be located at the inside of piasmatron 30 and
For hollow electrode cap cylinder 310, two electrode cap cylinders 310 are in coaxial arrangement, can project light along 310 periphery of electrode cap cylinder,
And light is made more to dissipate (as shown in Figure 5), compared to concentrating light, more aesthetics caused by traditional filament electrode.
The present invention also provides a kind of electronic devices 2, including a foregoing circuit module 1, further include one and circuit mould
The substrate 10 of the circuit board device 40 that group 1 is electrically connected, circuit board device 40 and circuit module 1 is with thickness side opposite direction
Direction engages, and in the present embodiment, circuit board device 40 is memory body, and certain circuit board device also can be display card, network
Card or printed circuit board；The substrate of certain circuit module can also be integrally formed with circuit board device.
Circuit board device 40 further includes one for the electrical insert row with an electrical electrical grafting of slot of a computer motherboard
41, electrical insert row 41 is set to side of the circuit board device 40 relative to circuit module 1, it will be understood that, electrical insert row 41 can
To meet peripheral component connection interface (Peripheral Component Interconnect, PCI), quick peripheral element connects
Connect interface (Peripheral Component Interconnect Express, PCI-E) or other connecting interface specifications
Insert row, to make circuit board device 40 carry out data transmission with computer motherboard by electrical insert row 41.
An at least bridgeware 42, each bridgeware are also associated between circuit board device 40 and the substrate of circuit module 1 10
The 42 thickness sides engaged across circuit board device 40 with the substrate 10 of circuit module 1, the both ends of each bridgeware 42 are simultaneously divided
It is not fixed in the substrate 10 of circuit board device 40 and circuit module 1, it will be understood that, a part for these bridgewares 42 is available
Make the power delivery of circuit board device 40 to the conducting wire of circuit module 1.
Electronic device 2 further includes two cooling fins 3, which covers respectively in the opposite sides of electronic device 2, into
One step says that two cooling fins 3 are covered respectively in the one side of circuit board device 40, produced when circuit board device 40 can be made to operate
Thermal energy shed, prevent electronic device 2 cause because of overheat heat when or damage；It will be appreciated that can also be not provided with cooling fin.Electricity
Sub-device 2 further includes an at least shells 4, and shells 4 is in parallelly to be halved together with a wherein cooling fin 3 in the side of electronic device 2,
In the present embodiment, electronic device 2 includes two shells 4, by two shells 4 and two cooling fins 3 can by most circuit module 1 with
Circuit board device 40 coats wherein, it is made to be not easy to be damaged by external factor.It will be appreciated that shells can be cooling material,
And make shells that there is heat dissipation effect；In the component that other embodiment, cooling fin can also be integrally formed with shells, while there is dress
Decorations, protection and heat dissipation effect.
To sum up, there is circuit module of the present invention an at least perforation, at least an electronic component to be arranged in the perforation, and such one
Come, when can reduce integral thickness, and it being made to be inserted in motherboard, be less susceptible to take up space, and more electronic devices can be made
It can be inserted on motherboard.
In conclusion in the overall construction design of the present invention, practicability and benefit, strictly complies fully in industry and develop
Required and disclosed architecture invention be also there is unprecedented innovative structure, so its have " novelty " should without doubt,
The present invention can have more the enhancement of effect compared with known structure again, therefore also have " progressive ".
Claims (10)
1. circuit module, for being electrically connected with a circuit board device, which includes a power output end portion,
It is characterized in that, which includes：
One substrate has an at least perforation, and the substrate with the circuit board device with the direction of thickness side opposite direction for being engaged；
One booster circuit is set to the substrate, including an at least conducting wire and plural number are electrically connected with an at least conducting wire
Electronic component, at least a conducting wire is embedded in the substrate for this, the substrate and the print that at least a conducting wire is integrally formed
Printed circuit board, the electronic component are to be electrically connected with plural pin with the mutually independent component of the printed circuit board, the electronic component
To the conducting wire of the printed circuit board, which includes an electricity for being electrically connected with the power output end portion
Source input end and two power output ends, at least a perforation is not closed out for this, at least one electronic component be arranged in the perforation, with
The hole wall of the perforation has gap and from the opening of the perforation with respect to the two ends exposure external world；
One piasmatron, opposite end have two electrodes being electrically connected with two power output end.
2. circuit module as described in claim 1, which is characterized in that each electrode includes one inside the piasmatron and is
Hollow electrode cap cylinder, two electrode cap cylinders are in coaxial arrangement.
3. circuit module as described in claim 1, which is characterized in that the power input end supply with it is defeated equipped with the power supply
Memory body, display card, network card or the printed circuit board for going out end are electrically connected.
4. circuit module as described in claim 1, which is characterized in that the plural number electronic component include plural passive device and
An at least transformer is electrically connected between the plural number passive device and constitutes a low pressure liter for being electrically connected the power input end
Volt circuit, an at least transformer constitute a height being electrically connected between the low pressure booster circuit and two power output end
Press booster circuit.
5. circuit module as claimed in claim 4, which is characterized in that the plural number electronic component further includes a processing unit,
The processing unit includes the frequency changer circuit of the electric connection power input end and the low pressure booster circuit.
6. a kind of electronic device includes just like the circuit module described in any one of claim 1 to 5, which is characterized in that also
The substrate of the circuit board device being electrically connected with the circuit module including one, the circuit board device and the circuit module is with thickness
Spend the direction engagement of side opposite direction.
7. electronic device as claimed in claim 6, which is characterized in that the circuit board device further includes a confession and computer master
The electrical insert row of the electrical grafting of electrical slot of machine plate, the electrical insert row are set to the circuit board device relative to the circuit
The side of module.
8. electronic device as claimed in claim 6, which is characterized in that the circuit board device and the substrate of circuit module it
Between be also associated with an at least bridgeware, each bridgeware crosses over the thickness that the circuit board device is engaged with the substrate of circuit module
Side is spent, the both ends of each bridgeware are respectively and fixedly connected with the substrate in the circuit board device and circuit module.
9. electronic device as claimed in claim 6, which is characterized in that further include two cooling fins, which covers respectively
In the opposite sides of the electronic device.
10. electronic device as claimed in claim 9, which is characterized in that further include an at least shells, the shells is in the electronics
The side of device is parallelly halved together with a wherein cooling fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510032275.8A CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510032275.8A CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104597978A CN104597978A (en) | 2015-05-06 |
| CN104597978B true CN104597978B (en) | 2018-10-02 |
Family
ID=53123826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510032275.8A Expired - Fee Related CN104597978B (en) | 2015-01-22 | 2015-01-22 | Electronic device and its circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104597978B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981298A (en) * | 2016-01-15 | 2017-07-25 | 全何科技股份有限公司 | Memory module and its manufacture method |
| CN111258385B (en) * | 2018-12-03 | 2023-03-17 | 技嘉科技股份有限公司 | Memory module with screen and mainboard module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202854799U (en) * | 2012-09-07 | 2013-04-03 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| CN203134376U (en) * | 2013-02-07 | 2013-08-14 | 宇帷国际股份有限公司 | Dynamic random access memory |
| CN103929895A (en) * | 2013-01-15 | 2014-07-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8248771B2 (en) * | 2009-01-15 | 2012-08-21 | Sea Sonic Electronics Co., Ltd. | Power supply of personal computers equipped with a modular conversion circuit |
| US8199463B2 (en) * | 2009-04-06 | 2012-06-12 | Fsp Technology Inc. | Output architecture of power supply |
-
2015
- 2015-01-22 CN CN201510032275.8A patent/CN104597978B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202854799U (en) * | 2012-09-07 | 2013-04-03 | 宇帷国际股份有限公司 | Dynamic random access memory body |
| CN103929895A (en) * | 2013-01-15 | 2014-07-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element |
| CN203134376U (en) * | 2013-02-07 | 2013-08-14 | 宇帷国际股份有限公司 | Dynamic random access memory |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104597978A (en) | 2015-05-06 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170413 Address after: Hongkong Chinese 95 how Ming Street, Kwun Tong Kowloon Sata center 10 building K room Applicant after: Letter Technology Co., Ltd. Address before: Taichung City, Taiwan, China Applicant before: AVEXIR TECHNOLOGIES CORP. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181002 Termination date: 20210122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |