CN104591531A - Cutting process - Google Patents
Cutting process Download PDFInfo
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- CN104591531A CN104591531A CN201510026418.4A CN201510026418A CN104591531A CN 104591531 A CN104591531 A CN 104591531A CN 201510026418 A CN201510026418 A CN 201510026418A CN 104591531 A CN104591531 A CN 104591531A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a cutting process which is suitable for cutting a workpiece provided with an upper base plate and a lower base plate which are arranged relatively. The cutting process comprises the following steps: setting a horizontal cutting line and a vertical cutting line on the upper base plate, and providing a cutting device to separate the upper base plate into multiple first small base plates along the horizontal cutting line and the vertical cutting line; slivering to obtain a workpiece with multiple first small base plates; setting a curve cutting line on the lower base plate, and providing a cutting light beam to separate the lower base plate into multiple second small base plates with at least one chamfer angle along the curve cutting line, wherein the length of the second small base plates is greater than that of the first small base plates; and slivering to obtain multiple workpiece units. By adopting the cutting process, the problems of low efficiency and low yield rate caused by cutter wheel cutting oblique lines or chamfer angles are avoided, and the problem of ITO and metal lead burns caused by laser cutting is solved, so that the efficiency and reliability are improved; and meanwhile, space is saved to be beneficial for increasing the screen occupation ratio, and a more perfect effect can be achieved.
Description
Technical field
The present invention relates to a kind of cutting technique, particularly relate to a kind of first with the cutting technique cutting hypocoxa after break bar cutting upper substrate with the cutting light velocity.
Background technology
Because human consumer constantly pursues widescreen and narrow limit to the intelligent mobile terminal such as smart mobile phone and Intelligent worn device, the ratio of display screen area and complete machine area namely shield accounting always toward larger future development.Comparatively speaking, the intelligent mobile terminal not only outward appearance perfection that screen accounting is large, and be convenient for carrying.
Current intelligent mobile terminal is based on display panels, display panels mainly formed by clipping one deck liquid crystal layer between the upper and lower base plate be oppositely arranged and this upper and lower base plate, this substrate is generally thin-film transistor element array substrate and colored optical filtering substrates, and the more substrate used is glass substrate at present, display panels is provided with ITO and metal lead wire simultaneously, when reaching large screen accounting, how to promote upper and lower base plate and both realize large screen accounting when carrying out abnormity cutting, do not produce again high fraction defective and do not burn ITO and metal lead wire are very important.In current production, on larger glass, usually carry out abnormity cutting obtain multiple touch-control display module, then cutting obtains junior unit.Abnormity cutting is as one of important step in touch-control display module manufacturing process, and cutting method main at present has laser cutting technique and break bar cutting technique.
Existing cutting technique has plenty of and carries out the whole large stretch of display panels of abnormity cutting with break bar cutting or laser cutting or both combinations simultaneously.When adopting separately break bar to carry out abnormity cutting, break bar cutter head needs when cutting each chamfering to decline, rise once, affects integral cutting efficiency; And due to the characteristic of break bar cutting itself, cutter spacing is owing to being at glass edge under break bar, easily occurs that bight collapses the large situation in limit or footpath, bight, produce high fraction defective and affect attractive in appearance, large screen accounting cannot be reached.When adopting separately laser to carry out abnormity cutting, there is the hidden danger of ITO on laser burn display panels and metal lead wire, affect the display performance of display panels and easily cause defective products.When combine both using whole large stretch of display panels is cut simultaneously time, be conducive to the risk and the cutting fraction defective that reduce burn ITO and metal lead wire, and technique relative complex.
Chinese patent application CN201110400362 discloses a kind of glass substrate cutting unit, and this glass substrate cutting unit comprises a laser beam emitting device and a cutting unit.This laser beam emitting device Emission Lasers bundle in glass baseplate surface to be cut, with glass baseplate surface formed microflute; This cutting unit, for cutting in microflute position glass substrate, comprises a break bar stationary installation and fixing diamond break bar thereon.Laser beam emitting device Emission Lasers bundle is utilized to form glass baseplate surface microflute, make diamond break bar can embed microflute cutting in the position of microflute, thus the frictional force between diamond break bar and glass substrate can be increased, preventing from the diamond break bar when cutting from producing to slide, improving the tolerance range of cutting.Although the cutting unit be oppositely arranged also can be adopted to cut double glazing, but embed microflute owing to still adopting break bar to cut, product full wafer is easily caused to break, product yield lower (the yield difference of current different manufacturers when causing break bar to cut, major part is about 50 ~ 70%), cause serious waste, improve cost, limit production capacity.
Summary of the invention
In order to solve above-mentioned the deficiencies in the prior art, the invention provides a kind of cutting technique, this cutting technique first adopts the cutting units such as break bar to carry out cutting splitting to the upper substrate of display panels, the cutting light beams such as laser are adopted the hypocoxa of display panels to be carried out to the cutting splitting of chamfering etc. again, obtain multiple LCD Slab element, the poor efficiency that this cutting technique not only avoids break bar cutting oblique line or chamfering to cause, the problem of low yield, and solve the problem that laser cutting causes ITO and metal lead wire burn, thus raise the efficiency and reliability; Save space simultaneously and be beneficial to the increasing of screen accounting, LCD board finished product can accomplish more ultimate attainment perfection under certain volume.
Technical problem to be solved by this invention is achieved by the following technical programs:
A kind of cutting technique, be suitable for cutting one and have the workpiece being oppositely arranged upper and lower base plate, described cutting technique comprises:
S1, on upper substrate, set horizontal cut line and vertical cutting secant, provide the horizontal cut line of a cutting unit along setting and vertical cutting secant upper substrate to be separated into multiple first little plate base;
S2, carry out sliver and obtain with the workpiece of multiple first little plate base;
S3, on hypocoxa setting curve line of cut, provide a cutting light beam, along curvilinear cut line, hypocoxa is separated into multiple the second little plate base with at least one chamfering; The length of described second little plate base is greater than the length of described first little plate base;
S4, carry out sliver and obtain multiple work cell with the first little plate base and the second little plate base.
Preferably, described cutting unit comprises the first locating platform and the break bar cutting mechanism that is positioned at above described first locating platform and the first image mechanism.
Preferably, described break bar cutting mechanism is diamond tool wheel cutting mechanism.
Preferably, described cutting light beam is laser cutting light beam.
Preferably, the curvilinear cut line set in step S3 comprises at least one camber line and at least four straight lines.
Preferably, described workpiece is display panels.
The present invention has following beneficial effect:
(1) this cutting technique can avoid the problem that efficiency is low and yield is low that break bar cutting oblique line or chamfering cause, and solves the problem that laser cutting causes ITO and metal lead wire burn, thus raises the efficiency and reliability;
(2) compared to traditional straight cuts, the LCD board finished product of abnormity cutting can save space, and be beneficial to screen accounting and strengthen, finished product can accomplish more ultimate attainment perfection under certain volume;
(3) display panels that this cutting technique (i.e. abnormity cutting) is shaping, owing to saving space, the stopping property of mobile phone can be accomplished better, and in waterproof, Defend salt fog, the design of anti-drop aspect can better realize.
Accompanying drawing explanation
Figure 1A to Fig. 1 D is the schematic flow sheet of the cutting technique of one embodiment of the invention;
Fig. 2 is the work cell schematic perspective view after one embodiment of the invention cutting;
Fig. 3 is the schematic top plan view of another embodiment of the present invention;
Fig. 4 is the schematic top plan view of further embodiment of this invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be described in detail.
Cutting technique provided by the invention is applicable to cutting one workpiece 1, and described workpiece 1 is for having the workpiece 1 of the upper and lower base plate be oppositely arranged.Described substrate can be glass substrate or other hard crisp substrates etc.Described substrate can be transparent or opaque substrate.Described workpiece 1 can be the large stretch of display panels comprising multiple LCD Slab element (i.e. work cell 10), can also be LCD boards half-finished product unit, but be not limited to this.
The present embodiment for the upper lower glass substrate of display panels (LCD), but is not limited to this.
The present embodiment adopts break bar cutting unit and laser cutting device priority cut the upper substrate 11 of described workpiece 1 and hypocoxa 12 but automatically do not rupture respectively, needs to carry out default line of cut before cutting.Described break bar cutting unit (scheming not shown) comprise one for carry described workpiece 1 the first locating platform, be located at the break bar cutting mechanism above described first locating platform and have and automatically grab the first image mechanism of mark to bit function.Described laser cutting device (scheming not shown) comprise one for carry described workpiece 1 the second locating platform, be located at the light beam cutting mechanism above described second locating platform and have and automatically grab the second image mechanism of mark to bit function.During specific implementation, described break bar cutting mechanism and light beam cutting mechanism can also be combined in a cutting unit, can use simultaneously or asynchronously use.Wherein, described break bar cutting mechanism is preferably diamond tool wheel cutting mechanism; Described first locating platform and the second locating platform may be the same or different; Described first image mechanism and the second image mechanism are all preferably ccd video camera, and ccd video camera is a kind of solid state camera, and CCD is charge-coupled type electrooptical device, makes by integrated circuit technology.It stores and the information of transmission with the form of charge packet, primarily of part compositions such as photosensitive unit, input structure and export structures.CCD have face battle array and linear array point.What photosensitive unit was in line is called line array CCD, and the pixel of face formation CCD device is arranged as a plane, and it comprises the combination of some row and columns.Ccd video camera is prior art, does not specifically describe at this.Described light beam cutting mechanism adopts a LASER Light Source as the transmitting illuminant of cutting light beam, and this LASER Light Source can be carbon dioxide laser, picosecond laser or other laser be applicable to.For break bar cutting unit and laser cutting device, not special requirement, commercially available break bar cutting machine and laser cutting machine all can use.
Step S1, please refer to Figure 1A, the upper substrate 11 of described workpiece 1 sets horizontal cut line 111 and vertical cutting secant 112, and the cutting path of cutting unit and the cutting parameter of default cutter head are set according to the horizontal cut line 111 of setting and vertical cutting secant 112; Described workpiece 1 is positioned at described first locating platform and automatically grabs mark contraposition by the first image mechanism; Along the horizontal cut line 111 set and vertical cutting secant 112, upper substrate 11 is separated into multiple first little plate base 110 by break bar cutting mechanism, but does not automatically rupture.
During specific implementation, according to practical situation, substantially set level and vertical cutting secant 112 and cutting path upper, this cutting path is preferably and has first cut again along Y direction (vertical direction) cutting along X-direction (horizontal direction), but is not limited to this.The preferred diamond segment of described cutter head, the cutting parameter of cutter head at least comprises cutter dark (the lower cutter degree of depth), cutter pressure (lower cutter pressure) and cutter speed (cutting speed in feet per minute).Shown cutting parameter is important parameter in described cutting technique, because break bar cutting is just cut the upper substrate 11 of described workpiece 1, do not relate to and hypocoxa 12 is cut, and upper and lower base plate 12 spacing be oppositely arranged is less again, therefore, cutter head cutting parameter arranges not good, can cause damage even form defective products to workpiece 1.Preferably but do not limit, cutter pressure is 0.06 ~ 0.1MPa, and cutter is 0.04 ~ 0.1mm deeply, and cutter speed is 400 ~ 500mm/S.
Step S2, please parameter Figure 1B, carry out sliver and obtain workpiece 1 with multiple first little plate base 110:
During specific implementation, can adopt sliver mode manually or automatically, preferably automatic sliver mode, suitably impacts described workpiece 1 back side by breaking machine, forms the workpiece 1 with multiple first little plate base 110 as shown in Figure 1B.The described workpiece 1 with multiple first little plate base 110 also remains with complete large stretch of hypocoxa 12.
Step S3, please refer to Fig. 1 C, setting curve line of cut on hypocoxa 12, and cutting path and light beam cutting parameter are set according to the curvilinear cut line of setting; The workpiece 1 with multiple first little plate base 110 of step S2 to be positioned on described second locating platform and to be undertaken grabbing mark contraposition by the second image mechanism; There is provided a cutting light beam, along curvilinear cut line, hypocoxa 12 is separated into multiple the second little plate base 120 with at least one chamfering 123 by light beam cutting mechanism, but automatically do not rupture.The length of wherein said second little plate base 120 is greater than the length of described first little plate base 110, and the width of described second little plate base 120 is equal to or greater than the width of described first little plate base 110.
During specific implementation, after break bar cutting splitting, directly can carry out the cutting of cutting light beam, also can blow with air gun and drench the few residual glass powder in workpiece 1 surface.
During specific implementation, can according to practical situation as the radius of chamfering 123 or the camber line etc. of different curvature carry out setting curve line of cut, this curvilinear cut line can be at least one camber line, 121, at least four straight line 122(as shown in Figure 1 C, when overlooking, three straight lines 122 of curvilinear cut line overlap with three sides of the first little plate base 110), to be connected with straight line 122 by camber line 121 and to be closed into curvilinear cut line, but be not limited to this.Described camber line 121 can form herring-bone curve and/or star closed curve, and this herring-bone curve is that adjacent two camber lines 121 be in outer peripheral adjacent two work cell 10 combine; This star closed curve is the closed curve that combines of adjacent four camber lines 121 in adjacent four work cell 10 of workpiece 1 inside.
Described light beam cutting parameter at least comprises laser power and speed, and preferably but do not limit, laser power is about 20W, laser speed is 400mm/s.
Step S4, please refer to Fig. 1 D, carry out sliver and obtain multiple work cell 10 with the first little plate base 110 and the second little plate base 120.During specific implementation, sliver mode manually or automatically can be adopted, preferably automatically sliver mode, form the multiple work cell 10 with the first little plate base 110 and the second little plate base 120 as Fig. 1 D.
Shown in Fig. 2, when chamfering 123 is two, preferably chamfering 123 is arranged on pilot circuit one side of work cell 10 inside, is generally the lower side of hypocoxa, limit, left side, right edge etc.Fig. 3,4 is respectively the work cell schematic top plan view that chamfering 123 is three and four, but is not limited to this.
During specific implementation, described cutting technique also comprises chamfers limit and clean etc. to described work cell 10, described in chamfer limit and clean as prior art, do not specifically describe at this.
Described cutting technique adopts break bar cutting unit and laser cutting device priority to cut the upper substrate 11 of described workpiece 1 and hypocoxa 12 respectively, the problem that efficiency is low and yield is low that break bar cutting oblique line or chamfering 123 cause can be avoided, and solve the problem that laser cutting causes ITO and metal lead wire burn, thus raise the efficiency and reliability; Compared to traditional straight cuts, the LCD board finished product of abnormity cutting can save space, and be beneficial to screen accounting and strengthen, finished product can accomplish more ultimate attainment perfection under certain volume.
In another embodiment, can be arranged on same cutting unit by break bar cutting mechanism and the set of light beam cutting mechanism, this break bar cutting mechanism and light beam cutting mechanism can be arranged or the setting of same vertical direction in same level direction.Cutting technique in this embodiment first can carry out break bar cutting by the upper substrate 11 of break bar cutting mechanism to described workpiece 1 and obtain with the workpiece 1 of multiple first little plate base 110, then carries out laser cutting by light velocity cutting mechanism to its hypocoxa 12 and obtain multiple work cell 10 with the first little plate base 110 and the second little plate base 120; The break bar cutting mechanism that is oppositely arranged up and down and laser cutting mechanism can also be utilized to cut the upper substrate 11 of described workpiece 1 and hypocoxa 12 respectively, synchronously can carry out or asynchronously to carry out, obtain multiple work cell 10 with the first little plate base 110 and the second little plate base 120.
The present inventor, by great many of experiments, for being the display panels of 0.1 ~ 0.5mm at upper and lower base plate thickness, adopts cutters deeply more suitable in 0.04 ~ 0.1mm scope.
In sum, compared with existing cutting technique, the problem that efficiency is low and yield is low that this cutting technique can avoid break bar cutting oblique line or chamfering 123 to cause, and the problem solving that laser cutting causes ITO and metal lead wire burn, thus raise the efficiency and reliability; Compared to traditional straight cuts, the LCD board finished product of abnormity cutting can save space, and be beneficial to screen accounting and strengthen, finished product can accomplish more ultimate attainment perfection under certain volume; The display panels that this cutting technique (i.e. abnormity cutting) is shaping, owing to saving space, the stopping property of mobile phone can be accomplished better, and in waterproof, Defend salt fog, the design of anti-drop aspect can better realize.
The above embodiment only have expressed embodiments of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; in every case the technical scheme adopting the form of equivalent replacement or equivalent transformation to obtain, all should drop within protection scope of the present invention.
Claims (7)
1. a cutting technique, be suitable for cutting one and have the workpiece being oppositely arranged upper and lower base plate, it is characterized in that, described cutting technique comprises:
S1, on upper substrate, set horizontal cut line and vertical cutting secant, provide the horizontal cut line of a cutting unit along setting and vertical cutting secant upper substrate to be separated into multiple first little plate base;
S2, carry out sliver and obtain with the workpiece of multiple first little plate base;
S3, on hypocoxa setting curve line of cut, provide a cutting light beam, along curvilinear cut line, hypocoxa is separated into multiple the second little plate base with at least one chamfering; The length of described second little plate base is greater than the length of described first little plate base;
S4, carry out sliver and obtain multiple work cell with the first little plate base and the second little plate base.
2. cutting technique according to claim 1, is characterized in that, described cutting unit comprises the first locating platform and the break bar cutting mechanism that is positioned at above described first locating platform and the first image mechanism.
3. cutting technique according to claim 2, is characterized in that, described break bar cutting mechanism is diamond tool wheel cutting mechanism.
4. cutting technique according to claim 1, is characterized in that, the length of described second little plate base is greater than the length of described first little plate base, and the width of described second little plate base is equal to or greater than the width of described first little plate base.
5. cutting technique according to claim 1, is characterized in that, described cutting light beam is laser cutting light beam.
6. cutting technique according to claim 1, is characterized in that, the curvilinear cut line set in step S3 comprises at least one camber line and at least four straight lines.
7. cutting technique according to claim 1, is characterized in that, described workpiece is display panels.
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| CN201510026418.4A CN104591531A (en) | 2015-01-20 | 2015-01-20 | Cutting process |
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| CN201510026418.4A CN104591531A (en) | 2015-01-20 | 2015-01-20 | Cutting process |
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| CN106932944A (en) * | 2017-04-28 | 2017-07-07 | 上海天马有机发光显示技术有限公司 | A kind of display panel and preparation method thereof |
| CN107102465A (en) * | 2017-06-20 | 2017-08-29 | 合肥市惠科精密模具有限公司 | A kind of liquid crystal display cutting technique |
| CN107180891A (en) * | 2017-04-11 | 2017-09-19 | 中国电子科技集团公司第十研究所 | A kind of dicing method of infrared detector |
| CN107919058A (en) * | 2016-10-07 | 2018-04-17 | 三星显示有限公司 | Display device and its manufacture method |
| CN108044240A (en) * | 2017-12-19 | 2018-05-18 | 东莞市盛雄激光设备有限公司 | The processing method and sliver apparatus of a kind of liquid crystal display |
| CN109279769A (en) * | 2018-10-19 | 2019-01-29 | 大族激光科技产业集团股份有限公司 | A kind of OLED double glazing cutting splitting processing method and production line |
| CN109387958A (en) * | 2017-08-09 | 2019-02-26 | 上海和辉光电有限公司 | A kind of glass panel cutting method |
| CN109396659A (en) * | 2018-09-19 | 2019-03-01 | 力成科技（苏州）有限公司 | Micro SD card abnormity frame cutting technique |
| CN112264720A (en) * | 2020-10-28 | 2021-01-26 | 安徽瑞迪微电子有限公司 | DBC substrate splitting method |
| CN113602013A (en) * | 2021-08-03 | 2021-11-05 | 宁波舜宇奥来技术有限公司 | Manufacturing method of shading structure and shading structure |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107919058A (en) * | 2016-10-07 | 2018-04-17 | 三星显示有限公司 | Display device and its manufacture method |
| CN107919058B (en) * | 2016-10-07 | 2021-12-21 | 三星显示有限公司 | Display device and method for manufacturing the same |
| CN107180891A (en) * | 2017-04-11 | 2017-09-19 | 中国电子科技集团公司第十研究所 | A kind of dicing method of infrared detector |
| CN106932944A (en) * | 2017-04-28 | 2017-07-07 | 上海天马有机发光显示技术有限公司 | A kind of display panel and preparation method thereof |
| US10290695B2 (en) | 2017-04-28 | 2019-05-14 | Shanghai Tianma AM-OLED Co., Ltd. | Display panel and fabrication method thereof |
| CN107102465A (en) * | 2017-06-20 | 2017-08-29 | 合肥市惠科精密模具有限公司 | A kind of liquid crystal display cutting technique |
| CN109387958A (en) * | 2017-08-09 | 2019-02-26 | 上海和辉光电有限公司 | A kind of glass panel cutting method |
| CN108044240A (en) * | 2017-12-19 | 2018-05-18 | 东莞市盛雄激光设备有限公司 | The processing method and sliver apparatus of a kind of liquid crystal display |
| CN109396659A (en) * | 2018-09-19 | 2019-03-01 | 力成科技（苏州）有限公司 | Micro SD card abnormity frame cutting technique |
| CN109279769A (en) * | 2018-10-19 | 2019-01-29 | 大族激光科技产业集团股份有限公司 | A kind of OLED double glazing cutting splitting processing method and production line |
| CN112264720A (en) * | 2020-10-28 | 2021-01-26 | 安徽瑞迪微电子有限公司 | DBC substrate splitting method |
| CN113602013A (en) * | 2021-08-03 | 2021-11-05 | 宁波舜宇奥来技术有限公司 | Manufacturing method of shading structure and shading structure |
| CN113602013B (en) * | 2021-08-03 | 2024-03-08 | 宁波舜宇奥来技术有限公司 | Manufacturing method of shading structure and shading structure |
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