CN104582446A - 一种复合结构的导热垫片 - Google Patents
一种复合结构的导热垫片 Download PDFInfo
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- CN104582446A CN104582446A CN201410857514.9A CN201410857514A CN104582446A CN 104582446 A CN104582446 A CN 104582446A CN 201410857514 A CN201410857514 A CN 201410857514A CN 104582446 A CN104582446 A CN 104582446A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000007791 liquid phase Substances 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 18
- 238000010276 construction Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000002427 irreversible effect Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910001338 liquidmetal Inorganic materials 0.000 abstract description 8
- 238000004100 electronic packaging Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000035807 sensation Effects 0.000 description 9
- 239000007787 solid Substances 0.000 description 8
- 230000004087 circulation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000012071 phase Substances 0.000 description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000013068 control sample Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 101100400452 Caenorhabditis elegans map-2 gene Proteins 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410857514.9A CN104582446B (zh) | 2014-12-31 | 2014-12-31 | 一种复合结构的导热垫片 |
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CN201410857514.9A CN104582446B (zh) | 2014-12-31 | 2014-12-31 | 一种复合结构的导热垫片 |
Publications (2)
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CN104582446A true CN104582446A (zh) | 2015-04-29 |
CN104582446B CN104582446B (zh) | 2018-01-05 |
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CN201410857514.9A Active CN104582446B (zh) | 2014-12-31 | 2014-12-31 | 一种复合结构的导热垫片 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109413938A (zh) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | 一种复合材料轻质高效冷却方法及装置 |
CN110343927A (zh) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | 一种降低液态金属合金导热片热阻的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030007329A1 (en) * | 2000-02-25 | 2003-01-09 | Thermagon Inc. | Thermal interface structure for placement between a microelectronic component package and heat sink |
CN2586335Y (zh) * | 2002-11-25 | 2003-11-12 | 英业达股份有限公司 | 散热基材结构 |
CN202857216U (zh) * | 2012-10-26 | 2013-04-03 | 中国航天科工集团第二研究院七〇六所 | 一种低热阻导热隔板 |
CN103131396A (zh) * | 2011-12-02 | 2013-06-05 | 中国科学院理化技术研究所 | 一种热界面材料及其制造方法 |
CN203617463U (zh) * | 2013-08-02 | 2014-05-28 | 泰科电子(上海)有限公司 | 导热装置、具有该导热装置的插头,插座及组合 |
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2014
- 2014-12-31 CN CN201410857514.9A patent/CN104582446B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030007329A1 (en) * | 2000-02-25 | 2003-01-09 | Thermagon Inc. | Thermal interface structure for placement between a microelectronic component package and heat sink |
CN2586335Y (zh) * | 2002-11-25 | 2003-11-12 | 英业达股份有限公司 | 散热基材结构 |
CN103131396A (zh) * | 2011-12-02 | 2013-06-05 | 中国科学院理化技术研究所 | 一种热界面材料及其制造方法 |
CN202857216U (zh) * | 2012-10-26 | 2013-04-03 | 中国航天科工集团第二研究院七〇六所 | 一种低热阻导热隔板 |
CN203617463U (zh) * | 2013-08-02 | 2014-05-28 | 泰科电子(上海)有限公司 | 导热装置、具有该导热装置的插头,插座及组合 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109413938A (zh) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | 一种复合材料轻质高效冷却方法及装置 |
CN110343927A (zh) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | 一种降低液态金属合金导热片热阻的方法 |
CN110343927B (zh) * | 2019-07-18 | 2021-01-08 | 深圳前海量子翼纳米碳科技有限公司 | 一种降低液态金属合金导热片热阻的方法 |
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Address after: Two road, Science City University of Guangzhou high tech Development Zone of Guangdong Province, No. 58 510663 Applicant after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, high tech Industrial Development Zone, Guangdong City, South Road, No. two, No. 58 Applicant before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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Address after: 510663 Guangzhou science and Technology Development Zone, high tech Industrial Development Zone, Guangdong City, South Road, No. two, No. 58 Applicant after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: Two road, Science City University of Guangzhou high tech Development Zone of Guangdong Province, No. 58 510663 Applicant before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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Effective date of registration: 20240322 Address after: No. 58, South Yun'er Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510000 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Country or region after: China Address before: 510663 No.58, Nanyun 2nd Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangdong Province Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Country or region before: China |
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