CN104582318A - Manufacturing method of printed circuit board and printed circuit board - Google Patents
Manufacturing method of printed circuit board and printed circuit board Download PDFInfo
- Publication number
- CN104582318A CN104582318A CN201310485558.9A CN201310485558A CN104582318A CN 104582318 A CN104582318 A CN 104582318A CN 201310485558 A CN201310485558 A CN 201310485558A CN 104582318 A CN104582318 A CN 104582318A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- back drill
- depth
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention provides a manufacturing method of a printed circuit board and the printed circuit board. The manufacturing method of the printed circuit board comprises the following steps: a through hole is formed in a circuit board; the circuit board with the through hole is plated with metal; back drilling is performed on the metal-plated through hole; the circuit board is pre-etched, wherein the sum of a back drilling depth and a longitudinal depth of etched metal on an inner wall of the through hole is equal to a preset depth of a non-metal layer of the circuit board. With the adoption of the technical scheme, the circuit board can maintain a resin layer of an etched metal-layer area, a back drill bit with a small diameter can be used for drilling, the width of the resin layer of the metal-layer area after back drilling is reduced, and the wiring area of the circuit board is increased, so that the wiring density of the circuit board is increased. Meanwhile, due to the fact that the back drilling hole diameter and the back drilling depth are reduced, copper cuttings, tin cuttings and dust generated in the back drilling process can be reduced, and the situation that the through hole is blocked as a result of too many copper cuttings and tin cuttings and too much dust is avoided.
Description
Technical field
The present invention relates to print circuit plates making technical field, in particular to a kind of print circuit plates making method and a kind of printed circuit board (PCB).
Background technology
When in the related back drill carrying out to pcb board general by the following technical solutions:
1) first that the electroplates in hole is thick and tin is thick to target copper, then adopt the back drill of 0.15mm more than larger than through hole to bore and chew a back drill, then carry out circuit etching technique.It is excessive that back drill due to employing bores the diameter chewed, and the copper ashes got out and dust greatly, easily occur copper ashes and dust plug-hole problem, are therefore unsuitable for the processing of aperture back drill plate.
2) same hole is adopted to make twice back drill.Because production efficiency during back drill is low, make back drill output decline reach 50% and more than, spent material and cost of manufacture increase reach 1 times and more than, and need drop into buying more back drill drilling equipment.
3) first electroplate thinner layers of copper and tin layers, then carry out back drill+ultrasonic high pressure cleaning+etching and move back tin+re-plating and thicken the techniques such as copper.But the program needs to use the multiple operation repeatedly manufacture crafts such as secondary is zinc-plated, secondary moves back tin, three electro-copperings usually, reduces the production efficiency of corresponding operation, increase the Order creation cycle.
In addition, due to the back drill scheme in correlation technique, usually need to use and bore than through hole the back drill chewing large 0.15mm or more and bore and chew making, and back drill at present drilling depth be drilled under needing can not porose layers of copper designated depth, the wiring area of pcb board is reduced, affects wiring density and promote.
Summary of the invention
The present invention based on above-mentioned technical problem one of at least, proposes a kind of new print circuit plates making method, can improve the wiring density of circuit board just, copper scale, tin can be avoided to consider to be worth doing and many mistakes of dust and block through hole simultaneously.
In view of this, according to an aspect of the present invention, provide a kind of print circuit plates making method, comprising: make through hole on circuit boards; To the circuit board plating being manufactured with described through hole; Back drill is carried out to the described through hole after plating; Circuit board described in pre-etched, wherein, metal longitudinal etched on the back drill degree of depth and described through-hole wall is the default without the metal level degree of depth of described circuit board to degree of depth sum.
In this technical scheme, if when carrying out back drill, directly making the back drill degree of depth reach and presetting without the metal level degree of depth, then can bore the too much resin bed of circuit board, thus cause circuit board wiring region to be reduced.Therefore by making metal longitudinal etched on the back drill degree of depth and through-hole wall meet the default without the metal level degree of depth of circuit board to degree of depth sum, circuit board can be made to retain the resin bed of etched metal layer region, and the back drill of minor diameter brill can be used to chew, decrease the resin bed width being fallen metal layer region by back drill, add the wiring area of circuit board, thus improve the wiring density of circuit board.In addition, due to when carrying out back drill, reducing the back drill degree of depth, because this reducing the copper scale, tin bits and the Dust Capacity that produce in back drill process, avoiding copper scale, tin bits and the many mistakes of dust and blocking through hole.
In addition, when carrying out pre-etched, because back drill carries out on the basis of through hole, therefore only pre-etched can be carried out to back drill hole.
In technique scheme, preferably, the described back drill degree of depth is greater than described etched metal longitudinal to the degree of depth.
In this technical scheme, deeply may impact the quality of circuit board due to etched, therefore by the metal longitudinal that makes the back drill degree of depth be greater than to etch away to the degree of depth, make, meeting under the prerequisite preset without the metal level degree of depth, to guarantee that circuit board has good quality.
In technique scheme, preferably, the brill adopted when back drill is chewed diameter and is less than or equal to 0.15 millimeter with the difference making the brill that adopts of described through hole and chew diameter.
In this technical scheme, bore the diameter chewed by making back drill and be less than or equal to 0.15 millimeter with the difference making brill that through hole adopts and chew diameter, making when carrying out back drill, a small amount of copper scale, tin bits and dust can be produced, thus avoid copper scale, tin bits and dust too much to block through hole.It can be 0.075 millimeter, 0.05 millimeter, 0.025 millimeter, 0.02 millimeter etc. that back drill bores the diameter chewed and the difference of the brill group diameter adopted when making through hole.
In technique scheme, preferably, when carrying out back drill to described circuit board, locate when adopting four registration holes targets and coordinate ccd image sensor alignment system to make back drill.
In this technical scheme, by adopting registration holes target and locating when coordinating ccd image sensor alignment system to make back drill, accurately can navigate to the position needing to carry out back drill, avoid location precisely not cause back drill failure, improve the Aligning degree of back drill process.
In technique scheme, preferably, when carrying out back drill to described circuit board, hole pin is adopted to position.
In this technical scheme, locating when making back drill by adopting hole pin, firm stable can accurately navigate to the position needing to carry out back drill, avoid location precisely not cause back drill failure, improve the Aligning degree of back drill process.Certainly, when adopting ccd image sensor to position, also first can be fixed circuit board with hole pin, thus more firm stable can accurately navigate to the position needing to carry out back drill.
In technique scheme, preferably, after back drill is carried out to described circuit board and before circuit board described in pre-etched, described circuit board is rinsed.
In this technical scheme, circuit board, after carrying out back drill, can remain copper scale, tin bits and dust, in through-holes by before pre-etched circuit board, circuit board is rinsed, avoids the process that the copper scale remained in through hole, tin bits and dust affect pre-etched.Wherein, when rinsing circuit board, can adopt and spray the swing water under high pressure being more than or equal to 40kg/cm and rinse, ordinary high pressure water can certainly be adopted to rinse.
In technique scheme, preferably, the step of the circuit board plating being manufactured with described through hole is comprised: copper facing is carried out to described circuit board, after copper plate, tin coating on described circuit board; Described in described pre-etched, the step of circuit board specifically comprises: etch the layers of copper on described through-hole wall, and described etched metal longitudinal is longitudinal degree of depth of etched layers of copper to the degree of depth.
In this technical scheme; by after copper facing on circuit boards; at the outside tin coating of layers of copper; make when carrying out pre-etched; tin layers can protect the part needing to retain metal level not fallen by etching corrosion; the incision stayed by back drill is etched, and can etch away partial metal layers (not referring to horizontal metal level herein, is metal level longitudinal in through hole).
In technique scheme, preferably, alkali etching is adopted during circuit board described in described pre-etched.
In technique scheme, preferably, also comprise: after the described circuit board of pre-etching, circuit-line making is carried out to described circuit board and moves back tin process.
According to a further aspect in the invention, also proposed a kind of printed circuit board (PCB), described printed circuit board (PCB) is made by the print circuit plates making method described in above-mentioned any one technical scheme, described printed circuit board (PCB) is provided with back drill hole.
In technique scheme, preferably, the difference of the diameter of the through hole that described printed circuit board (PCB) is arranged and the diameter in described back drill hole is less than or equal to 0.15 millimeter, and described through hole is coaxially concentric with described back drill hole.
By above technical scheme, the wiring density of circuit board can being improve, simultaneously due to when carrying out back drill, reducing the back drill degree of depth, because this reducing the copper scale, tin bits and the Dust Capacity that produce in back drill process, avoiding copper scale, tin bits and the many mistakes of dust and blocking through hole.
Accompanying drawing explanation
Fig. 1 shows the schematic flow diagram of print circuit plates making method according to an embodiment of the invention;
Fig. 2 shows the schematic flow diagram of print circuit plates making method according to another embodiment of the invention;
Fig. 3 shows location schematic diagram during back drill according to an embodiment of the invention;
Fig. 4 A to Fig. 4 D shows print circuit plates making flow chart according to an embodiment of the invention.
Embodiment
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from other modes described here and implement, and therefore, the present invention is not limited to the restriction of following public specific embodiment.
Fig. 1 shows the schematic flow diagram of print circuit plates making method according to an embodiment of the invention.
As shown in Figure 1, print circuit plates making method, comprising: step 102 according to an embodiment of the invention, makes through hole on circuit boards; Step 104, to the circuit board plating being manufactured with described through hole; Step 106, carries out back drill to the described through hole after plating; Step 108, circuit board described in pre-etched, wherein, metal longitudinal etched on the back drill degree of depth and described through-hole wall is the default without the metal level degree of depth of described circuit board to degree of depth sum.
In this technical scheme, if when carrying out back drill, directly making the back drill degree of depth reach and presetting without the metal level degree of depth, then can bore the too much resin bed of circuit board, thus cause circuit board wiring region to be reduced.Therefore by making metal longitudinal etched on the back drill degree of depth and through-hole wall meet the default without the metal level degree of depth of circuit board to degree of depth sum, circuit board can be made to retain the resin bed of etched metal layer region, add the wiring area of circuit board, thus improve the wiring density of circuit board.In addition, due to when carrying out back drill, reducing the back drill degree of depth, because this reducing the copper scale, tin bits and the Dust Capacity that produce in back drill process, avoiding copper scale, tin bits and the many mistakes of dust and blocking through hole.
In addition, when carrying out pre-etched, because back drill carries out on the basis of through hole, therefore only pre-etched can be carried out to back drill hole.
In technique scheme, preferably, the described back drill degree of depth is greater than described etched metal longitudinal to the degree of depth.
In this technical scheme, deeply may impact the quality of circuit board due to etched, therefore by the metal longitudinal that makes the back drill degree of depth be greater than to etch away to the degree of depth, make, meeting under the prerequisite preset without the metal level degree of depth, to guarantee that circuit board has good quality.
In technique scheme, preferably, the brill adopted when back drill is chewed diameter and is less than or equal to 0.15 millimeter with the difference making the brill that adopts of described through hole and chew diameter.
In this technical scheme, bore the diameter chewed by making back drill and be less than or equal to 0.15 millimeter with the difference making brill that through hole adopts and chew diameter, making when carrying out back drill, a small amount of copper scale, tin bits and dust can be produced, thus avoid copper scale, tin bits and dust too much to block through hole.It can also be 0.075 millimeter, 0.05 millimeter, 0.025 millimeter, 0.02 millimeter etc. that back drill bores the diameter chewed and the difference of the brill group diameter adopted when making through hole.
In technique scheme, preferably, when carrying out back drill to described circuit board, locate when adopting four registration holes targets and coordinate ccd image sensor alignment system to make back drill.
In this technical scheme, by adopting registration holes target and locating when coordinating ccd image sensor alignment system to make back drill, accurately can navigate to the position needing to carry out back drill, avoid location precisely not cause back drill failure, improve the Aligning degree of back drill process.
In technique scheme, preferably, when carrying out back drill to described circuit board, hole pin is adopted to position.
In this technical scheme, locating when making back drill by adopting hole pin, firm stable can accurately navigate to the position needing to carry out back drill, avoid location precisely not cause back drill failure, improve the Aligning degree of back drill process.Certainly, when adopting ccd image sensor to position, also first can be fixed circuit board with hole pin, thus more firm stable can accurately navigate to the position needing to carry out back drill.
In technique scheme, preferably, after back drill is carried out to described circuit board and before circuit board described in pre-etched, described circuit board is rinsed.
In this technical scheme, circuit board, after carrying out back drill, can remain copper scale, tin bits and dust, in through-holes by before pre-etched circuit board, circuit board is rinsed, avoids the process that the copper scale remained in through hole, tin bits and dust affect pre-etched.Wherein, when rinsing circuit board, can adopt and spray the swing water under high pressure being more than or equal to 40kg/cm and rinse, ordinary high pressure water can certainly be adopted to rinse.
In technique scheme, preferably, the step of the circuit board plating being manufactured with described through hole is comprised: copper facing is carried out to described circuit board, after copper plate, tin coating on described circuit board; Described in described pre-etched, the step of circuit board specifically comprises: etch the layers of copper on described through-hole wall, and described etched metal longitudinal is longitudinal degree of depth of etched layers of copper to the degree of depth.
In this technical scheme; by after copper facing on circuit boards; at the outside tin coating of layers of copper; make when carrying out pre-etched; tin layers can protect the part needing to retain metal level not fallen by etching corrosion; the incision stayed by back drill is etched, and can etch away partial metal layers (not referring to horizontal metal level herein, is metal level longitudinal in through hole).
In technique scheme, preferably, alkali etching is adopted during circuit board described in described pre-etched.
In technique scheme, preferably, also comprise: after the described circuit board of pre-etching, circuit-line making is carried out to described circuit board and moves back tin process.
The production program of printed circuit board (PCB) is according to an embodiment of the invention described in detail below in conjunction with Fig. 2 to Fig. 4 D.
Fig. 2 shows the schematic flow diagram of print circuit plates making method according to another embodiment of the invention.
As shown in Figure 2, print circuit plates making method according to another embodiment of the invention, comprising:
Step 202, makes outer pcb board.
Step 204, carries out holes drilled through to pcb board, as shown in Figure 4 A, is the pcb board after holes drilled through.
Step 206, pcb board is done heavy copper/plating after holes drilled through, makes through hole form metallization layers of copper, layers of copper 402 as shown in Figure 4 B.
Step 208, pcb board makes outer graphics transfer after heavy copper/plating.
Step 210, the pcb board forming outer graphics makes pattern plating copper tin, makes that its Kong Zhongtong is thick reaches appointment requirement, wherein 404 shown in Fig. 4 B are tin layers.
Step 212, back drill is carried out to through hole position, the brill that the difference adopting the brill bored when chewing diameter and holes drilled through to chew diameter is less than or equal to 0.15mm is chewed and is carried out back drill, as shown in Figure 3, the every Unit Design of plank four registration holes targets are also located when coordinating ccd image sensor alignment system to make back drill, and hole pin can certainly be adopted to position.Get into the reserved degree of depth under the back drill degree of depth, not needing to get into completely down can not the degree of depth of porose layers of copper, as in Fig. 4 C, 406 are depicted as the back drill degree of depth.
Brill during back drill is chewed diameter and is bored than through hole that to chew diameter slightly large, to ensure unwanted copper tin layers when being plated on copper and the graphic plating at through hole peritreme place when electroplating to bore, simultaneously less owing to boring the resin bed gone, therefore the less drilling cuttings produced can be discharged outside groove with boring the discharge launder chewed timely, is discharged outside through hole by the dust collecting system on rig.
Step 214, does high pressure washing hole to the pcb board after carrying out back drill, rinses out the residual drilling cuttings in back drill hole, can use the swing high pressure water washing spraying and be more than or equal to 40kg/cm, and ordinary high pressure water can certainly be used to rinse.
Step 216, back drill hole pre-etched is done to pcb board after doing high pressure washing hole, adopt alkaline etching liquid, etching is gone or layers of copper a little in residual pores, or residual a little copper scale, applying high voltage power erosion in pre-etched process high-pressure wash hole, by adjustment etching speed, control the through hole layers of copper degree of depth that in back drill hole, pre-etched is fallen, to guarantee that the back drill degree of depth and the longitudinal degree of depth sum of pre-etched layers of copper meet the depth requirements without metal level, as in Fig. 4 D, as indicated at 406, longitudinal degree of depth of etched layers of copper as shown at 408 for the back drill degree of depth.
Step 218, after pre-etched is carried out to back drill hole, pcb board is done to striping, etching (etching herein refers to the etching making circuit), moved back tin process, obtain the back drill pore structure needed and the PCB forming circuit, and carry out follow-up Making programme, as anti-welding, surface treatment, shaping, electrical testing, final quality inspection, packaging warehouse-in etc.
Technical scheme of the present invention is set forth below in conjunction with specific embodiment.
The dark 2mm of through hole of such as circuit board, need the metal level of reserved 1mm (that is will remove the metal level of 1mm), when carrying out back drill, 0.8mm can be got into, the tin on hole wall top layer drilled fall, but the layers of copper of tin layers inside may also have residual, residual layers of copper can be corroded when carrying out pre-etched.Due to when carrying out back drill, tin layers defines opening, and therefore etching solution directly can contact with layers of copper, can etch away 0.2mm layers of copper like this when carrying out pre-etched, and the back drill degree of depth and the layers of copper degree of depth sum etched away are the layers of copper degree of depth needing to remove.
Because the aperture in back drill hole and the difference in the aperture of through hole are less than 0.15mm(, to carry on the back boring aperture larger than through-hole aperture less than 0.15mm), namely current 0.15mm is less than, therefore more pcb board wiring area can just be retained, and when etching, remain the resin bed in etched layers of copper region, also further increase the wiring area of circuit board, thus improve the wiring density of circuit board.Meanwhile, owing to reducing the back drill degree of depth and back drill width, because this reducing the copper scale, tin bits and the Dust Capacity that produce in back drill process, avoiding copper scale, tin bits and the many mistakes of dust and blocking through hole.
Describe the process that have employed Graphic transitions-copper electroplating layer and tin layers-back drill-high pressure washing hole-back drill hole pre-etched-striping/etch/move back tin in above embodiment in detail and make printed circuit board (PCB), the process of back drill-high pressure washing hole-Graphic transitions-back drill hole pre-etched-striping/etch/move back tin can certainly be adopted to make printed circuit board (PCB).
More than be described with reference to the accompanying drawings according to technical scheme of the present invention, consider the back drill scheme in correlation technique, usual needs use is bored than through hole the back drill brill chewing large 0.15mm or more and is chewed making, and back drill at present drilling depth is drilled into atresia layers of copper designated depth under needing, the wiring area of pcb board is reduced, affects wiring density and promote.Therefore, the present invention proposes a kind of new print circuit plates making method, the wiring density of circuit board can be improve, copper scale, tin can be avoided to consider to be worth doing and many mistakes of dust and block through hole simultaneously.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a print circuit plates making method, is characterized in that, comprising:
Make through hole on circuit boards;
To the circuit board plating being manufactured with described through hole;
Back drill is carried out to the described through hole after plating;
Circuit board described in pre-etched, wherein, metal longitudinal etched on the back drill degree of depth and described through-hole wall is the default without the metal level degree of depth of described circuit board to degree of depth sum.
2. print circuit plates making method according to claim 1, is characterized in that, the described back drill degree of depth is greater than described etched metal longitudinal to the degree of depth.
3. print circuit plates making method according to claim 1, is characterized in that, the brill adopted when back drill is chewed diameter and is less than or equal to 0.15 millimeter with the difference making the brill that adopts of described through hole and chew diameter.
4. print circuit plates making method according to claim 3, is characterized in that, the difference of the diameter of the through hole that described printed circuit board (PCB) is arranged and the diameter in described back drill hole is 0.075 millimeter, 0.05 millimeter, 0.025 millimeter or 0.02 millimeter.
5. print circuit plates making method according to claim 1, is characterized in that, when carrying out back drill to described circuit board, adopting registration holes target and locating when coordinating ccd image sensor alignment system to make back drill, or adopts hole pin to position.
6. print circuit plates making method according to claim 1, is characterized in that, after carrying out back drill to described circuit board and before circuit board described in pre-etched, rinses described circuit board.
7., according to described print circuit plates making method arbitrary in claim 1 to 6, it is characterized in that, the step of the circuit board plating being manufactured with described through hole is comprised: copper facing is carried out to described circuit board, after copper plate, tin coating on described circuit board;
Described in described pre-etched, the step of circuit board specifically comprises: etch the layers of copper on described through-hole wall, and described etched metal longitudinal is longitudinal degree of depth of etched layers of copper to the degree of depth.
8. a printed circuit board (PCB), is characterized in that, described printed circuit board (PCB) is made by the print circuit plates making method such as according to any one of claim 1 to 7, described printed circuit board (PCB) is provided with back drill hole.
9. printed circuit board (PCB) according to claim 8, is characterized in that, the difference of the diameter of the through hole that described printed circuit board (PCB) is arranged and the diameter in described back drill hole is less than or equal to 0.15 millimeter, and described through hole is coaxially concentric with described back drill hole.
10. printed circuit board (PCB) according to claim 9, is characterized in that, the difference of the diameter of the through hole that described printed circuit board (PCB) is arranged and the diameter in described back drill hole is 0.075 millimeter, 0.05 millimeter, 0.025 millimeter or 0.02 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310485558.9A CN104582318A (en) | 2013-10-16 | 2013-10-16 | Manufacturing method of printed circuit board and printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310485558.9A CN104582318A (en) | 2013-10-16 | 2013-10-16 | Manufacturing method of printed circuit board and printed circuit board |
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| CN104582318A true CN104582318A (en) | 2015-04-29 |
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| CN201310485558.9A Pending CN104582318A (en) | 2013-10-16 | 2013-10-16 | Manufacturing method of printed circuit board and printed circuit board |
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| CN105025658A (en) * | 2015-06-30 | 2015-11-04 | 开平依利安达电子第五有限公司 | Mechanical backdrilling method for PCB |
| CN106455365A (en) * | 2016-09-22 | 2017-02-22 | 广东工业大学 | On-line adaptive PCB board drilling method |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN109996399A (en) * | 2017-12-29 | 2019-07-09 | 北大方正集团有限公司 | Back drilling method and printed circuit board |
| CN112825601A (en) * | 2019-11-21 | 2021-05-21 | 深南电路股份有限公司 | Circuit board and method for manufacturing the same |
| CN112839443A (en) * | 2019-11-25 | 2021-05-25 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN113540741A (en) * | 2021-05-28 | 2021-10-22 | 武汉凡谷电子技术股份有限公司 | Tin printing and assembling method for cavity filter cover plate and auxiliary tool |
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| CN105025658A (en) * | 2015-06-30 | 2015-11-04 | 开平依利安达电子第五有限公司 | Mechanical backdrilling method for PCB |
| CN106455365A (en) * | 2016-09-22 | 2017-02-22 | 广东工业大学 | On-line adaptive PCB board drilling method |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN109699122B (en) * | 2017-10-23 | 2021-01-26 | 健鼎（无锡）电子有限公司 | Circuit board and method for manufacturing the same |
| CN109996399A (en) * | 2017-12-29 | 2019-07-09 | 北大方正集团有限公司 | Back drilling method and printed circuit board |
| CN112825601A (en) * | 2019-11-21 | 2021-05-21 | 深南电路股份有限公司 | Circuit board and method for manufacturing the same |
| CN112839443A (en) * | 2019-11-25 | 2021-05-25 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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Application publication date: 20150429 |