CN104576415A - Bumping device with ball grid array structure - Google Patents
Bumping device with ball grid array structure Download PDFInfo
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- CN104576415A CN104576415A CN201310467225.3A CN201310467225A CN104576415A CN 104576415 A CN104576415 A CN 104576415A CN 201310467225 A CN201310467225 A CN 201310467225A CN 104576415 A CN104576415 A CN 104576415A
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- ball
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- transfer means
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Abstract
The invention relates to a bumping device with a ball grid array structure. The bumping device comprises a glue supply mechanism (1), a transfer printing mechanism (2), a ball supply mechanism (3), a bumping mechanism (4), a working platform (5), a residual ball detection mechanism (6), an X and Z axis motion mechanism (7) and a bottom stand (8), wherein the glue supply mechanism (1) and the ball supply mechanism (3) are correspondingly arranged at the top of the bottom stand (8), the transfer printing mechanism (2) is erected on the X and Z axis motion mechanism (7) and positioned above the glue supply mechanism (1), the working platform (5) is arranged between the glue supply mechanism (1) and the ball supply mechanism (3), the bumping mechanism (4) is erected on the X and Z axis motion mechanism (7) and positioned above the working platform (5), and the residual ball detection mechanism (6) is arranged on one side of the working platform (5). Compared with the prior art, all unit mechanisms are mutually matched and the production efficiency is improved.
Description
Technical field
The present invention relates to one kind and plant ball equipment, what especially relate to a kind of ball grid array structure plants ball equipment.
Background technology
The wafer that semiconductor preceding working procedure produces needs packaging technology just can become final chip.BGA package mode becomes the market mainstream, and BGA package is little with its high density, volume, the advantage such as good heat dissipation, excellent electrical property is being widely applied in large scale integrated circuit.A core process of BGA package technology plants ball exactly.Domestic rework equipments of planting ball and one single chip for ceramic chip is all manual equipment or manual at present, adopts the mode of steel mesh brush scaling powder, tin cream and tin ball to plant ball.What such as patent CN200610087137.0 etc. adopted plants ball mode, uses exactly and plants ball container or plant ball scraper plate, tin ball is leaked down to be placed into solder joint corresponding to chip from the web plate of porous.
These manual equipments and manual have following inevitable shortcoming:
1, low precision, therefore once can only plant several chip, negligible amounts, affect production capacity.
2, implant ball is consuming time longer, and product yield is low.
3, by hand plant ball and need a large amount of operating personnel, recruitment cost rises year by year, and the carrying out that the fluctuation extreme influence of the production capacity brought of flow of personnel and yield is normally produced.
4, contain heavy metal in tin cream and tin ball, operating personnel's Long contact time, also has certain injury to human body.
Summary of the invention
Object of the present invention be exactly provide a kind of cooperatively interacted by each unit mechanisms to overcome defect that above-mentioned prior art exists, ball grid array structure that production efficiency is high plant ball equipment.
Object of the present invention can be achieved through the following technical solutions:
Ball grid array structure plant a ball equipment, comprise glue feed mechanism, transfer means, ball mechanism, ball attachment machine structure, workbench, remaining ball testing agency, X, Z axis motion, bottom pallet,
Described glue feed mechanism and ball mechanism correspondence are arranged on the top of bottom pallet, described transfer means to be erected on X, Z axis motion and to be positioned at the top of glue feed mechanism, described workbench is located between glue feed mechanism and ball mechanism, described ball attachment machine framework to be located on X, Z axis motion and to be positioned at the top of workbench, and described remaining ball testing agency is located at workbench side.
Described workbench is equipped with the carrier of chip for placing.
Described glue feed mechanism and transfer means carry out a glue to chip in pallet, and glue feed mechanism is provided with spreading knife and supplies glue box.
Described ball mechanism and ball attachment machine structure plant ball to chip in pallet.
Described remaining ball detects and removing mechanism detects remaining ball on ball attachment machine structure after planting ball and removes.
Described X, Z axis motion are made up of transfer means Z axis, transfer means X-axis, ball attachment machine structure Z axis, ball attachment machine structure X-axis.
Described transfer means Z axis, transfer means X-axis control the motion of transfer means on Z axis and X-direction.
Described ball attachment machine structure Z axis, ball attachment machine structure X-axis control the motion of ball attachment machine structure on Z axis and X-direction.
Described workbench is set in workbench Y-axis, can move along Y direction.
Described ball equipment of planting comprises safety top cover well, and be located on the pallet of bottom, safety top cover is made up of shell body division board, touch-screen, button and three look alarm lamps.
Compared with prior art, the present invention has the following advantages:
1, this equipment automatically completes and smears scaling powder and plant ball process, improves production efficiency.
2, this equipment only needs operating personnel can complete whole operation and have very high production capacity, has saved human cost.
3, can corresponding various forms of target and various types of chip, different targets only needs more exchange device tool and carrier.
Accompanying drawing explanation
Fig. 1 is the main TV structure schematic diagram of the present invention when working;
Fig. 2 is the plan structure schematic diagram of the present invention when working;
Fig. 3 is structural representation of the present invention.
In figure, 1 be glue feed mechanism, 2 be transfer means, 3 be ball mechanism, 4 be ball attachment machine structure, 5 be workbench, 6 for remaining ball detect that removing mechanism, 7 is X, Z axis motion, 8 is bottom pallet, 9 be transfer means Z axis, 10 be transfer means X-axis, 11 be ball attachment machine structure Z axis, 12 be ball attachment machine structure X-axis, 13 be workbench Y-axis, 14 be chip tray mounting table, 15 for useless ball case, 16 be ball mechanism ball case, 17 be spreading knife, 18 for being safety top cover for glue box, 19.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment
Ball grid array structure plant a ball equipment, its structure as Figure 1-3, comprises glue feed mechanism 1, transfer means 2, ball mechanism 3, ball attachment machine structure 4, workbench, 5, remaining ball testing agency, 6, X, Z axis motion, 7, bottom pallet 8.
Glue feed mechanism 1 and ball mechanism 3 correspondence are arranged on the top of bottom pallet 8, transfer means 2 to be erected on X, Z axis motion 7 and to be positioned at the top of glue feed mechanism 1, workbench 5 is located between glue feed mechanism 1 and ball mechanism 3, ball attachment machine structure 4 to be erected on X, Z axis motion 7 and to be positioned at the top of workbench 5, and remaining ball testing agency (6) is located at workbench 5 side.
Workbench 5 is equipped with the carrier of chip for placing, be set in workbench Y-axis 13, can move along Y direction, workbench 5 is also provided with chip tray mounting table 14, useless ball case 15, in glue feed mechanism 1 and transfer means 2 pairs of pallets, chip carries out a glue, and glue feed mechanism 1 is provided with spreading knife 17 and for glue box 18.In ball mechanism 3 and ball attachment machine structure 4 pairs of pallets, chip plants ball.Ball mechanism 3 is provided with ball mechanism ball case 16.Remaining ball detects and removing mechanism 6 detects remaining ball on ball attachment machine structure 4 after planting ball and removes.X, Z axis motion 7 are made up of transfer means Z axis 9, transfer means X-axis 10, ball attachment machine structure Z axis 11, ball attachment machine structure X-axis 12, and transfer means Z axis 9 wherein, transfer means X-axis 10 control the motion of transfer means 2 on Z axis and X-direction.Ball attachment machine structure Z axis 11, ball attachment machine structure X-axis 12 control the motion of ball attachment machine structure 4 on Z axis and X-direction.In addition, plant ball equipment and comprise safety top cover 19 well, be located on the pallet 8 of bottom, safety top cover 19 is made up of shell body division board, touch-screen, button and three look alarm lamps.
During use, the pallet that chip is housed is placed on the feeding area of workbench 5 by operator, presses start button, and feeding area vacuum is opened with fixed chip.Place mistake as fruit chip then to report to the police, remind operating personnel again to put chip.Spreading knife 17 reciprocating motion of glue feed mechanism 1, strikes off for the scaling powder in glue box 18, completes for glue.Transfer means 2 is moved to by transfer means X-axis 10 and dips in glue position, behind in-position, transfer means Z axis 9 decline is carried out dipping in glue, after transfer means dips in glue, chip point glue position is moved to by transfer means X-axis 10, workbench 5 is also moved to by workbench Y-axis 13 and dips in glue position simultaneously, transfer means Z axis 9 starts to decline, and carries out a glue to chip in pallet, and glue feed mechanism 1 also carries out confession glue next time simultaneously.
After scaling powder transfer printing, transfer means Z axis 9 rises, and is moved to dip in glue position by transfer means X-axis 10.Ball attachment machine structure 4 moves to ball mechanism 3 by ball attachment machine structure X-axis 12 and dodges position for ball afterwards, ball mechanism 3 starts for ball operation, after ball operation, ball attachment machine structure 4 moves to suction ball position by ball attachment machine structure X-axis 12, ball attachment machine structure Z axis 11 declines, start to carry out the action of suction ball, after inhaling ball, ball attachment machine structure 4 rises, moved to by ball attachment machine structure X-axis 12 and plant ball position, workbench 5 also moves to plants ball position, and ball attachment machine structure 4 starts to plant ball, and ball mechanism 3 starts to carry out the operation of confession ball simultaneously.
After planting ball, ball attachment machine structure 4 rises to detection height and position, move to remaining ball testing agency 6 by ball attachment machine structure X-axis 12 to detect, if there is remaining ball, then ball attachment machine structure 4 moves to useless ball case 15 place, on removing ball attachment machine structure 4 after remaining ball, workbench 5 moves to discharging area and reminds operating personnel to carry out blanking operation.If do not have remaining ball, then workbench 5 first motion reminds operating personnel to carry out blanking operation to discharging area.
Claims (9)
1. a ball grid array structure plant ball equipment, it is characterized in that, comprise glue feed mechanism (1), transfer means (2), ball mechanism (3), ball attachment machine structure (4), workbench (5), remaining ball testing agency (6), X, Z axis motion (7), bottom pallet (8)
Described glue feed mechanism (1) and ball mechanism (3) correspondence are arranged on the top of bottom pallet (8), described transfer means (2) is erected at X, Z axis motion (7) is gone up and is positioned at the top of glue feed mechanism (1), described workbench (5) is located between glue feed mechanism (1) and ball mechanism (3), described ball attachment machine structure (4) is erected at X, Z axis motion (7) is gone up and is positioned at the top of workbench (5), and described remaining ball testing agency (6) is located at workbench (5) side.
2. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described workbench (5), for placing the carrier that chip is housed, is set in workbench Y-axis, can moves along Y direction.
3. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described glue feed mechanism (1) and transfer means (2) carry out a glue to chip in pallet, and glue feed mechanism (1) is provided with spreading knife (17) and supplies glue box (18).
4. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described ball mechanism (3) and ball attachment machine structure (4) plant ball to chip in pallet.
5. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described remaining ball detects and removing mechanism (6) is gone up remaining ball to ball attachment machine structure (4) after planting ball and detected and remove.
6. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described X, Z axis motion (7) are made up of transfer means Z axis (9), transfer means X-axis (10), ball attachment machine structure Z axis (11), ball attachment machine structure X-axis (12).
7. a kind of ball grid array structure according to claim 6 plant ball equipment, it is characterized in that, described transfer means Z axis (9), transfer means X-axis (10) control transfer means (2) motion on Z axis and X-direction.
8. a kind of ball grid array structure according to claim 6 plant ball equipment, it is characterized in that, described ball attachment machine structure Z axis (11), ball attachment machine structure X-axis (12) control ball attachment machine structure (4) motion on Z axis and X-direction.
9. a kind of ball grid array structure according to claim 1 plant ball equipment, it is characterized in that, described ball equipment of planting comprises safety top cover well, and be located on bottom pallet (8), safety top cover is made up of shell body division board, touch-screen, button and three look alarm lamps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310467225.3A CN104576415A (en) | 2013-10-09 | 2013-10-09 | Bumping device with ball grid array structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310467225.3A CN104576415A (en) | 2013-10-09 | 2013-10-09 | Bumping device with ball grid array structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576415A true CN104576415A (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310467225.3A Pending CN104576415A (en) | 2013-10-09 | 2013-10-09 | Bumping device with ball grid array structure |
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| CN (1) | CN104576415A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420564A (en) * | 2020-12-08 | 2021-02-26 | 深圳市卓茂科技有限公司 | Novel BGA ball mounting equipment |
| CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091948A (en) * | 2007-12-14 | 2008-04-17 | Athlete Fa Kk | Stage, and method of transferring substrate using the same |
| CN101996907A (en) * | 2010-09-09 | 2011-03-30 | 上海微松工业自动化有限公司 | Bumping device for pressing wafer-level elastomer into microsphere |
| CN102122606A (en) * | 2010-11-16 | 2011-07-13 | 上海微松工业自动化有限公司 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
| CN102744487A (en) * | 2006-11-22 | 2012-10-24 | 洛科企业有限公司 | An improved ball mounting apparatus and method |
| CN203521378U (en) * | 2013-10-09 | 2014-04-02 | 上海微松工业自动化有限公司 | Reballing equipment used in ball grid array structure |
-
2013
- 2013-10-09 CN CN201310467225.3A patent/CN104576415A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744487A (en) * | 2006-11-22 | 2012-10-24 | 洛科企业有限公司 | An improved ball mounting apparatus and method |
| JP2008091948A (en) * | 2007-12-14 | 2008-04-17 | Athlete Fa Kk | Stage, and method of transferring substrate using the same |
| CN101996907A (en) * | 2010-09-09 | 2011-03-30 | 上海微松工业自动化有限公司 | Bumping device for pressing wafer-level elastomer into microsphere |
| CN102122606A (en) * | 2010-11-16 | 2011-07-13 | 上海微松工业自动化有限公司 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
| CN203521378U (en) * | 2013-10-09 | 2014-04-02 | 上海微松工业自动化有限公司 | Reballing equipment used in ball grid array structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420564A (en) * | 2020-12-08 | 2021-02-26 | 深圳市卓茂科技有限公司 | Novel BGA ball mounting equipment |
| CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
| CN112477401B (en) * | 2020-12-21 | 2023-10-20 | 四川锐坤电子技术有限公司 | Pad printing equipment |
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Application publication date: 20150429 |
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| RJ01 | Rejection of invention patent application after publication |