CN104567611B - 一种背钻深度检测的方法 - Google Patents
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CN104567611B true CN104567611B (zh) | 2017-06-23 |
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Families Citing this family (12)
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CN104582288A (zh) * | 2015-01-14 | 2015-04-29 | 景旺电子科技(龙川)有限公司 | 一种pcb背钻板背钻深度检测方法 |
CN105880663A (zh) * | 2016-06-23 | 2016-08-24 | 上海振华重工集团(南通)有限公司 | 一种轨道吊小车架镗孔工艺 |
TWI632007B (zh) * | 2017-05-09 | 2018-08-11 | 達航科技股份有限公司 | Back-drilling processing method for multilayer printed wiring substrate and processing depth Substrate processing device of control mechanism |
CN110022648A (zh) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | 一种pcb的背钻方法及*** |
CN108712831B (zh) * | 2018-07-02 | 2020-01-14 | 华南理工大学 | 背钻pcb截面显微图像工艺参数提取方法 |
CN109540020B (zh) * | 2018-11-27 | 2020-09-25 | 安徽四创电子股份有限公司 | 一种背钻深度的光学检测方法及检测装置 |
CN109492329B (zh) * | 2018-12-03 | 2022-02-22 | 郑州云海信息技术有限公司 | 一种背钻设置的设计方法 |
CN111121586A (zh) * | 2019-12-31 | 2020-05-08 | 珠海杰赛科技有限公司 | 一种pcb背钻残厚的检验方法 |
CN111256578A (zh) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | 一种背钻板深度检测的方法 |
CN112221885B (zh) * | 2020-09-30 | 2022-07-26 | 惠州市特创电子科技股份有限公司 | 背钻测量装置及电路板 |
CN113111292B (zh) * | 2021-03-01 | 2023-05-26 | 广州广合科技股份有限公司 | 自动计算背钻深度的方法、电子设备及存储介质 |
CN114858081A (zh) * | 2022-03-22 | 2022-08-05 | 胜宏科技(惠州)股份有限公司 | 一种控深孔深度可视检测装置及方法 |
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JPH02297996A (ja) * | 1989-05-11 | 1990-12-10 | Fujitsu Ltd | プリント基板の微細スルーホール欠陥検出方法 |
JP2000218416A (ja) * | 1999-01-29 | 2000-08-08 | Canon Inc | プリント回路基板の孔あけ加工方法及びプリント回路基板の孔あけ加工装置 |
CN101876687B (zh) * | 2010-06-04 | 2012-10-03 | 深南电路有限公司 | 一种pcb板背钻深度测试方法 |
CN201828238U (zh) * | 2010-10-11 | 2011-05-11 | 深圳中富电路有限公司 | 一种背钻板背钻深度测试装置 |
CN103185733B (zh) * | 2011-12-30 | 2015-04-22 | 北大方正集团有限公司 | 一种印制电路板上钻孔质量的检测方法 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220915 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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