CN104559053A - Modified epoxy resin and application thereof - Google Patents

Modified epoxy resin and application thereof Download PDF

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Publication number
CN104559053A
CN104559053A CN201310496035.4A CN201310496035A CN104559053A CN 104559053 A CN104559053 A CN 104559053A CN 201310496035 A CN201310496035 A CN 201310496035A CN 104559053 A CN104559053 A CN 104559053A
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CN
China
Prior art keywords
modified epoxy
epoxy resin
epoxy according
application
agent
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201310496035.4A
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Chinese (zh)
Inventor
秦宏佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalian Shahekou District Small and Medium Sized Enterprise Service Center
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Dalian Shahekou District Small and Medium Sized Enterprise Service Center
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Application filed by Dalian Shahekou District Small and Medium Sized Enterprise Service Center filed Critical Dalian Shahekou District Small and Medium Sized Enterprise Service Center
Priority to CN201310496035.4A priority Critical patent/CN104559053A/en
Publication of CN104559053A publication Critical patent/CN104559053A/en
Pending legal-status Critical Current

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Abstract

The invention discloses modified epoxy resin which consists of epoxy resin, a curing agent, a flexibilizer, a thermal stabilizer, a filling reinforcing agent, an anti-impact modifier, a crosslinking agent and the like. By virtue of the different additives, the toughness, the intensity, the fatigue resistance of the modified epoxy resin can be improved, and the comprehensive performance of the epoxy resin is greatly improved. Due to the low cost of the modified epoxy resin, the use range of the modified epoxy resin can be greatly expanded, and the modified epoxy resin is particularly applicable to the field of electronic and electrical insulating materials.

Description

A kind of modified epoxy and application thereof
Technical field
The present invention relates to field of compound material, particularly relate to a kind of modified epoxy and application thereof.
Background technology
Epoxy resin is the most widely used matrix resin of polymer matrix composite.Be widely used because epoxy resin has the excellent feature such as adhesiveproperties, erosion resistance, mechanical property, chemical stability, easy-formation processing.In fields such as coating, light industry, building, machinery, space flight and aviation.But because after epoxy resin cure, cross-linking density is high, exist internal stress greatly, easy crisp, the defect such as resistance to fatigue is low, thermotolerance is low, poor impact resistance, make it be difficult to meet the eyeball of engineering, make it apply and be very restricted.
So be the primary study direction of current epoxy resin Application Areas to the modification work of epoxy resin.And in the modification of epoxy resin toughness reinforcing be improve its application very important part.There is heat-resistant powder filler toughness reinforcing in current prior art, the methods such as thermotropic liquid crystal polymer toughening, research at present for toughening modifying is mainly concentrated both ways: be how to obtain high performance modified epoxy on the one hand, to meet the needs in market and actual industrial production; Be the modified epoxy how obtaining low cost on the other hand, put into production in large quantity with scientific research and apply.
Summary of the invention
In order to solve the technological deficiency existed in above-mentioned prior art, the present invention proposes that a kind of cost is low, toughness significantly improves, mechanical property is good, physical strength is high, excellent combination property and can carry out the modified epoxy of large quantities of input industrial production and application, also has its application in electric insulating material field.
Technical scheme of the present invention is as follows:
A kind of modified epoxy, is formed by following composition and weight ratio proportioning:
Wherein toughner is the mixture of one or more in polyethersulfone, polyetherimide, polyetherketone, polyphenylene oxide.
Preferably, modified epoxy is formed by following composition and weight ratio proportioning:
Preferably, solidifying agent is the mixture of one or more compositions in glyoxaline compound, tertiary amine compound or organic phosphine compound.
Preferably, toughner is one or both mixture of polyetherimide, polyetherketone.
Preferably, thermo-stabilizer is dibasic lead stearate.Thermo-stabilizer can stop effectively, reduce the degraded even substantially stopping epoxy resin, thus extends its work-ing life.Therefore thermo-stabilizer has vital role for the over-all properties of modified epoxy, and preferred dibasic lead stearate can play good effect.
Preferably, packing strengthening agent is talcum powder.Weighting agent can improve the mechanical property of epoxy resin effectively, and reaches by the reaction conditions reducing reactant the object that a low consumption completes modifying process.Therefore the over-all properties for modified epoxy has vital role, and preferred talcum powder can reduce the reaction cost of this modified epoxy effectively.
Preferably, anti-impact modifier is chlorinatedpolyethylene.Anti-impact modifier can improve the low temperature brittleness of epoxy resin well, improves the toughness of epoxy resin.So anti-impact modifier has vital role for the performance of modified epoxy.Preferred chlorinatedpolyethylene can improve the toughness of epoxy resin effectively.
Preferably, linking agent is dicumyl peroxide.Linking agent, as the one of additive, can improve other over-all propertieies such as the thermotolerance of epoxy resin, oxidation-resistance, dimensional stability and mechanical property effectively significantly.Preferred dicumyl peroxide can improve the over-all properties of epoxy resin effectively.
Another goal of the invention of the present invention is the application of above-mentioned modified epoxy in electric insulating material field.
Effective effect of the present invention is:
The first, modified epoxy provided by the present invention, by using epoxy resin as matrix, add the modification that the additives such as solidifying agent, toughner, thermo-stabilizer promote epoxy resin wherein, greatly strengthen the toughness of epoxy resin, intensity, antifatigue degree, shock-resistant degree etc., substantially increase the over-all properties of epoxy resin.
The second, modified epoxy provided by the present invention, except the lifting in mechanical property, low its use range that also makes of the cost of its modification can be expanded greatly, application especially in the industrial production.
Three, modified epoxy provided by the present invention is in the application in electric insulating material field, because modified epoxy provided by the present invention is greatly improved in mechanical property, toughness, intensity, antifatigue degree, shock-resistant degree etc., make it particularly outstanding in the lifting of the application in electric insulating material field.
Embodiment
Following non-limiting example can make the present invention of those of ordinary skill in the art's comprehend, but does not limit the present invention in any way.
Embodiment 1
A kind of modified epoxy, it is formed by following composition and weight ratio proportioning:
Wherein solidifying agent is glyoxal ethyline, and toughner is polyetherimide, and thermo-stabilizer is dibasic lead stearate, and packing strengthening agent is talcum powder, and anti-impact modifier is chlorinatedpolyethylene, and linking agent is dicumyl peroxide.
Embodiment 2
A kind of modified epoxy, it is formed by following composition and weight ratio proportioning:
Wherein solidifying agent is glyoxal ethyline, and toughner is polyetherimide, and thermo-stabilizer is dibasic lead stearate, and packing strengthening agent is talcum powder, and anti-impact modifier is chlorinatedpolyethylene, and linking agent is dicumyl peroxide.
Embodiment 3
A kind of modified epoxy, it is formed by following composition and weight ratio proportioning:
Wherein solidifying agent is glyoxal ethyline, and toughner is polyetherimide, and thermo-stabilizer is dibasic lead stearate, and packing strengthening agent is talcum powder, and anti-impact modifier is chlorinatedpolyethylene, and linking agent is dicumyl peroxide.
The product obtained by embodiment 1-3 carries out mechanical property and other performance tests, post analysis is comprehensively reached a conclusion: embodiment 1-3 obtain product modification epoxy resin over-all properties be significantly improved, and embodiment obtain the over-all properties of product modification epoxy resin raising be obviously better than embodiment 2,3.

Claims (9)

1. a modified epoxy, is characterized in that: described modified epoxy is formed by following composition and weight ratio proportioning:
Wherein toughner is the mixture of one or more in polyethersulfone, polyetherimide, polyetherketone, polyphenylene oxide.
2. modified epoxy according to claim 1, is characterized in that: described modified epoxy is formed by following composition and weight ratio proportioning:
3. modified epoxy according to claim 1, is characterized in that: described solidifying agent is the mixture of one or more compositions in glyoxaline compound, tertiary amine compound or organic phosphine compound.
4. modified epoxy according to claim 1, is characterized in that: described toughner is one or both mixture of polyetherimide, polyetherketone.
5. modified epoxy according to claim 1, is characterized in that: described thermo-stabilizer is dibasic lead stearate.
6. modified epoxy according to claim 1, is characterized in that: described packing strengthening agent is talcum powder.
7. modified epoxy according to claim 1, is characterized in that: described anti-impact modifier is chlorinatedpolyethylene.
8. modified epoxy according to claim 1, is characterized in that: described linking agent is dicumyl peroxide.
9. modified epoxy according to claim 1 is in the application in electric insulating material field.
CN201310496035.4A 2013-10-21 2013-10-21 Modified epoxy resin and application thereof Pending CN104559053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310496035.4A CN104559053A (en) 2013-10-21 2013-10-21 Modified epoxy resin and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310496035.4A CN104559053A (en) 2013-10-21 2013-10-21 Modified epoxy resin and application thereof

Publications (1)

Publication Number Publication Date
CN104559053A true CN104559053A (en) 2015-04-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310496035.4A Pending CN104559053A (en) 2013-10-21 2013-10-21 Modified epoxy resin and application thereof

Country Status (1)

Country Link
CN (1) CN104559053A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105623265A (en) * 2016-04-01 2016-06-01 中国科学院长春应用化学研究所 Toughener and modified epoxy resin
CN106280252A (en) * 2016-08-11 2017-01-04 苏州柯创电子材料有限公司 The insulation board of form stable and manufacture method thereof
CN107383783A (en) * 2017-08-18 2017-11-24 苏州格瑞格登新材料科技有限公司 A kind of environment-friendly electronic insulating materials and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105623265A (en) * 2016-04-01 2016-06-01 中国科学院长春应用化学研究所 Toughener and modified epoxy resin
CN105623265B (en) * 2016-04-01 2018-07-03 中国科学院长春应用化学研究所 A kind of toughener and modified epoxy
CN106280252A (en) * 2016-08-11 2017-01-04 苏州柯创电子材料有限公司 The insulation board of form stable and manufacture method thereof
CN107383783A (en) * 2017-08-18 2017-11-24 苏州格瑞格登新材料科技有限公司 A kind of environment-friendly electronic insulating materials and preparation method thereof

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Application publication date: 20150429