CN104556467B - 处理蚀刻废液的方法 - Google Patents
处理蚀刻废液的方法 Download PDFInfo
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- CN104556467B CN104556467B CN201310491934.5A CN201310491934A CN104556467B CN 104556467 B CN104556467 B CN 104556467B CN 201310491934 A CN201310491934 A CN 201310491934A CN 104556467 B CN104556467 B CN 104556467B
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CN201310491934.5A CN104556467B (zh) | 2013-10-18 | 2013-10-18 | 处理蚀刻废液的方法 |
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CN104556467A CN104556467A (zh) | 2015-04-29 |
CN104556467B true CN104556467B (zh) | 2017-02-08 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112593233B (zh) * | 2020-11-26 | 2021-08-31 | 池蓉 | 印刷电路板蚀刻废液的处理方法 |
CN114516655B (zh) * | 2022-02-09 | 2023-07-04 | 广州科城环保科技有限公司 | 一种线路板废物生产氢氧化铜的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101654275A (zh) * | 2009-08-21 | 2010-02-24 | 广州市白云区南溪化工厂 | 一种酸碱蚀刻废液综合利用方法 |
CN102107978A (zh) * | 2010-12-23 | 2011-06-29 | 惠州市奥美特环境科技有限公司 | 电路板行业含铜蚀刻废液资源化利用及无害化处理的方法 |
WO2012018249A1 (en) * | 2010-08-02 | 2012-02-09 | Macro Growth Sdn Bhd | Flocculating agent for waste water treatment and method of using thereof |
CN202755059U (zh) * | 2012-08-09 | 2013-02-27 | 厦门市铜鑫环保科技有限公司 | 蚀刻废液处理设备 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101654275A (zh) * | 2009-08-21 | 2010-02-24 | 广州市白云区南溪化工厂 | 一种酸碱蚀刻废液综合利用方法 |
WO2012018249A1 (en) * | 2010-08-02 | 2012-02-09 | Macro Growth Sdn Bhd | Flocculating agent for waste water treatment and method of using thereof |
CN102107978A (zh) * | 2010-12-23 | 2011-06-29 | 惠州市奥美特环境科技有限公司 | 电路板行业含铜蚀刻废液资源化利用及无害化处理的方法 |
CN202755059U (zh) * | 2012-08-09 | 2013-02-27 | 厦门市铜鑫环保科技有限公司 | 蚀刻废液处理设备 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220921 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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