CN104553364B - A kind of noncontact full-automatic substrate slice grouping system and laser marking device - Google Patents
A kind of noncontact full-automatic substrate slice grouping system and laser marking device Download PDFInfo
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- CN104553364B CN104553364B CN201410842970.6A CN201410842970A CN104553364B CN 104553364 B CN104553364 B CN 104553364B CN 201410842970 A CN201410842970 A CN 201410842970A CN 104553364 B CN104553364 B CN 104553364B
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- 239000000758 substrate Substances 0.000 title claims abstract description 80
- 238000010330 laser marking Methods 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 47
- 230000005540 biological transmission Effects 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000004579 marble Substances 0.000 claims abstract description 22
- 239000003550 marker Substances 0.000 claims abstract description 7
- 230000002950 deficient Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
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Abstract
The present invention relates to semiconductor manufacturing and LED manufacture technology field, particularly relate to a kind of noncontact full-automatic substrate slice grouping system and laser marking device；The noncontact full-automatic substrate slice grouping system of the present invention and laser marking device, including frame, also include marble base plate, transmission workbench, scanning workbench, detection head bracket, laser detection head, marble crossbeam, material carrier platform, conveyer mechanical arm, centering machine, laser print apparatus, be arranged at marker's station of the downside of described laser print apparatus, the first elevator, the second elevator and the 3rd elevator；Detection equipment is fully-automatic equipment: automatic charging, detection, and according to testing result, qualified substrate slice is delivered to print area, laser control system control laser head and complete mark；The present invention improves production efficiency, decreases the pollution to substrate slice.
Description
Technical field
The present invention relates to semiconductor manufacturing and LED manufacture technology field, particularly relate to a kind of noncontact complete
Automatically substrate slice grouping system and laser marking device.
Background technology
In prior art, detect kind equipment at present, focus primarily upon manual and semi-automatic.To LED or
The substrate slice of IC manufacture process carries out non-contacting surface parameter detection: TTV, LTV, BOW, THK and
The parameters such as Warp.The detection technique used includes contactless optical sensor and uses Newton's ring technology
Realize.Mainly external product.Laser marking device, after positioning substrate slice, passes through software design patterns
Mark content, prints the information such as numbering, name of product on substrate slice by laser instrument.Domestic have
The production of this kind equipment.Detection equipment is the most only divided into manual and semi-automatic two kinds.And the most automatically
Sorting function.In actual use, easily polluting detection substrate slice, efficiency is low etc. asks
Topic.Laser marking device, due to reasons such as the laser head used and software processes, presently, there are and ask
Topic is that floor space is big, and efficiency is low.And fault rate is high.Both the above equipment, detects complete, will
Qualified substrate slice is carried out the information such as title, numbering by laser marking device.
Summary of the invention
It is an object of the invention to provide a kind of noncontact full-automatic substrate slice grouping system and laser marking sets
Standby, solve traditional equipment and easily pollute that detected substrate slice, detection efficiency be low, detection equipment accounts for
By the problem that space is relatively big and fault is higher.
The present invention solves that its technical problem be the technical scheme is that
A kind of noncontact full-automatic substrate slice grouping system and laser marking device, including frame, also wrap
The marble base plate that includes the side of the upper end being arranged at described frame, the upper end that is arranged at described frame
Opposite side transmission workbench, be arranged at the scanning workbench of upper end of described marble base plate, setting
The laser detecting head bracket, being arranged on described detection head bracket in the upper end of described scanning workbench
Detection head, it is arranged at the upper end of described marble base plate and is in upside big of described scanning workbench
Gypsum Fibrosum crossbeam, it is arranged at the upper end of described scanning workbench and is in described marble crossbeam and described biography
Material carrier platform between defeated workbench, it is arranged at the conveyer mechanical arm of the upper end of described transmission workbench, sets
The upper end being placed in described frame and the one end of the close described conveyer mechanical arm being in described transmission workbench
Centering machine, be arranged at described frame upper end and be in described transmission workbench away from described fixed
The laser print apparatus of one end of concentric mechanism, it is arranged at the marker of the downside of described laser print apparatus
Station, be arranged at described frame upper end and be in described transmission workbench away from described material carrier platform
First elevator of side, the second elevator and the 3rd elevator.
Wherein, described first elevator, described second elevator and the structure one of described 3rd elevator
Cause；Described second elevator is in described first elevator and the centre of described 3rd elevator；Described
Second elevator is for placing substrate slice to be detected and placing underproof substrate slice；Described first liter
Fall machine and described 3rd elevator for place mark complete substrate slice.
Wherein, described laser print apparatus includes support member and is arranged in the top of described support member
Marked part；Described marked part is in the surface of described marker's station.
Wherein, described conveyer mechanical arm includes installing component, is arranged at the upper end of described installing component
First arm for taking material and be arranged at second arm for taking material of upper end of described installing component；Described installing component revolves
It is located at the upper end of described transmission workbench, described first arm for taking material and described second arm for taking material angle
For θ；Described θ 100 °, and θ 150 °.
Wherein, substrate slice to be detected is placed in described second elevator together with film magazine；
Described conveyer mechanical arm moves on described transmission workbench, and described conveyer mechanical arm is treated described
The substrate slice of detection moves to described centering machine；
The mobile substrate slice described to be detected come is felt relieved by described centering machine；
Described conveyer mechanical arm moves on described transmission workbench, described to be detected by felt relieved
Substrate slice moves to described material carrier platform；
Described scanning workbench moves according to default program, and described laser detection head is treated described
The substrate slice of detection detects, and judges that described substrate slice to be detected is the most qualified；
If described substrate slice to be detected is defective, described conveyer mechanical arm will be underproof through detection
Described substrate slice is directly put back in described second elevator；
If described substrate slice to be detected is qualified, described conveyer mechanical arm by through detection qualified described in
Substrate slice is transferred to described laser print apparatus and carries out mark；
Described substrate slice after mark is transferred to described first elevator and described by described conveyer mechanical arm
3rd elevator.
Wherein, the surface of described substrate slice to be detected is detected by described laser detection head, and will
The data that detection is collected are transferred to computer, and transmission is come in by described computer according to default algorithm
Data process；
The data of described substrate slice detection to be detected are included TTV, LTV, BOW, Warp and THK；
The data of described substrate slice detection to be detected are stored in data base.
It is an advantage of the current invention that:
The noncontact full-automatic substrate slice grouping system of the present invention and laser marking device, including frame,
Also include being arranged at the marble base plate of the side of the upper end of described frame, being arranged at the upper of described frame
End opposite side transmission workbench, be arranged at the upper end of described marble base plate scanning workbench,
It is arranged at the detection head bracket of the upper end of described scanning workbench, is arranged on described detection head bracket
Laser detection head, it is arranged at the upper end of described marble base plate and is in the upside of described scanning workbench
Marble crossbeam, be arranged at the upper end of described scanning workbench and be in described marble crossbeam and institute
State transmission workbench between material carrier platform, be arranged at the upper end of described transmission workbench conveyer mechanical arm,
The upper end being arranged at described frame and the one of the close described conveyer mechanical arm being in described transmission workbench
End centering machine, be arranged at described frame upper end and be in described transmission workbench away from described
The laser print apparatus of one end of centering machine, it is arranged at the printing of the downside of described laser print apparatus
Workbench, be arranged at described frame upper end and be in described transmission workbench away from described material carrier platform
The first elevator of side, the second elevator and the 3rd elevator；In the present invention, detection equipment is
Fully-automatic equipment: automatic charging, detection, and according to testing result, deliver to qualified substrate slice beat
Print region, is controlled laser head by laser control system and completes mark；The substrate slice finally mark completed
Deliver in the film magazine set；The present invention improves production efficiency, decreases the pollution to substrate slice.
Accompanying drawing explanation
Fig. 1 is noncontact full-automatic substrate slice grouping system and the vertical view of laser marking device of the present invention
Figure.
Fig. 2 is the noncontact full-automatic substrate slice grouping system of the present invention and the master of laser marking device regards
Figure.
Fig. 3 be the noncontact full-automatic substrate slice grouping system of the present invention and laser marking device to lining
Egative film carries out the flow chart detected.
1-marble base plate；2-scanning workbench；3-laser detection head；4-marble crossbeam；5-carries
Material platform；6-laser print apparatus；7-transmits workbench；8-the first elevator；9-the second elevator；
10-the 3rd elevator；11-conveyer mechanical arm；12-centering machine；13-detects head bracket；14-prints
Workbench；15-frame.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be readily apparent from effect
Understand, below in conjunction with diagram and specific embodiment, the present invention is expanded on further.
In conjunction with Fig. 1 to Fig. 3 to the noncontact full-automatic substrate slice grouping system of the present invention and laser marking
Equipment is described in detail.
The noncontact full-automatic substrate slice grouping system of the present invention and laser marking device, including frame 15,
Also include being arranged at the marble base plate 1 of the side of the upper end of described frame 15, being arranged at described frame
The transmission workbench 7 of the opposite side of the upper end of 15, it is arranged at the sweeping of upper end of described marble base plate 1
Retouch workbench 2, be arranged at the detection head bracket 13 of the upper end of described scanning workbench 2, be arranged at institute
State laser detection head 3, the upper end being arranged at described marble base plate 1 and the place on detection head bracket 13
Marble crossbeam 4 in the upside of described scanning workbench 2, it is arranged at the upper of described scanning workbench 2
Hold and be in the material carrier platform 5 between described marble crossbeam 4 and described transmission workbench 7, be arranged at institute
State the conveyer mechanical arm 11 of the upper end of transmission workbench 7, be arranged at the upper end of described frame 15 and be in
The centering machine 12 of one end of the close described conveyer mechanical arm 11 of described transmission workbench 7, it is arranged at
The upper end of described frame 15 and be in described transmission workbench 7 away from the one of described centering machine 12
End laser print apparatus 6, be arranged at the downside of described laser print apparatus 6 marker's station 14,
Be arranged at described frame 15 upper end and be in described transmission workbench 7 away from described material carrier platform 5
First elevator the 8, second elevator 9 and the 3rd elevator 10 of side.To be risen by transmission mechanism
On fall machine, the substrate slice in film magazine is placed on the wafer-supporting platform on scanning workbench, then sets according to software
Put and carry out contactless scanning, and result is carried out relevant treatment by algorithm.Final result shows at screen
While on curtain, it is saved in corresponding lane database.And qualified substrate slice is numbered or batch
Number mark.After mark, then it is placed in corresponding film magazine.Meanwhile, can 3-D to substrate slice
Display, facilitates operator very clear, understands testing result at any time.
Described first elevator 8, described second elevator 9 and the structure one of described 3rd elevator 10
Cause；Described second elevator 9 is in described first elevator 8 and the centre of described 3rd elevator 10；
Described second elevator 9 is for placing substrate slice to be detected and placing underproof substrate slice；Described
First elevator 8 and described 3rd elevator 10 for place mark complete substrate slice.
Described laser print apparatus 6 includes support member and is arranged in the beating of top of described support member
Mark parts；Described marked part is in the surface of described marker's station 14.
Described conveyer mechanical arm 11 include installing component, be arranged at described installing component upper end first
Arm for taking material and be arranged at second arm for taking material of upper end of described installing component；The rotation of described installing component is located at
The upper end of described transmission workbench 7, described first arm for taking material and described second arm for taking material angle are
θ；Described θ 100 °, and θ 150 °.
Substrate slice to be detected is placed in described second elevator 9 together with film magazine；
Described conveyer mechanical arm 11 moves on described transmission workbench 7, described conveyer mechanical arm 11
Described substrate slice to be detected is moved to described centering machine 12；
The mobile substrate slice described to be detected come is felt relieved by described centering machine 12；
Described conveyer mechanical arm 11 moves on described transmission workbench 7, described to be checked by felt relieved
The substrate slice surveyed moves to described material carrier platform 5；
Described scanning workbench 2 moves according to default program, and described laser detection head 3 is to institute
State substrate slice to be detected to detect, and judge that described substrate slice to be detected is the most qualified；
If described substrate slice to be detected is defective, described conveyer mechanical arm 11 will be defective through detection
Described substrate slice directly put back in described second elevator 9；
If described substrate slice to be detected is qualified, described conveyer mechanical arm 11 is by the institute qualified through detection
State substrate slice to be transferred to described laser print apparatus 6 and carry out mark；
Described substrate slice after mark is transferred to described first elevator 8 He by described conveyer mechanical arm 11
Described 3rd elevator 10.
The surface of described substrate slice to be detected is detected by described laser detection head 3, and will detection
The data collected are transferred to computer, the number that transmission is come in by described computer according to default algorithm
According to processing；
The data of described substrate slice detection to be detected are included TTV, LTV, BOW, Warp and THK；
The data of described substrate slice detection to be detected are stored in data base.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described.This
Skilled person will appreciate that of industry, the present invention is not restricted to the described embodiments, above-described embodiment and
The principle that the present invention is simply described described in description, before without departing from spirit and scope of the invention
Putting the present invention and also have various changes and modifications, these changes and improvements both fall within claimed basis
In invention scope.Claimed scope is defined by appending claims and equivalent thereof.
Claims (2)
1. noncontact full-automatic substrate slice grouping system and a laser marking device, including frame (15),
It is characterized in that: also include being arranged at the side of the upper end of described frame (15) marble base plate (1),
Be arranged at the opposite side of the upper end of described frame (15) transmission workbench (7), be arranged at described greatly
The scanning workbench (2) of the upper end of Gypsum Fibrosum base plate (1), it is arranged at described scanning workbench (2)
The detection head bracket (13) of upper end, the laser detection head (3) being arranged on described detection head bracket (13),
The upper end being arranged at described marble base plate (1) and the upside being in described scanning workbench (2)
Marble crossbeam (4), it is arranged at the upper end of described scanning workbench (2) and to be in described marble horizontal
Material carrier platform (5) between beam (4) and described transmission workbench (7), it is arranged at described transmission work
The conveyer mechanical arm (11) of the upper end of platform (7), it is arranged at the upper end of described frame (15) and is in
The centering machine (12) of one end of the close described conveyer mechanical arm (11) of described transmission workbench (7),
Be arranged at described frame (15) upper end and be in described transmission workbench (7) away from described centering
The laser print apparatus (6) of one end of mechanism (12), it is arranged at described laser print apparatus (6)
Downside marker's station (14), be arranged at the upper end of described frame (15) and be in described transmission work
First elevator (8) of the side away from described material carrier platform (5) of station (7), the second elevator
And the 3rd elevator (10) (9)；
Described first elevator (8), described second elevator (9) and described 3rd elevator (10)
Structure consistent；Described second elevator (9) is in described first elevator (8) and the described 3rd
The centre of elevator (10)；Described second elevator (9) is for placing substrate slice to be detected and putting
Put underproof substrate slice；Described first elevator (8) and described 3rd elevator (10) are used for putting
Put mark complete substrate slice；
Described laser print apparatus (6) includes support member and the top being arranged in described support member
Marked part；Described marked part is in the surface of described marker's station (14)；
Described conveyer mechanical arm (11) includes installing component, is arranged at the upper end of described installing component
First arm for taking material and be arranged at second arm for taking material of upper end of described installing component；Described installing component revolves
Being located at the upper end of described transmission workbench (7), described first arm for taking material is become with described second arm for taking material
Angle is θ；Described θ 100 °, and θ 150 °；
Substrate slice to be detected is placed on described second elevator (9) together with film magazine；
Described conveyer mechanical arm (11) is upper mobile described transmission workbench (7), described transmission machinery
Described substrate slice to be detected is moved to described centering machine (12) by arm (11)；
The mobile substrate slice described to be detected come is felt relieved by described centering machine (12)；
Described conveyer mechanical arm (11) is upper mobile described transmission workbench (7), the institute that will have felt relieved
State substrate slice to be detected and move to described material carrier platform (5)；
Described scanning workbench (2) moves according to default program, described laser detection head (3)
Described substrate slice to be detected is detected, and judges that described substrate slice to be detected is the most qualified；
If described substrate slice to be detected is defective, described conveyer mechanical arm (11) will through detection not
Qualified described substrate slice is directly put back on described second elevator (9)；
If described substrate slice to be detected is qualified, described conveyer mechanical arm (11) will be qualified through detection
Described substrate slice be transferred to described laser print apparatus (6) and carry out mark；
Described substrate slice after mark is transferred to described first elevator by described conveyer mechanical arm (11)
And described 3rd elevator (10) (8).
A kind of noncontact full-automatic substrate slice grouping system the most according to claim 1 and laser are beaten
Marking device, it is characterised in that: the described laser detection head (3) surface to described substrate slice to be detected
Detecting, and data detection collected are transferred to computer, described computer is according to default
The data that transmission is come in by algorithm process；
The data of described substrate slice detection to be detected are included TTV, LTV, BOW, Warp and THK；
The data of described substrate slice detection to be detected are stored in data base.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410842970.6A CN104553364B (en) | 2014-12-30 | 2014-12-30 | A kind of noncontact full-automatic substrate slice grouping system and laser marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410842970.6A CN104553364B (en) | 2014-12-30 | 2014-12-30 | A kind of noncontact full-automatic substrate slice grouping system and laser marking device |
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| Publication Number | Publication Date |
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| CN104553364A CN104553364A (en) | 2015-04-29 |
| CN104553364B true CN104553364B (en) | 2016-08-24 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2550857B (en) * | 2016-05-25 | 2019-12-04 | Linx Printing Tech Limited | Printer |
| CN112880737B (en) * | 2021-01-14 | 2023-05-30 | 四川雅吉芯电子科技有限公司 | Integrated system for detecting monocrystalline silicon epitaxial wafer |
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| CN201116022Y (en) * | 2007-09-24 | 2008-09-17 | 东莞市奥普特自动化科技有限公司 | Full-automatic laser mark printing machine based on visual sense |
| CN101499430A (en) * | 2009-02-27 | 2009-08-05 | 天津伍嘉联创科技发展有限公司 | Automatic testing, detecting and packaging machine for 49S/SMD crystal |
| CN202727607U (en) * | 2012-08-08 | 2013-02-13 | 苏州迅镭激光科技有限公司 | Mobile phone middle plate laser automatic marking device |
| CN204506157U (en) * | 2014-12-30 | 2015-07-29 | 嘉兴微拓电子科技有限公司 | A kind of full-automatic substrate slice grouping system of noncontact and laser marking device |
-
2014
- 2014-12-30 CN CN201410842970.6A patent/CN104553364B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200996982Y (en) * | 2007-01-16 | 2007-12-26 | 天津必利优科技发展有限公司 | Quartz crystal oscillater, its automatic testing loader |
| CN201116022Y (en) * | 2007-09-24 | 2008-09-17 | 东莞市奥普特自动化科技有限公司 | Full-automatic laser mark printing machine based on visual sense |
| CN201109246Y (en) * | 2007-10-12 | 2008-09-03 | 深圳市大族激光科技股份有限公司 | Automatic laser marking gear |
| CN101499430A (en) * | 2009-02-27 | 2009-08-05 | 天津伍嘉联创科技发展有限公司 | Automatic testing, detecting and packaging machine for 49S/SMD crystal |
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| CN104553364A (en) | 2015-04-29 |
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Address after: No.18, Guigu 2nd Road, Luoxing street, Jiashan County, Jiaxing City, Zhejiang Province Patentee after: Jiaxing Weituo Electronic Technology Co., Ltd Address before: Jiaxing City, Zhejiang province Jiashan County 314100 street to Valley Park Luoxing Innovation Center Building 1, room 418 Patentee before: JIAXING WEITUO ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: A non-contact automatic substrate detection sorting and laser marking equipment Effective date of registration: 20210623 Granted publication date: 20160824 Pledgee: Zhejiang Jiashan rural commercial bank Limited by Share Ltd. science and technology sub branch Pledgor: Jiaxing Weituo Electronic Technology Co., Ltd Registration number: Y2021980005129 |
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Date of cancellation: 20220610 Granted publication date: 20160824 Pledgee: Zhejiang Jiashan rural commercial bank Limited by Share Ltd. science and technology sub branch Pledgor: Jiaxing Weituo Electronic Technology Co.,Ltd. Registration number: Y2021980005129 |
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Denomination of invention: A non-contact automatic substrate detection and sorting and laser marking equipment Effective date of registration: 20220614 Granted publication date: 20160824 Pledgee: Zhejiang Jiashan rural commercial bank Limited by Share Ltd. science and technology sub branch Pledgor: Jiaxing Weituo Electronic Technology Co.,Ltd. Registration number: Y2022990000325 |