CN104536266A - Dry film photoresist lamination body - Google Patents
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- CN104536266A CN104536266A CN201510050337.8A CN201510050337A CN104536266A CN 104536266 A CN104536266 A CN 104536266A CN 201510050337 A CN201510050337 A CN 201510050337A CN 104536266 A CN104536266 A CN 104536266A
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Abstract
The invention discloses a dry film photoresist lamination body which comprises a support layer, a first photoresist layer coating on the support layer, and a second photoresist layer coating on the first photoresist layer, wherein the acid value of the first photoresist layer is 80-400mgKOH/g, and the acid value of the second photoresist layer is 2-41.2mgKOH/g higher than that of the first photoresist layer. According to the dry film photoresist lamination body, the photoresist of a double-layer structure with different acid values is adopted, after the photoresist is exposed and developed, good graphic side morphology is formed, and an unexposed graphic adhesive layer can be relatively well removed. Therefore, the dry film photoresist lamination body can be used as a dry film photoresist lamination body material for etching or plating in fields such as manufacturing of printed circuit boards lead frames and semiconductor packaging and precise metal processing, and very good graphic line side morphology is achieved after graphs are exposed and developed.
Description
Technical field
The present invention relates to a kind of dry film photoresist layered product carrying out aqueous slkali development.
Background technology
In the encapsulation of the manufacture of printed circuit board (PCB), lead frame, semiconductor packages etc., BGA (Ball GridArray), CPS (Chip Size Package) etc., dry film photoresist layered product is widely used in the anticorrosive additive material of the processes such as etching or plating.Such as, when manufacturing printed circuit board (PCB), first, laminating film resist layer laminate on copper base, hides in dry film photoresist layered product with the mask with figure, expose, after graph exposure, remove unexposed position with developer solution, then implement etching or electroplating processes and form figure, finally peel off with remover and remove cured portion, thus realize Graphic transitions.
In recent years, along with electronic equipment is towards compact future development, the line size of the figures such as its printed circuit board (PCB) carried, lead frame is also more and more less, substrate and the resin combination contact area having formed figure are also in the trend diminished, in order to manufacture the line pattern of this thin space with more rate of good quality rate, this just requires that dry film photoresist layered product has good resolution and side pattern.
But, existing technology is, after graph exposure, development, at the side root of unexposed figure near exposed portion, cause reasons such as rinsing dead angle because circuit is meticulous, easily occur the cull that alkali lye fails to wash away, in follow-up etching or plating, and during resist after final removing solidification, accordingly, copper lines just forms the burr of evagination and the recessed inward hole, metal hole of coating.When pattern line gap is narrower, this cull is serious, and extreme case is exactly, and the glue surface between lines removes, but between lines, metal surface still exists very thin one deck cull, and resolution cannot promote.Although by the acid number promoting resist layer, reduce the methods such as the molecular weight of alkali soluble resin in resist and can obtain some improvement, but the side bad appearance of pattern line after the use of these methods also makes to develop, become not resistance to alkali cleaning, lines corner angle become fuzzy.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, a kind of dry film photoresist layered product is provided, in the fields such as the manufacture of its manufacture at printed circuit board (PCB), lead frame etc., semiconductor packages etc., the Precision Machining of metal, as the dry film photoresist laminate material etching use or plating, after graph exposure development, there is extraordinary pattern line side pattern.
The object of the invention is to be achieved through the following technical solutions: a kind of dry film photoresist layered product, the second resist layer comprising supporting layer, be coated on the first resist layer above supporting layer and be coated on above the first resist layer; The acid number of described first resist layer is 80 ~ 400mgKOH/g, and the acid number of the second resist layer is 82 ~ 441.2mgKOH/g, and the acid number of the second resist layer is than the high 2 ~ 41.2mgKOH/g of the first resist layer acid number.
Further, described first resist layer thickness is 5 ~ 50 microns, and the second resist layer thickness is 1-10 micron.
Further, described first resist layer and the second resist layer are 45 ~ 70% by massfraction carboxylic alkali-soluble polymkeric substance, massfraction be 15 ~ 45% be 0.01 ~ 5% containing at least one polymerisable unsaturated link monomer, massfraction be 0.5 ~ 10% light trigger, massfraction adjuvant forms.
Further, described carboxylic alkali-soluble polymkeric substance is by one or more carboxylic copolymerization units monomers, and the copolymerization units monomer of one or more not carboxyl groups obtains according to any proportioning copolymerization, described carboxylic copolymerization units monomer is selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, acid half ester, maleic acid, fumaric acid, vinyl acetic acid and acid anhydrides thereof etc., the copolymerization units monomer of described not carboxyl group is selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) lauryl acrylate, (methyl) octadecyl acrylate, (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxybutyl, polyethyleneglycol (methyl) acrylate, polypropylene glycol list (methyl) acrylate, (methyl) vinyl cyanide, (methyl) glycidyl acrylate, N, N-dimethyl (methyl) ethyl acrylate, N, N-diethyl (methyl) ethyl acrylate, N, N-dimethyl (methyl) propyl acrylate, N, N-diethyl (methyl) propyl acrylate, N, N-dimethyl (methyl) butyl acrylate, N, N-diethyl (methyl) butyl acrylate, (methyl) acrylamide, N-methylol-acrylamide, N-butoxymethyl-acrylamide, styrene, (methyl) benzyl acrylate, Phenoxyethyl (methyl) acrylate, (alkoxylate) nonyl phenol (methyl) acrylate etc.
Further, the weight-average molecular weight of described carboxylic alkali-soluble polymkeric substance is 10000-200000, further preferred 10000-120000.
Further, described containing at least one polymerisable unsaturated link monomer, be selected from trimethylolpropane triacrylate, (ethoxy) propoxylation trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, dipentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol acrylate, polyethyleneglycol diacrylate, polypropyleneglycol diacrylate, ethoxylated bisphenol a diacrylate, propoxylated bisphenol diacrylate, glycerin tripropionate.
Further, described light trigger is 2,4,5-triarylimidazoles dimer or the dimeric derivant of 2,4,5-triarylimidazoles.
Further, described light trigger by initiating agent auxiliary agent and 2,4,5-triarylimidazoles dimer or the dimeric derivant of 2,4,5-triarylimidazoles according to arbitrarily than mixing; Described initiating agent auxiliary agent is by aromatic ketone, quinone, styrax compound, benzil derivatives, acridine derivatives, N-phenylglycine derivant, coumarin series compounds, and one or more in oxazole based compound are according to forming than mixing arbitrarily.
Further, described adjuvant is made up of according to any proportioning mixing one or more in dyestuff, light colour coupler, quality thermal stabilizer, plastifier, pigment, filler, defoamer, fire retardant, stabilizing agent, levelling agent, stripping promoter, antioxidant, spices, preparation, thermal cross-linking agent.
Beneficial effect of the present invention is: the present invention adopts the double-deck resist of different acid number, and after anti-aging drug development, form good figure side pattern, unexposed figure glue-line can remove better.
Embodiment
A kind of dry film photoresist layered product of the present invention, comprises supporting layer, is coated on the second resist layer above the first resist layer above supporting layer and coating and the first resist layer; The acid number of described first resist layer is 80 ~ 400mgKOH/g, and the acid number of the second resist layer is 82 ~ 441.2mgKOH/g, and the acid number of the second resist layer is than the high 2 ~ 41.2mgKOH/g of the first resist layer acid number.
The present invention adopts the double-deck resist of different acid number, and make it after anti-aging drug development, form good figure side pattern, unexposed figure glue-line can remove better.
Above-mentioned first resist layer thickness is 5 ~ 50 microns, and the second resist layer thickness is 1-10 micron.
Above-mentioned first resist layer and the second resist layer are by carboxylic alkali-soluble polymkeric substance (A), form containing at least one polymerisable unsaturated link monomer (B), light trigger (C), adjuvant (D).
1. described in, the consumption of carboxylic alkali-soluble polymkeric substance (A) accounts for the 45-70% of total resist weight; In first resist layer and the second resist layer, the consumption due to carboxylic alkali-soluble polymkeric substance is different or carboxylic alkali-soluble polymkeric substance acid number is different, causes both acid numbers different.Two-layer acid number height is by increasing or reduce the consumption of A; Or when synthesizing A, increasing or reducing the methods such as carboxyl group-containing monomer consumption and controlling.Carboxylic alkali-soluble polymkeric substance is by one or more carboxylic copolymerization units monomers, and the copolymerization units monomer of one or more not carboxyl groups obtains according to any proportioning copolymerization; Its preparation method can be prepared, as solution polymerization, suspension polymerization etc. by known preparation method.Wherein, carboxylic copolymerization units monomer is selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, acid half ester, maleic acid, fumaric acid, vinyl acetic acid and acid anhydrides thereof etc., the copolymerization units monomer of described not carboxyl group is selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) lauryl acrylate, (methyl) octadecyl acrylate, (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxybutyl, polyethyleneglycol (methyl) acrylate, polypropylene glycol list (methyl) acrylate, (methyl) vinyl cyanide, (methyl) glycidyl acrylate, N, N-dimethyl (methyl) ethyl acrylate, N, N-diethyl (methyl) ethyl acrylate, N, N-dimethyl (methyl) propyl acrylate, N, N-diethyl (methyl) propyl acrylate, N, N-dimethyl (methyl) butyl acrylate, N, N-diethyl (methyl) butyl acrylate, (methyl) acrylamide, N-methylol-acrylamide, N-butoxymethyl-acrylamide, styrene, (methyl) benzyl acrylate, Phenoxyethyl (methyl) acrylate, (alkoxylate) nonyl phenol (methyl) acrylate etc.
The preferred 10000-200000 of weight-average molecular weight of carboxylic alkali-soluble polymkeric substance, from developability, further preferably less than 120000, from the resistance to corner angle of raising and side corrosion, preferably more than 10000.
For ensureing that the second resist layer is than the high 2 ~ 41.2mgKOH/g of the first resist layer acid number, two kinds of methods are all feasible below: increase the consumption of alkali-soluble polymer A in the second resist layer; Or when the A that synthesis second resist layer uses, increase carboxyl group-containing monomer consumption.
2. the above-mentioned consumption containing at least one polymerisable unsaturated link monomers B, from raising photosensitivity angle, be preferably resist weight 15% or its more than, from final alkali cleaning striping angle, be preferably resist weight 45% or its below.Trimethylolpropane triacrylate is selected from containing at least one polymerisable unsaturated link monomer, (ethoxy) propoxylation trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, dipentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol acrylate, polyethyleneglycol diacrylate, polypropyleneglycol diacrylate, ethoxylated bisphenol a diacrylate, propoxylated bisphenol diacrylate, glycerin tripropionate.From the angle of development and resolution, preferably (ethoxy) propoxylation trimethylolpropane triacrylate, (ethoxy) propoxylated bisphenol diacrylate and polyethyleneglycol diacrylate.Alternative commercialization monomer can select examples example as, the Sartomer trade mark SR454, CD542, SR602, SR541, SR480, SR252, SR644 etc.
First resist layer can be identical with consumption with the kind containing at least one polymerisable unsaturated link monomer used in the second resist layer, also can be different.
3. the consumption of above-mentioned light trigger C is the 0.5-10% of resist weight, light trigger consumption lower than 0.5% time, its photosensitivity be deteriorated; Light trigger consumption higher than 10% time, it may cause photosensitive dry film resolution to reduce.Light trigger is 2,4,5-triarylimidazoles dimer or the dimeric derivant of 2,4,5-triarylimidazoles.Can illustrate out, 2-(Chloro-O-Phenyl)-4,5-diphenyl-imidazole dipolymer, 2-(Chloro-O-Phenyl)-4,5-bis-(methoxyphenyl) imidazole dimer, 2-(adjacent fluorophenyl)-4,5-diphenyl-imidazole dipolymer, 2-(o-methoxyphenyl)-4,5-diphenyl-imidazole dipolymer, 2-(p-methoxyphenyl)-4,5-diphenyl-imidazole dipolymer etc.
Described initiating agent also can include initiating agent auxiliary agent, and initiating agent auxiliary agent can list, thioxanthones, benzoin phenyl ether, two ketones, benzoin methyl ether, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's keton), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxyl-4'-dimethylamino benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-butanone-1,2-methyl isophthalic acid-aromatic ketone such as [4-(methyl thio) phenyl]-2-morpholino-acetone-1 grade, 2-EAQ, phenanthrenequione, 2-tert-butyl group anthraquinone, prestox anthraquinone, 1,2-benzo anthraquinone, 2,3-benzo anthraquinone, 2-phenyl anthraquinone, 2,3-diphenyl anthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthrenequione, 2-methyl 1,4-naphthoquinone, the quinones such as 2,3-dimethyl anthraquinone, benzoin methyl ether, benzoin ethyl ether, , the benzoin ether compounds such as styrax phenyl ether, styrax, benzoin methyl, the styrax compounds such as ethyl styrax, the benzil derivatives such as benzil dimethyl ketal, 9-phenylacridine, the acridine derivatives such as two (9, the 9'-acridine) heptane of 1,7-, the N-phenylglycine derivants such as N-phenylglycine, coumarin series compounds, oxazole based compound etc.
First resist layer can be identical with consumption with the kind of initiating agent used in the second resist layer, also can be different.
4., except such as mentioned component, as required, adjuvant D can be added.Adjuvant D accounts for 0.01 ~ 5% of resist weight.Adjuvant is one or more potpourris according to any proportioning mixing composition in the light such as malachite green and other dyes, leuco crystal violet colour coupler, quality thermal stabilizer, plastifier, pigment, filler, defoamer, fire retardant, stabilizing agent, levelling agent, stripping promoter, antioxidant, spices, preparation, thermal cross-linking agent etc.
First resist layer can be identical with consumption with the kind of adjuvant used in the second resist layer, also can be different.
Dry film photoresist layered product of the present invention, can be as required, by carboxylic alkali-soluble polymkeric substance, be dissolved in methyl alcohol, ethanol, isopropyl alcohol, acetone, butanone, methyl cellosolve, toluene, N containing at least one polymerisable unsaturated link monomer, light trigger, adjuvant, in the mixed solvent of dinethylformamide, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate equal solvent or these solvents, use with the solution state of solid content 10-80%.
Dry film photoresist layered product of the present invention is by obtaining with under type: such as, modulates the solution of the solution of the first resist layer, the second resist layer respectively, certain thickness colourless support is coated with the solution of the first resist layer, and is dried.After drying, continue the solution being coated with the second resist layer on the first resist layer, and be dried.
The known coating methods such as coating method can adopt bar coater to be coated with, reverse roller coat spreader, gravure coater, comma spreader, curtain coater carry out.Drying mode can adopt the drying mode such as infra-red drying, heated-air drying.1-30 minute is carried out at baking temperature 50-120 DEG C.
Also the solution of the solution of above-mentioned first resist layer, the second resist layer can be carried out disposable coating by multilayer slope stream extrusion coated.
Above-mentioned water white transparency support can be Low Density Polyethylene, high density polyethylene, polypropylene, polyester, polyethylene terephthalate, polycarbonate, polyarylate, etc. film.For dry film photoresist layered product, in order to avoid moisture impacts its physical property and application conditions, preferred supporting carrier film is polyethylene terephthalate, tygon, and polypropylene film.
Water white transparency support thickness is 10-100 μm, preferred 15-80 μm, more preferably the pet film of 15-40 μm.
Then, at the above-mentioned coated stacked polymeric roofing membrane for the protection of dry film photoresist layered product in dry film photoresist layered product upper strata, finally dry film is obtained.Coverlay is the same with transparent support film, preferably low-moisture permeability, the resin molding easily peeled off, but can transparent also can be opaque.Preferred coverlay is polyethylene terephthalate, the resin molding such as tygon and polypropylene with 5-100 μm of thickness.
Below in conjunction with embodiment, the invention will be further described.
Embodiment (embodiment 1-5, comparative example 1-3)
(1) the following alkali-soluble polymer resin (A) containing carboxylic acid is prepared.
In a nitrogen atmosphere, 120 milliliters of butanone are added in the four openning flasks of 500 milliliters being equipped with heating arrangement, paddle, serpentine condenser, constant pressure funnel and thermometer, add the whole monomers used in polymer formulators, open stirring apparatus, the temperature of heating arrangement is increased to 80 DEG C.Then, in a nitrogen atmosphere, in reaction bulb, slowly drip 30 milliliters of butanone solutions of 0.8 gram of azoisobutyronitrile, drip process lasts about 1.5 hours.After dropwising, continue insulation 4 hours.
Then, be dissolved in by the azoisobutyronitrile of 0.6g in 40 milliliters of butanone, be added drop-wise at twice in reactant liquor, each time for adding is 15 minutes, and first time drips rear insulation and just carries out second time dropping after 1 hour.After dripping, continue insulation 2 hours.Stop heating and stir, being cooled to room temperature, take out reactant liquor, obtain alkali-soluble polymer resin solution (A-1), alkali-soluble polymer resin weight-average molecular weight is 110,000, and recording its solids content is 40.1%.
Use the same method, monomer composition mass ratio, the polymer average molecular weight obtained and solid content that synthetic alkali soluble polymer Resin A-2 to A-5. polymkeric substance uses are as shown in table 1.
Table 1
(2) prepare following containing at least one polymerisable unsaturated link monomer (B):
B-1: ethoxylated trimethylolpropane triacrylate (Sartomer monomer SR454, ethoxy unit number is 3)
B-2: ethoxylated bisphenol a diacrylate (Sartomer monomer SR602, ethoxy unit number is 10)
B-3: polyglycol (600) diacrylate (Sartomer monomer SR252)
(3) following light trigger (C) is prepared
C-1:2-(Chloro-O-Phenyl)-4,5-diphenyl-imidazole dimer
C-2:4,4 '-bis-(diethylamino) benzophenone
C-3:2-isopropyl thioxanthone
(4) following adjuvant (D) is prepared:
D-1: leuco crystal violet
D-2: Viride Nitens pigment
D-3: brilliant green pigment
D-4: trisbromomethyl benzene sulphur sulfone
(5) following solvents (E) is prepared:
E-1: butanone
(6) resist layer solution preparation, as shown in table 2.
Table 2
(7), after mixing according to the proportioning of table 2, respectively through fully stirring, mixing, deaeration, is coated with according to the coating method of table 3.
Table 3
Coating uses bar coater to be coated on by the first resist layer dissolution homogeneity as 18 μm of support thick pet film surfaces, drying 2 minutes in the air dry oven of 90 DEG C, then take out, form first resist layer of thick about 20 μm, second resist layer dissolution homogeneity is coated in anti-corrosion agent composition 1 coating surface by continuation bar coater, in the air dry oven of 90 DEG C dry 2 minutes again, finally form the second resist layer.Dry film photoresist layer gross thickness is 25 μm (wherein the first resist thickness 20 μm, second resist thickness 5 μm).Then, resist layer surface, fits as 25 μm of protective seam thick polyethylene films, thus obtains dry film photoresist layered product.
(8) performance evaluation
1. the processing of substrate surface: photosensitivity and adhesion evaluation substrate, by being 1.5mm by thickness, after the polishing of wet type polishing roll is carried out on the copper-clad laminate surface of stacked 35 μm of rolled copper foils, then carry out jet cleaning polishing (expulsion pressure is 0.2MPa).
2. stacked: under the roller temperature of 105 DEG C, peel off the diaphragm of dry film photoresist layered product, while be pressed in through surface working with hot roll lamination machine by resist layer and be preheating on the copper-clad laminate of 60 DEG C.Stress control is at 0.3Mpa, and stacked speed is 1.5 ms/min.
3. expose: will the film of circuitous pattern be had to be placed on support, compress, utilize ultrahigh pressure mercury lamp to expose, regulate exposure energy to being exposed to the 8th lattice with 21 lattice exposure guide rules (Stouffer GraphicArts equipment company).
4. develop: after the support above the resist after above-mentioned exposure is peeled off, in official hour, spray the aqueous sodium carbonate of the 1.2 quality % of 30 DEG C, dissolve and remove resist layer unexposed portion.The resist layer of unexposed portion is dissolved completely the minimum time of needs as minimum development time.
5. resolution evaluation: after the PE film of the photosensitive dry film resist layer laminate manufactured by removing, utilizes Heating roll to carry out stacked dry film on copper coin.At this, utilize the mask of the wiring pattern that the width with exposed portion and unexposed portion is 1:1 to expose, show movie queen with 1.5 of minimum development time, will normally define the value of minimum mask width as resolution of solidification resist line.
◎: resolution value is for being less than or equal to 15 μm;
Zero: resolution value, for being greater than 15 μm, is less than or equal to 20 μm
△: resolution value is greater than 20 μm
6. figure side pattern is evaluated: after the PE film of the photosensitive dry film resist layer laminate manufactured by removing, utilizes Heating roll to carry out stacked dry film on copper coin.At this, utilize the width with exposed portion and unexposed portion to be all that the mask of the wiring pattern of 15 μm exposes, show movie queen with 1.5 of minimum development time, normally will define solidification resist lines, by microscope, observe unexposed portion lines and whether remove.To evaluate perpendicular to lines, the cull width size that is parallel to copper foil surface, find out cull breadth extreme along lines, cull breadth extreme is less, and it is better to show.
◎: cull size is less than or equal to 0.5 μm;
Zero: cull size is greater than 0.5 μm, be less than or equal to 2 μm;
△: cull size is greater than 2 μm;
Evaluation result is as shown in table 4.
From above test result, the present invention can provide a kind of photosensitive dry film resist layer laminate, in the fields such as its Precision Machining at printed circuit board (PCB), lead frame, semiconductor packages, photovoltaic cell, metal, as resist material against corrosion, especially for the figure circuit of thin space, better figure side pattern can be obtained after development, be conducive to the lifting of resolution.
Claims (9)
1. a dry film photoresist layered product, is characterized in that, the second resist layer comprising supporting layer, be coated on the first resist layer above supporting layer and be coated on above the first resist layer; The acid number of described first resist layer is 80 ~ 400 mgKOH/g, and the acid number of the second resist layer is 82 ~ 441.2mgKOH/g, and the acid number of the second resist layer is than the high 2 ~ 41.2mgKOH/g of the first resist layer acid number.
2. dry film photoresist layered product according to claim 1, is characterized in that, described first resist layer thickness is 5 ~ 50 microns, and the second resist layer thickness is 1-10 micron.
3. dry film photoresist layered product according to claim 1, it is characterized in that, carboxylic alkali-soluble polymkeric substance, massfraction that described first resist layer and the second resist layer are 45 ~ 70% by massfraction be 15 ~ 45% be 0.01 ~ 5% containing at least one polymerisable unsaturated link monomer, massfraction be 0.5 ~ 10% light trigger, massfraction adjuvant forms.
4. dry film photoresist layered product according to claim 3, it is characterized in that, described carboxylic alkali-soluble polymkeric substance is by one or more carboxylic copolymerization units monomers, and the copolymerization units monomer of one or more not carboxyl groups obtains according to any proportioning copolymerization, described carboxylic copolymerization units monomer is selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, acid half ester, maleic acid, fumaric acid, vinyl acetic acid and acid anhydrides thereof etc., the copolymerization units monomer of described not carboxyl group is selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) lauryl acrylate, (methyl) octadecyl acrylate, (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxybutyl, polyethyleneglycol (methyl) acrylate, polypropylene glycol list (methyl) acrylate, (methyl) vinyl cyanide, (methyl) glycidyl acrylate, N, N-dimethyl (methyl) ethyl acrylate, N, N-diethyl (methyl) ethyl acrylate, N, N-dimethyl (methyl) propyl acrylate, N, N-diethyl (methyl) propyl acrylate, N, N-dimethyl (methyl) butyl acrylate, N, N-diethyl (methyl) butyl acrylate, (methyl) acrylamide, N-methylol-acrylamide, N-butoxymethyl-acrylamide, styrene, (methyl) benzyl acrylate, Phenoxyethyl (methyl) acrylate, (alkoxylate) nonyl phenol (methyl) acrylate etc.
5. dry film photoresist layered product according to claim 4, is characterized in that, the weight-average molecular weight of described carboxylic alkali-soluble polymkeric substance is 10000-200000, further preferred 10000-120000.
6. dry film photoresist layered product according to claim 3, it is characterized in that, described containing at least one polymerisable unsaturated link monomer, be selected from trimethylolpropane triacrylate, (ethoxy) propoxylation trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, dipentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol acrylate, polyethyleneglycol diacrylate, polypropyleneglycol diacrylate, ethoxylated bisphenol a diacrylate, propoxylated bisphenol diacrylate, glycerin tripropionate.
7. dry film photoresist layered product according to claim 3, is characterized in that, described light trigger is 2,4,5-triarylimidazoles dimer or the dimeric derivant of 2,4,5-triarylimidazoles.
8. dry film photoresist layered product according to claim 3, is characterized in that, described light trigger by initiating agent auxiliary agent and 2,4,5-triarylimidazoles dimer or the dimeric derivant of 2,4,5-triarylimidazoles according to arbitrarily than mixing; Described initiating agent auxiliary agent is by aromatic ketone, quinone, styrax compound, benzil derivatives, acridine derivatives, N-phenylglycine derivant, coumarin series compounds, and one or more in oxazole based compound are according to forming than mixing arbitrarily.
9. dry film photoresist layered product according to claim 3, it is characterized in that, described adjuvant is made up of according to any proportioning mixing one or more in dyestuff, light colour coupler, quality thermal stabilizer, plastifier, pigment, filler, defoamer, fire retardant, stabilizing agent, levelling agent, stripping promoter, antioxidant, spices, preparation, thermal cross-linking agent.
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| CN105511227A (en) * | 2015-12-26 | 2016-04-20 | 杭州福斯特光伏材料股份有限公司 | Dry film resist with good hole shielding function and laminated body thereof |
| CN105676593A (en) * | 2016-01-19 | 2016-06-15 | 杭州福斯特光伏材料股份有限公司 | Photosensitive dry film with stable storage and preparation method of photosensitive dry film |
| CN107942618A (en) * | 2017-11-29 | 2018-04-20 | 浙江福斯特新材料研究院有限公司 | A kind of high adhesion speed developability dry film photoresist |
| CN110564316A (en) * | 2019-09-17 | 2019-12-13 | 广东莱尔新材料科技股份有限公司 | UV viscosity reduction protective film with high stability in electroplating processing process and preparation method thereof |
| CN112824973A (en) * | 2019-11-20 | 2021-05-21 | 浙江福斯特新材料研究院有限公司 | Dry film resist laminate |
| CN114545734A (en) * | 2022-03-09 | 2022-05-27 | 珠海市能动科技光学产业有限公司 | Solder-resisting dry film photoresist, preparation method and application thereof |
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| CN105511227A (en) * | 2015-12-26 | 2016-04-20 | 杭州福斯特光伏材料股份有限公司 | Dry film resist with good hole shielding function and laminated body thereof |
| CN105511227B (en) * | 2015-12-26 | 2019-08-02 | 杭州福斯特应用材料股份有限公司 | A kind of dry film photoresist and its layered product with good hole masking function |
| CN105676593A (en) * | 2016-01-19 | 2016-06-15 | 杭州福斯特光伏材料股份有限公司 | Photosensitive dry film with stable storage and preparation method of photosensitive dry film |
| CN105676593B (en) * | 2016-01-19 | 2019-07-16 | 杭州福斯特应用材料股份有限公司 | A kind of photosensitive dry film of stable storing and preparation method thereof |
| CN107942618A (en) * | 2017-11-29 | 2018-04-20 | 浙江福斯特新材料研究院有限公司 | A kind of high adhesion speed developability dry film photoresist |
| CN107942618B (en) * | 2017-11-29 | 2021-02-05 | 浙江福斯特新材料研究院有限公司 | High-adhesion quick-developable dry film resist |
| CN110564316A (en) * | 2019-09-17 | 2019-12-13 | 广东莱尔新材料科技股份有限公司 | UV viscosity reduction protective film with high stability in electroplating processing process and preparation method thereof |
| CN110564316B (en) * | 2019-09-17 | 2021-10-15 | 广东莱尔新材料科技股份有限公司 | UV viscosity reduction protective film with high stability in electroplating processing process and preparation method thereof |
| CN112824973A (en) * | 2019-11-20 | 2021-05-21 | 浙江福斯特新材料研究院有限公司 | Dry film resist laminate |
| CN114545734A (en) * | 2022-03-09 | 2022-05-27 | 珠海市能动科技光学产业有限公司 | Solder-resisting dry film photoresist, preparation method and application thereof |
| CN114545734B (en) * | 2022-03-09 | 2022-08-12 | 珠海市能动科技光学产业有限公司 | Solder-resisting dry film photoresist, preparation method and application thereof |
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