CN104534772B - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
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- CN104534772B CN104534772B CN201510004788.8A CN201510004788A CN104534772B CN 104534772 B CN104534772 B CN 104534772B CN 201510004788 A CN201510004788 A CN 201510004788A CN 104534772 B CN104534772 B CN 104534772B
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- semiconductor chilling
- semiconductor
- electric power
- chilling plate
- conversion apparatus
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
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- Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The invention provides a semiconductor refrigerator which comprises multiple semiconductor chilling plates and a power supply system supplying power for the semiconductor chilling plates. The semiconductor refrigerator is provided with multiple temperature areas, and each temperature area is refrigerated through one or more of the semiconductor chilling plates. The power supply system supplies power for the semiconductor chilling plates of the temperature areas respectively. According to the scheme, the semiconductor chilling plates refrigerate the temperature areas respectively, the power supply system supplies power for the semiconductor chilling plates of the temperature areas respectively, the refrigerating capacities of the semiconductor chilling plates are different due to the fact that different voltages are applied to the semiconductor chilling plates of the different temperature areas, the storage environments of different temperature areas with different temperatures are achieved, and the storage requirements of different goods are met. A source transformation device meeting the power supply requirement of the semiconductor chilling plates is selected from multiple source transformation devices with different voltage output ranges for power supply, and the energy consumption efficiency of the semiconductor refrigerator is improved.
Description
Technical field
The present invention relates to a kind of art of refrigeration units, more particularly to a kind of semiconductor freezer.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation and conduction
Technology and automatic pressure-transforming Variable flow control technology realize refrigeration, without the need for refrigeration working medium and mechanical moving element, solve medium pollution
With the application problem of the traditional mechanical refrigerator such as mechanical vibration.
The refrigerating capacity of semiconductor chilling plate is determined from the voltage swing powered to the semiconductor chilling plate, in prior art
In, typically by calculating cryogenic temperature and the difference of design temperature, calculate semiconductor chilling plate needs existing semiconductor freezer
The supply voltage wanted, then provides the supply voltage required for it to semiconductor chilling plate using electric power conversion apparatus.Namely
Identical when semiconductor freezer great majority are the temperature inside single temperature zone, that is, semiconductor freezer, causes semiconductor freezer
Purposes it is single, it is impossible to meet storage variety classes article requirement.
It is very wide additionally, due to the operating voltage range of semiconductor chilling plate, in some use environments, electric power conversion apparatus
Power supply conversion efficiency it is very low, cause the energy consumption of semiconductor freezer very big.And the electric power conversion apparatus of wide scope are also resulted in
Cost increase.
The content of the invention
In view of the above problems, it is proposed that the present invention so as to provide one kind overcome the problems referred to above or at least in part solve on
State the semiconductor freezer of problem.
The present invention one further objective is that the storage environment for making semiconductor freezer possess various different temperatures, meet not
With the memory requirement of type of item.
The present invention one further objective is that the energy consumption efficiency for improving quasiconductor.
According to an aspect of the present invention, the invention provides a kind of semiconductor freezer.The semiconductor freezer includes multiple
Semiconductor chilling plate and the electric power system for powering to multiple semiconductor chilling plates, semiconductor freezer is provided with multiple warm areas,
Each warm area is freezed by one or more in semiconductor chilling plate；Electric power system is configured to the semiconductor refrigerating to multiple warm areas
Piece is powered respectively.
Alternatively, electric power system includes：Multiple electric power conversion apparatus, the voltage output range of each electric power conversion apparatus sets
Difference is set to, and is configured to controllably be electrically connected on the semiconductor chilling plate of one or more warm areas.
Alternatively, electric power system also includes：Ac input end and rectification filtering module；Wherein ac input end is configured to connect
Connect external ac power source；And rectification filtering module is connected between multiple electric power conversion apparatus and ac input end, and is configured
Into by external ac power source rectifying and wave-filtering be DC source.
Alternatively, multiple electric power conversion apparatus are Switching Power Supply, the input connection rectification of each electric power conversion apparatus
The DC terminal of filtration module, is configured to that DC source is converted to the voltage in respective voltage output range.
Alternatively, electric power system also includes：Dc switch component, is arranged at the outfan and half of multiple electric power conversion apparatus
Between conductor cooling piece, the electric power conversion apparatus for being configured to the semiconductor chilling plate power reguirements by each warm area is met are communicated to
The semiconductor chilling plate of correspondence warm area.
Alternatively, dc switch component includes：Multiple first ends and multiple second ends, the output of each electric power conversion apparatus
End is connected to a first end；The semiconductor chilling plate of each warm area is connected to second end；Dc switch component is also configured that
Into：By each first end be controllably connected to the second end one or more on.
Alternatively, above semiconductor freezer also includes：Multiple temperature measurement units, each temperature measurement unit is configured to survey
The cryogenic temperature of one warm area of amount, for determining the power reguirements of the semiconductor chilling plate of the warm area according to cryogenic temperature.
Alternatively, each warm area is freezed by a semiconductor chilling plate.
Alternatively, the semiconductor chilling plate quantity of each warm area is different.
Alternatively, electric power conversion apparatus are two, and the voltage output range of one of electric power conversion apparatus is set to make
Semiconductor chilling plate makees in high refrigerating efficiency section, and the voltage output range of another electric power conversion apparatus is set to make quasiconductor
Cooling piece works in high refrigerating capacity section.
The semiconductor freezer of the present invention is freezed respectively using multiple semiconductor chilling plates to multiple warm areas, and using power supply
System to the semiconductor chilling plate of multiple warm areas is powered respectively, and by the semiconductor chilling plate to different warm areas different voltages are applied
So that the refrigerating capacity of semiconductor chilling plate is different, make different warm areas realize the storage environment of different temperatures, meet variety classes
Article memory requirement.
Further, semiconductor freezer of the invention is from multiple electric power conversion apparatus with different voltage output ranges
Select and meet the electric power conversion apparatus of semiconductor chilling plate power reguirements and be powered, it is therefore prevented that the power supply of wide-voltage range becomes
The low caused semiconductor freezer energy consumption of changing device power supply conversion efficiency when too low or too high voltages are exported is too high.
According to the detailed description below in conjunction with accompanying drawing to the specific embodiment of the invention, those skilled in the art will be brighter
Above-mentioned and other purposes, the advantages and features of the present invention.
Description of the drawings
Describe some specific embodiments of the present invention in detail by way of example, and not by way of limitation with reference to the accompanying drawings hereinafter.
Identical reference denotes same or similar part or part in accompanying drawing.It should be appreciated by those skilled in the art that these
What accompanying drawing was not necessarily drawn to scale.In accompanying drawing：
Fig. 1 is the semiconductor chilling plate-refrigerating capacity-voltage relationship in semiconductor freezer according to an embodiment of the invention
Figure；
Fig. 2 is the schematic diagram of semiconductor freezer according to an embodiment of the invention；
Fig. 3 is the schematic diagram of semiconductor freezer according to another embodiment of the present invention；And
Fig. 4 is the schematic diagram of dc switch component in semiconductor freezer shown in Fig. 3.
Specific embodiment
Fig. 1 is the semiconductor chilling plate-refrigerating capacity-voltage relationship in semiconductor freezer according to an embodiment of the invention
Figure, respectively illustrates the change curve and semiconductor chilling plate of the refrigerating efficiency with supply voltage of semiconductor chilling plate in figure
Refrigerating capacity with supply voltage change curve, it can be seen that magnitude of voltage V1 to the region between magnitude of voltage V3 be semiconductor refrigerating
Piece refrigerating efficiency highest region (can be referred to as high refrigerating efficiency section) in the present embodiment, wherein A points are best operating point,
In the refrigerating efficiency highest of A point semiconductor chilling plates, the voltage of A points is designated as V2.Magnitude of voltage V3 is to the region between magnitude of voltage V4
Refrigerating capacity for semiconductor chilling plate reaches maximum (can be referred to as high refrigerating capacity section in the present embodiment).Due to magnitude of voltage it is little
The work efficiency of semiconductor chilling plate is too low in V1 and the region more than V4, typically cannot use.Therefore semiconductor freezer
Semiconductor chilling plate operating voltage range be V1 to V4 between.
As can be seen from Figure 1 the operating voltage range of the semiconductor chilling plate of semiconductor freezer is between V1 to V4.It is logical
Cross and different voltages are applied to semiconductor chilling plate, semiconductor chilling plate can be made to realize different refrigerating capacitys.If using this
A little semiconductor chilling plates freeze to the different closed areas of semiconductor freezer, it is possible to realize in semiconductor freezer different
Warm area, so as to create condition for the storage of variety classes article.
It is very wide additionally, due to the running voltage efficiency of semiconductor chilling plate, it is adjustable using a voltage in the prior art
DC source is powered, and one is convenient higher to voltage output range requirement, increased cost, another conveniently to will also result in direct current
Power supply cannot ensure higher energy conversion efficiency in wider output area so that in the overall power of semiconductor freezer
Rise.
Fig. 2 is the schematic diagram of semiconductor freezer according to an embodiment of the invention, and the semiconductor freezer includes multiple half
Conductor cooling piece 200 and the electric power system 100 for powering to multiple semiconductor chilling plates 200, semiconductor freezer is provided with many
Individual warm area, each warm area is freezed by one or more in semiconductor chilling plate 200；Electric power system 100 is configured to multiple temperature
The semiconductor chilling plate 200 in area is powered respectively.
The semiconductor freezer of the embodiment is freezed respectively using multiple semiconductor chilling plates 200 to multiple warm areas, and is made
Powered respectively to the semiconductor chilling plate 200 of multiple warm areas with electric power system, applied by the semiconductor chilling plate to different warm areas
Plus different voltages cause the refrigerating capacity of semiconductor chilling plate different, make different warm areas realize the storage environment of different temperatures, meet
The memory requirement of different types of article.
When in use, the semiconductor freezer of the present embodiment can arrange a temperature measurement unit in each warm area, use
In the cryogenic temperature for measuring the warm area, and each warm area is calculated according to the gap for measuring the cryogenic temperature and design temperature for drawing
Semiconductor chilling plate 200 needed for supply voltage, exported to corresponding semiconductor chilling plate 200 respectively from electric power system 100
Corresponding DC voltage.
Usually, a warm area can be freezed using a semiconductor chilling plate 200, using semiconductor chilling plate
200 refrigerating capacity realizes that the cryogenic temperature of warm area is different.In some alternative embodiments, the semiconductor chilling plate of each warm area
200 quantity it can also be provided that difference, to realize the difference of refrigerating capacity using the varying number of semiconductor chilling plate 200.
Fig. 3 is the schematic diagram of semiconductor freezer according to another embodiment of the present invention, and the semiconductor freezer of the embodiment exists
On the basis of a upper embodiment, electric power system is optimized, and increased some associated components.
Electric power system 100 includes：Multiple electric power conversion apparatus 110, the voltage output range of each electric power conversion apparatus 110
Difference is set to, and is configured to controllably be electrically connected to semiconductor chilling plate 200.In the semiconductor chilling plate of multiple warm areas
200 required voltage is different, can by more than in multiple electric power conversion apparatus 110 one in correspondence warm area or
Multiple semiconductor chilling plates 200 are powered.
Power frequency supply (such as 220V, alternating current of 50Hz) power supply is generally used in view of semiconductor freezer, therefore can be made
By power frequency supply rectifying and wave-filtering it is the higher unidirectional current of voltage with rectification filtering module, the multiple electric power conversion apparatus 110 of the above can
With from output voltage adjustable Switching Power Supply within the specific limits, its input for rectification filtering module output unidirectional current, its
It is output as the adjustable unidirectional current in different voltage ranges.
The summation of the voltage output range of multiple electric power conversion apparatus 110 can be the running voltage model in semiconductor chilling plate
Enclose, the power of each electric power conversion apparatus 110 needs to meet simultaneously for the requirement of the power supply of all semiconductor chilling plates 200.
High cost is also resulted in view of the excessive electric power conversion apparatus of quantity, it is preferred that electric power conversion apparatus
110 is two, and the voltage output range of one of electric power conversion apparatus is set to the high refrigerating efficiency area of semiconductor chilling plate
Section (such as V1 to V3 in Fig. 1), the voltage output range of another electric power conversion apparatus is set to the high refrigeration of semiconductor chilling plate
Amount section (such as V3 to V4 in Fig. 1).In some other embodiments, the quantity and voltage output range of electric power conversion apparatus can
To be configured according to requirements, for example, three electric power conversion apparatus are configured, voltage output range is each configured to：V1 is extremely
V2, V2 to V3, V3 to V4；Two electric power conversion apparatus are for example configured again, and voltage output range is each configured to：V1 to V2, V2
To V4.
In figure 3, the embodiment is provided with voltage output range and is set to make semiconductor chilling plate work in high refrigeration effect
The electric power conversion apparatus 111 of rate section and voltage output range are set to make semiconductor chilling plate work in high refrigerating capacity section
Electric power conversion apparatus 112.
Ac input end 120 is configured to connect external ac power source, and rectification filtering module 130 is connected to multiple power conversions
Between device 110 and ac input end 120, and it is DC source to be configured to external ac power source rectifying and wave-filtering, for example will
The power frequency supply of 220V carries out the DC voltage of full-bridge rectifier filter output 310V or so, and in addition rectification filtering module 130 may be used also
To be provided with output switch, controllably by direct current electricity suppl in electric power conversion apparatus 111 or electric power conversion apparatus 112.
Fig. 4 is the schematic diagram of dc switch component 140 in semiconductor freezer shown in Fig. 3, and dc switch component 140 is arranged
Between the outfan and semiconductor chilling plate 200 of multiple electric power conversion apparatus 110, will accord with multiple electric power conversion apparatus 110
One semiconductor chilling plate 200 for being communicated to the warm area of unification warm area power reguirements.
For example dc switch component 140 can include：Multiple first ends and multiple second ends, each electric power conversion apparatus
110 first end is connected to an input；One or more semiconductor chilling plates 200 of each warm area are connected to one second
End；Dc switch component 140 each first end is controllably connected to the second end one or more on.
In the case where semiconductor freezer is single temperature zone, namely multiple semiconductor chilling plates 200 are jointly semiconductor freezer
Same warm area freeze in the case of, now multiple semiconductor chilling plates 200 need supply voltage identical, in the case, directly
The outfan of stream switch module 140 can be one, and the power end of multiple semiconductor chilling plates 200 is connected in parallel on the outfan.
Dc switch component 140 can be configured to：One in multiple first ends is controllably connected on the second end.Dc switch group
Multiple relays or electrical switch (such as transistor, metal-oxide-semiconductor power electronic devices) can be used in part 140 as joint
Point.
Above electric power conversion apparatus 110, rectification filtering module 130, ac input end 120, dc switch component 140 can be with
It is controlled by one or more controllers 300, controller 300 can measure multiple by multiple temperature measurement units 400
The cryogenic temperature (electrical connection of controller 300 to multiple temperature measurement units 400 not shown in figure) of warm area, controller
The actual temperature of the 300 each warm areas for measuring multiple temperature measurement units 400 is compared with its respective design temperature, it is determined that
The supply voltage gone out needed for the semiconductor chilling plate of each warm area, correspondingly, sends to power conversion to rectification filtering module 130
Device 110 power supply switching signal, to electric power conversion apparatus 110 send Regulation Control signal, send to dc switch component 140
Open and close controlling signal, to different semiconductor chilling plates 200 required supply voltage is provided.
For example, controller 300 can utilize PID (proportional-integral-differential) algorithm, according to design temperature and temperature survey
Voltage of the difference of the measurement temperature of part 400 required for calculate semiconductor chilling plate 200, when the institute of semiconductor chilling plate 200
During the voltage V3 for needing, converting means 112 of cutting off the electricity supply only is powered with electric power conversion apparatus 111 to semiconductor chilling plate 200,
The actual power voltage of electric power conversion apparatus 111 is the regulation voltage sum that optimal supply voltage is calculated with PID.Work as quasiconductor
When voltage needed for cooling piece 200 is higher than V3, converting means 111 of cutting off the electricity supply, only with electric power conversion apparatus 112 come to quasiconductor
Cooling piece 200 is powered.
When necessary, voltage range exports relatively low one in above electric power conversion apparatus 110, can also be blower fan, temperature
Degree measurement part 400, the control unit part that grades is powered.In addition, only needing to a relatively low electricity after semiconductor freezer temperature refrigeration
Pressure can just make each warm area temperature maintain setting value, preferentially ensure the power supply under this operating mode using electric power conversion apparatus 111
With higher efficiency.Therefore electric power conversion apparatus 111 generally require maintenance work, in addition it is also necessary to except semiconductor chilling plate 200 it
Outer consuming parts are powered.
In the semiconductor freezer of multi-temperature zone, dc switch component 140 includes multiple first ends and multiple second ends, each
The outfan of electric power conversion apparatus 110 is connected to a first end；Each semiconductor chilling plate 200 is connected to second end；
Dc switch component 140 is configured to：By each first end be controllably connected to the second end one or more on.It is namely
The semiconductor chilling plate 200 of each warm area selects output voltage range electric power conversion apparatus 110 corresponding with power demands voltage,
For its power supply.
For the semiconductor freezer of multi-temperature zone, temperature measurement unit 400 successively will to the equal independent measurement temperature of each warm area
The supply voltage needed for the semiconductor chilling plate 200 of each warm area is calculated, corresponding voltage is exported into model by dc switch component 140
The electric power conversion apparatus 111 or electric power conversion apparatus 112 for enclosing are communicated on the semiconductor chilling plate 200 of the warm area.For most
The semiconductor freezer in number dual temperature area, two electric power conversion apparatus 110 can meet power reguirements.
For the more than two situation of warm area, can be solved using two ways, one kind is setting and warm area quantity number
Consistent electric power conversion apparatus 110, another kind of preferred mode is opened still to arrange two electric power conversion apparatus 110 in direct current
Filter regulator circuit is provided between the outfan and the semiconductor chilling plate 200 of each warm area that close component 140 (not showing in figure
Go out), the switch in the dc switch component 140 that each is connected with the second end is controlled using PWM ripple, so as to be formed
PWM chopping devices.When powering to semiconductor chilling plate, multiple warm areas are set to into two groups, less than one group of voltage V3 by electricity
Source converting means 111 is powered, and is powered by electric power conversion apparatus 112 higher than one group of voltage V3, electric power conversion apparatus 111 and power supply
The output voltage of converting means 112 is disposed as the peak of voltage needed for correspondence group, then using PWM chopping devices by electricity
Pressure drop is depressed into the required voltage of every group of semiconductor chilling plate.
The semiconductor freezer of the present embodiment is freezed respectively using multiple semiconductor chilling plates to multiple warm areas, and using confession
Electric system to the semiconductor chilling plate of multiple warm areas is powered respectively, and by the semiconductor chilling plate to different warm areas different electricity are applied
Pressure causes the refrigerating capacity of semiconductor chilling plate different, makes different warm areas realize the storage environment of different temperatures, meets not of the same race
The memory requirement of the article of class.
Further, the semiconductor freezer of the present embodiment is from multiple electric power conversion apparatus with different voltage output ranges
In select and meet the electric power conversion apparatus of semiconductor chilling plate power reguirements and be powered, it is therefore prevented that the power supply of wide-voltage range
The low caused semiconductor freezer energy consumption of converting means power supply conversion efficiency when too low or too high voltages are exported is too high.
So far, although those skilled in the art will appreciate that detailed herein illustrate and describe multiple showing for the present invention
Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure
It is determined that or deriving many other variations or modifications for meeting the principle of the invention.Therefore, the scope of the present invention is understood that and recognizes
It is set to and covers all these other variations or modifications.
Claims (8)
1. a kind of semiconductor freezer, including multiple semiconductor chilling plates and the confession for powering to the plurality of semiconductor chilling plate
Electric system, it is characterised in that
The semiconductor freezer is provided with multiple warm areas, and each warm area is made by one or more in the semiconductor chilling plate
It is cold；
The electric power system is configured to be powered respectively to the semiconductor chilling plate of the plurality of warm area, wherein, the power supply
System includes：
Multiple electric power conversion apparatus, the voltage output range of each electric power conversion apparatus is set to difference, and is configured to
Controllably it is electrically connected on the semiconductor chilling plate of one or more warm areas, and
The electric power conversion apparatus are two, and the voltage output range of one of them electric power conversion apparatus is set to make described
Semiconductor chilling plate works in high refrigerating efficiency section, and the voltage output range of another electric power conversion apparatus is set to make
The semiconductor chilling plate works in high refrigerating capacity section.
2. semiconductor freezer according to claim 1, it is characterised in that
The electric power system also includes：Ac input end and rectification filtering module；Wherein
The ac input end is configured to connect external ac power source；And
The rectification filtering module is connected between the plurality of electric power conversion apparatus and the ac input end, and be configured to by
The external ac power source rectifying and wave-filtering is DC source.
3. semiconductor freezer according to claim 2, it is characterised in that
The plurality of electric power conversion apparatus are Switching Power Supply, and the input of each electric power conversion apparatus connects the rectification
The DC terminal of filtration module, is configured to that the DC source is converted to the voltage in respective voltage output range.
4. semiconductor freezer according to claim 1, it is characterised in that the electric power system also includes：
Dc switch component, is arranged between the outfan of the plurality of electric power conversion apparatus and the semiconductor chilling plate, matches somebody with somebody
The electric power conversion apparatus for being set to the semiconductor chilling plate power reguirements by each warm area is met are communicated to correspondence warm area
The semiconductor chilling plate.
5. semiconductor freezer according to claim 4, it is characterised in that the dc switch component includes：Multiple first ends
With multiple second ends,
The outfan of each electric power conversion apparatus is connected to a first end；
The semiconductor chilling plate of each warm area is connected to second end；
The dc switch component is configured to：Each described first end is controllably connected to into of second end or many
On individual.
6. semiconductor freezer according to claim 5, it is characterised in that also include：
Multiple temperature measurement units, each described temperature measurement unit is configured to measure the cryogenic temperature of a warm area, with
Power reguirements for determining the semiconductor chilling plate of the warm area according to the cryogenic temperature.
7. the semiconductor freezer according to any one in claim 1 to 6, it is characterised in that
Each described warm area is by a semiconductor chilling plate refrigeration.
8. the semiconductor freezer according to any one in claim 1 to 6, it is characterised in that
The semiconductor chilling plate quantity of each warm area is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510004788.8A CN104534772B (en) | 2015-01-06 | 2015-01-06 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510004788.8A CN104534772B (en) | 2015-01-06 | 2015-01-06 | Semiconductor refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104534772A CN104534772A (en) | 2015-04-22 |
| CN104534772B true CN104534772B (en) | 2017-04-12 |
Family
ID=52850346
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510004788.8A Active CN104534772B (en) | 2015-01-06 | 2015-01-06 | Semiconductor refrigerator |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106288585A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | semiconductor refrigerating box |
| CN105501683A (en) * | 2016-01-22 | 2016-04-20 | 河南鸿昌电子有限公司 | Semi-surrounding type cold and heat storage box |
| CN107477949A (en) * | 2017-08-07 | 2017-12-15 | 青岛海尔股份有限公司 | Inner bag case and refrigerating device for refrigerating device |
| CN113206656B (en) * | 2021-05-20 | 2024-02-02 | 成都业贤科技有限公司 | Method for improving temperature control output voltage resolution of digital semiconductor refrigeration sheet |
| CN113945061B (en) * | 2021-10-11 | 2022-06-24 | 珠海格力电器股份有限公司 | Refrigerator custom storage method, mobile interconnection method and storage control device |
| CN113982877A (en) * | 2021-11-19 | 2022-01-28 | 天津市通洁高压泵制造有限公司 | High-pressure plunger pump for fatigue test of gas cylinder |
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| CN102788445A (en) * | 2012-08-24 | 2012-11-21 | 合肥美的荣事达电冰箱有限公司 | Semiconductor refrigeration plate drive circuit, temperature control device and refrigerator |
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| JP3372792B2 (en) * | 1996-11-18 | 2003-02-04 | 株式会社エコ・トゥエンティーワン | Electronic refrigerator |
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| US5105067A (en) * | 1989-09-08 | 1992-04-14 | Environwear, Inc. | Electronic control system and method for cold weather garment |
| CN2543963Y (en) * | 2002-02-07 | 2003-04-09 | 张家林 | Temp-controller for two-D grad gene amplificator |
| CN201697409U (en) * | 2009-08-21 | 2011-01-05 | 张延红 | Multi-temperature region refrigerator with energy saving and environmental protection |
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| CN104180576A (en) * | 2014-09-03 | 2014-12-03 | 四川航天***工程研究所 | Low-temperature semiconductor refrigerator and method for providing linear voltage for chilling plates of refrigerator |
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| CN104534772A (en) | 2015-04-22 |
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