CN104534554B - Bonded structure, heater and technique for sticking - Google Patents
Bonded structure, heater and technique for sticking Download PDFInfo
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- CN104534554B CN104534554B CN201410790430.8A CN201410790430A CN104534554B CN 104534554 B CN104534554 B CN 104534554B CN 201410790430 A CN201410790430 A CN 201410790430A CN 104534554 B CN104534554 B CN 104534554B
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Abstract
The present invention provides a kind of bonded structure, heater and technique for sticking, wherein, bonded structure includes:First plate, the second plate, rapid-curing cutback glue-line and high temperature resistant glue-line, are provided with the first groove and the second groove on the second plate;Rapid-curing cutback glue-line is located in the first groove, and by the second plate and the first plate fixed bonding;High temperature resistant glue-line is located in the second groove, and by the second plate and the first plate fixed bonding.Bonded structure provided by the invention, rapid-curing cutback glue-line, which is set, realizes quickly fixing between the first plate and the second plate, and rapid-curing cutback glue-line disclosure satisfy that in downlink production process to the fixing intensity requirement between the first plate and the second plate, the first plate through rapid-curing cutback glue-line bonding and the second plate can be made to enter in the production process of downlink, and the high temperature resistant glue-line then spontaneous curing in downlink production process, so, on the premise of product performance is not influenced, shorten the time-consuming of bonding station, the production efficiency of product complete machine is improved, reduces the production cost of product.
Description
Technical field
The present invention relates to the sticking technology field of bonded structure, in particular to a kind of bonded structure, has and is somebody's turn to do
The technique for sticking of the heater of bonded structure and the bonded structure.
Background technology
As shown in Figure 1, setting fluted 3' on the sheet metal 2' of existing heater, it is recessed that pyroceram glue is injected into this
In groove 3', to be adhesively fixed to pyroceram plate 1' and sheet metal 2', still, the production line of existing heater
In, since the hardening time of pyroceram glue is very long, so as to cause the time-consuming increase for being bonded station, this greatly reduces production
The production efficiency of product complete machine, and then cause the cost of product to increase;To solve the problems, such as this, in the prior art usually by high temperature resistant glass
Glass plate 1' carried out with sheet metal 2' it is be bonded in advance, although which improve to a certain extent product flow line production effect
Rate, still, the pyroceram plate 1' being bonded in advance and sheet metal 2' need to take during pyroceram adhesive curing
Very big placing space, so as to cause which to have certain use limitation, is not easy to promote.
The content of the invention
In order to solve the above-mentioned technical problem at least one, it is an object of the present invention to provide a kind of simple in structure, and
The bonded structure of product production line production efficiency can be improved.
It is another object of the present invention to provide a kind of heater with above-mentioned bonded structure.
It is yet a further object of the present invention to provide a kind of technique for sticking of above-mentioned bonded structure.
In view of this, first aspect present invention embodiment provides a kind of bonded structure, including:First plate;Second plate, institute
State and the first groove and the second groove are provided with the second plate;Rapid-curing cutback glue-line, the rapid-curing cutback glue-line are arranged on first plate and institute
Between stating the second plate, the rapid-curing cutback glue-line is located in first groove, and second plate and first plate are fixed and glued
Connect;With high temperature resistant glue-line, the high temperature resistant glue-line is arranged between first plate and second plate, the high temperature resistant glue-line
In second groove, and by second plate and the first plate fixed bonding.
Bonded structure provided by the invention, is provided with the first groove and the second groove on the second plate, and in the first groove
Rapid-curing cutback glue-line is set, high temperature resistant glue-line is set in the second groove, since the curing rate of rapid-curing cutback glue-line is fast, it is achieved thereby that first
It is quick fixed between plate and the second plate, and rapid-curing cutback glue-line has certain adhesive strength, disclosure satisfy that the downlink of bonding station
To the requirement of fixing intensity between the first plate and the second plate in production process, so that, it can make after rapid-curing cutback glue-line is adhesively fixed
First plate and the second plate enter in the production process of downlink, and high temperature resistant glue-line can then be bonded the downlink production of station in product
During spontaneous curing, so, on the premise of being arranged on of the structure does not influence product performance, highly shortened bonding
Taking for station, so as to improve the production efficiency of product complete machine, thereby reduces the production cost of product.
Specifically, in the production process of existing heater, it need to wait until that the pyroceram glue in bonded structure is completely solid
The production process of downlink could be carried out after change, this greatly reduces the production efficiency of product, and bonding provided by the invention is tied
Structure, can be such that the first plate after rapid-curing cutback glue-line is adhesively fixed and the second plate enters in the production process of downlink, and high temperature resistant glue-line
Then can the spontaneous curing in the downlink production process that product is bonded station, so, being arranged on of the structure, which does not influence product, to be made
On the premise of with performance, the time-consuming of bonding station is highly shortened, so as to improve the production efficiency of product, is thereby reduced
The production cost of product.
In addition, the bonded structure in above-described embodiment provided by the invention can also have following additional technical feature:
According to one embodiment of present invention, the area of first groove is less than or equal to the face of second groove
Product.
According to one embodiment of present invention, the bottom wall of second groove and/or side wall are uneven.
According to one embodiment of present invention, the bottom wall of first groove and/or side wall are uneven.
According to one embodiment of present invention, multiple first spout holes are provided with the bottom plate of first groove;It is described
Multiple second spout holes are provided with the bottom plate of second groove.
According to one embodiment of present invention, two first spout holes are provided with the bottom plate of first groove;
Two second spout holes are provided with the bottom plate of second groove.
According to one embodiment of present invention, first groove is made of Sheet Metal Forming Technology, and/or, described second is recessed
Groove is made of Sheet Metal Forming Technology.
The embodiment of second aspect of the present invention provides a kind of heater, including the bonded structure described in any of the above-described.
The bonding knot that the heater that second aspect of the present invention embodiment provides is provided by being provided with first aspect embodiment
Structure, the first groove and the second groove are provided with the second plate, and rapid-curing cutback glue-line is set in the first groove, are set in the second groove
High temperature resistant glue-line, can be such that the first plate after rapid-curing cutback glue-line is adhesively fixed and the second plate enters in the production process of downlink, and resistance to
High temperature glue-line then can product be bonded station downlink production process in spontaneous curing, so, which is arranged on not shadow
On the premise of ringing product performance, the time-consuming of bonding station is highly shortened, so as to improve the production effect of product complete machine
Rate, thereby reduces the production cost of product.
The embodiment of third aspect present invention provides a kind of technique for sticking, for the bonding knot described in any of the above-described
Structure, includes the following steps:Injecting glue step, injects high-temperature plastic into the second groove, injects quick-drying gelatin into the first groove;It is fixed
Step, the second plate is placed on the first plate, applies pressure to the second plate, and keep pressure to rapid-curing cutback adhesive curing;Procedure of processing,
First plate and the second plate are machined.
According to one embodiment of present invention, further included between the fixing step and the procedure of processing:Cleaning,
The quick-drying gelatin flowed out from the first spout hole is removed, the high-temperature plastic flowed out from the second spout hole is removed.
Technique for sticking provided by the invention, first injects high-temperature plastic in the second groove, then quick-drying gelatin injection first is recessed
In groove, since the curing rate of quick-drying gelatin is faster than high-temperature plastic, the setting of the injection order ensure that quick-drying gelatin to the second plate and
The adhesive effect of first plate, efficiently avoid quick-drying gelatin, curing causes the adhesive strength of quick-drying gelatin to be weakened in advance;In addition, to
Second plate applies pressure, and keeps pressure to rapid-curing cutback adhesive curing, for finished product be bonded, efficiently reduce the first plate and
Gap between second plate, i.e. quick-drying gelatin the tension of the first plate and the second plate to be in phase between the first plate and the second plate
To impaction state, so that, without providing pressure to the second plate in high-temperature plastic solidification process again, it is only necessary to make high-temperature plastic viscous
Spontaneous curing in the downlink production process of station is connect, so that the production of product is more convenient.
The additional aspect and advantage of the present invention will become obvious in following description section, or the practice by the present invention
Recognize.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein:
Fig. 1 is the dimensional structure diagram of existing bonded structure;
Fig. 2 is the dimensional structure diagram of bonded structure of the present invention;
Fig. 3 is the structure diagram of the second plate described in Fig. 2;
Fig. 4 is the second plate another kind example structure schematic diagram of the present invention;
Fig. 5 is the left view structural representation of bonded structure shown in Fig. 4;
Fig. 6 is the schematic flow diagram of one embodiment of technique for sticking according to the present invention;
Fig. 7 is the schematic flow diagram of another embodiment of technique for sticking according to the present invention.
Wherein, the correspondence between the reference numeral in Fig. 1 and component names is:
1' pyroceram plates, 2' sheet metals, 3' grooves;
Correspondences of the Fig. 2 into Fig. 5 between reference numeral and component names be:
1 first plate, 2 second plates, 21 first grooves, 211 first spout holes, 22 second grooves, 221 second spout holes;
Dotted line shown in figure is the first plate and the invisible contour line of the second plate.
Embodiment
It is to better understand the objects, features and advantages of the present invention, below in conjunction with the accompanying drawings and specific real
Mode is applied the present invention is further described in detail.It should be noted that in the case where there is no conflict, the implementation of the application
Feature in example and embodiment can be mutually combined.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
To be implemented using other different from other modes described here, therefore, protection scope of the present invention and from described below
Specific embodiment limitation.
Bonded structure described according to some embodiments of the invention is described referring to Fig. 2 to Fig. 5.
As shown in Figures 2 to 5, the bonded structure that first aspect present invention embodiment provides, including:First plate 1, the second plate
2nd, rapid-curing cutback glue-line (not shown) and high temperature resistant glue-line (not shown).
Specifically, the first groove 21 and the second groove 22 are provided with the second plate 2;Rapid-curing cutback glue-line be arranged on the first plate 1 with
Between second plate 2, rapid-curing cutback glue-line is located in the first groove 21, and by 1 fixed bonding of the second plate 2 and the first plate;High temperature resistant glue-line
It is arranged between the first plate 1 and the second plate 2, high temperature resistant glue-line is located in the second groove 22, and the second plate 2 and the first plate 1 are consolidated
Fixed bonding.
Bonded structure provided by the invention, is provided with the first groove 21 and the second groove 22 on the second plate 2, and recessed first
Rapid-curing cutback glue-line is set in groove 21, high temperature resistant glue-line is set in the second groove 22, since the curing rate of rapid-curing cutback glue-line is fast, so that real
Quickly fixing between the first plate 1 and the second plate 2 is showed, and rapid-curing cutback glue-line has certain adhesive strength, disclosure satisfy that bonding
To the requirement of fixing intensity between the first plate 1 and the second plate 2 in the downlink production process of station, so that, it can make through rapid-curing cutback glue-line
The first plate 1 and the second plate 2 after being adhesively fixed enter in the production process of downlink, and high temperature resistant glue-line can be then bonded in product
Spontaneous curing in the downlink production process of station, so, on the premise of being arranged on of the structure does not influence product performance, pole
The earth shortens the time-consuming of bonding station, so as to improve the production efficiency of product complete machine, thereby reduces being produced into for product
This.
Heretofore described downlink process is other production processes after bonding station in the production line of product.
In one embodiment of the invention, it is preferable that the area of the first groove 21 is less than or equal to the second groove 22
Area.
In this embodiment, the second groove 22 is used to accommodate high-temperature plastic, and the adhesive strength of high-temperature plastic is with resistance to height
The increase of the bond area of warm glue and increase, in the present solution, high-temperature plastic adhesive strength and product performance cease cease
Correlation, to be further ensured that the size that 22 area of the second groove is set in product quality should require phase with the use intensity of product
Adapt to, and the first groove 21 is mainly used for accommodating quick-drying gelatin, and the adhesive strength of quick-drying gelatin is with the bond area of quick-drying gelatin
Increase and increase, in the present solution, the adhesive strength of setting quick-drying gelatin only need to meet it is strong in production process of the product in downlink
Spend and require, so, set the area of the first groove 21 to be less than or equal to the area of the second groove 22, ensure adding for product
On the premise of work, the dosage of quick-drying gelatin is reduce further, so as to reduce the production cost of product.
Certainly, with different to adhesive strength requirement between the first plate 1 and the second plate 2 in the downlink process of bonding process,
The size of the area of the first groove 21 can suitably be adjusted.
In one particular embodiment of the present invention, it is preferable that the bottom wall and/or side wall of the first groove 21 are uneven.
In this embodiment, the bottom wall of the first groove 21 of setting and/or side wall are uneven, and being arranged on for the structure is not expanded
On the premise of the area of big first groove 21, the contact area between the second plate 2 and rapid-curing cutback glue-line is added, so as to further increase
The adhesive strength between rapid-curing cutback glue-line and the second plate 2 is added.
In one particular embodiment of the present invention, it is preferable that the bottom wall and/or side wall of the second groove 22 are uneven.
In this embodiment, the bottom wall of the second groove 22 of setting and/or side wall are uneven, and being arranged on for the structure is not expanded
On the premise of the area of big second groove 22, the contact area between the second plate 2 and high temperature resistant glue-line is added, so that further
Add the adhesive strength between the second plate 2 and high temperature resistant glue-line.
In one embodiment of the invention, it is preferable that as shown in Figures 2 to 4, be provided with the bottom plate of the first groove 21
Multiple first spout holes 211;Multiple second spout holes 221 are provided with the bottom plate of second groove 22.
In this embodiment, multiple first spout holes are set respectively on the bottom plate of the first groove 21 and the second groove 22
211 and multiple second spout holes 221 so that in the solidification process of quick-drying gelatin and high-temperature plastic, when applying pressure to the second plate 2,
Unnecessary quick-drying gelatin can be overflowed from the first spout hole 211 and the second spout hole 221 respectively with high-temperature plastic, thus avoid it is unnecessary
Quick-drying gelatin and high-temperature plastic cure rear support between the first plate 1 and the second plate 2, cause to occur between the first plate 1 and the second plate 2
Larger gap.
In one embodiment of the invention, it is preferable that as shown in Figures 2 to 4, be provided with the bottom plate of the first groove 21
Two the first spout holes 211;Two the second spout holes 221 are provided with the bottom plate of second groove 22.
In this embodiment, two the first spout holes 211 are provided with the bottom plate of the first groove 21;Second groove 22
Two the second spout holes 221 are provided with bottom plate, overflow is disclosure satisfy that in the first spout hole 211 of guarantee and the second spout hole 221
On the premise of it is required that, the manufacturing procedure of the second plate 2 is further reduced, so that, correspondingly improve Product processing efficiency.
Certainly, since quick-drying gelatin has certain shrinkage, and the shrinking percentage of different quick-drying gelatins is different, such as Fig. 2 and Fig. 3 institutes
Show, during using the big quick-drying gelatin of shrinking percentage, can not have to set the first spout hole 211 on the bottom plate of the first groove 21.
In one embodiment of the invention, it is preferable that the first groove 21 is made of Sheet Metal Forming Technology, and/or, second is recessed
Groove 22 is made of Sheet Metal Forming Technology.
In this embodiment, the second plate 2 is metallic plate, and the thinner thickness of the second plate 2, easy to punch forming, due to punching
Molded processing technology is simple, quick, the first groove 21 is made of Sheet Metal Forming Technology, and/or, the second groove 22 is using punching
Pressure technique is made, then further increases the processing efficiency of product.
The heater (not shown) that the embodiment of second aspect of the present invention provides, including it is viscous described in any of the above-described
Binding structure.
The bonding knot that the heater that second aspect of the present invention embodiment provides is provided by being provided with first aspect embodiment
Structure, the first groove 21 and the second groove 22 are provided with the second plate 2, and set rapid-curing cutback glue-line in the first groove 21, and second is recessed
High temperature resistant glue-line is set in groove 22, the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 can be made to enter the production of downlink
In process, and high temperature resistant glue-line then can product be bonded station downlink production process in spontaneous curing, so, the structure
It is arranged on the premise of not influencing product performance, the time-consuming of bonding station is highly shortened, so that it is whole to improve product
The production efficiency of machine, thereby reduces the production cost of product.
As shown in fig. 6, the embodiment of third aspect present invention provides a kind of technique for sticking, for described in any of the above-described
Bonded structure, include the following steps:
Step 101, high-temperature plastic is injected into the second groove, injects quick-drying gelatin into the first groove;
Step 102, the second plate is placed on the first plate, applies pressure to the second plate, and keep pressure to quick-drying gelatin to consolidate
Change;
Step 104, the first plate and the second plate are machined.
Technique for sticking provided by the invention, first injects high-temperature plastic in the second groove, then quick-drying gelatin injection first is recessed
In groove, since the curing rate of quick-drying gelatin is faster than high-temperature plastic, the setting of the injection order ensure that quick-drying gelatin to the second plate and
The adhesive effect of first plate, efficiently avoid quick-drying gelatin, curing causes its adhesive strength to be weakened in advance;In addition, to second
Plate applies pressure, and keeps pressure for finished product is bonded, to efficiently reduce the first plate and second to rapid-curing cutback adhesive curing
Gap between plate, i.e. quick-drying gelatin the tension of the first plate and the second plate to be in opposite pressure between the first plate and the second plate
Tight state, so that, without providing pressure to the second plate in high-temperature plastic solidification process again, it is only necessary to make high-temperature plastic in bonding work
Spontaneous curing in the downlink production process of position, so that the production of product is more convenient.
In one embodiment of the invention, as shown in fig. 7, being further included between step 102 and step 104:
Step 103, the quick-drying gelatin flowed out from the first spout hole is removed, the high-temperature plastic flowed out from the second spout hole is clear
Remove.
Wherein, step 101 is injecting glue step, and step 102 is fixing step, and step 103 is cleaning, and step 104 is
Procedure of processing.
In this embodiment, to avoid from the outflow of the second spout hole, uncured high-temperature plastic in downlink production process
Middle pollution process equipment, causes the process equipment service life to reduce, so that setting steps 103 between step 102 and step 104, with
The high-temperature plastic of second spout hole outflow is removed, then is effectively guaranteed production spatter property, while also correspondingly extend
Service life of downlink production equipment.
In conclusion bonded structure provided by the invention, the first groove 21 and the second groove 22 are provided with the second plate 2,
And rapid-curing cutback glue-line is set in the first groove 21, high temperature resistant glue-line is set in the second groove 22, due to the curing speed of rapid-curing cutback glue-line
Degree is fast, it is achieved thereby that it is quick fixed between the first plate 1 and the second plate 2, and rapid-curing cutback glue-line has certain adhesive strength, energy
To the fixing intensity requirement of the first plate 1 and the second plate 2 in enough downlink production processes for meeting bonding station, so that, it can make through speed
Drying adhesive layer be adhesively fixed after the first plate 1 and the second plate 2 enter in the production process of downlink, and high temperature resistant glue-line can then produce
Spontaneous curing in the downlink production process of product bonding station, so, before being arranged on of the structure does not influence product performance
Put, highly shortened the time-consuming of bonding station, so as to improve the production efficiency of product complete machine, thereby reduce product
Production cost.
Specifically, in the production process of existing heater, it need to wait until that the pyroceram glue in bonded structure is completely solid
The production process of downlink could be carried out after change, this greatly reduces the production efficiency of product, and bonding provided by the invention is tied
Structure, can be such that the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 enters in the production process of downlink, and high-temperature plastic
Layer then can product be bonded station downlink production process in spontaneous curing, so, being arranged on for the structure does not influence product
On the premise of performance, the time-consuming of bonding station is highly shortened, so that the production efficiency of product complete machine is improved, and then
Reduce the production cost of product.
In the present invention, term " first ", " second " are only used for the purpose described, and it is not intended that instruction or hint phase
To importance;Term " multiple " then refers to two or more, unless otherwise restricted clearly.Term " installation ", " connected ",
The terms such as " connection ", " fixation " should all be interpreted broadly, for example, " connection " can be fixedly connected or detachably connect
Connect, or be integrally connected;" connected " can be directly connected, and can also be indirectly connected by intermediary.For this area
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean to combine at least one reality that the particular features, structures, materials, or characteristics that the embodiment or example describe are contained in the present invention
Apply in example or example.In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more embodiments or example with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, for the skill of this area
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.
Claims (8)
- A kind of 1. bonded structure, it is characterised in that including:First plate;Second plate, is provided with the first groove and the second groove on second plate;Rapid-curing cutback glue-line, the rapid-curing cutback glue-line are arranged between first plate and second plate, and the rapid-curing cutback glue-line is located at institute State in the first groove, and by second plate and the first plate fixed bonding;WithHigh temperature resistant glue-line, the high temperature resistant glue-line are arranged between first plate and second plate, the high temperature resistant glue-line In second groove, and by second plate and the first plate fixed bonding;The area of first groove is less than or equal to the area of second groove;Multiple first spout holes are provided with the bottom plate of first groove;Multiple are provided with the bottom plate of second groove Two spout holes.
- 2. bonded structure according to claim 1, it is characterised in thatThe bottom wall and/or side wall of second groove are uneven.
- 3. bonded structure according to claim 2, it is characterised in thatThe bottom wall and/or side wall of first groove are uneven.
- 4. bonded structure according to claim 1, it is characterised in thatTwo first spout holes are provided with the bottom plate of first groove;Two are provided with the bottom plate of second groove A second spout hole.
- 5. bonded structure according to claim 1, it is characterised in thatFirst groove is made of Sheet Metal Forming Technology, and/or, second groove is made of Sheet Metal Forming Technology.
- 6. a kind of heater, it is characterised in that including just like the bonded structure any one of claim 1 to 5.
- A kind of 7. technique for sticking, for the bonded structure any one of claim 1 to 5, it is characterised in that including as follows Step:Injecting glue step, injects high-temperature plastic into the second groove, injects quick-drying gelatin into the first groove;Fixing step, the second plate is placed on the first plate, applies pressure to the second plate, and keep pressure to rapid-curing cutback adhesive curing;Procedure of processing, is machined the first plate and the second plate.
- 8. technique for sticking according to claim 7, it is characterised in thatFurther included between the fixing step and the procedure of processing:Cleaning, the quick-drying gelatin flowed out from the first spout hole is removed, and the high-temperature plastic flowed out from the second spout hole is removed.
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CN201410790430.8A CN104534554B (en) | 2014-12-17 | 2014-12-17 | Bonded structure, heater and technique for sticking |
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CN201410790430.8A CN104534554B (en) | 2014-12-17 | 2014-12-17 | Bonded structure, heater and technique for sticking |
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CN104534554B true CN104534554B (en) | 2018-04-24 |
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CN110420807A (en) * | 2019-08-06 | 2019-11-08 | 深圳市中孚能电气设备有限公司 | A kind of equipment and glue-pouring device |
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CN2113434U (en) * | 1991-08-16 | 1992-08-19 | 工贸合营山东省招远电池总厂 | Electric heating warmer |
CN201407706Y (en) * | 2009-05-19 | 2010-02-17 | 九阳股份有限公司 | Induction cooker with waterproof structure |
CN202118992U (en) * | 2011-06-07 | 2012-01-18 | 广东科龙配件有限公司 | Electric heater with anti-fog glass panel |
CN202915448U (en) * | 2012-11-07 | 2013-05-01 | 林光成 | Warmer |
CN203501238U (en) * | 2013-09-29 | 2014-03-26 | 九阳股份有限公司 | Panel induction cooker |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102538033B (en) * | 2010-12-23 | 2015-07-15 | 珠海格力电器股份有限公司 | Household appliance and bonding method thereof |
CN102520502B (en) * | 2011-12-12 | 2014-05-07 | 中国科学院电工研究所 | Bonding process for reflecting mirror unit of solar condenser |
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2014
- 2014-12-17 CN CN201410790430.8A patent/CN104534554B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2113434U (en) * | 1991-08-16 | 1992-08-19 | 工贸合营山东省招远电池总厂 | Electric heating warmer |
CN201407706Y (en) * | 2009-05-19 | 2010-02-17 | 九阳股份有限公司 | Induction cooker with waterproof structure |
CN202118992U (en) * | 2011-06-07 | 2012-01-18 | 广东科龙配件有限公司 | Electric heater with anti-fog glass panel |
CN202915448U (en) * | 2012-11-07 | 2013-05-01 | 林光成 | Warmer |
CN203501238U (en) * | 2013-09-29 | 2014-03-26 | 九阳股份有限公司 | Panel induction cooker |
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