CN104526766A - Nano cutting knife for processing nano material and use method thereof - Google Patents
Nano cutting knife for processing nano material and use method thereof Download PDFInfo
- Publication number
- CN104526766A CN104526766A CN201410730289.2A CN201410730289A CN104526766A CN 104526766 A CN104526766 A CN 104526766A CN 201410730289 A CN201410730289 A CN 201410730289A CN 104526766 A CN104526766 A CN 104526766A
- Authority
- CN
- China
- Prior art keywords
- copper cap
- cnt
- piezoelectric ceramic
- metal probe
- metallic copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a nano cutting knife for processing nano material and a use method thereof, the cutting knife comprises a shell having U-shaped cross section, a circuit general control arranged at the opening end of the U-shaped shell, a piezoelectric ceramic drive barrel arranged at one end in the shell, a metal copper cap and a metal probe mounted in the metal copper cap, a four-electrode connection wire arranged at the other end in the shell, a first support ceramic blade, a spring compression module, a second support ceramic blade, a four-electrode connection blade and a carbon nano tube, the metal copper cap and the metal probe are controlled by the piezoelectric ceramic drive barrel for having precision movement, the carbon nano tube is fixed on any two electrodes of the four-electrode connection blade; the general control circuit module is used for offering the load voltage for two ends of the carbon nano tube, the carbon nano tube generates the joule heat, the metal copper cap and the metal probe are controlled by the piezoelectric ceramic drive barrel for moving, the nano wire to be processed is located on the carbon nano tube for having the nano cutting operation.
Description
Technical field
The present invention relates to for nano material micro-nano technology field of nanometer devices, particularly relate to a kind of design of the nanotube cutter for nano material cutting processing.
Background technology
Along with the development of micro-nano electronics, the size of electronic device is done less and less, integrated level is more and more higher, and traditional MEMS also develops to nano electromechanical systems gradually.Build micro-nano device to need to use various nano material, comprise one-dimensional nano line, nano particle, two-dimensional nano sheet etc.Preparation nano material has the method for top-down micro fabrication and self assembly from bottom to top usually, and two kinds of methods have their own characteristics each.But, because top-down micro fabrication is applicable to carry out structure fabrication usually in substrate, be difficult to obtain unsettled, can the nanostructured of high crystalline quality of free operant, and the nano material of self-assembled growth has the advantages such as high-purity, high-crystallinity, excellent electricity, mechanical characteristic usually from bottom to top, thus the nano material of self-assembled growth is the important materials that nano-device manufactures and designs middle meeting and uses.
The nano material of self-assembled growth, as metal nanometer line, its diameter, degree of crystallinity can be carried out Effective Regulation by chemical means, but is usually difficult to accurate control to its length usually.In addition, for two-dimensional nano sheet, owing to being difficult to control its geometry in growth course, thus current still cannot prepare to have specify the two-dimentional lamellar structure of geometry.These restraining factors all limit the application of nano material on nano-device.Explore a kind of method effectively can cut out nano material, design a kind of device that can carry out cutting processing to nano material, to the great significance for design of applications to nanostructures and nano-device.
In addition, in the research process of nano material, researcher finds that the properity of nano material can be closely related with its geometry.Such as, nanocatalyst, Graphene, molybdenum sulfide etc., their character is by the multifactor impact such as its structure, edge pattern.In order to be familiar with contacting between the different geometry states of nano material and its character, performance further, researcher needs optionally to process these nano materials, cut.And current still shortage can carry out processing to nano material the effective ways cut, the cutting tool thus exploring a kind of nanoscale is significant too for the stuctures and properties of further investigation nano material.
Summary of the invention
Technical problem solved by the invention is:
Design a kind of nanometer cutter that can be used for cutting nano material.Utilize the nanometer cutter designed by the present invention can carry out geometry to structures such as nano wire, nano particle, nanometer sheet to cut out, thus promote the further investigation of nano material and promote the application of nano material in nano-device.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
The invention provides a kind of nanometer cutter for processing nano material, comprise the shell that cross section is U type, be located at the circuit master control of U-shaped shell aperture end, if the Piezoelectric Ceramic cylinder of one end, metallic copper cap and the metal probe of metallic copper cap can be loaded in the enclosure, if four contact conductors, first of one end support potsherd in addition in the enclosure, spring compression module, second supports potsherd, four electrode connecting piece of four electrodes compositions and CNT; Piezoelectric Ceramic wound packages to be assigned in U-shaped shell and to be connected with circuit master control, and metallic copper cap is fixed on Piezoelectric Ceramic cylinder front end, and metal probe is dismountable to be fixed on metallic copper cap; First supports potsherd to be fixed in U-shaped shell and to be connected with four contact conductors, four contact conductors are by U-shaped shell inwall lead-in wire connecting circuit master control, second supports potsherd is fixed in U-shaped shell, utilize spring compression module pressing and connect the first support potsherd and second and support potsherd, four electrode connecting piece are fixed on the second piezoelectric ceramic piece; Controlled the accurate movement of metallic copper cap and metal probe by Piezoelectric Ceramic cylinder, CNT is fixed on any two electrodes of four electrode connecting piece.
Preferably, described first support potsherd and second supports on potsherd and has four apertures, and in aperture and aperture both sides deposit gold or platinum electrode, four electrode independent not conductings mutually separately on each potsherd.
Preferably, the base material that described four electrode connecting piece use is aluminium oxide or silicon nitride, and four electrode materials are gold, platinum or nickel gold.
Preferably, described four electrodes are close between two in substrate one end, and two width between electrode are 2 μm ~ 20 μm, and two groups of close electrodes have part to be suspended on outside substrate, and electrode pendulous tank is 0.1 μm ~ 20 μm, shown in Fig. 2.
Preferably, the material of described metal probe is tungsten, gold, copper or aluminium.
Preferably, the on-load voltage of described circuit master control is 0.1V ~ 5V.
For processing a using method for the nanometer cutter of nano material, it uses step as follows:
1. take off metallic copper cap and metal probe, in carbon nanotube powder, adhere to CNT with tweezers grip probe;
2. the metal probe being stained with CNT is fixed back on metallic copper cap, then metallic copper cap is fixed back on Piezoelectric Ceramic cylinder;
3. the structure assembled being loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder moving metal copper cap and metal probe, the CNT on metal probe being snapped on the overhanging portion of four electrodes;
4. retract Piezoelectric Ceramic cylinder, assembly structure is taken out from transmission electron microscope, take off metallic copper cap and metal probe;
5. take off the metal probe with CNT from metallic copper cap, get a new metal probe and glue the material got and need cutting, the metal probe being stained with material to be cut is reinstalled on metallic copper cap;
6. assembly structure is loaded transmission electron microscope, made the CNT of nano silver wire on four electrodes on metal probe by mobile Piezoelectric Ceramic cylinder;
7. carry out on-load voltage electric current by circuit master control to the CNT in four electrode connecting piece, mobile Piezoelectric Ceramic cylinder makes the material to be cut on metal probe cost CNT, is cut nano silver wire by the joule heat of CNT.
The invention has the beneficial effects as follows: the present invention proposes a kind of nanometer cutter for processing nano material, this invention effectively can make up the current deficiency to nano material processing cutting means.Resistant to elevated temperatures CNT is adopted to snap into the overhanging portion of the electrode of four electrode connecting piece, be connected with circuit master control after supporting potsherd, spring compression module, the first support potsherd, four electrode connecting lines connections by second, make CNT forms current loop, carbon nanotube loaded upper electric current is allowed by circuit master control, carbon pipe is made to have very high-temperature, when needing the nano material of cutting to be positioned on the CNT of heating, can cut nano material.The CNT cutter of the present invention's design, not only can repair and cut out nano material and be beneficial to nano-device and manufacture and design, can also repair and cut out nano material for studying the corresponding relationship of its Structure and Properties.
Accompanying drawing explanation
Fig. 1: a kind of device schematic diagram that can be used for the nanometer cutter cutting nano material.
Fig. 2: four electrode connecting piece schematic diagrames of CNT are carried in the present invention.
Fig. 3: the present invention is for cutting nano silver wire instance graph.
Reference numeral: 1-circuit master control; 2-U shell; 3-Piezoelectric Ceramic cylinder; 4-metallic copper cap; 5-metal probe; 6-tetra-electrode connecting piece; 7-second supports potsherd; 8-spring compression module; 9-first supports potsherd; 10-tetra-contact conductor; 11-metal four electrode connecting line; 12-CNT.
Detailed description of the invention
The operation principle of the present invention's design is: overhanging portion CNT being snapped into the electrode of four electrode connecting piece, be connected with circuit master control after supporting potsherd, spring compression module, the first support potsherd, four electrode connecting lines connections by second, make CNT forms current loop, carbon nanotube loaded upper electric current (size of current is between 1 μ A-1mA) is allowed by circuit master control, now carbon pipe has very high-temperature, needing the nano material of cutting to be positioned on the CNT of heating, nano material is cut.
Below in conjunction with Figure of description, the present invention is further illustrated.
To cut nano silver wire, illustrate and use the basic cutting process of the present invention's design to nano wire:
piezoelectric Ceramic cylinder 3, metallic copper cap 4, tungsten pin are installed respectively in U-shaped shell mechanism, four electrode connecting piece 6, second support potsherd 7, spring compression module 8, first supports potsherd 9, four contact conductor 10, circuit master control 1 in connection;
take off metallic copper cap 4 and tungsten pin, rub with tweezers grip tungsten pin melon on multi-wall carbon nano-tube pipe powder, make tungsten pin is stained with CNT 12;
the tungsten pin being stained with CNT 12 is fixed back on metallic copper cap 4, then metallic copper cap 4 is fixed back on Piezoelectric Ceramic cylinder 3;
the structure that assembles is loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder 3 moving metal tungsten pin, on the unsettled electrode CNT 12 on tungsten pin being snapped into four electrode connecting piece 6 and deposit amorphous carbon layers be fixed;
retract Piezoelectric Ceramic cylinder 3, assembly structure is taken out from transmission electron microscope, take off metallic copper cap 4 and tungsten pin;
take off the tungsten pin with CNT 12 from metallic copper cap 4, get a new tungsten pin and glue the nano silver wire got and need cutting, the tungsten pin being stained with nano silver wire is reinstalled metallic copper cap 4;
assembly structure is loaded in transmission electron microscope again, makes nano silver wire on tungsten pin near CNT 12 by mobile Piezoelectric Ceramic cylinder 3;
carry out loading current by circuit master control 1 to the CNT 12 in four electrode connecting piece 6, mobile Piezoelectric Ceramic cylinder 3 makes nano silver wire cost CNT 12, is cut, as shown in Figure 3 by the joule heat of CNT 12 to nano silver wire.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (7)
1. one kind for processing the nanometer cutter of nano material, it is characterized in that: comprise the shell (2) that cross section is U type, be located at the circuit master control (1) of U-shaped shell (2) openend, if the Piezoelectric Ceramic cylinder (3) of one end in the enclosure, metallic copper cap (4) and the metal probe (5) of metallic copper cap (4) can be loaded into, if four contact conductors (10) of other one end in the enclosure, first supports potsherd (9), spring compression module (8), second supports potsherd (7), four electrode connecting piece (6) that four electrodes (11) form and CNT, Piezoelectric Ceramic cylinder (3) to be assemblied in U-shaped shell (2) and to be connected with circuit master control (1), and metallic copper cap (4) is fixed on Piezoelectric Ceramic cylinder (3) front end, and Demountable metallic probe (5) is fixed on metallic copper cap (4), first supports potsherd (9) to be fixed in U-shaped shell (2) and to be connected with four contact conductors (10), four contact conductors (10) are by U-shaped shell (2) inwall lead-in wire connecting circuit master control (1), second supports potsherd (7) is fixed in U-shaped shell (2), utilize spring compression module (8) to compress and connect the first support potsherd (9) and second and support potsherd (7), four electrode connecting piece (6) are fixed on the second piezoelectric ceramic piece (7), controlled the accurate movement of metallic copper cap (4) and metal probe (5) by Piezoelectric Ceramic cylinder (3), CNT is fixed on any two electrodes of four electrode connecting piece (6).
2. a kind of nanometer cutter for processing nano material according to claim 1, it is characterized in that described first support potsherd (9) and second supports on potsherd (7) and have four apertures, in aperture and aperture both sides deposit gold or platinum electrode, four electrode independent not conductings mutually separately on each potsherd.
3. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the base material that described four electrode connecting piece (6) use is aluminium oxide or silicon nitride, and four electrodes (11) material is gold, platinum or nickel gold.
4. a kind of nanometer cutter for processing nano material according to claim 3, it is characterized in that described four electrodes (11) are close between two in substrate one end, two width between electrode are 2 μm ~ 20 μm, two groups of close electrodes have part to be suspended on outside substrate, and electrode pendulous tank is 0.1 μm ~ 20 μm.
5. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the material of described metal probe (5) is tungsten, gold, copper or aluminium.
6. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the on-load voltage of described circuit master control is 0.1V ~ 5V.
7. the using method of a kind of nanometer cutter for processing nano material as claimed in claim 1, it uses step as follows:
1. take off metallic copper cap (4) and metal probe (5), in carbon nanotube powder, adhere to CNT with tweezers grip probe (5);
2. the metal probe (5) being stained with CNT is fixed back on metallic copper cap (4), then metallic copper cap (4) is fixed back on Piezoelectric Ceramic cylinder (3);
3. the structure assembled being loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder (3) moving metal copper cap (4) and metal probe (5), the CNT on metal probe (5) being snapped on the overhanging portion of four electrodes (11);
4. retract Piezoelectric Ceramic cylinder (3), assembly structure is taken out from transmission electron microscope, take off metallic copper cap (4) and metal probe (5);
5. take off the metal probe (5) with CNT from metallic copper cap (4), get that a new metal probe (5) is sticky gets the material needing cutting, the metal probe (5) being stained with material to be cut is reinstalled on metallic copper cap (4);
6. assembly structure is loaded transmission electron microscope, made the CNT of nano silver wire on four electrodes (11) on metal probe (5) by mobile Piezoelectric Ceramic cylinder (3);
7. by circuit master control (1), on-load voltage electric current is carried out to the CNT in four electrode connecting piece (6), mobile Piezoelectric Ceramic cylinder (3) makes the material to be cut on metal probe (5) cost CNT, is cut nano silver wire by the joule heat of CNT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410730289.2A CN104526766B (en) | 2014-12-04 | 2014-12-04 | A kind of nanometer cutter for processing nano material and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410730289.2A CN104526766B (en) | 2014-12-04 | 2014-12-04 | A kind of nanometer cutter for processing nano material and using method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104526766A true CN104526766A (en) | 2015-04-22 |
| CN104526766B CN104526766B (en) | 2016-03-30 |
Family
ID=52842491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410730289.2A Active CN104526766B (en) | 2014-12-04 | 2014-12-04 | A kind of nanometer cutter for processing nano material and using method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104526766B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060205109A1 (en) * | 2003-02-28 | 2006-09-14 | Cox David C | Method and apparatus for fabricating nanoscale structures |
| CN1935631A (en) * | 2006-09-22 | 2007-03-28 | 北京大学 | Method for accurately cutting-connecting nano material and its use |
| KR20110070031A (en) * | 2009-12-18 | 2011-06-24 | 동우 화인켐 주식회사 | Nanoneedle tip for atomic force microscope and method for fabricating the same |
| JP4730686B2 (en) * | 2005-03-28 | 2011-07-20 | 独立行政法人物質・材料研究機構 | Carbon fiber cutting and processing methods |
| CN102581460A (en) * | 2012-03-09 | 2012-07-18 | 常州萨恩斯机电设备有限公司 | Nanoscale resistance spot welding device and nanoscale resistance spot welding method |
-
2014
- 2014-12-04 CN CN201410730289.2A patent/CN104526766B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060205109A1 (en) * | 2003-02-28 | 2006-09-14 | Cox David C | Method and apparatus for fabricating nanoscale structures |
| JP4730686B2 (en) * | 2005-03-28 | 2011-07-20 | 独立行政法人物質・材料研究機構 | Carbon fiber cutting and processing methods |
| CN1935631A (en) * | 2006-09-22 | 2007-03-28 | 北京大学 | Method for accurately cutting-connecting nano material and its use |
| KR20110070031A (en) * | 2009-12-18 | 2011-06-24 | 동우 화인켐 주식회사 | Nanoneedle tip for atomic force microscope and method for fabricating the same |
| CN102581460A (en) * | 2012-03-09 | 2012-07-18 | 常州萨恩斯机电设备有限公司 | Nanoscale resistance spot welding device and nanoscale resistance spot welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104526766B (en) | 2016-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wang et al. | Ultrathin Au nanowires and their transport properties | |
| CN100543905C (en) | A kind of field emission apparatus and preparation method thereof | |
| JP4365398B2 (en) | Field emission device and manufacturing method thereof | |
| Zhao et al. | Electrical breakdown of nanowires | |
| Shen et al. | Self-coiling of Ag2V4O11 nanobelts into perfect nanorings and microloops | |
| Mazloumi et al. | Fabrication of three-dimensional carbon nanotube and metal oxide hybrid mesoporous architectures | |
| Chu et al. | Filling of carbon nanotubes with silver, gold, and gold chloride | |
| Lyu et al. | Low-temperature growth of ZnO nanowire array by a simple physical vapor-deposition method | |
| Zhang et al. | In situ fabrication of inorganic nanowire arrays grown from and aligned on metal substrates | |
| Wu et al. | Twinned SiC zigzag nanoneedles | |
| Wang et al. | Large-scale growth of well-aligned SiC tower-like nanowire arrays and their field emission properties | |
| Li et al. | Transparent, flexible heater based on hybrid 2D platform of graphene and dry-spun carbon nanotubes | |
| Agrawal et al. | High-performance stable field emission with ultralow turn on voltage from rGO conformal coated TiO2 nanotubes 3D arrays | |
| CN110167873A (en) | For manufacturing the method for being coated with the electronic emitter of the coating containing nanometer rods | |
| Lee et al. | Facile synthesis of single crystalline metallic RuO2 nanowires and electromigration-induced transport properties | |
| Yasaei et al. | Mapping hot spots at heterogeneities of few-layer Ti3C2 MXene sheets | |
| Lv et al. | Enhanced field emission performance of hierarchical ZnO/Si nanotrees with spatially branched heteroassemblies | |
| Liu et al. | Giant enhancement of field emission from selectively edge grown ZnO–carbon nanotube heterostructure arrays via diminishing the screen effect | |
| Barnett et al. | Experimental measurement of angular and overlap dependence of conduction between carbon nanotubes of identical chirality and diameter | |
| Vogl et al. | Transforming layered MoS 2 into functional MoO 2 nanowires | |
| CN101540251A (en) | Field-emission electron source | |
| Rawal et al. | Surface structure-dependent low turn-on electron field emission from polypyrrole/tin oxide hybrid cathodes | |
| Kaindl et al. | Aerosol jet printing of graphene and carbon nanotube patterns on realistically rugged substrates | |
| US7504014B2 (en) | High density interconnections with nanowiring | |
| Li et al. | High-performance field emitters based on SiC nanowires with designed electron emission sites |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |