CN104519659B - A kind of circuit board leads to the production method and circuit board of layer blind hole - Google Patents
A kind of circuit board leads to the production method and circuit board of layer blind hole Download PDFInfo
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- CN104519659B CN104519659B CN201310461629.1A CN201310461629A CN104519659B CN 104519659 B CN104519659 B CN 104519659B CN 201310461629 A CN201310461629 A CN 201310461629A CN 104519659 B CN104519659 B CN 104519659B
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- layer
- conductive pattern
- blind hole
- window
- logical
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to printed circuit board technology field, discloses production method and circuit board that a kind of circuit board leads to layer blind hole.Multiple conductive pattern layers that the production method is turned on for needs, during each conductive pattern layer is formed, by corresponding to the position formation window for needing logical layer blind hole to be formed, and the window for being arranged close to the conductive pattern layer of core layer is located remotely from the region where the window of the conductive pattern layer of core layer, so as to which only laser boring need to be carried out in the window of outermost layer conductive pattern layer, it can expose in the conductive pattern layer that needs turn on and treat coupling part, logical layer blind hole needed for being formed, greatly reduce the number to form laser boring during logical layer blind hole.Moreover, only the logical layer blind hole of formation need to once be electroplated, it is possible to realize the conducting of multiple conductive pattern layers, shorten product manufacturing process, reduce the quality risk of production cost and product.
Description
Technical field
The present invention relates to printed circuit board technology field, more particularly to a kind of circuit board lead to layer blind hole production method and
Circuit board.
Background technology
With the continuous development of electronic communication, electronic product develops towards multi-functional, highly dense direction；As electronics
The wiring board of component carrier is transformed to high density interconnection from traditional PCB（High Density Interconnect,
Referred to as " HDI "）.In order to reduce board area, closeness is lifted, it is often necessary to realize the mutual of adjacent multiple conductive pattern layers
Conducting.
Circuit board generally comprises a core layer and pressing is formed in that core plate is laminated or two opposite faces on multiple conductions
Graph layer.Wherein, conductive pattern layer includes the insulating layer and conductive layer pattern being pressed together on successively in core layer, and core layer is one
Two opposite faces of the kind on a plate body are respectively formed on the special conductive pattern layer of conductive layer pattern.
In the prior art, generally use leads to layer blind hole to realize the phase mutual conductance of adjacent multiple conductive pattern layers inside circuit board
It is logical.For the manufacture craft of logical layer blind hole, traditional production method be core layer first do a laser boring formed it is first blind
Hole, and plating is carried out to the first blind hole and fills out copper；After pressing increasing layer, then position same on circuit board after pressing is done once
Laser boring forms the second blind hole, then carries out plating to the second blind hole and fills out copper, so that two neighboring conductive pattern layer passes through the
The logical layer blind hole mutual conduction of one blind hole and the second blind hole composition；Repeat to press in increasing layer, then circuit board after pressing
Same position carries out the making of the 3rd blind hole, then carries out plating to the 3rd blind hole and fills out copper, so that adjacent three conductive patterns
The logical layer blind hole mutual conduction that layer is made up of the first blind hole, the second blind hole and the 3rd blind hole.
From the process above as can be seen that when making the logical layer blind hole for turning on adjacent three conductive pattern layers, except core layer
Outside blind hole makes, laser boring twice and plating twice is needed to fill out process for copper and form logical layer blind hole, production procedure length, production cost
Height, production delivery time length, the undesirable risk of quality are high.
The content of the invention
The present invention provides the production method and circuit board that a kind of circuit board leads to layer blind hole, leads to layer to solve available circuit plate
In the manufacture craft of blind hole, existing above-mentioned technical problem.
In order to solve the above technical problems, the present invention provides the production method that a kind of circuit board leads to layer blind hole, including：
Multiple the first conductive pattern layers for needing to turn on are sequentially formed in the one side of core layer, wherein, form each first
During conductive pattern layer, a first window is formed in the position corresponding to need logical layer blind hole to be formed, and close to described
The first window of first conductive pattern layer of core layer is located remotely from the first window of the first conductive pattern layer of the core layer
In the region at place；
Laser boring operation is carried out in the first window of outermost first conductive pattern layer, forms logical layer blind hole, dew
First gone out in the first conductive pattern layer for needing to turn on treats coupling part；
The logical layer blind hole is electroplated, forms the electrodeposited coating that coupling part is treated in connection described first.
Above-mentioned production method, wherein, it is not required between at least two first conductive pattern layers formed with least one
The second conductive pattern layer to be turned on；
During forming each second conductive pattern layer, the is being formed corresponding to the position for needing logical layer blind hole to be formed
Two windows, and the first window of outermost first conductive pattern layer is in the region where second window, and outermost layer
The first conductive pattern layer first window contour line and the contour line of the second window between it is not overlapping.
Above-mentioned production method, wherein, second conductive pattern layer is led including the second insulating layer and patterned second
Electric layer；The step of second insulating layer is set close to the core layer, formation second window, is specially：
Second conductive layer is patterned, forms second window.
Above-mentioned production method, wherein, first conductive pattern layer is led including the first insulating layer and patterned first
Electric layer, first insulating layer are set close to the core layer；
The step of forming the first window, is specially：
First conductive layer is patterned, forms the first window.
Above-mentioned production method, wherein, the logical layer blind hole is the small stepped hole in the big the inner in an outer end；
The ladder of the stepped hole is formed by the first conductive layer of the first conductive pattern layer for needing to turn on.
Above-mentioned production method, wherein, the logical layer blind hole is a cylindrical hole.
Above-mentioned production method, wherein, the logical layer blind hole is electroplated, forms the electricity that coupling part is treated described in connection
After the step of coating, further include：
Filled layer is formed in the logical layer blind hole, fills and leads up the logical layer blind hole.
In order to solve the above technical problems, lead to a layer production method system for blind hole using foregoing circuit plate the present invention also provides a kind of
The circuit board of work.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
In above-mentioned technical proposal, for the multiple conductive pattern layers for needing to turn on, the mistake of each conductive pattern layer is being formed
Cheng Zhong, by forming window in the position corresponding to need logical layer blind hole to be formed, and is arranged close to the conductive pattern of core layer
In region where the window for the conductive pattern layer that the window of layer is located remotely from core layer, so that only need to be in outermost layer conductive pattern
Laser boring is carried out in the window of layer, you can expose in the conductive pattern layer that needs turn on and treat coupling part, formed required
Logical layer blind hole, greatly reduces the number to form laser boring during logical layer blind hole.Moreover, only need to be to the logical layer blind hole of formation
Once electroplated, it is possible to realize the conducting of multiple conductive pattern layers, shorten product manufacturing process, reduce production cost
With the quality risk of product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other attached drawings according to these attached drawings.
Circuit board leads to the manufacturing process schematic diagram of layer blind hole in Fig. 1-Fig. 5 expression embodiment of the present invention one；
Fig. 6-Fig. 9 represents to form the process schematic of logical layer blind hole in the embodiment of the present invention two in core layer；
Circuit board leads to the structure diagram one of layer blind hole in Figure 10 expression embodiment of the present invention two；
Circuit board leads to the structure diagram two of layer blind hole in Figure 11 expression embodiment of the present invention two.
Embodiment
Below in conjunction with drawings and examples, the embodiment of the present invention is described in further detail.Following reality
Apply example to be used to illustrate the present invention, but be not limited to the scope of the present invention.
Embodiment one
The production method that a kind of circuit board leads to layer blind hole is provided in the embodiment of the present invention, it is multiple on turning circuit plate
Conductive pattern layer, especially on turning circuit plate, is formed in the laminated upper and adjacent multiple conductive pattern layers of core plate, and reduce
The laser boring number and plating number during logical layer blind hole are formed, to shorten the production procedure of product, reduces the life of product
Produce cost.
Circuit board leads to the production method of layer blind hole in the embodiment of the present invention, specifically includes following steps：
The first conductive pattern layer for needing to turn on is sequentially formed in the one side of core layer, wherein, it is conductive to form each first
During graph layer, a first window is formed in the position corresponding to need logical layer blind hole to be formed, and close to the core plate
The first window of first conductive pattern layer of layer is located remotely from where the first window of the first conductive pattern layer of the core layer
Region in；
Laser boring operation is carried out in the first window of outermost first conductive pattern layer, forms logical layer blind hole, dew
Go out in the first conductive pattern layer for needing to turn on and treat coupling part；
The logical layer blind hole is electroplated, forms the electrodeposited coating that coupling part is treated described in connection.
Wherein, the first conductive pattern layer treats that coupling part is its conductive structure, so that multiple first conductive pattern layer energy
Enough by electrodeposited coating and treat that conducting is realized in the connection of coupling part.
In technical scheme, for the multiple conductive pattern layers for needing to turn on, each conductive pattern layer is being formed
During, window is formed in the position corresponding to need logical layer blind hole to be formed, and be arranged close to the conductive pattern of core layer
In region where the window for the conductive pattern layer that the window of layer is located remotely from core layer, so that only need to be in outermost layer conductive pattern
Laser boring is carried out in the window of layer, you can ensure to expose the coupling part for the treatment of in the conductive pattern layer that needs turn on, form institute
The logical layer blind hole needed, greatly reduces the number to form laser boring during logical layer blind hole.Moreover, only need to be to the logical layer of formation
Blind hole carries out once plating and forms electrodeposited coating, and connection of the electrodeposited coating with treating coupling part can realize multiple conductive pattern layers
Conducting, substantially reduces product manufacturing process, reduces production cost.Meanwhile the reduction of technique number also reduces product
Quality risk.
Herein, it should be noted that sequentially form need " successively " in the first conductive pattern layer for turning on only for
For first conductive pattern layer, no other graph layers between these first conductive pattern layers are not represented, this will later
Illustrate, no further details to be given herein.
Meanwhile in a specific embodiment of the present invention, a window is located in the region where another window and contains including two kinds
Justice：
1st, the contour line of two windows is completely overlapped in vertical direction；And
2nd, a window is completely covered by another window, between the contour line of the contour line of capped window and another window
It is not overlapping（Situation as shown in Figure 5）.
Below by by taking multiple first conductive pattern layers for needing to turn on are two adjacent the first conductive pattern layers as an example, come
Illustrate the manufacturing process that circuit board in the embodiment of the present invention leads to layer blind hole：
Step 1, as shown in Figure 1, the one side formation in core layer 1 needs first the first conductive pattern layer turned on.Should
First conductive pattern layer specifically includes the first insulating layer 11 and patterned first conductive layer 10, wherein, the first insulating layer 11 leans on
Nearly core layer 1 is set, and is pressed together on by copper coin in core layer 1.First conductive layer 10 generally passes through chemical-copper-plating process shape
Into the copper foil on the first insulating layer 11.
Step 2, as shown in Fig. 2, in first the first conductive pattern layer, corresponding to need logical layer blind hole to be formed
Position forms first window 101.Specifically, being patterned to the first conductive layer 10, first window 101 is formed.As one
Embodiment, can carry out mechanical punching operation to the first conductive layer 10, form first window 101.
Step 3, with reference to shown in Fig. 3 and Fig. 4, forms need to turn on second in first the first conductive pattern layer
First conductive pattern layer.Equally forming first window 101 corresponding to the position for needing logical layer blind hole to be formed, detailed process with
The process of formation first window is identical in first the first conductive pattern layer, and details are not described herein.Wherein, lead for second first
First window of the first window 101 of electric graph layer positioned at first the first conductive pattern layer（Not shown in figure）The region at place
It is interior.
Step 4, as shown in figure 5, carrying out laser boring behaviour in the first window 101 of second the first conductive pattern layer
Make, form logical layer blind hole 100.Since the first window 101 of second the first conductive pattern layer is located at first the first conductive pattern
In region where the first window of shape layer, it thereby may be ensured that in two the first conductive pattern layers and treat that coupling part is revealed
Go out.Wherein, the first conductive pattern layer treats that coupling part is the first conductive layer 10.
Step 5, with reference to shown in Fig. 5, carries out electroplating copper to logical layer blind hole 100, is formed and treat coupling part described in connection
Electrodeposited coating（Not shown in figure）, then two the first conductive pattern layers turned on by electrodeposited coating.
Step 6, filled layer, such as epoxy resin are formed in logical layer blind hole, for filling and leading up the logical layer blind hole, so that electric
The surfacing of road plate.
When the first conductive pattern layer that multiple first conductive pattern layers for needing to turn on are adjacent three or more than three
When, the process of the corresponding logical layer blind hole of formation is same as described above, simply the repetition in step.Certainly also need to ensure close to core plate
The first window of first conductive pattern layer of floor is located remotely from the area where the first window of the first conductive pattern layer of core layer
In domain.
The logical layer blind hole 100 that production method in through this embodiment is formed can be the small ladder in the big the inner in an outer end
Hole, and the ladder of logical layer blind hole 100 is formed by the first conductive layer 10 of the first conductive pattern layer for needing to turn on, as shown in Figure 5.
Certainly, through this embodiment in production method formed logical layer blind hole 100 can also be a cylindrical hole or back taper
Shape hole（That is the small bellmouth in the big the inner in outer end）.
Embodiment two
, it is necessary to which multiple first conductive pattern layers of conducting can also be not exclusively adjacent more in actual application process
Between a first conductive pattern layer, i.e. at least two first conductive pattern layers formed with it is at least one need not turn on second lead
Electric graph layer.
Specifically, with reference to shown in Figure 10 and Figure 11, the second conductive pattern layer includes the second insulating layer 21 and patterned the
Two conductive layers 20.Wherein, the second insulating layer 21 is set close to core layer 1, and is pressed together on by copper coin in core layer 1.Second leads
Electric layer 20 is generally the copper foil being formed in by chemical-copper-plating process on the second insulating layer 21.
While multiple first conductive pattern layers are turned on to realize, do not turned on the second conductive pattern layer, the present embodiment
During the second conductive pattern layer is formed, corresponding to needing the position of logical layer blind hole to be formed to form the second window
102, and the first window of outermost first conductive pattern layer is in the region where the second window 102, and outermost the
It is not overlapping between the contour line of the first window of one conductive pattern layer and the contour line of the second window 102.
With reference to shown in Figure 10 and Figure 11.The electrodeposited coating and the second conductive layer 20 being then formed in logical layer blind hole 100 pass through
Insulating layer in two windows 102 disconnects, insulation.
In the case that one kind is special, when multiple first conductive pattern layers for needing to turn on are located at the both sides of core layer 1, it is
The conducting of the first conductive pattern interlayer is realized, it is necessary to which corresponding in core layer 1 needs the position of logical layer blind hole to be formed to be formed
Transition connection portion point.Since core layer 1 is that a kind of two opposite faces in a plate body 31 have been respectively formed on the 3rd conductive layer pattern 30
Special conductive pattern layer, therefore, the specific manufacturing process of transition connection portion in core layer 1 point is：
Step 1, as shown in fig. 6, being patterned technique to one of them the 3rd conductive layer 30 of core layer 1, forms transition
The pattern 32 of coupling part.Wherein, transition connection portion point 32 is specially the 3rd conductive layer 30, and with needing logical layer blind hole to be formed
Position correspondence.
Step 2, as shown in fig. 7, corresponding to the position for needing logical layer blind hole to be formed, carries out transition connection portion point 32
Mechanical punching, forms the 3rd window 103.
Step 3, as shown in figure 8, carrying out laser boring operation in the 3rd window 103, forms transition blind hole 200.
Step 3, as shown in figure 9, carrying out plating to the transition blind hole fills out copper, fills and leads up the transition blind hole.
Through the above technical solutions, the first conductive pattern layer of core layer both sides passes through the transition connection portion in core layer point
Realize conducting.
Embodiment three
A kind of circuit board made according to above-mentioned production method is additionally provided in the embodiment of the present invention, due to reducing circuit
Plate leads to laser boring number and plating number in layer blind hole manufacturing process, so as to shorten the production procedure of circuit board, reduces
The production cost and quality risk of circuit board.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvement and replacement can also be made, these improve and replace
Also it should be regarded as protection scope of the present invention.
Claims (7)
1. the production method that a kind of circuit board leads to layer blind hole, including：
Multiple the first conductive pattern layers for needing to turn on are sequentially formed in the one side of core layer, wherein, it is conductive to form each first
During graph layer, a first window is formed in the position corresponding to need logical layer blind hole to be formed, and close to the core plate
The first window of first conductive pattern layer of layer is located remotely from where the first window of the first conductive pattern layer of the core layer
Region in；
Laser boring operation is carried out in the first window of outermost first conductive pattern layer, forms logical layer blind hole, exposing needs
Coupling part is treated in the first conductive pattern layer to be turned on；
The logical layer blind hole is electroplated, forms the electrodeposited coating that coupling part is treated described in connection；
Formed with least one the second conductive pattern layer that need not be turned between at least two first conductive pattern layers；
During forming each second conductive pattern layer, corresponding to the second window of position formation for needing logical layer blind hole to be formed
Mouthful, and the first window of outermost first conductive pattern layer is in the region where second window, and outermost the
It is not overlapping between the contour line of the first window of one conductive pattern layer and the contour line of the second window.
2. production method according to claim 1, it is characterised in that second conductive pattern layer includes the second insulating layer
With patterned second conductive layer；The step of second insulating layer is set close to the core layer, formation second window,
Specially：
Second conductive layer is patterned, forms second window.
3. production method according to claim 1, it is characterised in that first conductive pattern layer includes the first insulating layer
With patterned first conductive layer, first insulating layer is set close to the core layer；
The step of forming the first window, is specially：
First conductive layer is patterned, forms the first window.
4. production method according to claim 3, it is characterised in that the logical layer blind hole is the small rank in the big the inner in an outer end
Terraced hole；
The ladder of the stepped hole is formed by the first conductive layer of the first conductive pattern layer for needing to turn on.
5. production method according to claim 1, it is characterised in that the logical layer blind hole is a cylindrical hole.
6. according to claim 1-5 any one of them production methods, it is characterised in that the logical layer blind hole is electroplated,
Formed after the step for the treatment of the electrodeposited coating of coupling part described in connection, further included：
Filled layer is formed in the logical layer blind hole, fills and leads up the logical layer blind hole.
A kind of 7. circuit board made according to claim 1-6 any one of them production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461629.1A CN104519659B (en) | 2013-09-30 | 2013-09-30 | A kind of circuit board leads to the production method and circuit board of layer blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461629.1A CN104519659B (en) | 2013-09-30 | 2013-09-30 | A kind of circuit board leads to the production method and circuit board of layer blind hole |
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| Publication Number | Publication Date |
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| CN104519659A CN104519659A (en) | 2015-04-15 |
| CN104519659B true CN104519659B (en) | 2018-04-13 |
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| CN201310461629.1A Active CN104519659B (en) | 2013-09-30 | 2013-09-30 | A kind of circuit board leads to the production method and circuit board of layer blind hole |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7145979B2 (en) | 2019-07-31 | 2022-10-03 | 深南電路股▲ふん▼有限公司 | Circuit board and its manufacturing method |
| CN113556886A (en) * | 2020-04-23 | 2021-10-26 | 深南电路股份有限公司 | Manufacturing method of multi-order blind hole circuit board and multi-order blind hole circuit board |
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| CN101009972A (en) * | 2006-01-26 | 2007-08-01 | 株式会社日立制作所 | Circuit board provided and transmission device with the same mounted |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| CN102686017A (en) * | 2011-03-15 | 2012-09-19 | 富士通株式会社 | Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI298613B (en) * | 2006-05-19 | 2008-07-01 | Foxconn Advanced Tech Inc | Method for manufacturing via holes used in printed circuit boards |
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2013
- 2013-09-30 CN CN201310461629.1A patent/CN104519659B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| CN101009972A (en) * | 2006-01-26 | 2007-08-01 | 株式会社日立制作所 | Circuit board provided and transmission device with the same mounted |
| CN102686017A (en) * | 2011-03-15 | 2012-09-19 | 富士通株式会社 | Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board |
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| CN104519659A (en) | 2015-04-15 |
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