CN104502360A - Chip appearance defect detection system - Google Patents
Chip appearance defect detection system Download PDFInfo
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- CN104502360A CN104502360A CN201410827792.XA CN201410827792A CN104502360A CN 104502360 A CN104502360 A CN 104502360A CN 201410827792 A CN201410827792 A CN 201410827792A CN 104502360 A CN104502360 A CN 104502360A
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Abstract
The invention discloses a chip appearance defect detection system which comprises a platform, a light source, a plane mirror, a lens, an image sensor and an image processor, wherein a detected chip is arranged on the platform; the light source is used for providing light needed by chip imaging; the plane mirror is positioned above the detected chip and is used for projecting the light provided by the light source to the detected chip and returning the light reflected by the detected chip along a same path; the lens is positioned in back of the light source and is used for detecting the light reflected by the detected chip and imaging; the image sensor is used for capturing an image of the detected chip imaged by the lens; and the image processor is used for processing the image of the detected chip, so that the appearance defect of the detected chip is detected. With the adoption of the plane mirror imaging method, the space needed by the detection system can be greatly reduced, only the space of a plane mirror is needed, and the detection system device can be installed.
Description
Technical field
The present invention relates to the detection field of chip package open defect, particularly relate to a kind of design of the chip package open defect detection system for small space.
Background technology
It is last important step that semi-conductor chip is produced that outward appearance detects, and is detected by outward appearance, can find and remove the defect of chip outward appearance, while ensureing chip complete appearance, also can avoid the chip functions defect caused by chip appearance defects.Utilize the Aulomatizeted Detect of realizing of Robot Vision chip appearance defects can avoid the error brought due to human subjective's property, reduce the cost of labor of producing, enhance productivity.At present, the automatic encapsulation device that most of semi-conductor chip production firm uses does not have chip appearance defects automatic detection function, an independent chip appearance defects detection system can be designed be arranged on above existing automatic encapsulation device, realize the automatic detection of chip appearance defects.But the volume size of chip appearance defects detection system must be considered, and the how problem of chip open defect system inside limited space.Research and development are had to the automatic encapsulation device of chip appearance defects measuring ability, need equally to consider this problem.
Summary of the invention
(1) technical matters that will solve
For above problem, the present invention proposes one can space-saving chip appearance defects detection system, according to the installation method proposed, can install a chip appearance defects detection system in limited small space.
(2) technical scheme
To achieve the above object, the present invention proposes a kind of chip appearance defects detection system, it comprises:
Platform, it is placed detected chip;
Light source, for providing the light needed for chip imaging;
Level crossing, it is positioned at the top of detected chip, and the light for being provided by light source is projected to detected chip, and will return through detected chip reflection Hou Guangyuan road;
Camera lens, it is positioned at light source rear, carries out imaging for the light that detects after the reflection of detected chip;
Imageing sensor, it is for catching the image of the detected chip after described lens imaging;
Image processor, it is for processing the image of detected chip, to detect the open defect of detected chip.
(3) beneficial effect
The chip package open defect detection system for small space that the present invention proposes, comprise high speed imaging sensor, camera lens, light source, level crossing, image processor, owing to adopting the structure of flat mirror reflects imaging, chip package open defect detection system is made only to take very little space, when space cannot hold high speed imaging sensor, camera lens, light source and image processor, the installation of the device of system can be realized.
Accompanying drawing explanation
Below in conjunction with accompanying drawing and embodiment, the present invention is elaborated.
Fig. 1 is the structural representation of the chip package open defect detection system that the present invention proposes.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in further detail.
As shown in Figure 1, chip package open defect detection system comprises: high speed imaging sensor 04, camera lens 03, light source 02, level crossing 01, and described chip package open defect detection system also comprises image processor (not shown).Detected chip 05 is placed on delivery platform 06.Wherein level crossing 01 is positioned at directly over chip 05 to be detected, and certain angle that tilts, camera lens 03 is positioned at the rear of light source 02, and imageing sensor 04 is positioned at the rear of camera lens 03; According to mirror imaging principle, the light that the position of adjustment light source 02 makes light source 02 send is projected on detected chip 05 after level crossing 01, reflect Hou Yuan road through detected chip 05 to return, after camera lens 03 amplification imaging, catch by high speed imaging sensor 04 detection.Described level crossing makes to equal reflection angle β from the incident angle α of light on level crossing 01 after detected chip 05 reflection.The angle of inclination of described level crossing 01 is determined according to the position of described light source 02, camera lens 03 and imageing sensor 04.Wherein, described high speed imaging sensor 04 is for catching the image of detected chip package, because the size of chip is smaller, need to be scaled to picture with a camera lens, light source 02 is for generation of uniform irradiation, and level crossing is used for catoptric imaging, image processor receives the view data of image capture sensor, carry out image procossing according to corresponding detection algorithm and make detecting judgement, in the present invention, applicable any detection algorithm of the prior art, is not therefore described in detail at this.Described platform is delivery platform, it is placed with multiple chip, can be transferred into successively below mirror dawn and detect.After current chip detects, next chip is sent to below level crossing 01 by delivery platform 06, and imageing sensor 04 obtains image again, and image processor detects again, so circulates.
Owing to employing level crossing, mirror imaging shooting is carried out to chip under test, the installation site of high speed imaging sensor, camera lens, light source can be made more flexible, such as on most of robotization sealed in unit, there is no enough spaces to install whole chip appearance defects detection system, just can by mode as shown in Figure 1, only need very little sky to ask top level crossing being arranged on detected chip, obtain image by mirror imaging.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a chip appearance defects detection system, it comprises:
Platform, it is placed detected chip;
Light source, for providing the light needed for chip imaging;
Level crossing, it is positioned at the top of detected chip, and the light for being provided by light source is projected to detected chip, and will return through detected chip reflection Hou Guangyuan road;
Camera lens, it is positioned at light source rear, carries out imaging for the light that detects after the reflection of detected chip;
Imageing sensor, it is for catching the image of the detected chip after described lens imaging;
Image processor, it is for processing the image of detected chip, to detect the open defect of detected chip.
2. the system as claimed in claim 1, wherein, described level crossing is positioned at directly over described detected chip, and has certain angle of inclination.
3. system as claimed in claim 2, wherein, the angle of inclination of described level crossing is determined according to the position of described light source, camera lens and imageing sensor.
4. the system as claimed in claim 1, wherein, described light source is for generation of irradiating light uniformly.
5. the system as claimed in claim 1, wherein, described platform is delivery platform, it is placed with multiple chip, can be transferred into successively below mirror dawn and detect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410827792.XA CN104502360A (en) | 2014-12-25 | 2014-12-25 | Chip appearance defect detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410827792.XA CN104502360A (en) | 2014-12-25 | 2014-12-25 | Chip appearance defect detection system |
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| Publication Number | Publication Date |
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| CN104502360A true CN104502360A (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410827792.XA Pending CN104502360A (en) | 2014-12-25 | 2014-12-25 | Chip appearance defect detection system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105241895A (en) * | 2015-10-28 | 2016-01-13 | 重庆远创光电科技有限公司 | Framework for automatic detection of chip |
| CN105372247A (en) * | 2015-10-28 | 2016-03-02 | 重庆远创光电科技有限公司 | Frame for automatic chip detection |
| CN105388159A (en) * | 2015-12-14 | 2016-03-09 | 重庆远创光电科技有限公司 | Chip image acquisition apparatus |
| CN105445273A (en) * | 2015-12-14 | 2016-03-30 | 重庆远创光电科技有限公司 | Rapid acquisition apparatus for chip image |
| CN105572142A (en) * | 2015-12-14 | 2016-05-11 | 重庆远创光电科技有限公司 | Dual-camera chip detection system |
| CN105572135A (en) * | 2015-12-14 | 2016-05-11 | 重庆远创光电科技有限公司 | System for performing qualification detection on eutectic soldering on air-conditioner chips |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201072409Y (en) * | 2007-08-27 | 2008-06-11 | 柳明 | Circuit board soldering point scanning and testing apparatus |
| CN101320703A (en) * | 2007-06-08 | 2008-12-10 | 株式会社新川 | Pick-up device for jointing device and pick-up method |
| CN201724908U (en) * | 2010-05-14 | 2011-01-26 | 久元电子股份有限公司 | Chip appearance inspection device |
| CN102213680A (en) * | 2010-04-09 | 2011-10-12 | 久元电子股份有限公司 | Device and method for detecting luminous diode grain appearance |
| CN203443901U (en) * | 2013-08-27 | 2014-02-19 | 上海美诺福实验自动化有限公司 | Test defect identification device |
| CN103901039A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Detection system |
-
2014
- 2014-12-25 CN CN201410827792.XA patent/CN104502360A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320703A (en) * | 2007-06-08 | 2008-12-10 | 株式会社新川 | Pick-up device for jointing device and pick-up method |
| CN201072409Y (en) * | 2007-08-27 | 2008-06-11 | 柳明 | Circuit board soldering point scanning and testing apparatus |
| CN102213680A (en) * | 2010-04-09 | 2011-10-12 | 久元电子股份有限公司 | Device and method for detecting luminous diode grain appearance |
| CN201724908U (en) * | 2010-05-14 | 2011-01-26 | 久元电子股份有限公司 | Chip appearance inspection device |
| CN103901039A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Detection system |
| CN203443901U (en) * | 2013-08-27 | 2014-02-19 | 上海美诺福实验自动化有限公司 | Test defect identification device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105241895A (en) * | 2015-10-28 | 2016-01-13 | 重庆远创光电科技有限公司 | Framework for automatic detection of chip |
| CN105372247A (en) * | 2015-10-28 | 2016-03-02 | 重庆远创光电科技有限公司 | Frame for automatic chip detection |
| CN105388159A (en) * | 2015-12-14 | 2016-03-09 | 重庆远创光电科技有限公司 | Chip image acquisition apparatus |
| CN105445273A (en) * | 2015-12-14 | 2016-03-30 | 重庆远创光电科技有限公司 | Rapid acquisition apparatus for chip image |
| CN105572142A (en) * | 2015-12-14 | 2016-05-11 | 重庆远创光电科技有限公司 | Dual-camera chip detection system |
| CN105572135A (en) * | 2015-12-14 | 2016-05-11 | 重庆远创光电科技有限公司 | System for performing qualification detection on eutectic soldering on air-conditioner chips |
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Application publication date: 20150408 |
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