CN104487609A - 用于打印及镀覆工序的印制方法 - Google Patents

用于打印及镀覆工序的印制方法 Download PDF

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CN104487609A
CN104487609A CN201280073503.0A CN201280073503A CN104487609A CN 104487609 A CN104487609 A CN 104487609A CN 201280073503 A CN201280073503 A CN 201280073503A CN 104487609 A CN104487609 A CN 104487609A
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substrate
printing
ink
printed
plating
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桑尔·李
俊熙·帕克
以法莲·乌尔姆
文伟·郭
彦·赵
董宇·李
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Galtronics Corp Ltd
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Galtronics Corp Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
    • B41J3/40731—Holders for objects, e. g. holders specially adapted to the shape of the object to be printed or adapted to hold several objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
    • C—CHEMISTRY; METALLURGY
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/1601—Process or apparatus
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0471—Non-planar, stepped or wedge-shaped patch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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Abstract

本发明提供一种用于打印在基板上的方法，包括：提供一基板，其具有至少一个三维表面；及通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而在所述至少一个三维表面的至少一个部分进行一油墨的喷墨打印。

Description

用于打印及镀覆工序的印制方法
技术领域
本发明是有关于一种用于喷墨打印在一基板的方法，特别是有关于一种应用于打印及镀覆工序。
背景技术
以下的文件被视为本技术领域的最新状态：
美国专利第3,900,320号；第5,342,501号；第5,547,559号；第5,955,179号；第7,179,741号；第7,510,985号；及第7,608,203号。
PCT专利申请公开第WO 2005/45095号；第WO 2005/56875号；第WO2006/123144号；第WO 2008/12512号；及第WO 2008/40936号。
韩国专利第10-0839557号；及第10-0830970号。
发明内容
本发明的目的在于提供一种用于喷墨打印在基板上的改进打印方法，所述方法特别应用于镀覆天线的制造。
因此，根据本发明一优选实施例提供一种用于打印在基板上的方法，其包含提供一基板，其具有至少一个三维表面；及通过及仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而在所述基板的至少一个三维表面的至少一个部分进行一油墨的喷墨打印。
根据本发明的一优选实施例中，所述打印方法还包含步骤：在所述基板的至少一个三维表面的已打印部分上镀覆至少一导电层。
优选地，所述导电层包括一金属层。
优选地，所述金属层包括一天线。
根据本发明的另一优选实施例中，所述基板的至少一个三维表面包括一通孔，且所述已打印部分形成在所述通孔的一孔径上。
优选地，所述镀覆包含电镀。
可替代地，所述镀覆包含无电镀。
优选地，所述基板包含一非导电基板。
优选地，所述非导电基板包含一塑料。
优选地，所述油墨包括一非导电油墨。
优选地，所述喷墨打印包括压电喷墨打印。
根据本发明另一优选实施例还提供一种天线，其包含一基板，其包括至少至少一个三维表面；一油墨图案，通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而被打印在所述三维表面的至少一个部分上；及至少一导电层，被镀覆在所述油墨图案的至少一个部分上。
根据本发明另一优选实施例还提供一种用于在通孔的孔径上打印的方法，其包含提供一基板，其具有至少一通孔，所述通孔内具有一孔径；及通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而在所述通孔的孔径的至少一部分上进行一油墨的喷墨打印。
优选地，所述方法还包含以下步骤：在所述孔径的已打印部分上镀覆至少一导电层。
附图说明
从下面的详细描述与其中附图的结合，本发明将被理解及更充分的认识：
图1是根据本发明的优选实施例一种打印及镀覆工序的简化流程图。
图2是根据本发明的优选实施例一种应用于图1所示的类型的工序的打印方法的示意图。
图3A至3C为图2所示的类型的打印方法的各个阶段的示意图。
图4A至4F为图2至图3C所示的类型的打印方法的各个阶段的简化放大立体图。
具体实施方式
请参阅图1所示，为根据本发明一优选实施例的一打印及镀覆工序100的简化流程图。
如图1所示，工序100优选地开始于一第一步骤102，提供一基板104。所述基板104优选地具有至少一个三维(3D)表面，其中优选地包含一弯曲上表面106及一弯曲下表面108。上及下表面106、108优选地通过一通孔110形成在其中的方式连接。然而，可以理解的是，所述基板104的配置仅为示例性，且所述表面106、108的三维形貌及基板104其他表面特征可适应于根据一装置的设计要求而引入所述基板104中。所述基板104优选地为一非导电基板及特别优选由塑料形成。
所述工序100还包含一第二喷墨打印步骤112。在打印步骤112中，通过及仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，一油墨114的图案被打印在基板104的至少一个三维表面的至少一部分上。
打印步骤112也可被称为一个二维(2D)喷墨打印步骤。可以理解的是，打印步骤112为一种非接触式打印步骤，在打印步骤中，油墨的液滴分别从喷墨打印头喷出，相对于所述基板104在两个维度偏移而重新定位。进一步理解的是，喷墨打印头的重新定位，在二维中相对于所述基板104，可包括所述打印头及/或所述基板104的重新定位，详细说明可参照以下附图2至4F。
一种二维非接触式打印方法被用于打印一图案为本发明一较佳实施例的优选特征，例如一油墨114图案，在一个三维表面，如基板104的表面106、108。本发明的打印二维方法相较于板印(pad printing)较为有利，激光直接结构化(laser direct structuring,LDS)及含有金属粒子的喷墨打印，其中全部的常规技术被用于在一种三维表面上一图案的形成。特别是，所述本发明的二维打印方法相较于板印方法为较快、较简单及较可靠，且相较于激光直接结构化为较便宜。这需要专门设计的基板材料。此外，本发明的二维打印方法相较于含有金属粒子的打印方法较简单进行，由于在打印的过程中，保持金属油墨的均匀较为困难。
关于二维喷墨打印步骤112的进一步细节，包括由二维喷墨打印被使用于在基板三维表面实现图案打印的机构细节，请参阅所提供的图2至4F。
所述基板104的至少一个三维表面的打印部分，以举例的方式优选包括，位于基板104三维上表面106的一打印部116，位于基板104三维下表面108的一打印部118，位于贯穿基板104的通孔110的孔径122上的一打印部120，如截面A-A所示。可以理解的是，截面A-A所示的通孔110的形状仅作为示例的方式，所述通孔也可以各种形状替代，例如单及双圆锥通孔，还可通过二维喷墨打印步骤112的方式打印。
所述打印部分116、118分别位于所述基板104的上及下表面106、108，优选地通过打印步骤112实施二次以配置于基板104，以便依序分别露出上及下表面106、108至一喷墨打印头，详细描述如图2所示。所述打印部分120通过油墨利用重力溢流至通孔110的孔径来实现，由油墨抽吸的方式通过所述通孔110的孔径，或通过本领域其他任何已知的机制。
油墨图案114优选地由非导电油墨形成，适合用于打印在塑料基板104及油墨图案114的至少一部分可镀覆导电层，因而使所述基板104的至少一部分的道德层镀覆如下所述。如非导电油墨的实例，适用于使用在二维喷墨打印步骤112，其包括申请人为Galtronics Korea Co.,Ltd.的韩国专利第10-0839557号及第10-0830970号描述的类型的油墨，本申请的受让人为全资子公司，其描述通过引用并入本文中。
以下的第二次二维喷墨打印步骤112，工序100继续至一第三导电镀覆步骤128。在导电镀覆步骤128中，至少一导电层130被镀覆在已镀覆油墨图案的至少一部分的顶部。导电层130包含一金属层132，被镀覆在打印部116上，一金属层134被镀覆在打印部118上，及一金属层136被镀覆至打印部120上，如截面B-B所示。优选地，所述导电图案用以形成天线。
如步骤128可清楚看出，所述金属层136形成在所述通孔110的孔径122的打印部120上，优选地在位于上表面106的金属层132及位于所述基板104的下表面108的金属层134之间提供一导电连接。因此，所述通孔110作为一导电管连接所述基板104的上及下表面106、108的导电部分。
可在镀覆步骤128中执行适合金属镀覆的方法在本技术领域中是已知的。在所述镀覆步骤128中使用非导电镀覆被认为是较有利于电镀，由于在非导电镀覆排除对于电极的需要，因而在基板104节省宝贵的空间。此外，非导电镀覆相较于电镀提供镀覆金属层的厚度均匀性的改进。
可以理解的是，所述相应的第一、第二及第三步骤102、112、128虽然优选地依序执行上述程序，也可通过其他步骤的执行或重复而分开，所述其他步骤可以或非具有上述描述的步骤。例如，一干燥步骤可能将打印步骤128与二维喷墨打印步骤112分离开，同样地，二维喷墨打印步骤112可在基板104的其他表面依序执行，除了所述表面106及108，从之前的打印步骤128开始。本领域的其他步骤，包括例如洗涤、清洗及去油步骤，也可以安插在工序100中。
进一步理解的是，虽然所述工序100已描述在上述参照在基板104上的天线130的形成，所述工序100可替换地被用于在一打印基板的三维表面上对于任何导电结构的形成。这样的结构具有广泛的用途，包含例如电子***的互连。
请参阅图2所示，为根据本发明优选实施例用于图1类型的工序的一打印方法的简化示意图。可以理解的是，图2所示的打印方法为打印的二维喷墨打印步骤112及图1所示的打印工序100的一个特别优选实施例。
如图2所示，提供一打印机200。所述打印机200优选为一喷墨打印机，用于执行非接触喷墨打印。特别优选地，所述打印机为一3PL(ultra-micro)超威点阵打印机，其具有爱普生(Epson)公司的微压电(MicroPiezo)打印头202，所述打印头202在放大204可清楚显示。可理解的是，为简单起见，虽然图2仅显示一个打印头202，但在打印机200内含有大量的打印头也是可能的。打印机优选地能够在5760*1440dpi的最大分辨率具有1.5pL的液滴尺寸。
打印机200优选地通过一电缆206连接至一计算机208，所述计算机208优选地由一操作者210操作。然而，可以理解的是，所述计算机208的计算功能可替代地组合至打印机200上，因而计算机208可被省略。进一步理解的是，二维喷墨打印步骤112，由于具有有益简便的效果，很容易以这样的程度自动化，操作者210可不需要存在。
打印机200优选地由一平板印刷夹具212在所述平板(flat bed)212上被送入，多个基板104优选地被排列。多个基板104优选地被保持在腔体中加工至平板212的表面。这些腔体的存在有利于多个基板104相对于打印机200的打印头202的准确定位。可以理解的是，在实施例中所示的阵列包含基板104的五列及十二行，仅作为示例。在本发明的一优选实施例中，所述平板212为机械加工，以便执行一阵列，其包含基板104的六列及十九行。进一步理解的是，所述尺寸及平板212的承载能力根据二维喷墨打印步骤112的生产要求可改变。
打印机200包含一高度传感器(图未示)设置在打印机200的区域214中。所述高度传感器可自动检测位于打印头202下方的一表面的最高点的定位。然后所述打印头202的定位自动调整，优选为表面最高点以上2毫米的位置，相对于上表面106中，如放大204可清楚显示。所述打印头202距离表面106最高点2毫米，相当于打印头距离打印目标的最佳分离量，以达到最大的喷墨打印分辨率。
容易理解的是，当打印头202被定位在距离表面106最高点的最佳2毫米处时，由于表面106非平面轮廓，表面106部分会位于从打印头202起算超过2毫米的距离处。然而，实验证明一个聚焦范围216可被定义，所述聚焦范围216位于从打印头202起算超过2毫米的距离处，然而在聚焦范围216内的打印头202仍可用一个可接受的解决方案打印所述基板104的三维表面106。如上所述，所述最大可聚焦范围216用于喷墨打印已被发现大约为7毫米。然而，可以理解的是，不同尺寸的聚焦范围可被定义，这取决于油墨图案114所需的分辨率及打印头202的结构。
因此，基板104的三维表面的高度变化设置不超过所述聚焦范围216内，油墨图案114可被打印在所述三维表面，在未修改二维操作形式中使用打印机200。如图3A至3C所示，分别为在基板104的三维表面106的各个区域，打印头202打印油墨图案114的选定部分。如图3A至3C所示，所述打印头202的高度在打印头202及三维表面106之间优选地固定及分离。因此变化作为打印头202相对于基板104重新定位。然而，打印头202打印油墨图案114仍可接受，尽管非恒定，由于表面106的打印部分的分辨率位于上述聚焦范围216内。因此三维基板104被打印，利用简单、高效及易于自动化的方式。
在基板104的三维表面的高度变化被打印超过聚焦范围216的情况下，倾斜的腔体可被加工至平板212。通过将基板104的部分放置在所述倾斜的腔体中，所述基板可适当地形成角度，以便确保所述三维表面的所述部分被打印，能够位于打印机200的聚焦范围216中。
在打印机200的操作中，所述平板212优选地以平面的方式逐渐移动，通过打印机200，并沿着纵向轴线218的方向移动。同时，打印头202优选地以平面的方式逐渐移动，沿着一横向轴线220的方向，同时喷涂油墨滴的预定图案至基板104的阵列，优选地根据现有的压电喷墨打印机构。如图4A至4F所示，分别说明在打印头202相对于平板212的逐渐重新定位的选择连续阶段。如图4A至4F所示，打印头202优选地仅在相对于平板212的二维内重新定位，通过重新定位打印头202及平板212的方式。
以下为多个基板104的一第一表面的打印，如图2所述的表面106，所述平板211可从打印机200传送至另一打印机，反转及多个基板104的附加表面，如表面108，随后被打印。连续印刷之间的最小延迟可能需要允许油墨图案114的干燥。可以理解的是，由于平板212的承载能力，多个基板104可有效地同时被打印。
本发明不限于已经具体示出和描述的内容，它将被本领域的技术人员可理解。本发明的范围包括上文描述的组合及各种特征子组合，以及发生于本领域中的技术人员在阅读上述描述而非现有技术的修改形式。

Claims (14)

1.一种用于打印在基板上的方法，其特征在于：所述方法包含步骤：
提供一基板，其具有至少一个三维表面；及
通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而在所述基板的至少一个三维表面的至少一个部分进行油墨的喷墨打印。
2.如权利要求1所述的用于打印在基板上的方法，其特征在于：所述打印方法还包含步骤：在所述基板的至少一个三维表面的已打印部分上镀覆至少一导电层。
3.如权利要求2所述的用于打印在基板上的方法，其特征在于：所述导电层包括一金属层。
4.如权利要求3所述的用于打印在基板上的方法，其特征在于：所述金属层包括一天线。
5.如权利要求2所述的用于打印在基板上的方法，其特征在于：所述基板的至少一个三维表面包括一通孔，且所述已打印部分形成在所述通孔的一孔径上。
6.如权利要求2所述的用于打印在基板上的方法，其特征在于：所述镀覆包含电镀。
7.如权利要求2所述的用于打印在基板上的方法，其特征在于：所述镀覆包含无电镀。
8.如权利要求1所述的用于打印在基板上的方法，其特征在于：所述基板包含一非导电基板。
9.如权利要求8所述的用于打印在基板上的方法，其特征在于：所述非导电基板包含一塑料。
10.如权利要求1所述的用于打印在基板上的方法，其特征在于：所述油墨包括一非导电油墨。
11.如权利要求1所述的用于打印在基板上的方法，其特征在于：所述喷墨打印包括压电喷墨打印。
12.一种天线，其特征在于：所述天线包含：
一基板，其包括至少至少一个三维表面；
一油墨图案，通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而被打印在所述三维表面的至少一个部分上；及
至少一导电层，被镀覆在所述油墨图案的至少一个部分上。
13.一种用于在通孔的孔径上打印的方法，其特征在于：所述方法包含步骤：提供一基板，其具有至少一通孔，所述通孔内具有一孔径；及通过仅在二维中利用重新定位一喷墨打印头相对于所述基板的位置，而在所述通孔的孔径的至少一部分上进行一油墨的喷墨打印。
14.如权利要求13所述的用于在通孔的孔径上打印的方法，其特征在于：还包含步骤：在所述孔径的已打印部分上镀覆至少一导电层。
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