CN104485228A - Flat thin-film capacitor - Google Patents

Flat thin-film capacitor Download PDF

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Publication number
CN104485228A
CN104485228A CN201410765294.7A CN201410765294A CN104485228A CN 104485228 A CN104485228 A CN 104485228A CN 201410765294 A CN201410765294 A CN 201410765294A CN 104485228 A CN104485228 A CN 104485228A
Authority
CN
China
Prior art keywords
annular sleeve
film capacitor
baffle plate
circular baffle
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410765294.7A
Other languages
Chinese (zh)
Inventor
万广文
钱立文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongling City Start Electronic Manufacturing Co Ltd
Original Assignee
Tongling City Start Electronic Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongling City Start Electronic Manufacturing Co Ltd filed Critical Tongling City Start Electronic Manufacturing Co Ltd
Priority to CN201410765294.7A priority Critical patent/CN104485228A/en
Publication of CN104485228A publication Critical patent/CN104485228A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a flat thin-film capacitor. The flat thin-film capacitor comprises a capacitor body and two pins mounted on the body, wherein each pin comprises a metal core, a copper layer and a tin layer, each copper layer is wrapped on the outer layer of the corresponding metal core, each tin layer is wrapped on the outer layer of the corresponding copper layer, and the corresponding metal core, copper layer and tin layer are mutually laminated to form a whole body; a welding device is arranged on each pin in a sleeved mode; each welding device comprises a circular baffle plate, an annular sleeve and a taper sleeve, the lower part of each circular baffle plate is connected to the corresponding annular sleeve, each annular sleeve is connected to the corresponding taper sleeve, and the corresponding circular baffle plate, annular sleeve and taper sleeve are coaxial; each pin is located on the common axis of the corresponding circular baffle plate, annular sleeve and taper sleeve. When the flat thin-film capacitor disclosed by the invention is welded on a PCB, in different environments, loosening phenomena are avoided, and the safety performance is improved; moreover, the conductivity and tenacity of the pins are increased through the copper layers, so that the pins are prevented from being fractured by multiple bending; in addition, when the flat thin-film capacitor is mounted, the welding is firm, and the flat thin-film capacitor is unlikely to be loosened and is convenient and quick.

Description

A kind of flat film capacitor
Technical field
The present invention relates to film capacitor technical field, particularly relate to a kind of flat film capacitor.
Background technology
MEA, MPA flat film capacitor, is mainly used in refrigerator, air-conditioning, alternating current motor, water pump, generator, household electrical appliance, electronic product etc.The pin of existing film capacitor is plain conductor, receive after on pcb board in soldering, in the process used, often run under different temperatures environment, when in the environment that high temperature, low temperature, high temperature different temperatures replace, be easy to make the overheated generation fusing flowing of scolding tin place, meet condensation knot, make the junction loose contact of pin, produce potential safety hazard.In addition, existing flat film capacitor is in PCB during welded and installed, directly pin is inserted on pcb board and install, but the length that two pins on capacitor insert is difficult to be consistent, and when welding, need one end of capacitor to fix, could well weld, and be easy to cause because the phenomenon that not prison welding is solid appears in pin imbalance.
Summary of the invention
The object of the invention is for the deficiencies in the prior art, provide a kind of flat film capacitor, can use in different temperature environments, fail safe is good, in PCB during welded and installed, and firm welding, convenience.
The technical solution used in the present invention is as follows:
A kind of flat film capacitor, comprise capacitor body and be arranged on two pins on body, described pin comprises metal-cored, copper layer and tin matter layer, the copper layer of described metal-cored outer layer covers, the outer layer covers tin matter layer of copper layer, described metal-cored, copper layer and tin matter layer are laminated integrally, described pin is arranged with welder, described welder comprises circular baffle plate, annular sleeve and taper sheath, annular sleeve is connected below described circular baffle plate, annular sleeve connects taper sheath, described circular baffle plate, annular sleeve and taper sheath coaxial, described pin is in circular baffle plate, on annular sleeve and the common axis of taper sheath.
Welder on two described pins is identical with the distance between capacitor body.
Described pin is column.
Compared with the prior art, beneficial effect of the present invention is as follows:
Flat film capacitor of the present invention, described pin is laminated by metal-cored, copper layer and tin matter layer and forms, when being welded on pcb board, scolding tin directly welds, in different environment with pin outer field tin matter layer, even if the overheated flowing of scolding tin, also can by the fusing of outer field tin matter layer tightly be fixed on pcb board, avoid the phenomenon occurring loosening, improve security performance, and copper layer increases conductivity and the toughness of pin, prevent pin from rupturing because of repeatedly bending; In addition, by arranging welder on pin, welder comprises circular baffle plate, annular sleeve and taper sheath, connect annular sleeve below described circular baffle plate, annular sleeve connects taper sheath, during installation, directly pin is inserted the installing hole on pcb board, and hold pin, until taper sheath is through pcb board, annular sleeve is made to be stuck on installing hole, circular baffle plate is against on pcb board face, then welds, firm welding, be not easy to loosen, convenient and swift.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the sectional view of pin of the present invention.
Embodiment
See accompanying drawing, a kind of flat film capacitor, two pins 2 comprising capacitor body 1 and be arranged on body, described pin 2 is column, described pin 2 comprises metal-cored 3, copper layer 4 and tin matter layer 5, the copper layer 4 of described metal-cored 3 outer layer covers, the outer layer covers tin matter layer 5 of copper layer 4, described metal-cored 3, copper layer 4 and tin matter layer 5 are laminated integrally, described pin 2 is arranged with welder 6, described welder 6 comprises circular baffle plate 601, annular sleeve 602 and taper sheath 603, annular sleeve 602 is connected below described circular baffle plate 601, annular sleeve 602 connects taper sheath 603, described circular baffle plate 601, annular sleeve 602 and taper sheath 603 coaxial, described pin 2 is in circular baffle plate, on annular sleeve and the common axis of taper sheath, welder on two described pins is identical with the distance between capacitor body.Flat film capacitor of the present invention, described pin 2 is laminated by metal-cored 3, copper layer 4 and tin matter layer 5 and forms, when being welded on pcb board, scolding tin directly welds, in different environment with pin outer field tin matter layer 5, even if the overheated flowing of scolding tin, also outer field tin matter layer 5 can be melted and tightly be fixed on pcb board, avoid occur loosen phenomenon, improve security performance, and copper layer 4 increases conductivity and the toughness of pin, prevent pin from rupturing because of repeatedly bending; In addition, by arranging welder 6 on pin 2, welder comprises circular baffle plate, annular sleeve and taper sheath, connect annular sleeve below described circular baffle plate, annular sleeve connects taper sheath, during installation, directly pin is inserted the installing hole on pcb board, and hold pin, until taper sheath 603 is through pcb board, annular sleeve 602 is made to be stuck on installing hole, circular baffle plate 601 is against on pcb board face, then welds, firm welding, be not easy to loosen, convenient and swift.

Claims (3)

1. a flat film capacitor, it is characterized in that: comprise capacitor body and be arranged on two pins on body, described pin comprises metal-cored, copper layer and tin matter layer, the copper layer of described metal-cored outer layer covers, the outer layer covers tin matter layer of copper layer, described metal-cored, copper layer and tin matter layer are laminated integrally, described pin is arranged with welder, described welder comprises circular baffle plate, annular sleeve and taper sheath, annular sleeve is connected below described circular baffle plate, annular sleeve connects taper sheath, described circular baffle plate, annular sleeve and taper sheath coaxial, described pin is in circular baffle plate, on annular sleeve and the common axis of taper sheath.
2. flat film capacitor according to claim 1, is characterized in that: the welder on two described pins is identical with the distance between capacitor body.
3. flat film capacitor according to claim 1, is characterized in that: described pin is column.
CN201410765294.7A 2014-12-11 2014-12-11 Flat thin-film capacitor Pending CN104485228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410765294.7A CN104485228A (en) 2014-12-11 2014-12-11 Flat thin-film capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410765294.7A CN104485228A (en) 2014-12-11 2014-12-11 Flat thin-film capacitor

Publications (1)

Publication Number Publication Date
CN104485228A true CN104485228A (en) 2015-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410765294.7A Pending CN104485228A (en) 2014-12-11 2014-12-11 Flat thin-film capacitor

Country Status (1)

Country Link
CN (1) CN104485228A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211628A (en) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 Electronic component fast welding T-Ring
CN112601353A (en) * 2020-12-23 2021-04-02 新沂市承翔电子有限公司 Electronic component pin and electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103680954A (en) * 2013-12-21 2014-03-26 铜陵源丰电子有限责任公司 Thin film capacitor suitable for high-temperature and low-temperature environments
CN103700491A (en) * 2013-12-21 2014-04-02 铜陵源丰电子有限责任公司 Convenient-to-mount thin-film capacitor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103680954A (en) * 2013-12-21 2014-03-26 铜陵源丰电子有限责任公司 Thin film capacitor suitable for high-temperature and low-temperature environments
CN103700491A (en) * 2013-12-21 2014-04-02 铜陵源丰电子有限责任公司 Convenient-to-mount thin-film capacitor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211628A (en) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 Electronic component fast welding T-Ring
CN106211628B (en) * 2016-08-31 2019-05-21 安徽赛福电子有限公司 Electronic component rapid welding ring
CN112601353A (en) * 2020-12-23 2021-04-02 新沂市承翔电子有限公司 Electronic component pin and electronic component

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Application publication date: 20150401